CN110611018A - LED chip transfer method, substrate and system - Google Patents
LED chip transfer method, substrate and system Download PDFInfo
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- CN110611018A CN110611018A CN201911001288.3A CN201911001288A CN110611018A CN 110611018 A CN110611018 A CN 110611018A CN 201911001288 A CN201911001288 A CN 201911001288A CN 110611018 A CN110611018 A CN 110611018A
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- 239000000758 substrate Substances 0.000 title claims abstract description 101
- 238000012546 transfer Methods 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000007853 buffer solution Substances 0.000 claims abstract description 31
- 239000000243 solution Substances 0.000 claims abstract description 14
- 239000000872 buffer Substances 0.000 claims abstract description 10
- 239000012530 fluid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a transfer method, a substrate and a system of an LED chip, wherein the transfer method of the LED chip comprises the following steps: the LED chip transfer substrate is arranged in a solution tank containing a buffer solution, and comprises a substrate body and a groove defined by the substrate body; immersing a first LED chip, a second LED chip, and a third LED chip in a buffer, the first LED chip including a first shaped base, the second LED chip including a second shaped base, the third LED chip including a third shaped base; the buffer solution is driven to flow so as to align the first shape base part into the first groove, align the second shape base part into the second groove, align the second shape base part into the third groove, and attract each other through magnetic force between the first groove and the first LED chip, between the second groove and the second LED chip, and/or between the third groove and the third LED chip. When the LED chips are transferred in a large quantity, the red light LED chips, the green light LED chips and the blue light LED chips are effectively distinguished, and the efficiency and the accuracy rate during transfer are improved.
Description
Technical Field
The embodiment of the invention relates to an LED chip transfer technology, in particular to a transfer method, a substrate and a system of an LED chip.
Background
In the manufacturing process of the Micro-LED display device, because the size of the Micro-LED chip is small, a large number of LED chips are often needed for manufacturing the display device. For a 4K television, 829.4 ten thousand Micro-LED chips are needed for a single screen, 2488.2 ten thousand red LED chips, green LED chips and blue LED chips are needed to be transferred, the pixel diameter of each Micro-LED is only 30 mu m, the processing speed of the equipment is about 25000 units per hour at present, and 1 month or more is needed for processing a 4K screen. Therefore, the mass transfer technology becomes a difficulty in the development and production technology of Micro-LED display, and particularly, when the red LED chip, the green LED chip and the blue LED chip are simultaneously and massively transferred, the red LED chip, the green LED chip and the blue LED chip need to be accurately distinguished.
Disclosure of Invention
The invention provides a transfer method, a substrate and a system of LED chips, which are used for realizing the simultaneous massive transfer process of red LED chips, green LED chips and blue LED chips and effectively distinguishing and accurately transferring the red LED chips, the green LED chips and the blue LED chips.
In a first aspect, an embodiment of the present invention provides a method for transferring an LED chip, including:
placing an LED chip transfer substrate in a solution tank containing a buffer solution, wherein the buffer solution submerges the LED chip transfer substrate, the LED chip transfer substrate comprises a substrate body and grooves defined by the substrate body, the grooves comprise a first groove, a second groove and a third groove, the first groove is in a first shape, the second groove is in a second shape, and the third groove is in a third shape;
immersing a first LED chip, a second LED chip, and a third LED chip in the buffer, the first LED chip including a first shaped base, the second LED chip including a second shaped base, the third LED chip including a third shaped base;
driving the buffer solution to flow so as to align the first-shaped base part into the first groove, align the second-shaped base part into the second groove, align the second-shaped base part into the third groove, and attract each other by magnetic force between the first groove and the first LED chip, between the second groove and the second LED chip, and/or between the third groove and the third LED chip.
Optionally, after driving the buffer fluid to flow to align the first shape base into the first groove, the second shape base into the second groove, and the second shape base into the third groove, the method further includes:
and fixing the first LED chip, the second LED chip and the third LED chip on the LED chip transfer substrate on a target substrate.
Optionally, fixing the first LED chip, the second LED chip, and the third LED chip on the LED chip transfer substrate on a target substrate, further includes:
separating the LED chip transfer substrate from the first LED chip, the second LED chip, and the third LED chip.
Optionally, the first surface of the first shaped base comprises a first magnetic pole, the second surface of the second shaped base comprises a second magnetic pole, the third surface of the third shaped base comprises a third magnetic pole, and the first magnetic pole, the second magnetic pole, and the third magnetic pole are all N magnetic poles or S magnetic poles at the same time.
Optionally, the first groove further includes a first coil, the second groove further includes a second coil, the third groove further includes a third coil, and the driving the buffer solution to flow further includes:
controlling a first end of the first coil to generate a fourth magnetic pole, wherein a magnetic attraction force is formed between the fourth magnetic pole and the first magnetic pole;
controlling a second end of the second coil to generate a fifth magnetic pole, wherein a magnetic attraction force exists between the fifth magnetic pole and the second magnetic pole;
and controlling a third end of the third coil to generate a sixth magnetic pole, wherein magnetic attraction is formed between the sixth magnetic pole and the third magnetic pole.
Optionally, the separating the LED chip transfer substrate from the first LED chip, the second LED chip, and the third LED chip includes:
disconnecting the power of the first coil, the second coil, and the third coil to separate the LED chip transfer substrate from the first LED chip, the second LED chip, and the third LED chip.
Optionally, the first groove further includes a seventh magnetic pole, the second groove further includes an eighth magnetic pole, the third groove further includes a ninth magnetic pole, a magnetic attraction force is formed between the seventh magnetic pole and the first magnetic pole, a magnetic attraction force is formed between the eighth magnetic pole and the second magnetic pole, and a magnetic attraction force is formed between the ninth magnetic pole and the third magnetic pole.
Optionally, the separating the LED chip transfer substrate from the first LED chip, the second LED chip, and the third LED chip includes:
and placing the LED chip transfer substrate in a substrate dissolving solution for dissolving so as to separate the LED chip transfer substrate from the first LED chip, the second LED chip and the third LED chip.
In a second aspect, an embodiment of the present invention provides a transfer substrate for an LED chip, including: the substrate comprises a substrate body and a groove defined by the substrate body, wherein the groove comprises a first groove, a second groove and a third groove, the first groove is in a first shape, the second groove is in a second shape, the third groove is in a third shape, the first groove is used for aligning with a first shape base of a first chip, the second groove is used for aligning with a second shape base of a second chip, and the third groove is used for aligning with a third shape base of a third chip.
In a third aspect, an embodiment of the present invention provides a transfer system for an LED chip, including:
the solution tank is used for containing buffer solution;
and the LED chip transfer substrate is immersed in the buffer solution.
According to the technical scheme, the first-shaped base part is aligned into the first groove, the second-shaped base part is aligned into the second groove, and the second-shaped base part is aligned into the third groove, so that the problem that different types of chips are difficult to distinguish when multiple LED chips are transferred simultaneously is solved, the red LED chips, the green LED chips and the blue LED chips are effectively distinguished when the LED chips are transferred in a large amount, the efficiency and the accuracy rate of subsequent transfer are improved, and the disorder of the display of the LED display produced due to the dislocation of the red LED chips, the green LED chips and the blue LED chips in subsequent installation is avoided.
Drawings
The foregoing and other features and advantages of embodiments of the present invention will become more apparent to those of ordinary skill in the art to which the present invention pertains by describing in detail exemplary embodiments thereof with reference to the attached drawings, wherein:
fig. 1 is a flowchart of a method for transferring LED chips according to a first embodiment of the present invention;
FIG. 2 is a schematic view of an LED chip transfer substrate placed in a solution tank containing a buffer solution according to a first embodiment of the present invention;
FIG. 3 is a schematic view of the first shape of the base and the first groove, the second shape of the base and the second groove, and the second shape of the base and the third groove being aligned respectively according to the first embodiment of the present invention;
FIG. 4 is a flowchart of a method for transferring LED chips according to a first embodiment of the present invention;
FIG. 5 is a flow chart of a method for transferring LED chips according to a first embodiment of the present invention;
FIG. 6 is a flow chart of a method for transferring LED chips according to a second embodiment of the present invention;
fig. 7 is a schematic view of an LED chip transfer substrate according to a second embodiment of the present invention;
FIG. 8 is a schematic view of the second shape of the base and the third groove being aligned with the first shape of the base and the first groove, and the second shape of the base and the second groove, respectively, according to the second embodiment of the present invention;
fig. 9 is a flowchart of a transfer method of LED chips in a third embodiment of the present invention;
fig. 10 is a schematic view of an LED chip transfer substrate, a first shape base, a second shape base, and a third shape base in the third embodiment of the present invention.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and not restrictive thereof. It should also be noted that the described embodiments are only some embodiments, not all embodiments, of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the terms "first," "second," and the like may be used herein to describe various orientations, actions, steps, elements, or the like, but the orientations, actions, steps, or elements are not limited by these terms. These terms are only used to distinguish one direction, action, step or element from another direction, action, step or element. For example, the first LED chip may be referred to as a second LED chip, and similarly, the second LED chip may be referred to as a first LED chip, without departing from the scope of the present invention. The first LED chip and the second LED chip are both LED chips, but they are not the same LED chip. The terms "first", "second", etc. are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. It should be noted that when a portion is referred to as being "secured to" another portion, it can be directly on the other portion or there can be an intervening portion. When a portion is said to be "connected" to another portion, it may be directly connected to the other portion or intervening portions may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the steps as a sequential process, many of the steps can be performed in parallel, concurrently or simultaneously. In addition, the order of the steps may be rearranged. A process may be terminated when its operations are completed, but may have additional steps not included in the figure. A process may correspond to a method, a function, a procedure, a subroutine, a subprogram, etc.
Example one
Fig. 1 is a flowchart of a transfer method of an LED chip according to an embodiment of the present invention, which specifically includes the following steps:
step 110, placing an LED chip transfer substrate in a solution tank containing a buffer solution, wherein the buffer solution immerses the LED chip transfer substrate, the LED chip transfer substrate comprises a substrate body and a groove defined by the substrate body, the groove comprises a first groove, a second groove and a third groove, the first groove is in a first shape, the second groove is in a second shape, and the third groove is in a third shape.
In this step, the buffer solution 5 is non-conductive deionized water or acetone, and referring to fig. 2, the first groove, the second groove, and the third groove are disposed on the same side of the LED chip transfer substrate 6. In this step, placing the LED chip transfer substrate 6 in the solution tank 4 containing the buffer solution 5 includes: the side provided with the first groove, the second groove and the third groove on the LED chip transfer substrate 6 faces upwards and is completely immersed in the buffer solution 5.
Step 120, immersing a first LED chip, a second LED chip, and a third LED chip in the buffer, the first LED chip including a first shaped base, the second LED chip including a second shaped base, the third LED chip including a third shaped base.
In this step, the first LED chip, the second LED chip, and the third LED chip correspond to a red LED chip, a green LED chip, and a blue LED chip, respectively. The first LED chip comprises a first-shaped base part and a first LED chip body embedded in the first-shaped base part; the second LED chip comprises a second shape base part and a second LED chip body embedded in the second shape base part; the third LED chip comprises a third-shaped base part and a third LED chip body embedded in the third-shaped base part.
Step 130, driving the buffer solution to flow so as to align the first-shaped base part into a first groove, align the second-shaped base part into a second groove, align the second-shaped base part into a third groove, and attract each other by magnetic force between the first groove and the first LED chip, between the second groove and the second LED chip, and/or between the third groove and the third LED chip.
In this step, the method for driving the flow of the buffer solution includes: the liquid is subjected to ultrasonic oscillation or is stirred by means of external force. The liquid flow can generate micro mechanical force to push the first LED chip, the second LED chip and the third LED chip to be aligned. The first shaped base may be matingly aligned to fit within the first recess, the second shaped base may be matingly aligned to fit within the second recess, and the third shaped base may be matingly aligned to fit within the third recess.
Exemplarily, referring to fig. 3, taking the first shape as a square, the second shape as a triangle, and the third shape as a circle as an example, after the first LED chip, the second LED chip, and the third LED chip are driven by the driving buffer to flow, they are moved by the micro mechanical force of the buffer, and when the square base 71 of the first LED chip is aligned with the square groove 61 of the LED chip transfer substrate 6 by the micro mechanical force, the square groove 61 of the LED chip transfer substrate 6 attracts the square base 71 of the first LED chip by the magnetic force to transfer the first chip onto the LED chip transfer substrate 6; when the triangular base 72 of the second LED chip is aligned with the triangular groove 62 of the LED chip transfer substrate 6 under the driving of micro mechanical force, the triangular groove 62 of the LED chip transfer substrate 6 attracts the triangular base 72 of the second LED chip by magnetic force to transfer the second chip onto the LED chip transfer substrate 6; when the circular base 73 of the third LED chip is aligned with the circular groove 63 of the LED chip transfer substrate 6 under the driving of micro mechanical force, the circular groove 63 of the LED chip transfer substrate 6 attracts the circular base 73 of the third LED chip by magnetic force to transfer the third chip onto the LED chip transfer substrate 6. The first shape is square, the second shape is triangular, and the third shape is circular, so that the design structure is simple, the manufacturing is easy, and the manufacturing cost is lower compared with other special-shaped structures.
In this step, the magnets may be disposed in the first, second, and third grooves of the LED chip transfer substrate, and the magnetic materials disposed on the first, second, and third shaped bases may realize mutual attraction between the first groove and the first LED chip, between the second groove and the second LED chip, and/or between the third groove and the third LED chip by a magnetic force.
According to the technical scheme, the first shape base part is aligned to the first groove, the second shape base part is aligned to the second groove, the second shape base part is aligned to the third groove, the problem that different types of chips are difficult to distinguish when multiple LED chips are transferred simultaneously is solved, when the LED chips are transferred in a large amount, red light LED chips, green light LED chips and blue light LED chips are effectively distinguished, the efficiency in subsequent transfer is improved, and the situation that the red light LED chips, the green light LED chips and the blue light LED chips are dislocated in subsequent mounting is avoided, so that the disorder of display of an LED display is caused.
An alternative embodiment, referring to fig. 4, further comprises after step 130:
and 140, fixing the first LED chip, the second LED chip and the third LED chip on the LED chip transfer substrate on a target substrate.
In this alternative embodiment, the positions of the first groove, the second groove, and the third groove provided on the LED chip transfer substrate correspond to the fixing positions of the first LED chip, the second LED chip, and the third LED chip preset on the target substrate one to one. The first LED chip, the second LED chip and the third LED chip are fixed on the target substrate through a welding method.
An alternative embodiment, referring to fig. 5, step 140 is followed by:
step 150, separating the LED chip transfer substrate from the first LED chip, the second LED chip, and the third LED chip.
Example two
Fig. 6 is a flowchart of a transfer method of an LED chip according to a second embodiment of the present invention, which specifically includes the following steps:
step 210, placing an LED chip transfer substrate in a solution tank containing a buffer solution, wherein the buffer solution immerses the LED chip transfer substrate, the LED chip transfer substrate comprises a substrate body and a groove defined by the substrate body, the groove comprises a first groove, a second groove and a third groove, the first groove is in a first shape, the second groove is in a second shape, the third groove is in a third shape, the first groove further comprises a first coil, the second groove further comprises a second coil, and the third groove further comprises a third coil.
In the present embodiment, referring to fig. 7, the first groove 611 of the LED chip transfer substrate further includes a first coil 81 disposed below the first groove 611; the second recess 622 further includes a second coil 82 disposed below the second recess 622; third groove 633 also includes third coil 83 disposed below third groove 633; after the coil is electrified with direct current, a magnetic field is generated, and the magnetic field can be used for adsorbing magnetic materials.
Step 220, dipping a first LED chip, a second LED chip and a third LED chip in the buffer, the first LED chip comprising a first shaped base, the second LED chip comprising a second shaped base and the third LED chip comprising a third shaped base. The first surface of the first shaped base comprises a first magnetic pole, the second surface of the second shaped base comprises a second magnetic pole, the third surface of the third shaped base comprises a third magnetic pole, and the first magnetic pole, the second magnetic pole, and the third magnetic pole are all simultaneously either N magnetic poles or S magnetic poles.
In this step, the first LED chip, the second LED chip, and the third LED chip correspond to a red LED chip, a green LED chip, and a blue LED chip, respectively. The first magnetic pole is generated by a magnet fixed to a first surface of the first shaped base; the second magnetic pole is generated by a magnet fixed on the second surface of the second shape base; the third magnetic pole is generated by a magnet affixed to a third surface of the third shaped base.
Step 230, driving the buffer solution to flow so as to align the first shaped base portion into a first groove, align the second shaped base portion into a second groove, align the second shaped base portion into a third groove, and attract each other by magnetic force between the first groove and the first LED chip, between the second groove and the second LED chip, and/or between the third groove and the third LED chip.
In this embodiment, the driving the buffer solution to flow further comprises, before or during the driving:
231, controlling the first end of the first coil to generate a fourth magnetic pole, wherein a magnetic attraction force is formed between the fourth magnetic pole and the first magnetic pole;
step 232, controlling a second end of the second coil to generate a fifth magnetic pole, wherein a magnetic attraction force exists between the fifth magnetic pole and the second magnetic pole;
and 233, controlling a third end of the third coil to generate a sixth magnetic pole, wherein a magnetic attraction force exists between the sixth magnetic pole and the third magnetic pole.
In this embodiment, step 231, step 232 and step 233 may be executed simultaneously or separately.
In the present embodiment, referring to fig. 8, after the first coil 81, the second coil 82, and the third coil 83 are energized with direct current, the first end of the first coil 81 generates a fourth magnetic pole; the second end of the second coil 82 generates a fifth magnetic pole; the third end of the third coil 83 generates a sixth magnetic pole. After the buffer solution is driven to flow, under the driving of the micro mechanical force of the buffer solution, the first surface 701 of the first shape base 711, the second surface 702 of the second shape base 722, and the third surface 703 of the third shape base 733 may be magnetically adsorbed in the first groove 611, the second groove 622, and the third groove 633, respectively.
And 240, fixing the first LED chip, the second LED chip and the third LED chip on the LED chip transfer substrate on a target substrate.
Step 250, disconnecting the power supply of the first coil, the second coil and the third coil to separate the LED chip transfer substrate from the first LED chip, the second LED chip and the third LED chip.
In this step, after the power supply of the first coil, the second coil, and the third coil is turned off, the magnetic field disappears, the magnetic force of the first LED chip, the second LED chip, and the third LED chip and the elements of the first coil, the second coil, and the third coil disappears, and the first LED chip, the second LED chip, and the third LED chip are separated from the LED chip and transferred to the first groove, the second groove, and the third groove of the substrate.
In this embodiment, before the first LED chip, the second LED chip, and the third LED chip are fixed on the target substrate, some chips damaged in the transferring process may be removed, and specifically, the power supply of the coil that adsorbs the damaged chip groove may be turned off or a reverse current may be applied to remove the damaged chip through a magnetic repulsive force.
According to the technical scheme, the first shape base portion is aligned to the first groove, the second shape base portion is aligned to the second groove, the second shape base portion is aligned to the third groove, the problem that different types of chips are difficult to distinguish when multiple LED chips are transferred simultaneously is solved, when the LED chips are transferred in a large amount, the red LED chips, the green LED chips and the blue LED chips are effectively distinguished, the efficiency and the accuracy rate during subsequent transfer are improved, and dislocation of the red LED chips, the green LED chips and the blue LED chips in subsequent mounting is avoided, so that disorder display of an LED display is caused.
EXAMPLE III
Fig. 9 is a flowchart of a transfer method of an LED chip according to a third embodiment of the present invention, which specifically includes the following steps:
step 310, the LED chip transfer substrate is placed in a solution tank containing a buffer solution, the buffer solution submerges the LED chip transfer substrate, the LED chip transfer substrate comprises a substrate body and a groove defined by the substrate body, the groove comprises a first groove, a second groove and a third groove, the first groove is in a first shape, the second groove is in a second shape, the third groove is in a third shape, the first groove further comprises a seventh magnetic pole, the second groove further comprises an eighth magnetic pole, and the third groove further comprises a ninth magnetic pole.
In this embodiment, the seventh magnetic pole is generated by a magnet fixed to the bottom of the first groove; the eighth magnetic pole is generated by a magnet fixed at the bottom of the second groove; the ninth magnetic pole is generated by a magnet fixed to the bottom of the third groove.
Step 320, dipping a first LED chip, a second LED chip, and a third LED chip in the buffer, the first LED chip including a first shaped base, the second LED chip including a second shaped base, the third LED chip including a third shaped base. The first surface of the first shaped base comprises a first magnetic pole, the second surface of the second shaped base comprises a second magnetic pole, the third surface of the third shaped base comprises a third magnetic pole, and the first magnetic pole, the second magnetic pole, and the third magnetic pole are all simultaneously either N magnetic poles or S magnetic poles.
In this step, the first LED chip, the second LED chip, and the third LED chip correspond to a red LED chip, a green LED chip, and a blue LED chip, respectively. The first magnetic pole is generated by a magnet fixed to a first surface of the first shaped base; the second magnetic pole is generated by a magnet fixed on the second surface of the second shape base; the third magnetic pole is generated by a magnet affixed to a third surface of the third shaped base.
Step 330, driving the buffer solution to flow so as to align the first shape base to the first groove, align the second shape base to the second groove, align the second shape base to the third groove, and attract each other by magnetic force between the first groove and the first LED chip, between the second groove and the second LED chip, and/or between the third groove and the third LED chip.
In this step, a magnetic attraction force is formed between the seventh magnetic pole and the first magnetic pole, a magnetic attraction force is formed between the eighth magnetic pole and the second magnetic pole, and a magnetic attraction force is formed between the ninth magnetic pole and the third magnetic pole.
And 340, fixing the first LED chip, the second LED chip and the third LED chip on the LED chip transfer substrate on a target substrate.
And 350, placing the LED chip transfer substrate in a substrate dissolving solution for dissolving so as to separate the LED chip transfer substrate from the first LED chip, the second LED chip and the third LED chip.
In this embodiment, the LED chip transfer substrate is soluble in the solution and the LED chip is insoluble by the difference in material between the LED chip transfer substrate and the LED chip.
According to the technical scheme, the first shape base portion is aligned to the first groove, the second shape base portion is aligned to the second groove, the second shape base portion is aligned to the third groove, the problem that different types of chips are difficult to distinguish when multiple LED chips are transferred simultaneously is solved, when the LED chips are transferred in a large amount, the red LED chips, the green LED chips and the blue LED chips are effectively distinguished, the efficiency and the accuracy rate during subsequent transfer are improved, and dislocation of the red LED chips, the green LED chips and the blue LED chips in subsequent mounting is avoided, so that disorder display of an LED display is caused.
In an alternative embodiment, the first surface of the first shaped base comprises an N pole and an S pole; the second surface of the second shaped base comprises an N-pole and an S-pole; a third surface of the third shaped base comprises an N-pole and an S-pole; the first groove comprises an N magnetic pole and an S magnetic pole; the second groove comprises an N magnetic pole and an S magnetic pole; the third groove includes an N-pole and an S-pole.
Specifically, referring to fig. 10, the N-pole and the S-pole are disposed on both sides of the first surface 701 of the first shaped base 711, respectively; the N-pole and the S-pole are respectively disposed on both sides of the second surface 702 of the second shaped base 722; the third surface 703 of the third shaped base 733 has N and S poles disposed on opposite sides thereof, respectively. The N-pole and the S-pole are respectively disposed on two sides of the first groove 611, and the N-pole and the S-pole in the first groove 611 correspond to the positions of the first surface 701, at which the N-pole and the S-pole are respectively disposed, one by one, so that the first shaped base 711 is attracted to the first groove 611 by magnetic force; n magnetic poles and S magnetic poles are respectively arranged on two sides of the second groove 622, and the N magnetic poles and S magnetic poles in the second groove 622 correspond to the positions of the N magnetic poles and S magnetic poles respectively arranged on the second surface 702 one by one, so that the second shape base 722 is attracted to the second groove 622 through magnetic force; the N-pole and the S-pole are respectively disposed on two sides of the third groove 633, and the N-pole and the S-pole in the third groove 633 are respectively corresponding to the N-pole and the S-pole on the third surface 703 in a one-to-one manner, so that the third shape base 733 is attracted to the third groove 633 by magnetic force.
According to the embodiment, the N magnetic pole and the S magnetic pole are arranged at the base part of the chip, and the S magnetic pole and the N magnetic pole are arranged in the groove in a matched mode, so that the groove of the LED chip transfer substrate can more accurately adsorb the corresponding chip.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A method for transferring LED chips is characterized by comprising the following steps:
placing an LED chip transfer substrate in a solution tank containing a buffer solution, wherein the buffer solution submerges the LED chip transfer substrate, the LED chip transfer substrate comprises a substrate body and grooves defined by the substrate body, the grooves comprise a first groove, a second groove and a third groove, the first groove is in a first shape, the second groove is in a second shape, and the third groove is in a third shape;
immersing a first LED chip, a second LED chip, and a third LED chip in the buffer, the first LED chip including a first shaped base, the second LED chip including a second shaped base, the third LED chip including a third shaped base;
driving the buffer solution to flow so as to align the first-shaped base part into the first groove, align the second-shaped base part into the second groove, align the second-shaped base part into the third groove, and attract each other by magnetic force between the first groove and the first LED chip, between the second groove and the second LED chip, and/or between the third groove and the third LED chip.
2. The method of transferring an LED chip according to claim 1, wherein the driving the buffer fluid flow to align the first shaped base into the first groove, the second shaped base into the second groove, and the second shaped base into the third groove further comprises:
and fixing the first LED chip, the second LED chip and the third LED chip on the LED chip transfer substrate on a target substrate.
3. The method according to claim 2, wherein the first LED chip, the second LED chip, and the third LED chip on the LED chip transfer substrate are fixed on a target substrate, further comprising:
separating the LED chip transfer substrate from the first LED chip, the second LED chip, and the third LED chip.
4. The method of claim 1, wherein the first surface of the first shaped base comprises a first magnetic pole, the second surface of the second shaped base comprises a second magnetic pole, the third surface of the third shaped base comprises a third magnetic pole, and the first magnetic pole, the second magnetic pole, and the third magnetic pole are all N-magnetic poles or S-magnetic poles at the same time.
5. The method of transferring an LED chip according to claim 4, wherein the first recess further comprises a first coil, the second recess further comprises a second coil, the third recess further comprises a third coil, and the driving the buffer solution while flowing further comprises:
controlling a first end of the first coil to generate a fourth magnetic pole, wherein a magnetic attraction force is formed between the fourth magnetic pole and the first magnetic pole;
controlling a second end of the second coil to generate a fifth magnetic pole, wherein a magnetic attraction force exists between the fifth magnetic pole and the second magnetic pole;
and controlling a third end of the third coil to generate a sixth magnetic pole, wherein magnetic attraction is formed between the sixth magnetic pole and the third magnetic pole.
6. The method for transferring LED chips according to claims 3 and 5, wherein said separating the LED chip transfer substrate from the first LED chip, the second LED chip, and the third LED chip comprises:
disconnecting the power of the first coil, the second coil, and the third coil to separate the LED chip transfer substrate from the first LED chip, the second LED chip, and the third LED chip.
7. The method of claim 4, wherein the first cavity further comprises a seventh magnetic pole, the second cavity further comprises an eighth magnetic pole, the third cavity further comprises a ninth magnetic pole, and a magnetic attraction force is formed between the seventh magnetic pole and the first magnetic pole, a magnetic attraction force is formed between the eighth magnetic pole and the second magnetic pole, and a magnetic attraction force is formed between the ninth magnetic pole and the third magnetic pole.
8. The method for transferring LED chips according to claims 3 and 7, wherein said separating the LED chip transfer substrate from the first LED chip, the second LED chip, and the third LED chip comprises:
and placing the LED chip transfer substrate in a substrate dissolving solution for dissolving so as to separate the LED chip transfer substrate from the first LED chip, the second LED chip and the third LED chip.
9. A transfer substrate of LED chips, comprising: the substrate comprises a substrate body and a groove defined by the substrate body, wherein the groove comprises a first groove, a second groove and a third groove, the first groove is in a first shape, the second groove is in a second shape, the third groove is in a third shape, the first groove is used for aligning with a first shape base of a first chip, the second groove is used for aligning with a second shape base of a second chip, and the third groove is used for aligning with a third shape base of a third chip.
10. A transfer system for LED chips, comprising:
the solution tank is used for containing buffer solution;
an LED chip transfer substrate according to claim 9, immersed in the buffer solution.
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| CN201911001288.3A CN110611018A (en) | 2019-10-21 | 2019-10-21 | LED chip transfer method, substrate and system |
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| CN201911001288.3A CN110611018A (en) | 2019-10-21 | 2019-10-21 | LED chip transfer method, substrate and system |
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