CN110643850B - Copper alloy with excellent bending performance and preparation method and application thereof - Google Patents
Copper alloy with excellent bending performance and preparation method and application thereof Download PDFInfo
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- CN110643850B CN110643850B CN201911017399.3A CN201911017399A CN110643850B CN 110643850 B CN110643850 B CN 110643850B CN 201911017399 A CN201911017399 A CN 201911017399A CN 110643850 B CN110643850 B CN 110643850B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Abstract
The invention discloses a copper alloy with excellent bending performance, which comprises the following components in percentage by weight: 0.51 to 2.00wt% of Ni, 0.10 to 0.35wt% of P, and the balance of Cu and inevitable impurities, wherein the weight percentage ratio of Ni to P is Ni/P =2.4 to 5.7. The preparation method of the copper alloy comprises the steps of casting, hot rolling, first cold rolling, solution treatment, second cold rolling, aging, third cold rolling and the like. The copper alloy has a precipitation strengthening effect, the yield strength of a copper alloy strip is 550-700 MPa, the electric conductivity of the copper alloy strip is 60-70% IACS (intrinsic elastic modulus), and excellent bending performance and stress relaxation resistance are obtained by controlling the component proportion of Ni and P. The copper alloy of the invention is particularly suitable for connectors, busbars, relay springs and heat dissipation systems, for example: the automobile fuse box comprises a male terminal and a female terminal in a connector, a bus bar and a pin for the automobile fuse box, a relay movable reed, a mobile phone, a notebook computer and a tablet computer cooling system.
Description
Technical Field
The invention relates to a copper alloy, in particular to a copper alloy with excellent bending performance, and a preparation method and application thereof.
Background
With the development of new energy vehicles, new generation USB data transmission technology, 5G mobile phones, notebook computers and other electronic products, the parts of these products are also miniaturized and lightened, and the thickness of the copper alloy strip used is reduced, and the current carrying capacity is increased, so that the copper alloy strip is required to have higher mechanical property, conductivity and stress relaxation resistance, thereby ensuring the reliability and durability of the electronic product. In addition, with the high-density installation application and finer processing of electronic components, the material processability, particularly the bending performance, needs to be improved, the yield strength of the copper alloy strip is 550-700 MPa, the electric conductivity is 60-70% IACS, the residual stress of the strip reaches more than 70% of the initial loading stress after the strip is subjected to heat preservation at 120 ℃ and 150 ℃ for 1000 hours, and cracks are not allowed to exist on the bending surface of the strip during the bending processing.
In the existing copper alloy system, high-strength and high-conductivity beryllium copper alloys represented by the marks of C17410, C17460 and the like can meet the performance requirements, but the use of the materials is limited due to the problems of cost and generation of toxic substances in the processing process of the beryllium-containing materials. Besides beryllium copper, the materials C18665 and C64800 can meet the performance requirements, but the two materials respectively contain higher contents of Mg and Co elements, and leftover materials generated in the process of processing the materials in downstream industries are not easy to digest and treat, so that social resource waste is caused.
The copper-nickel-phosphorus alloy is a typical precipitation strengthening alloy, the alloy is environment-friendly, and leftover materials generated in the processing process are easy to digest. However, with the progress of miniaturization and weight reduction of parts, alloy materials are required to have high strength and high conductivity, and also to have excellent stress relaxation resistance and bending performance. However, the existing copper nickel phosphorus alloy cannot have the above properties at the same time, so that the development of a copper nickel phosphorus alloy having the above properties is an urgent need. In view of the above, the invention provides a copper alloy with excellent bending performance, and a preparation method and application thereof.
Disclosure of Invention
The invention aims to solve the technical problem of providing a copper alloy with excellent bending performance, and a preparation method and application thereof, aiming at the defects of the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows: a copper alloy with excellent bending performance comprises the following components in percentage by weight: 0.51 to 2.00wt% of Ni, 0.10 to 0.35wt% of P, and the balance of Cu and inevitable impurities, wherein the weight percentage ratio of Ni to P is Ni/P2.4 to 5.7.
The copper alloy has a precipitation strengthening effect, the yield strength of a copper alloy strip is 550-700 MPa, the electric conductivity of the copper alloy strip is 60-70% IACS (intrinsic elastic modulus), and excellent bending performance and stress relaxation resistance are obtained by controlling the component proportion of Ni and P.
According to the invention, 0.51-2.00 wt% of Ni is added, and the Ni and P can form a nano-scale precipitation phase after being added simultaneously, so that the mechanical property and the conductivity of the alloy can be improved. When the content of Ni added is less than 0.50wt%, the alloy has high conductivity, but does not obtain ideal mechanical properties, limiting the application of the alloy. When the content of Ni added exceeds 2.00wt%, part of Ni can not form compound precipitation during the aging process of the alloy and still remains in the copper matrix, which can result in the reduction of the conductive performance of the alloy. Therefore, the copper alloy of the present invention controls the Ni content to 0.51 to 2.00wt%, preferably 0.60 to 1.90 wt%.
The invention adds 0.10-0.35 wt% of P. And P is added to enable Ni to form a precipitate phase to be separated out, so that the strength and the conductivity of the alloy are improved. When the P content is less than 0.10 wt%, the amount of precipitated phases is small, and ideal mechanical properties cannot be obtained. When the content of the added P exceeds 0.35wt%, the amount of precipitated phases is too large, and even redundant P and Cu form a phosphor-copper compound, so that the conductivity of the alloy is remarkably reduced, and although the mechanical property of the alloy can be improved, the subsequent processing is difficult. Therefore, the P content of the copper alloy is controlled to be 0.10-0.35 wt%, preferably 0.15-0.30 wt%.
The weight percentage ratio of Ni to P in the copper alloy is 2.4-5.7, and the desolventizing of Ni and P atoms can be realized in the range, so that the residual of Ni and P atoms in a matrix can be reduced to the maximum extent while the aging strengthening is realized, and the influence of the added elements on the conductivity of the alloy is reduced as much as possible. But the Ni/P can not obtain ideal conductive performance when the Ni/P is less than 2.4 and can not obtain ideal mechanical performance when the Ni/P exceeds 5.7, so that the Ni/P is controlled to be 2.4-5.7 to ensure the conductive performance and the mechanical performance of the alloy.
The copper alloy strip can be used only after being processed into parts, and the main modes for processing the parts are stamping, bending and the like, wherein the bending performance of the strip has a great influence on the bending processing. If the bending performance of the copper alloy strip is poor, the bending part is easy to crack during stamping and bending. The stamping and bending process of the alloy strip is a plastic deformation process. The most common mode of plastic deformation is slip, i.e. one part of the crystal slips relative to another part along a certain crystal plane and direction, and the accumulation of a large amount of slip constitutes macroscopic plastic deformation. The copper alloy strip belongs to polycrystal, under the action of external stress, plastic deformation of different crystals (grains) in the copper alloy strip is superposed to form plastic deformation of the copper alloy strip, and the area ratios of different orientations of the rolled surface of the copper alloy have important influence on the improvement of the plastic deformation capability of the alloy. In order to further improve the bending performance of the alloy, the area ratios of different orientations of the rolling surface of the alloy strip are controlled, so that the crystal orientation of the copper alloy strip meets the following requirements within a deviation angle of less than 15 degrees: the area ratio of the Brass orientation {011} <211> is 15.0-30.0%, the area ratio of the S orientation {123} <634> is 7.0-28.0%, the area ratio of the Copper orientation {112} <111> is 6.5-20.0%, and the area ratio of the R orientation {124} <211> is 6.0-16.0%. The inventor finds that when the area ratios of different orientations of the rolled surface meet the requirements, the plastic deformation capacity of the alloy is improved, the cracking problem is greatly reduced in the alloy stamping and bending process, and the stamping and bending processing requirements are met. Through the texture control, the bending performance of the alloy is further improved while the alloy meets the requirements of strength, conductivity and stress relaxation resistance.
Meanwhile, the inventor further discovers that the alloy is plastic through experimentsThe deformability is also related to its schmitt factor, and the better the bending performance as the schmitt factor in each orientation is closer to its maximum. The Schmidt factor is the ratio of the shear stress of the slip plane on the crystal to the applied stress applied to the crystal, and can be used
Is calculated, wherein
Is the included angle between the direction of the external stress and the normal line of the slip surface, and lambda is the included angle between the direction of the external stress and the slip direction. The schmidt factor is also called an orientation factor, and the larger the value, the larger the shear stress acting on the slip plane, and the easier the crystal is deformed. Due to the fact that
It can be seen that there is a maximum value of 0.5 for the schmitt factor. The copper alloy strip is polycrystal, because of the processing mode, a plurality of crystals (grains) with different orientations exist in the copper alloy strip, and the Schmidt factor value of different crystals in the copper alloy strip can be improved through a technological means and is close to the maximum value, so that the purpose of improving the bending performance of the material is achieved. Therefore, in order to realize better bending performance, the Schmidt factor on the rolled surface of the copper alloy strip is further controlled, and when the orientation area ratio of the Schmidt factor more than or equal to 0.3 on the rolled surface of the copper alloy strip is 98-100%, and the orientation area ratio of the Schmidt factor more than or equal to 0.4 is 60-85%, the bending performance of the alloy is further improved.
As for the control of the impurity element, the content of the impurity element Si in the copper alloy is controlled to be less than 0.10 wt%. In the alloy, a small amount of Si can form a nano-scale precipitate with Ni like P, so that the mechanical property of the alloy is further improved. However, Si is required to be controlled as an impurity, and when the content of Si exceeds 0.10 wt%, the conductivity of the alloy is significantly reduced, so that the conductivity of the alloy cannot reach 60 to 70% IACS, and at the same time, too much Si affects the stamping process of the alloy, and since Si is likely to form an oxide of Si having a large hardness in the heat treatment process, the stamping die is damaged in the subsequent stamping process. Therefore, the invention controls Si as impurity, and the content is controlled below 0.10 wt%.
Preferably, the copper alloy further comprises 0.01-0.50 wt% of Zn. Zn mainly plays a role in solid solution strengthening in the copper alloy, and the mechanical property of the alloy can be further improved. In the process of solution treatment, Zn can also inhibit the growth of crystal grains, thereby achieving the effect of improving the bending performance of the alloy. In addition, the addition of 0.01-0.50 wt% of Zn has little influence on the conductivity of the alloy, if the content of the added Zn exceeds 0.50wt%, the conductivity of the alloy is obviously reduced, and if the content of the added Zn is less than 0.01 wt%, the beneficial effect of Zn cannot be realized. Therefore, the Zn content of the alloy is controlled to be 0.01 to 0.50wt%, preferably 0.01 to 0.40 wt%.
Preferably, the copper alloy further comprises one or more of Co, Fe, Cr, Sn, Mg, Mn, Ti, Ag, Zr, single rare earth and mixed rare earth in a total amount of 0.01-0.40 wt%. After the Co, Fe, Cr, Mg, Ti, Ag, Zr and P form a precipitate phase, the conductivity, stress relaxation resistance and high temperature softening resistance of the alloy strip can be improved, but the amount of the nickel-phosphorus precipitate phase can be reduced due to excessively high addition of the elements, so that the mechanical property of the alloy is reduced. Sn and Mn can be dissolved in copper in a solid mode, and the mechanical property of the alloy is improved. The single rare earth and the mixed rare earth have the functions of grain refinement and oxygen removal. The total amount of one or more selected from Co, Fe, Cr, Sn, Mg, Mn, Ti, Ag, Zr, single rare earth and mixed rare earth is controlled to be 0.01-0.40 wt%.
Preferably, the copper alloy strip has a yield strength of 550 to 700MPa, an electrical conductivity of 60 to 70% IACS, and a ratio r of a bending radius parallel to a rolling direction to a thickness of the strip1T is less than or equal to 1.0, and the ratio r of the bending radius perpendicular to the rolling direction to the thickness of the strip2/t≤2.0。
The preparation method of the copper alloy with excellent bending performance comprises the following steps:
1) casting: melting a copper alloy raw material at 1100-1300 ℃ by adopting a conventional copper alloy melting method, and casting a cast ingot by an iron mold, horizontal continuous casting or vertical semi-continuous casting;
2) hot rolling: carrying out hot rolling on the ingot at the temperature of 700-980 ℃, and controlling the reduction rate of the cross section area of the ingot hot rolling to be not less than 75%, and preferably not less than 90%, so as to obtain a hot rolled plate;
3) first cold rolling: cooling the hot rolled plate to room temperature, and then carrying out first cold rolling, wherein the reduction rate of the cross section area of the first cold rolling is controlled to be not less than 70%, and more preferably not less than 80%;
4) solution treatment: carrying out solution treatment on the plate subjected to the first cold rolling, and the specific process comprises the following steps: heating the plate at 700-900 ℃ for no less than 30s, then carrying out water cooling or air cooling treatment, cooling to room temperature within 30 s-1 h, and after solution treatment, the average grain size of recrystallized grains of the plate is less than or equal to 25 mu m;
5) and (3) second cold rolling: reducing the cross section area of the plate subjected to the solution treatment by 0-90% through second cold rolling;
6) aging: annealing the plate at the temperature of 350-450 ℃ for 0.5-12 h to separate out a precipitate phase;
7) and (3) cold rolling for the third time: and reducing the cross section area of the plate by 20-70% through third cold rolling.
Preferably, the method further comprises the following steps: annealing the plate at 200-550 ℃ for 1 min-10 h after the third cold rolling in the step 7). The steps can be increased as required, so that the performance of the finished product is stable.
Preferably, step 5) and step 6) are performed as one step unit, and the step unit is repeatedly performed a plurality of times.
The copper alloy with excellent bending performance is applied to connectors, bus bars, relay elastic sheets and heat dissipation systems. For example: the automobile fuse box comprises a male terminal and a female terminal in a connector, a bus bar and a pin for the automobile fuse box, a relay movable reed, a mobile phone, a notebook computer and a tablet computer cooling system.
Compared with the prior art, the invention has the advantages that:
(1) the copper alloy has a precipitation strengthening effect, the yield strength of a copper alloy strip is 550-700 MPa, the electric conductivity of the copper alloy strip is 60-70% IACS (intrinsic elastic modulus), and excellent bending performance and stress relaxation resistance are obtained by controlling the component proportion of Ni and P.
(2) In order to further improve the bending performance of the alloy, the area ratios of different orientations of the rolling surface of the alloy strip are controlled by a preparation process, so that the crystal orientation of the copper alloy strip meets the following requirements within a deviation angle of less than 15 degrees: the area ratio of the Brass orientation {011} <211> is 15.0-30.0%, the area ratio of the S orientation {123} <634> is 7.0-28.0%, the area ratio of the Copper orientation {112} <111> is 6.5-20.0%, and the area ratio of the R orientation {124} <211> is 6.0-16.0%, so that the alloy strength, the conductivity, the stress relaxation resistance and the bending performance are synchronously improved.
(3) In order to realize better bending performance, the Schmidt factor on the rolled surface of the copper alloy strip is further controlled, and when the orientation area ratio of the Schmidt factor more than or equal to 0.3 on the rolled surface of the copper alloy strip is 98-100%, and the orientation area ratio of the Schmidt factor more than or equal to 0.4 is 60-85%, the bending performance of the alloy is further improved.
(4) The copper alloy strip can realize the ratio r of the bending radius parallel to the rolling direction (namely the good direction) to the thickness of the strip1T is less than or equal to 1.0, and the ratio r of the bending radius perpendicular to the rolling direction (i.e. the direction of failure) to the thickness of the strip2/t≤2.0。
(5) The copper alloy strip of the invention can meet the following stress relaxation resistance: when the initial stress is 80% of the yield strength, the residual stress of the strip after aging treatment at 120 ℃ for 1000 hours reaches 85-92% of the initial stress; when the initial stress is 80% of the yield strength, the residual stress of the strip after aging treatment at 150 ℃ for 1000 hours reaches 75-83% of the initial stress.
(6) The copper alloy of the invention is particularly suitable for connectors, busbars, relay springs and heat dissipation systems, for example: the automobile fuse box comprises a male terminal and a female terminal in a connector, a bus bar and a pin for the automobile fuse box, a relay movable reed, a mobile phone, a notebook computer and a tablet computer cooling system.
Drawings
FIG. 1 is an EBSD photograph of example 4;
FIG. 2 shows the EBSD texture test results of example 4, which shows the texture of {011} <211> grain-oriented area ratio of 16.0%, {123} <634> grain-oriented area ratio of 18.4%, {112} <111> grain-oriented area ratio of 16.4%, and {124} <211> grain-oriented area ratio of 13.0% in the rolled surface;
FIG. 3 is a graph showing the Schmidt factor ratio of the copper alloy strip of example 13, wherein the ratio of the area of each grain oriented with the Schmidt factor of 0.3 to the area of 99.0% and the ratio of the area of each grain oriented with the Schmidt factor of 0.4 to the area of 80.0% on the rolled surface of the copper alloy strip of the example;
FIG. 4 is a stress relaxation resistance test curve of example 10, in which the initial stress is 80% yield strength, and the residual stress of the strip after aging treatment at 120 ℃ for 1000 hours reaches 91.1% of the initial stress;
FIG. 5 is a stress relaxation resistance test curve of example 10, in which the initial stress is 80% yield strength, and the residual stress of the strip after aging treatment at 150 ℃ for 1000 hours reaches 80.0% of the initial stress;
FIG. 6 is a graph showing the test curve of the high temperature softening resistance of example 7, wherein the strip after aging treatment at 400 ℃ for 30min has a hardness of 93.9% of the initial hardness.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
And selecting 30 example alloys, adding all the added elements into a smelting furnace according to the requirement of the addition amount, and casting a rectangular ingot by a vertical semi-continuous casting method. Heating at 700-980 ℃ for 1-5 h, and then starting hot rolling, wherein the cross section area is reduced by at least 90%. And (2) cooling the hot rolled plate to room temperature, then carrying out cold rolling, reducing the cross section area by not less than 80%, carrying out solution treatment at the temperature of 700-900 ℃ after rolling to the required size, heating for not less than 30 seconds, then carrying out water cooling or air cooling, cooling to room temperature within the time of 30 seconds to 1 hour, and enabling the average grain size of recrystallized grains after solution treatment to be not more than 25 mu m. And (3) carrying out cold rolling on the blank subjected to solution treatment after acid pickling, wherein the area of the cross section is reduced by 0-90%. And (3) aging at the temperature of 350-450 ℃, wherein the aging time is 0.5-12 hours, so that a precipitate phase is precipitated. And after the aging is finished, cold rolling is carried out, and the area of the cross section is reduced by 20-70%. And (3) after the cold rolling is finished, aging at the temperature of 350-450 ℃, wherein the aging time is 0.5-12 hours, and further aging to precipitate a precipitate phase. After the aging is finished, the cross section area is reduced by 20-70% through cold rolling to prepare a finished product, and annealing treatment at the temperature of 200-550 ℃ for 1 min-10 h can be performed according to needs, so that the performance is stable. And then testing the mechanical property, the conductivity, the stress relaxation resistance, the high temperature softening resistance, the bending property, the texture distribution on the rolling surface and the Schmidt factor of the material.
Tensile test at room temperature according to GB/T228.1-2010 Metal Material tensile test part 1: the room temperature test method is carried out on an electronic universal mechanical property tester, and a sample adopts a rectangular cross section proportion sample with a proportion coefficient of 5.65.
Conductivity test according to GB/T3048-2007 electric wire and cable electric performance test method part 2: resistivity test of metallic material, expressed in% IACS.
The stress relaxation resistance was measured by the following method: sampling a copper alloy strip along the rolling direction, wherein the sample is a strip sample with the width of 10mm, then fixing one end of the strip sample on a test fixture, applying a stress on the other end to bend the strip sample to form a cantilever beam, and calculating the stress on the cantilever beam by adopting the following formula: 6Et/L2Wherein E is the Young's modulus of elasticity of the copper alloy strip, t is the thickness of the strip, and is deflection, L is the length of the cantilever beam, and the magnitude of the loaded stress value can be changed by changing the deflection and fixing other parameters. A common test stress is 80% yield strength, and when the loaded stress is removed after the heat is maintained in an oven at 120 ℃ and 150 ℃ for 1000 hours, the cantilever beam will be permanently bent, and the stress relaxation rate is the height of the bend divided by the initial deflection, expressed as a percentage. (100% -stress relaxation Rate) is the stress relaxation Rate of the materialExpressed in percent. The stress relaxation resistance test curves of example 10 are shown in FIGS. 4 and 5.
The high temperature softening resistance is measured by the following method: and (3) annealing the copper alloy strip at 400 ℃ for 30min, and measuring the hardness value after annealing, wherein the ratio of the hardness after annealing to the initial hardness is the high-temperature-resistant softening performance. The test curve for high temperature softening resistance of example 7 is shown in FIG. 6.
The bending properties were measured by the following methods: a copper alloy strip is sampled in a long strip shape along a rolling direction (namely a good direction) and in a long strip shape perpendicular to the rolling direction (namely a bad direction), the width of a sample is 10mm, then the long strip shape is bent by adopting a 90-degree V-shaped punch with different radiuses at the tip, and then the outer surface of the bent part is observed by adopting a stereoscopic microscope to be represented by the minimum bending radius/plate thickness without generating cracks on the surface.
The texture and the Schmidt factor of the strip are measured by adopting EBSD, the deflection angle in the test is 15 degrees, and the crystal area percentage occupied by different textures and the crystal area percentage occupied by the Schmidt factor with different sizes are counted. The EBSD photograph and texture detection results of example 4 are shown in fig. 1 and 2, respectively. The Schmidt factor scale for example 13 is shown in FIG. 3.
According to the embodiment, the copper alloy in the embodiment of the invention realizes the performances of the yield strength of more than or equal to 550MPa and the electric conductivity of more than or equal to 60% IACS, and meanwhile, the bending processing performance of the alloy is excellent, namely the bending radius ratio (r) parallel to the rolling direction (i.e. the good direction) of the strip is more than the thickness ratio (r)1T) is less than or equal to 1.0, and the ratio of the bending radius perpendicular to the rolling direction (i.e. the failure direction) to the thickness of the strip (r)2T) is less than or equal to 2.0. The copper alloy of the invention can meet the following stress relaxation resistance performance: the initial stress is 80% yield strength, and the residual stress of the strip after aging treatment at 120 ℃ for 1000 hours reaches 85-92% of the initial stress. The initial stress is 80% yield strength, and the residual stress of the strip after aging treatment at 150 ℃ for 1000 hours reaches 75-83% of the initial stress. Meanwhile, the comparison examples 21-30 show that the reasonable addition of Si, Zn, Co, Fe, Cr, Sn, Mg, Mn, Ti, Ag, Zr, single rare earth, mixed rare earth and other elements has the effects of yield strength, conductivity and stress relaxation resistanceImprovement in various degrees.
As can be seen from the comparative examples 1 to 6, when the contents of Ni and P do not satisfy the control requirements, or the weight percentage ratio of Ni to P does not satisfy 2.4 to 5.7, the properties of the material satisfying our needs cannot be obtained. It can be seen from comparative examples 7 to 8 that when the alloy orientation and the schmitt factor do not satisfy the control requirements, the alloy material having the bending property satisfying the requirements cannot be obtained although the strength and the conductivity of the alloy satisfy the requirements. As can be seen from comparative example 9, when the Si content in the alloy is more than 0.1 wt%, the conductive property of the alloy is significantly reduced, and an alloy satisfying our property requirements cannot be obtained.
The compositions and performance test results of the examples are shown in tables 1 and 2.
Table 1: example and comparative example Components
Claims (8)
1. The copper alloy with excellent bending performance is characterized by comprising the following components in percentage by weight: 0.51 to 2.00wt% of Ni, 0.10 to 0.35wt% of P, and the balance of Cu and inevitable impurities, wherein the weight percentage ratio of Ni to P is Ni/P =2.4 to 5.7; the ratio of each orientation area with the Schmidt factor of more than or equal to 0.3 on the rolled surface of the strip of the copper alloy is 98-100%, and the ratio of each orientation area with the Schmidt factor of more than or equal to 0.4 is 60-85%; the yield strength of the copper alloy strip is 550-700 MPa, the conductivity of the copper alloy strip is 60-70% IACS, and the ratio r of the bending radius parallel to the rolling direction to the thickness of the strip1T is less than or equal to 1.0, and the ratio r of the bending radius perpendicular to the rolling direction to the thickness of the strip2/t≤2.0。
2. The copper alloy excellent in bending formability according to claim 1, wherein the crystal orientation of the strip of the copper alloy satisfies the following conditions within a deviation angle of less than 15 °: the area ratio of the Brass orientation {011} <211> is 15.0-30.0%, the area ratio of the S orientation {123} <634> is 7.0-28.0%, the area ratio of the Copper orientation {112} <111> is 6.5-20.0%, and the area ratio of the R orientation {124} <211> is 6.0-16.0%.
3. The copper alloy with excellent bending property according to claim 1, wherein the copper alloy further comprises 0.01-0.50 wt% of Zn.
4. The copper alloy with excellent bending property according to claim 1, wherein the copper alloy further comprises 0.01-0.40 wt% of one or more selected from Co, Fe, Cr, Sn, Mg, Mn, Ti, Ag, Zr, single rare earth and mixed rare earth.
5. A method for preparing the copper alloy with excellent bending property according to any one of claims 1 to 4, which is characterized by comprising the following steps:
1) casting: melting a copper alloy raw material at 1100-1300 ℃ by adopting a conventional copper alloy melting method, and casting a cast ingot by an iron mold, horizontal continuous casting or vertical semi-continuous casting;
2) hot rolling: carrying out hot rolling on the ingot at the temperature of 700-980 ℃, and controlling the reduction rate of the hot rolled cross section area of the ingot to be not less than 75% to obtain a hot rolled plate;
3) first cold rolling: the hot rolled plate is cooled to room temperature and then is subjected to first cold rolling, and the reduction rate of the cross section area of the first cold rolling is controlled to be not less than 70 percent;
4) solution treatment: carrying out solution treatment on the plate subjected to the first cold rolling, and the specific process comprises the following steps: heating the plate at 700-900 ℃ for no less than 30s, then carrying out water cooling or air cooling treatment, and cooling to room temperature within 30 s-1 h;
5) and (3) second cold rolling: reducing the cross section area of the plate subjected to the solution treatment by 0-90% through second cold rolling;
6) aging: annealing the plate at the temperature of 350-450 ℃ for 0.5-12 h;
7) and (3) cold rolling for the third time: and reducing the cross section area of the plate by 20-70% through third cold rolling.
6. The method for preparing the copper alloy with excellent bending property according to claim 5, further comprising the following steps: annealing the plate at 200-550 ℃ for 1 min-10 h after the third cold rolling in the step 7).
7. The method of manufacturing a copper alloy excellent in bending formability according to claim 5 or 6, wherein the step 5) and the step 6) are repeated a plurality of times as a single step unit.
8. The use of the copper alloy according to any one of claims 1 to 4, which has excellent bending properties, in a connector, a bus bar, a relay spring, and a heat dissipation system.
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| CN201911017399.3A CN110643850B (en) | 2019-10-24 | 2019-10-24 | Copper alloy with excellent bending performance and preparation method and application thereof |
| PCT/CN2019/000210 WO2021077241A1 (en) | 2019-10-24 | 2019-11-08 | Copper alloy with excellent anti-bending performance, preparation method therefor and use thereof |
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| CN201911017399.3A CN110643850B (en) | 2019-10-24 | 2019-10-24 | Copper alloy with excellent bending performance and preparation method and application thereof |
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| CN111304489B (en) * | 2020-04-18 | 2022-05-03 | 宁波兴业盛泰集团有限公司 | Preparation and processing method of copper alloy plate strip for vapor chamber |
| CN111733372B (en) * | 2020-08-27 | 2020-11-27 | 宁波兴业盛泰集团有限公司 | Elastic copper-titanium alloy and preparation method thereof |
| CN113484351A (en) * | 2021-07-07 | 2021-10-08 | 中国航发北京航空材料研究院 | Method for representing yield strength anisotropy of beta forging titanium alloy forging |
| CN113981265A (en) * | 2021-09-07 | 2022-01-28 | 铜陵有色金属集团股份有限公司金威铜业分公司 | Copper alloy having excellent hot rolling properties and method for producing same |
| CN114196850B (en) * | 2021-12-22 | 2022-08-23 | 宁波兴业盛泰集团有限公司 | Low residual stress copper alloy for lead frame and preparation method thereof |
| CN113981264B (en) * | 2021-12-28 | 2022-03-29 | 宁波兴业盛泰集团有限公司 | Copper alloy material and preparation method and application thereof |
| CN114855026B (en) * | 2022-03-25 | 2023-02-14 | 宁波博威合金材料股份有限公司 | High-performance precipitation strengthening type copper alloy and preparation method thereof |
| CN115369280A (en) * | 2022-08-20 | 2022-11-22 | 国工恒昌新材料沧州有限公司 | C17460 alloy and preparation process thereof |
| CN116694954B (en) * | 2023-06-30 | 2023-12-22 | 宁波博威合金板带有限公司 | Copper alloy plate strip and preparation method thereof |
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