CN110832620B - 隐形切割用粘着片及半导体装置的制造方法 - Google Patents

隐形切割用粘着片及半导体装置的制造方法 Download PDF

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Publication number
CN110832620B
CN110832620B CN201880044028.1A CN201880044028A CN110832620B CN 110832620 B CN110832620 B CN 110832620B CN 201880044028 A CN201880044028 A CN 201880044028A CN 110832620 B CN110832620 B CN 110832620B
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China
Prior art keywords
adhesive
invisible
adhesive sheet
semiconductor wafer
dicing
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Active
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CN201880044028.1A
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English (en)
Chinese (zh)
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CN110832620A (zh
Inventor
福元孝齐
山下茂之
中村优智
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Lintec Corp
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Lintec Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
CN201880044028.1A 2017-07-03 2018-02-02 隐形切割用粘着片及半导体装置的制造方法 Active CN110832620B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017130299 2017-07-03
JP2017-130299 2017-07-03
PCT/JP2018/003592 WO2019008808A1 (ja) 2017-07-03 2018-02-02 ステルスダイシング用粘着シートおよび半導体装置の製造方法

Publications (2)

Publication Number Publication Date
CN110832620A CN110832620A (zh) 2020-02-21
CN110832620B true CN110832620B (zh) 2024-01-02

Family

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CN201880044028.1A Active CN110832620B (zh) 2017-07-03 2018-02-02 隐形切割用粘着片及半导体装置的制造方法

Country Status (5)

Country Link
JP (1) JP7062653B2 (ko)
KR (1) KR102560370B1 (ko)
CN (1) CN110832620B (ko)
TW (1) TWI762576B (ko)
WO (1) WO2019008808A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200143259A (ko) 2019-06-13 2020-12-23 닛토덴코 가부시키가이샤 다이싱 테이프 및 다이싱 다이 본드 필름

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009063825A1 (ja) * 2007-11-16 2009-05-22 Tokyo Seimitsu Co., Ltd. ウェーハ処理装置
JP2011171588A (ja) * 2010-02-19 2011-09-01 Nitto Denko Corp ダイシング・ダイボンドフィルム
CN103460348A (zh) * 2012-01-06 2013-12-18 古河电气工业株式会社 晶片加工用胶带及使用其的半导体装置的制造方法
JP2014509450A (ja) * 2011-03-08 2014-04-17 エルジー・ハウシス・リミテッド ウエハ加工フィルム用粘着剤組成物
CN105264127A (zh) * 2013-03-15 2016-01-20 Gpb科学有限责任公司 颗粒的片上微流体处理
WO2016052444A1 (ja) * 2014-09-29 2016-04-07 リンテック株式会社 半導体ウエハ加工用シート用基材、半導体ウエハ加工用シート、および半導体装置の製造方法
CN105683319A (zh) * 2013-10-30 2016-06-15 琳得科株式会社 半导体接合用粘接片及半导体装置的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4770126B2 (ja) 2003-06-06 2011-09-14 日立化成工業株式会社 接着シート
CN110753993B (zh) * 2017-07-03 2023-12-01 琳得科株式会社 隐形切割用粘着片及半导体装置的制造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009063825A1 (ja) * 2007-11-16 2009-05-22 Tokyo Seimitsu Co., Ltd. ウェーハ処理装置
JP2011171588A (ja) * 2010-02-19 2011-09-01 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2014509450A (ja) * 2011-03-08 2014-04-17 エルジー・ハウシス・リミテッド ウエハ加工フィルム用粘着剤組成物
CN104204126A (zh) * 2011-03-08 2014-12-10 乐金华奥斯有限公司 用于晶圆加工薄膜的粘合剂组合物
CN103460348A (zh) * 2012-01-06 2013-12-18 古河电气工业株式会社 晶片加工用胶带及使用其的半导体装置的制造方法
CN105264127A (zh) * 2013-03-15 2016-01-20 Gpb科学有限责任公司 颗粒的片上微流体处理
CN105683319A (zh) * 2013-10-30 2016-06-15 琳得科株式会社 半导体接合用粘接片及半导体装置的制造方法
WO2016052444A1 (ja) * 2014-09-29 2016-04-07 リンテック株式会社 半導体ウエハ加工用シート用基材、半導体ウエハ加工用シート、および半導体装置の製造方法

Also Published As

Publication number Publication date
JPWO2019008808A1 (ja) 2020-05-07
KR102560370B1 (ko) 2023-07-27
WO2019008808A1 (ja) 2019-01-10
CN110832620A (zh) 2020-02-21
JP7062653B2 (ja) 2022-05-06
TW201906957A (zh) 2019-02-16
TWI762576B (zh) 2022-05-01
KR20200024126A (ko) 2020-03-06

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