CN110828394B - 半导体封装件 - Google Patents

半导体封装件 Download PDF

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Publication number
CN110828394B
CN110828394B CN201910701419.2A CN201910701419A CN110828394B CN 110828394 B CN110828394 B CN 110828394B CN 201910701419 A CN201910701419 A CN 201910701419A CN 110828394 B CN110828394 B CN 110828394B
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layer
opening
semiconductor package
disposed
semiconductor chip
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Chinese (zh)
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CN110828394A (zh
Inventor
朴智恩
朴美珍
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN201910701419.2A 2018-08-10 2019-07-31 半导体封装件 Active CN110828394B (zh)

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KR1020180093929A KR102127828B1 (ko) 2018-08-10 2018-08-10 반도체 패키지
KR10-2018-0093929 2018-08-10

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CN110828394B true CN110828394B (zh) 2023-09-12

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KR (1) KR102127828B1 (ko)
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TW (1) TWI689057B (ko)

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US11990353B2 (en) 2017-11-29 2024-05-21 Pep Innovation Pte. Ltd. Semiconductor device with buffer layer
KR20210133524A (ko) * 2020-04-29 2021-11-08 삼성전자주식회사 배선 구조체 및 이를 포함하는 반도체 패키지
TWI738325B (zh) * 2020-05-08 2021-09-01 大陸商上海兆芯集成電路有限公司 晶片封裝方法、晶片封裝體陣列及晶片封裝體
CN115280489A (zh) * 2020-07-15 2022-11-01 Pep创新私人有限公司 具有缓冲层的半导体器件
CN114695301A (zh) * 2020-12-30 2022-07-01 万国半导体国际有限合伙公司 具有薄衬底的半导体封装及其制造方法

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