CN110832620B - 隐形切割用粘着片及半导体装置的制造方法 - Google Patents
隐形切割用粘着片及半导体装置的制造方法 Download PDFInfo
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- CN110832620B CN110832620B CN201880044028.1A CN201880044028A CN110832620B CN 110832620 B CN110832620 B CN 110832620B CN 201880044028 A CN201880044028 A CN 201880044028A CN 110832620 B CN110832620 B CN 110832620B
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- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 150000002918 oxazolines Chemical class 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017130299 | 2017-07-03 | ||
JP2017-130299 | 2017-07-03 | ||
PCT/JP2018/003592 WO2019008808A1 (ja) | 2017-07-03 | 2018-02-02 | ステルスダイシング用粘着シートおよび半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110832620A CN110832620A (zh) | 2020-02-21 |
CN110832620B true CN110832620B (zh) | 2024-01-02 |
Family
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CN201880044028.1A Active CN110832620B (zh) | 2017-07-03 | 2018-02-02 | 隐形切割用粘着片及半导体装置的制造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7062653B2 (ko) |
KR (1) | KR102560370B1 (ko) |
CN (1) | CN110832620B (ko) |
TW (1) | TWI762576B (ko) |
WO (1) | WO2019008808A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20200143259A (ko) | 2019-06-13 | 2020-12-23 | 닛토덴코 가부시키가이샤 | 다이싱 테이프 및 다이싱 다이 본드 필름 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009063825A1 (ja) * | 2007-11-16 | 2009-05-22 | Tokyo Seimitsu Co., Ltd. | ウェーハ処理装置 |
JP2011171588A (ja) * | 2010-02-19 | 2011-09-01 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
CN103460348A (zh) * | 2012-01-06 | 2013-12-18 | 古河电气工业株式会社 | 晶片加工用胶带及使用其的半导体装置的制造方法 |
JP2014509450A (ja) * | 2011-03-08 | 2014-04-17 | エルジー・ハウシス・リミテッド | ウエハ加工フィルム用粘着剤組成物 |
CN105264127A (zh) * | 2013-03-15 | 2016-01-20 | Gpb科学有限责任公司 | 颗粒的片上微流体处理 |
WO2016052444A1 (ja) * | 2014-09-29 | 2016-04-07 | リンテック株式会社 | 半導体ウエハ加工用シート用基材、半導体ウエハ加工用シート、および半導体装置の製造方法 |
CN105683319A (zh) * | 2013-10-30 | 2016-06-15 | 琳得科株式会社 | 半导体接合用粘接片及半导体装置的制造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4770126B2 (ja) | 2003-06-06 | 2011-09-14 | 日立化成工業株式会社 | 接着シート |
CN110753993B (zh) * | 2017-07-03 | 2023-12-01 | 琳得科株式会社 | 隐形切割用粘着片及半导体装置的制造方法 |
-
2018
- 2018-02-02 KR KR1020197030926A patent/KR102560370B1/ko active IP Right Grant
- 2018-02-02 CN CN201880044028.1A patent/CN110832620B/zh active Active
- 2018-02-02 WO PCT/JP2018/003592 patent/WO2019008808A1/ja active Application Filing
- 2018-02-02 JP JP2019528340A patent/JP7062653B2/ja active Active
- 2018-02-09 TW TW107104714A patent/TWI762576B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009063825A1 (ja) * | 2007-11-16 | 2009-05-22 | Tokyo Seimitsu Co., Ltd. | ウェーハ処理装置 |
JP2011171588A (ja) * | 2010-02-19 | 2011-09-01 | Nitto Denko Corp | ダイシング・ダイボンドフィルム |
JP2014509450A (ja) * | 2011-03-08 | 2014-04-17 | エルジー・ハウシス・リミテッド | ウエハ加工フィルム用粘着剤組成物 |
CN104204126A (zh) * | 2011-03-08 | 2014-12-10 | 乐金华奥斯有限公司 | 用于晶圆加工薄膜的粘合剂组合物 |
CN103460348A (zh) * | 2012-01-06 | 2013-12-18 | 古河电气工业株式会社 | 晶片加工用胶带及使用其的半导体装置的制造方法 |
CN105264127A (zh) * | 2013-03-15 | 2016-01-20 | Gpb科学有限责任公司 | 颗粒的片上微流体处理 |
CN105683319A (zh) * | 2013-10-30 | 2016-06-15 | 琳得科株式会社 | 半导体接合用粘接片及半导体装置的制造方法 |
WO2016052444A1 (ja) * | 2014-09-29 | 2016-04-07 | リンテック株式会社 | 半導体ウエハ加工用シート用基材、半導体ウエハ加工用シート、および半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2019008808A1 (ja) | 2020-05-07 |
KR102560370B1 (ko) | 2023-07-27 |
WO2019008808A1 (ja) | 2019-01-10 |
CN110832620A (zh) | 2020-02-21 |
JP7062653B2 (ja) | 2022-05-06 |
TW201906957A (zh) | 2019-02-16 |
TWI762576B (zh) | 2022-05-01 |
KR20200024126A (ko) | 2020-03-06 |
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