CN110828394B - 半导体封装件 - Google Patents
半导体封装件 Download PDFInfo
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- CN110828394B CN110828394B CN201910701419.2A CN201910701419A CN110828394B CN 110828394 B CN110828394 B CN 110828394B CN 201910701419 A CN201910701419 A CN 201910701419A CN 110828394 B CN110828394 B CN 110828394B
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020180093929A KR102127828B1 (ko) | 2018-08-10 | 2018-08-10 | 반도체 패키지 |
KR10-2018-0093929 | 2018-08-10 |
Publications (2)
Publication Number | Publication Date |
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CN110828394A CN110828394A (zh) | 2020-02-21 |
CN110828394B true CN110828394B (zh) | 2023-09-12 |
Family
ID=69406785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910701419.2A Active CN110828394B (zh) | 2018-08-10 | 2019-07-31 | 半导体封装件 |
Country Status (4)
Country | Link |
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US (3) | US10756030B2 (ko) |
KR (1) | KR102127828B1 (ko) |
CN (1) | CN110828394B (ko) |
TW (1) | TWI689057B (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11990353B2 (en) | 2017-11-29 | 2024-05-21 | Pep Innovation Pte. Ltd. | Semiconductor device with buffer layer |
KR20210133524A (ko) * | 2020-04-29 | 2021-11-08 | 삼성전자주식회사 | 배선 구조체 및 이를 포함하는 반도체 패키지 |
TWI738325B (zh) * | 2020-05-08 | 2021-09-01 | 大陸商上海兆芯集成電路有限公司 | 晶片封裝方法、晶片封裝體陣列及晶片封裝體 |
CN115280489A (zh) * | 2020-07-15 | 2022-11-01 | Pep创新私人有限公司 | 具有缓冲层的半导体器件 |
CN114695301A (zh) * | 2020-12-30 | 2022-07-01 | 万国半导体国际有限合伙公司 | 具有薄衬底的半导体封装及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US9087832B2 (en) * | 2013-03-08 | 2015-07-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Warpage reduction and adhesion improvement of semiconductor die package |
CN106328618A (zh) * | 2015-06-30 | 2017-01-11 | 台湾积体电路制造股份有限公司 | 凸块下金属(ubm)及其形成方法 |
Family Cites Families (15)
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EP1107307B1 (en) | 1999-06-15 | 2005-09-07 | Fujikura Ltd. | Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package |
KR100396889B1 (ko) * | 2001-03-08 | 2003-09-03 | 삼성전자주식회사 | 크랙방지층을 이용한 콘택 형성방법 및 이를 이용한반도체 소자 |
KR100394808B1 (ko) * | 2001-07-19 | 2003-08-14 | 삼성전자주식회사 | 웨이퍼 레벨 적층 칩 패키지 및 그 제조 방법 |
US6743660B2 (en) * | 2002-01-12 | 2004-06-01 | Taiwan Semiconductor Manufacturing Co., Ltd | Method of making a wafer level chip scale package |
TWI229930B (en) * | 2003-06-09 | 2005-03-21 | Advanced Semiconductor Eng | Chip structure |
TWI251890B (en) * | 2004-11-05 | 2006-03-21 | Advanced Semiconductor Eng | Wafer structure, chip structure and bumping process |
KR100817079B1 (ko) | 2006-12-05 | 2008-03-26 | 삼성전자주식회사 | 웨이퍼 레벨 칩 스케일 패키지, 그 제조 방법, 및 웨이퍼레벨 칩 스케일 패키지를 포함하는 반도체 칩 모듈 |
TWI479617B (zh) * | 2009-03-16 | 2015-04-01 | Winbond Electronics Corp | 半導體結構及其製造方法 |
US8759209B2 (en) | 2010-03-25 | 2014-06-24 | Stats Chippac, Ltd. | Semiconductor device and method of forming a dual UBM structure for lead free bump connections |
US9159686B2 (en) * | 2012-01-24 | 2015-10-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Crack stopper on under-bump metallization layer |
CN108091564A (zh) * | 2012-06-29 | 2018-05-29 | 索尼公司 | 半导体装置、半导体装置的制造方法和电子设备 |
TWI578420B (zh) * | 2015-05-04 | 2017-04-11 | 精材科技股份有限公司 | 半導體結構及其製作方法 |
US9646943B1 (en) * | 2015-12-31 | 2017-05-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Connector structure and method of forming same |
KR102016492B1 (ko) * | 2016-04-25 | 2019-09-02 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 |
KR101872619B1 (ko) * | 2016-11-17 | 2018-06-28 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 |
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US9087832B2 (en) * | 2013-03-08 | 2015-07-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Warpage reduction and adhesion improvement of semiconductor die package |
CN106328618A (zh) * | 2015-06-30 | 2017-01-11 | 台湾积体电路制造股份有限公司 | 凸块下金属(ubm)及其形成方法 |
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US11862581B2 (en) | 2024-01-02 |
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