CN101784684B - High-strength high-electroconductivity copper alloy possessing excellent hot workability - Google Patents
High-strength high-electroconductivity copper alloy possessing excellent hot workability Download PDFInfo
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- CN101784684B CN101784684B CN2008801037913A CN200880103791A CN101784684B CN 101784684 B CN101784684 B CN 101784684B CN 2008801037913 A CN2008801037913 A CN 2008801037913A CN 200880103791 A CN200880103791 A CN 200880103791A CN 101784684 B CN101784684 B CN 101784684B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Abstract
This invention provides a copper alloy, for an electronic component, formed of a Cu-Ni-P-base alloy which has good hot workability and, at the same time, can exhibit high strength, high electroconductivity, and high heat conductivity without sacrificing bendability. The copper alloy comprises, by mass, Ni: 0.50% to 1.00% and P: 0.10% to 0.25%. The content ratio of Ni to P is Ni/P = 4.0 to 5.5. The copper alloy further comprises Cr: 0.03% to 0.45% and O: not more than 0.0050%. The content of at least one of Fe, Co, Mn, Ti, and Zr is not more than 0.05%, preferably not more than 0.03%, in total. In the copper alloy, the balance consists of Cu and unavoidable impurities. Regarding the size of Ni-P-base second phase particles, not less than 80% of the area of the total second phase particles contained in the copper alloy is accounted for by second phase particles having an a value of not less than 20 nm and not more than 50 nm and an aspect ratio, a/b, of not less than 1 and not more than 5 wherein a represents a major axis and b represents a minor axis.
Description
Technical field
The electronics part that the present invention relates to a kind of HS, high conductivity is used copper alloy; Be particularly related to a kind of lead-in wire at small-sized, highly integrated semiconductor devices with and terminal connector with copper alloy in; Have superior hot workability and can not damage bendability, and particularly the electronic component of intensity, electroconductibility, excellent thermal conductivity is used copper alloy.
Background technology
Copper and copper alloy are as junctor, lead terminal electronic component and pliability circuit board uses such as (lead terminal); Relate to multiple use by the material that extensively utilizes; Because the demand of the high performance of the fast-developing caused information equipment of infotechization and miniaturized, slimming, require further to promote the characteristic (intensity, bendability, electroconductibility) of copper and copper alloy for reply.
In addition; As IC (Integrated Circuit; Unicircuit) highly integrated; The use of the semiconductor element that consumes electric power is high is increasing, in the lead frame material of semiconductor devices, uses precipitation type alloys such as the good Cu-Ni-Si system of thermal diffusivity (electroconductibility), Cu-Fe-P, Cu-Cr-Sn, Cu-Ni-P.
In patent documentation 1, proposing a kind of is that Ni in the alloy, P, Mg become component to adjust to Cu-Ni-P, thereby possesses the alloy of intensity and electroconductibility, stress relaxation-resistant characteristic.
Patent documentation 1: Japanese Patent open communique spy open 2000-273562 number
Usually, in the casting of copper alloy, for example, in continuous or semicontinuous casting, ingot casting dispels the heat through mold, and except the ingot casting top layer number millimeter, inside can need the some time to solidify.At this moment, in the process of cooling when solidifying and after solidifying, amount surpasses at room temperature can or separate out at crystal grain boundary or crystal grain intercrystalline in the alloying element of the boundary of Cu parent phase in solid solution.Be the crystal grain interface crystallization of alloy or the Ni-P based compound of separating out particularly at Cu-Ni-P; Because its fusing point is lower than the Cu of parent phase; Therefore the stress or the external force that can be produced because of the uneven strain in solidifying etc. cause producing destruction in the part of Ni-P based compound.In addition, even when hot rolled heats, if the Ni-P based compound is softening or liquefaction, then also crackle can take place when carrying out hot rolling.As stated, Cu-Ni-P is that alloy exists in casting and the problem of crackle takes place during hot rolling, but patent documentation 1 this problem not to be noted.
Summary of the invention
The object of the present invention is to provide a kind of can prevent in the casting step and the hot-work step add pine for or hot-work in the crackle that taken place, and hot workability is good and can not damage bendability just to bring into play the Cu-Ni-P of HS, high conductivity and high thermal conductivity be that the electronic component that alloy constitutes is used copper alloy.
The inventor etc. are in order to reach above-mentioned purpose, through the continuous result of research, find through adopting following formation, and can not damage the Cu-Ni-P that bendability just can obtain possessing excellent hot workability and excellent in strength and electroconductibility is alloy.
The present invention is a kind of high-strength high-conductive copper alloy that has superior hot workability, and it is characterized in that: contain Ni:0.50%～1.00% (% that in this manual, is expressed as proportion by subtraction is quality %), P:0.10%～0.25% in the said copper alloy; The Ni and the ratio Ni/P of the amount of P are 4.0～5.5, and Cr is 0.03%～0.45%, and O is below 0.0050%; More than one amount adds up to below 0.05% among Fe, Co, Mn, Ti and the Zr, is preferably below 0.03%, and remainder is made up of Cu and unavoidable impurities; Size for the second phase particle; If major diameter is a, when minor axis was b, a was that 20nm～50nm and long-width ratio (aspect ratio) a/b are 1～5 the second phase particle; Area occupation ratio with whole second phase particles contained in copper alloy calculates, and accounts for more than 80%.
Copper alloy of the present invention, further can contain content add up among 0.01%～1.00% Sn and the In more than a kind.
The present invention through being the Cr that alloy adds specified quantitative to Cu-Ni-P, can suppress the Ni-P compound to the crystal grain boundary crystallization or separate out, and can improve the high-temperature brittleness of crystal boundary thus and improve hot workability.
Embodiment
Then, explain that the present invention limits the reason and the effect thereof of the numerical range that the one-tenth of copper alloy is grouped into.
The amount of Ni
Ni can solid solution in alloy, have the effect of guaranteeing intensity, stress relaxation-resistant characteristic and thermotolerance (at high temperature keeping high-intensity characteristic), and separating out of stating after can making with the formed compound of P, help to improve the intensity of alloy.Yet, if its amount less than 0.50% o'clock, can't obtain desirable intensity; On the other hand; If the Ni that contains is greater than 1.00%, then electric conductivity will significantly reduce, and can't obtain tensile strength more than the 650MPa and the high-strength and high-conductivity of electric conductivity more than 45%IACS.Therefore the Ni amount of alloy of the present invention is 0.50%～1.00%.
The amount of P
P can improve thermotolerance, thereby and can separate out the intensity that improves alloy with the formed compound of Ni.If the P amount is less than 0.10%, then because separating out of compound can be insufficient, so can't obtain desirable intensity.On the other hand, if the P amount greater than 0.25%, then the content balance of Ni and P will be collapsed and made that the P in the alloy is superfluous, the amount of the P of solid solution increases, electric conductivity significantly reduces.Therefore the P amount of alloy of the present invention is 0.10%～0.25%.
The ratio of Ni/P
Even the amount of Ni and P is in above-mentioned limited range, if Ni and the ratio Ni/P of the amount of P depart from the second suitable stoichiometric composition ratio of particle mutually, promptly; Under less than 4.0 situation; Then the solid solution capacity of P can increase, and when greater than 5.5 the time, then the solid solution capacity of Ni can increase; Electric conductivity can significantly reduce, so be bad.Therefore the ratio of the Ni/P of alloy of the present invention is preferably 4.5～5.0 below 4.0～5.5.
The amount of Cr
Usually, when the speed of cooling when Cu-Ni-P is solidifying of alloy is slow, for example from 1100 ℃ to 950 ℃ speed of cooling less than 30 ℃/timesharing, because the Ni-P based compound can follow centralization, thickization in the crystal grain boundary crystallization, so be bad.
When Cu-Ni-P is solidifying of alloy or when process of cooling after solidifying and hot worked heating, Cr can suppress the Ni-P compound to the crystal grain boundary crystallization or separate out, and improves the hot workability of alloy.Yet, if its amount less than 0.03% o'clock, the effect of the hot workability that can't improve on the other hand, if the Cr that contains produces compounds such as Ni-P-Cr, Cr-P in greater than 0.45%, then can or solidifying in fusion, perhaps produces the crystallisate of Cr.These contain compound and the crystallisate of Cr, can solid solution when solution treatment in the Cu parent phase, the Ni-P compound of therefore when ageing treatment, separating out will reduce, thereby causes the intensity of alloy to reduce.Compound such as Ni-P-Cr, Cr-P in addition; Owing in product, can remain in the product with the inclusion form more than the major diameter 5 μ m; The starting point of the defective the when starting point of the crackle when becoming surface imperfection, the bending machining of product and plating are handled is so be bad.Therefore, the Cr amount of alloy of the present invention is 0.03%～0.45%, is preferably 0.05%～0.30%.
The amount of Fe, Co, Mn, Ti and Zr
The all easy and P generation compound of any material of Fe, Co, Mn, Ti and Zr; And compounds such as generation Fe-P, Co-P, Mn-P, Ti-P and Zr-P in fusion or in solidifying; In addition; If in ageing treatment, separate out these compounds, then the second phase particle of Ni-P system will reduce, thereby causes the intensity of alloy to reduce.Therefore, the independent or two or more amount of Fe, Co, Mn, Ti and Zr is below 0.05%, and preferred total amount is below 0.03%.
The amount of O
O reacts with P and Cu in alloy easily, if in alloy, exist with the state (Cu-P-O) of oxide compound, then will hinder the separating out of compound of Ni and P, and causes the intensity reduction, and bendability is degenerated.Therefore, the O amount of alloy of the present invention is below 0.0050%, preferably below 0.0030%.
The amount of Sn, In
Any material of Sn and In can not make the electroconductibility of alloy significantly reduce, and Sn and In mainly have the effect that improves intensity through solution strengthening.Therefore can optionally add more than one of these metals; If but its amount in total amount less than 0.01% o'clock; Then can't obtain reaching the effect that improves intensity through solution strengthening; On the other hand, if when add surpassing 1.0% amount in total amount, then the electric conductivity of alloy and bendability will significantly reduce.Therefore, add separately or Sn that compound interpolation is two or more and the amount of In are 0.01%～1.0%, preferably count 0.05%～0.8% with total amount.In addition, these elements, the element for add intentionally is not a unavoidable impurities in the present invention.
The size of the second phase particle and area occupation ratio
Comprise precipitate, crystallisate, inclusion etc. in the second phase particle of the present invention.In compositing range of the present invention, can not separate out Ni-P usually is the second phase particle beyond the second phase particle, and Ni-P is the second phase particle, except in solution treatment, also can in ageing treatment, be controlled to specific size.As other the second phase particle; Can there be " crystallisate " (Ni-P, Ni-P-Cr etc.), " inclusion " (oxide compound and sulfide such as Cu-O, Cu-Ni-P-O, Cu-Ni-P-Cr-O, Cu-S) of being produced in fusion and the casting in the present invention; But when having these materials; Its size can play from 100nm and surpass 1 μ m, even handle through solution treatment and timeliness, can not their size be controlled within the scope of the invention.Therefore, fully carry out solution treatment crystallisate, inclusion are not residued in the alloy, and in order to suppress the generation of inclusion, and the addition of regulation P, Cr etc., and for the generation of inhibited oxidation thing (inclusion), and the lower O amount of regulation.Area occupation ratio C in the sample that can not fully reduce crystallisate and inclusion is less than 80%, outside scope of the present invention.
If establish the major diameter of the second phase particle is a (nm), and when minor axis was b (nm), then final a before cold rolling was less than the second phase particle of 20nm; If process the above rolling processing in deformation η=2; Then the second phase particle again solid solution in copper, electric conductivity is reduced, so be bad.Here, processing deformation η refers to that when establishing rolling preceding thickness of slab be t
0, when the thickness of slab after rolling is t, η=ln (t
0/ t).On the other hand, the final cold rolling preceding second phase particle of a more than 20nm even process the above rolling processing in deformation η=2, also is difficult to solid solution again, will exist with the form of the second phase particle more than the 20nm, and helps precipitation strength and work strengthening.Yet; Major diameter a before rolling is greater than the second phase particle of 50nm; Owing to after rolling, also be difficult to solid solution again and can keep its size,, therefore cause to obtain the effect of precipitation strength and work strengthening so the second phase dispersion of particles in the alloy will become excessive at interval.
In addition; Above-mentioned major diameter a and minor axis b; Parallel with rolling direction and vertically cut for the alloy bar before will be final cold rolling with thickness direction; Use image analysis apparatus that the second phase particle of all major diameter a more than 5nm measured to profile image, and the major diameter of the whole second phase particles that obtain and minor axis MV separately.
According to foregoing, the final cold rolling preceding preferred size of the second phase particle of alloy of the present invention is that major diameter a is 20nm～50nm.
In addition, if represent the long-width ratio of the second phase particle with a/b, then when a/b greater than 5 the time, if carry out the above rolling processing in η=2, then the second phase particle again solid solution in copper, electric conductivity is reduced.The long-width ratio a/b of the therefore final second phase particle before cold rolling is preferably 1～5, and more preferably 1～3.
In order to prevent the reduction of intensity and electric conductivity, a of the second phase particle after preferred alloy of the present invention final cold rolling is 20nm～50nm, and a/b is 1～5.Yet owing to be difficult to make the second whole phase particles all in the preferable range of above-mentioned a and a/b, therefore the second phase particle in the scope of above-mentioned a and a/b becomes important with respect to the ratio of whole second phase particles.In addition, " whole second phase particle " is meant the whole of the second phase particle of major diameter a more than 5nm.Therefore; If the area summation of the second phase particle that will be in the preferable range of above-mentioned a and a/b; During as area occupation ratio C, area occupation ratio C then of the present invention is more than 80% with respect to the ratio of the area summation of the whole second phase particles in the final alloy before cold rolling after the ageing treatment.
Area occupation ratio C is less than 80% situation, for existing a greater than the second phase particle of 50nm or less than the second phase particle of 20nm in a large number.For example; When solid solution and Ni-P particle (crystallisate) more than the 1000nm that left behind etc. do not exist in a large number in heating and the solution treatment before hot rolling of crystallisate that a is produced during greater than the second phase particle of 50nm, fusion casting; Since big to improving the helpful size of intensity from 20 to 50nm fine second phase dispersion of particles interval, so can not obtain desirable intensity through the work hardening in the rolling processing.On the other hand, a is less than the second phase particle of 20nm, because can be because of rolling processing solid solution again, so electric conductivity can significantly reduce.
The Cu-Ni-P that satisfies the prerequisite of the invention described above is an alloy; The ingot casting casting that those skilled in the art is adopted when usually making, hot rolling, solution treatment, middle cold rolling, ageing treatment, finally in cold rolling, the stress relief annealing etc., wait and make through selecting suitable Heating temperature, time, speed of cooling, rolling rate.For example, can be according to (1) fusion, casting, (2) hot rolling; (3) scale removal, (4) cold rolling (adjustment thickness), (5) solution treatment; (6) cold rolling, (7) ageing treatment, (8) surface cleaning is handled (grinding, pickling); (9) cold rolling (finally), the order of (10) stress relief annealing repeats or clipped step is made.
Temperature and time when preferably suitably adjusting ageing treatment, and preferably make about final cold rolling degree of finish η=0～1.4.
Embodiment
The manufacturing of sample
With electrolytic copper or oxygen free copper is main raw material; With nickel (Ni), 15%P-Cu mother alloy (P), 10%Cr-Cu mother alloy (Cr), tin (Sn), indium (In), 10%Fe-Cu (Fe), 10%Co-Cu (Co), 25%Mn-Cu (Mn), Titanium Sponge 40-60 mesh (Ti) and zirc sponge (Zr) is auxiliary material; Utilize the high-frequency melting stove in a vacuum or in the argon atmospher with its fusion, be cast as the ingot casting of 45 * 45 * 90mm.Carry out the hot rolling test of ingot casting, to the ingot casting of crackle does not take place, according to hot rolling and solution treatment, ageing treatment, middle cold rolling, ageing treatment, finally order cold rolling, stress relief annealing is implemented to handle, and processes the flat board of thickness 0.15mm in hot rolling.Gather the various test films of prepared sheet material, make an experiment, " intensity " is reached " electric conductivity " estimate.
The hot workability evaluation of ingot casting
" hot workability " estimated through hot rolling.That is, ingot casting is cut into 45 * 45 * 25mm, after 1 hour, carries out testing by the hot rolling of thickness 25mm to 5mm with 3 stages 850 ℃ of heating.Specimen surface after the hot rolling and edge when recognizing crackle, are evaluated as " crackle is arranged " with visual, on the surface and the edge flawless, when level and smooth, are evaluated as " flawless ".
In the present invention, have superior hot workability to be meant in above-mentioned evaluation to be " flawless ".
The evaluation of physical property of test film
For " intensity ", utilize the tension test of JIS Z 2241 defineds, use No. 13 B test films to make an experiment, measured tensile strength.
In the present invention, HS is meant that tensile strength is more than 650MPa in above-mentioned evaluation.
" electric conductivity " is to use 4 terminal methods that the resistance of test film is measured, and representes with %IACS.
In the present invention, high conduction is meant that electric conductivity is more than 45%IACS in above-mentioned evaluation.
" bendability " estimated with 90 degree W pliability tests.Experimental evidence CES-M0002-6 uses the anchor clamps of R-0.1mm, carries out 90 degree bending machining with the load of 50kN.The evaluation of bend is a situation of utilizing observation by light microscope central part bump surface, establishes generation crackle person and is " * ", and it is " △ " that the fold person is taken place, and good person is " zero ".Bending axis is right angle (Good way, a good way) with respect to rolling direction.
Ni-P is the evaluation of the second phase particle
Final alloy bar before cold rolling is parallel with rolling direction and vertically cut with thickness direction, use sem and transmission electron microscope, from the second phase particle of 10 visuals field observation sections.Size at the second phase particle is under the situation of 5nm～50nm, with 500,000 times～700,000 times the visuals field (about 1.4 * 10
10～2.0 * 10
10Nm
2) take a picture, be under the situation of 50nm～2000nm in the size of the second phase particle, with 50,000 times～100,000 times the visuals field (about 1.0 * 10
13～2.0 * 10
13Nm
2) take a picture.Photograph image to gained uses image analysis apparatus (Nireco Corp.'s system, trade(brand)name: LUZEX) the second phase particle of major diameter a more than 5nm all measured major diameter a, minor axis b and area one by one.From 100 of these second phase particle picked at random, obtain the MV a of the major diameter of whole second phase particles
Ta, minor axis MV b
TaReach the mean aspect ratio a that tries to achieve according to them
Ta/ b
Ta, respectively as major diameter a, minor axis b and long-width ratio a/b.If the summation of the area of the whole second phase particles of major diameter a more than 5nm is whole second phase total areas of particles.Is major diameter a that 20nm～50nm and long-width ratio a/b are the area summation of 1～5 the second phase particle, with respect to the ratio of these whole second phase total areas of particles as area occupation ratio C (%).
In addition; Learn through confirming, through finally cold rolling (processing deformation η=more than 2) usually; Though being the second phase particle or major diameter, the Ni-P below the major diameter 20nm understands solid solution greater than 5 the second phase particle greater than 20nm and long-width ratio; But 20nm is above and long-width ratio is 1～5 the second phase particle, final cold rolling after, keep its major diameter, minor axis and long-width ratio constant.In addition, the area occupation ratio C of the second phase particle because can be because of rolling solid solution again greater than the second phase particle of 20nm, thus final cold rolling after, almost do not change yet.
The copper alloy that is grouped into for the one-tenth shown in the table 1 is explained the embodiment of the high-strength high-conductive copper alloy that has superior hot workability of the present invention with comparative example.Crackle does not take place in alloy embodiment 1～8 of the present invention when hot rolling, and possesses excellent intensity and electric conductivity.On the other hand, if the result of research comparative example 9～26, then for comparative example 9～12, owing to not adding Cr or addition, so crackle takes place when hot rolling less than specified amount.Comparative example 13 is because the addition of Sn and In adds up to greater than 1.0%, and comparative example 14 is because the addition of In adds up to also greater than 1.0%, and it is all bad that therefore electric conductivity reduction and bendability all take place.Comparative example 15 because the ratio of Ni/P is higher than scope of the present invention, reduces so the solid solution capacity of Ni increases and electric conductivity takes place, and because the amount of the second phase particle is few, so intensity is also low.Comparative example 16 because the ratio of Ni/P is lower than suitable ratio of components, reduces so the solid solution capacity of P increases and electric conductivity takes place, and intensity is also low.Comparative example 17 is because the addition of Ni and P is lower than scope given to this invention, so intensity is low.The Ni amount of comparative example 18 and the P amount of comparative example 19 reduce so electric conductivity takes place owing to all be higher than scope given to this invention.Comparative example 20, because the amount of O is greater than 0.0050%, so when fusion, generate the oxide compound of Cu-P-O, the second phase particle weight of Ni-P system reduces, and intensity is low, and bendability is also bad.Comparative example 21, because the amount of Cr is higher than scope given to this invention, thus when fusion, casting, generate Ni-P-Cr, Cr-P etc., and because crystallization reduces the second phase particle of Ni-P system, intensity and electric conductivity are low, bendability is also bad.Comparative example 22 and 23 is because the amount of Fe, Co, Mn, Ti and Zr is higher than scope given to this invention, so because of these elements and P generation compound, the second phase particle of Ni-P system is reduced, and intensity is low.Comparative example 24 is higher than scope given to this invention because Ni-P is the average major diameter of the second phase particle, is that the area occupation ratio C of 1～5 the second phase particle is zero so major diameter is 20nm～50nm and long-width ratio, can not be through the cold rolling intensity that improves, and intensity is low.Comparative example 25 and 26 is lower than scope given to this invention because Ni-P is the average major diameter of the second phase particle, thus area occupation ratio C less than 80%, Ni-P is the second phase particle generation solid solution when cold rolling, electric conductivity is low.
Table 2
" ※ " expression can't be estimated because of obtaining sample.
Claims (2)
1. a high-strength high-conductive copper alloy that has superior hot workability is characterized in that: by quality ratio, contain Ni:0.50%～1.00%, P:0.10%～0.25%; The Ni and the ratio Ni/P of the amount of P are 4.0～5.5, and Cr is 0.03%～0.45%, and O is below 0.0050%; More than one amount is aggregated in below 0.05% among Fe, Co, Mn, Ti and the Zr; Remainder is made up of Cu and unavoidable impurities, and for the size of the second phase particle, establishing major diameter is a; When minor axis is b; A is below the above 50nm of 20nm and long-width ratio a/b is the second phase particle below 5 more than 1, and the area occupation ratio calculating with whole second phase particles contained in copper alloy accounts for more than 80%.
2. the high-strength high-conductive copper alloy that has superior hot workability according to claim 1 is characterized in that: said copper alloy contains content and adds up to 0.01%～1.0% Sn and among the In more than one.
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| JP2007251849 | 2007-09-27 | ||
| JP2007-251849 | 2007-09-27 | ||
| PCT/JP2008/064931 WO2009041194A1 (en) | 2007-09-27 | 2008-08-21 | High-strength high-electroconductivity copper alloy possessing excellent hot workability |
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| CN101784684B true CN101784684B (en) | 2012-05-23 |
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| KR (1) | KR101203437B1 (en) |
| CN (1) | CN101784684B (en) |
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| WO2016171055A1 (en) * | 2015-04-24 | 2016-10-27 | 古河電気工業株式会社 | Copper alloy material and method for producing same |
| CN105603253B (en) * | 2016-01-15 | 2017-10-17 | 宁波博威合金材料股份有限公司 | A kind of nickeliferous phosphorus, the Cu alloy material of nickel boron phase and its manufacture method |
| CN107541613B (en) * | 2016-06-28 | 2019-03-08 | 沈阳慧坤新材料科技有限公司 | One Albatra metal and its preparation method and application |
| CN110643850B (en) * | 2019-10-24 | 2020-12-01 | 宁波博威合金材料股份有限公司 | Copper alloy with excellent bending performance and preparation method and application thereof |
| CN115537595B (en) * | 2022-09-30 | 2023-08-01 | 宁波金田铜业(集团)股份有限公司 | Copper foil and preparation method thereof |
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| JP4950734B2 (en) * | 2007-03-30 | 2012-06-13 | Ｊｘ日鉱日石金属株式会社 | High strength and high conductivity copper alloy with excellent hot workability |
| JP5101149B2 (en) * | 2007-03-30 | 2012-12-19 | Ｊｘ日鉱日石金属株式会社 | High strength and high conductivity copper alloy with excellent hot workability |
| JP5079574B2 (en) * | 2008-03-31 | 2012-11-21 | Ｊｘ日鉱日石金属株式会社 | High strength and high conductivity copper alloy with excellent hot workability |
-
2008
- 2008-08-21 WO PCT/JP2008/064931 patent/WO2009041194A1/en active Application Filing
- 2008-08-21 CN CN2008801037913A patent/CN101784684B/en not_active Expired - Fee Related
- 2008-08-21 KR KR1020107001453A patent/KR101203437B1/en active IP Right Grant
- 2008-08-21 JP JP2009534243A patent/JP5232794B2/en not_active Expired - Fee Related
- 2008-08-26 TW TW97132498A patent/TWI386493B/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498978A (en) * | 2002-10-31 | 2004-05-26 | 日矿金属株式会社 | Easy machining, high strength and high conductive copper alloy |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2001-335864A 2001.12.04 |
| JP特开2005-298931A 2005.10.27 |
| JP特开2006-16667A 2006.01.19 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101784684A (en) | 2010-07-21 |
| JP5232794B2 (en) | 2013-07-10 |
| TW200925298A (en) | 2009-06-16 |
| KR20100021666A (en) | 2010-02-25 |
| WO2009041194A1 (en) | 2009-04-02 |
| KR101203437B1 (en) | 2012-11-21 |
| TWI386493B (en) | 2013-02-21 |
| JPWO2009041194A1 (en) | 2011-01-20 |
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