CN111292631B - Micro light-emitting diode display panel and preparation method thereof - Google Patents
Micro light-emitting diode display panel and preparation method thereof Download PDFInfo
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- CN111292631B CN111292631B CN201811393652.0A CN201811393652A CN111292631B CN 111292631 B CN111292631 B CN 111292631B CN 201811393652 A CN201811393652 A CN 201811393652A CN 111292631 B CN111292631 B CN 111292631B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Abstract
The application discloses little emitting diode display panel and preparation method thereof, this little emitting diode display panel includes: the driving back plate is provided with a plurality of grooves on one surface, and a magnetic coil is arranged at the bottom of each groove or below the bottom of each groove; and the micro light-emitting diode is arranged on the driving back plate and embedded into the groove, one end of the micro light-emitting diode is a light-emitting surface, the other end far away from the light-emitting surface is provided with a magnetic material, and the magnetic material is positioned in a magnetic field range generated by electrifying the magnetic coil. By means of the mode, the transfer efficiency of the micro light-emitting diode can be improved, and huge transfer is achieved.
Description
Technical Field
The application relates to the technical field of micro light-emitting diode transfer printing, in particular to a micro light-emitting diode display panel and a preparation method thereof.
Background
Micro light emitting diode (Micro LED) technology refers to a Micro-sized LED array integrated on a substrate at high density, and Micro LEDs are expected to lead to next generation display technology due to their extremely high light emitting efficiency and extremely long display lifetime.
After the micro light emitting diode is manufactured, a huge amount of micro light emitting diode chips are transferred to a driving circuit board to form a micro light emitting diode array. When the micro light emitting diodes are transferred by the current fluid assembly method, the generation efficiency of the micro light emitting diodes is possibly low due to the random distribution of the micro light emitting diodes in the fluid.
Disclosure of Invention
The application provides a micro light-emitting diode display panel and a preparation method thereof, which can solve the problems that in the prior art, the probability of the micro light-emitting diode reaching a driving back plate is low, the micro light-emitting diode and a driving back plate electrode are staggered, and the micro light-emitting diode cannot be adhered to the driving back plate.
The technical scheme adopted by the application is as follows: provided is a micro light emitting diode display panel including: the magnetic force sensor comprises a driving back plate, a magnetic force coil and a magnetic force coil, wherein a plurality of grooves are formed in one surface of the driving back plate, and a magnetic force coil is arranged at the bottom of each groove or below the bottom of each groove; the micro light-emitting diode is mounted on the driving back plate and embedded into the groove, one end of the micro light-emitting diode is a light-emitting surface, the other end, far away from the light-emitting surface, of the micro light-emitting diode is provided with a magnetic material, and the magnetic material is located in a magnetic field range generated by electrifying the magnetic coil.
The technical scheme adopted by the application is as follows: a preparation method of a micro light-emitting diode display panel is provided, and the preparation method comprises the following steps: putting a driving back plate into a fluid with a plurality of micro light-emitting diodes, wherein a plurality of grooves are formed in one surface of the driving back plate, a magnetic coil is arranged at the bottom of each groove or below the bottom of each groove, one end of each micro light-emitting diode is a light-emitting surface, and a magnetic material is arranged at the other end, far away from the light-emitting surface, of each micro light-emitting diode; current in a preset direction is conducted to the magnetic coil; removing the drive back plate from the fluid; and forming a micro light-emitting diode display panel based on the taken out driving back plate.
The beneficial effect of this application is: the magnetic coil used for adsorbing the micro light-emitting diode with the magnetic material is arranged at the bottom of the groove of the driving back plate, so that when the micro light-emitting diode is transferred by adopting fluid assembly, the time for the micro light-emitting diode to fall into the groove of the driving back plate can be shortened, the probability that the micro light-emitting diode reaches the groove of the driving back plate is increased, the transfer efficiency of the micro light-emitting diode is improved, and the mass transfer of the micro light-emitting diode is realized.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of a micro light emitting diode display panel according to the present invention;
FIG. 2 is a schematic plan view of an embodiment of the magnetic coil of the present application;
3a-3b are schematic views of the magnetic coils of the present application at various placement locations on the driving backplate;
FIG. 4 is a schematic structural diagram of an embodiment of a micro light emitting diode of the present application;
FIG. 5 is a schematic structural diagram of a second embodiment of a micro light emitting diode of the present application;
FIG. 6 is a schematic flow chart illustrating one embodiment of a method for fabricating a micro light emitting diode display panel according to the present invention;
FIG. 7 is a schematic view of an embodiment of a method for manufacturing a micro light emitting diode display panel according to the present application;
FIG. 8 is a schematic side view of an embodiment of the present fluid channeling device;
figure 9 is a schematic top view of one embodiment of the fluid channeling device of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a micro light emitting diode display panel according to the present application, and as shown in fig. 1, the micro light emitting diode display panel 500 provided by the present application includes a driving back plate 100 and micro light emitting diodes 300.
Wherein, a surface of the driving backplate 100 is provided with a plurality of grooves a, a magnetic coil B is arranged below the bottom of the groove a or the bottom of the groove a, wherein each groove a corresponds to a sub-pixel, in this embodiment, the magnetic coil B is arranged below the bottom of the groove a, and along the plane of the driving backplate 100, the cross-sectional area of the groove a is larger than the cross-sectional area of the magnetic coil B. It can be understood that, the sectional area of the groove a is set to be larger than that of the magnetic coil B, so that the action range of the magnetic coil B can only cover the groove a above the position of the groove B, and the problem that adjacent magnetic coils B interfere with each other due to too close distance does not occur.
Specifically, the driving backplate 100 further includes a first base layer 110, an insulating layer 120, and a second base layer 130, which are stacked. The grooves a are disposed on the surface of the second substrate 130, the magnetic coils B are disposed in the insulating layer 120, and a magnetic coil B is disposed below each groove a.
With further reference to fig. 2, fig. 2 is a schematic plan view of an embodiment of the magnetic coil of the present application. Referring to fig. 2, in this embodiment, the magnetic coil B may be an electrically controlled magnetic coil, which may be driven by an external driving circuit, so that a conducting wire (not shown) connecting the magnetic coil and the external driving circuit (not shown) is disposed on the driving back plate 100, and after the external driving circuit is powered on, the magnetic coil B may generate a magnetic field, which may attract the magnetic material on the micro light emitting diode during the process of transferring the micro light emitting diode by fluid assembly, so as to suck the micro light emitting diode into the groove a of the driving back plate 100, so as to be fixed on the driving back plate 100, thereby realizing correct alignment of the micro light emitting diode and the driving electrode on the driving back plate 100, and the micro light emitting diode may accurately fall into and be fixed in the groove a of the driving back plate 100 under the combined action force of the magnetic field and the self gravity, thereby shortening the time for the micro light emitting diode to fall into the groove a of the driving back plate 100, the probability that the micro light-emitting diode reaches the groove of the driving back plate is increased, so that the transfer efficiency of the micro light-emitting diode is improved, and mass transfer is realized. Meanwhile, the magnetic coil B can be of a planar structure, is simple to manufacture in the process and low in cost, and is suitable for batch production.
Of course, in other embodiments, a driving power supply (not shown) is disposed inside the driving back plate 100 for driving the magnetic coil B to generate a magnetic field to attract the micro light emitting diodes 300, and the driving power supply is directly integrated inside the driving back plate without an additional external driving circuit.
In other embodiments, the magnetic coil B may also be a magnetic material, such as one of an alnico permanent magnetic alloy, an iron-chromium-cobalt permanent magnetic alloy, a permanent magnetic ferrite, a rare earth permanent magnetic material, and a composite permanent magnetic material, which is not limited herein. And the magnetic material is adopted as the magnetic coil B, so that the magnetic force can be generated to realize the adsorption of the micro light-emitting diode without additionally arranging a driving power supply inside or outside the driving back plate, and the micro light-emitting diode is fixed in the groove of the driving back plate.
In addition, referring to fig. 3a-3B, fig. 3a-3B are schematic structural diagrams of the magnetic coil at different positions on the driving back plate according to the present application, where in fig. 3a, the insulating layer 120 is a magnetic coil B and is located below the bottom of the recess a, and in fig. 3B, the magnetic coil B is located at the bottom of the recess a, but may be located on the side wall of the recess in other embodiments, and the like, which are not limited specifically.
Alternatively, the light emitting diodes 300 are mounted to the driving backplate 100 and embedded in the grooves a. One end of the light emitting diode 300 is a light emitting surface, and the other end away from the light emitting surface is provided with a magnetic material, the magnetic material is located in a magnetic field range generated by the magnetic coil B being energized, so that the micro light emitting diode 300 is fixed on the driving back plate 100 under the action of a magnetic field, and the magnetic material is a material capable of reacting to the magnetic field. The micro light emitting diode 300 is partially accommodated in the groove A, wherein the groove A has a positioning effect on the micro light emitting diode 300, the micro light emitting diode 300 can easily fall into the groove A, and the difficulty in preparing the groove A is reduced.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of the micro light emitting diode of the present application, for example, the micro light emitting diode 300 in fig. 4 includes a first electrode 310(N electrode), an N-type semiconductor layer 330, a light emitting layer 340, a P-type semiconductor layer 350, and a second electrode 320(P electrode) stacked in sequence, where the second electrode 320 is a magnet, the magnetic coils B of the second electrode 320 and the driving back plate 100 are opposite magnetic poles, and the second electrode 320 may be one of an aluminum-nickel-cobalt permanent magnetic alloy, an iron-chromium-cobalt permanent magnetic alloy, a permanent magnetic ferrite, a rare earth permanent magnetic material, and a composite permanent magnetic material, which is not specifically limited herein, so as to ensure that the micro light emitting diode is always fixed on the driving back plate. The bottom of the groove a of the driving backplate 100 is provided with a driving electrode (not shown), and the polarity of the surface of the driving electrode contacting with the second electrode 320 of the micro light emitting diode 300 is opposite, so that when the micro light emitting diode 300 is transferred by fluid assembly, the second electrode 320 of the micro light emitting diode 300 and the driving electrode on the driving backplate 100 are bonded in a contraposition manner.
In addition, the micro led 300 further includes an insulating protective layer 360 surrounding and covering the micro led 300, and the insulating protective layer 360 is used for diffusing heat inside the micro led 300 in time, so as to prolong the service life of the micro led.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a second embodiment of the micro light emitting diode of the present application, and the difference from fig. 4 is that the second electrode 320 of the micro light emitting diode 300 in fig. 4 is a magnet, i.e., the electrode and the magnet are integrally disposed, whereas in this embodiment, the magnet G is directly disposed on the second electrode 320, and the magnetic pole of the side of the magnet G close to the driving back plate and the magnetic pole generated by the magnetic coil on the driving back plate are opposite in direction, i.e., the magnetic poles are opposite in name. The magnet G may be made of one of an alnico permanent magnetic alloy, an iron-chromium-cobalt permanent magnetic alloy, a permanent magnetic ferrite, a rare earth permanent magnetic material, and a composite permanent magnetic material, so that the micro-led 300 can be directly fixed on the driving back plate when being transferred later.
It is understood that in other embodiments, a metal material, such as copper, iron, aluminum, etc., may be further disposed at the second electrode 320 of the micro light emitting diode 300, and the magnetic coil generates a magnetic force under the driving of the driving power source, and the metal material disposed on the second electrode 320 of the micro light emitting diode 300 may also be adsorbed, so as to fix the micro light emitting diode 300 in the groove of the driving back plate.
In the above embodiment, the magnetic coil is disposed at the bottom of the groove of the driving back plate, and the magnetic coil generates magnetic force in the power-on state, so as to attract the micro light emitting diode with magnetic material, and when the micro light emitting diode is transferred by adopting fluid assembly, the time for the micro light emitting diode to fall into the groove of the driving back plate can be shortened, and the probability for the micro light emitting diode to reach the groove of the driving back plate can be increased, thereby improving the transfer efficiency of the micro light emitting diode and realizing mass transfer.
Referring to fig. 6, fig. 6 is a schematic flow chart illustrating a method for manufacturing a micro light emitting diode display panel according to an embodiment of the present disclosure. The micro leds 300 mentioned in the present application may specifically include red micro leds, green micro leds and blue micro leds, and a driving assembly (not shown) may also be used in the micro led manufacturing process for implementing micro led transfer. Wherein the transmission assembly may be a mechanical arm or a vacuum nozzle, and is not limited herein. And before the micro light-emitting diode display panel is prepared, the method further comprises the following steps:
s100, preparing a plurality of micro light emitting diodes on an original substrate.
Wherein the original substrate may be a laser transparent substrate, such as a sapphire substrate, a silicon carbide (SiC) substrate, etc., and is not particularly limited herein.
With reference to the specific structure of the micro light emitting diode in fig. 4, step S100 in this embodiment may specifically include:
a first electrode 310, an N-type semiconductor layer 330, a light emitting layer 340, and a P-type semiconductor layer 350 are sequentially prepared on an original substrate. Next, a magnetic material is deposited on the P-type semiconductor layer 350 to form a second electrode 320 (P-electrode), where the second electrode 320 is made of a magnetic material, or a magnetic material is deposited on the second electrode 320, and the magnetic material may be deposited by using a physical vapor phase technique. It can be understood that the inside of the magnetic material is divided into a plurality of tiny regions, each tiny region is called a magnetic domain, each magnetic domain has its own magnetic moment (tiny magnetic field), generally, the magnetic moment directions of the magnetic domains are different, the magnetic fields cancel each other out, and the whole magnetic material does not show magnetism to the outside. When the magnetic material is put into a magnetic field, under the action of an external magnetic field, the magnetic moment directions of all magnetic domains tend to be consistent, and the whole magnetic material shows magnetism outwards. At this time, the external magnetic field is removed, the magnetic moment direction of each magnetic domain can be continuously maintained, and the whole magnetic material becomes a magnet. Therefore, after the magnetic material is laid on the second electrode 320, the magnetic material needs to be further magnetized until the second electrode 320 shows magnetism to become a magnet. The magnetic coils of the second electrode 320 and the driving back plate are unlike magnetic poles. The magnetic material may be one of an alnico permanent magnetic alloy, an iron-chromium-cobalt permanent magnetic alloy, a permanent magnetic ferrite, a rare earth permanent magnetic material, and a composite permanent magnetic material, which is not limited herein.
Of course, the micro light emitting diode 300 may also have a structure as shown in fig. 5, and the detailed description refers to the detailed description of the second embodiment of the micro light emitting diode, which is not repeated herein.
And S110, stripping the micro light-emitting diode from the original substrate.
Further, the micro light emitting diodes 300 are peeled from the original substrate in a laser peeling mode and placed into suspension fluid, and the suspension fluid can be acetone solution which is volatile, easy to remove and simple and convenient to process. Of course, in other embodiments, the suspension may be any one of ethanol, polyol, halogenated hydrocarbon or water, and is not specifically limited herein.
It is understood that steps S100-S110 are not essential to implementing the present invention, and may be modified or omitted by those skilled in the art according to the actual use situation.
With reference to fig. 7, fig. 7 is a schematic view of a scene of an embodiment of a method for manufacturing a micro light emitting diode according to the present application.
And S120, placing a fluid channel device above the driving back plate, wherein the fluid channel device comprises a plurality of grooves, and the bottom of each groove is provided with through holes which correspond to the grooves of the driving back plate one by one.
A fluid channeling device 200 is disposed over the driving backplate 100, with reference to fig. 8-9, wherein fig. 8 is a side view of an embodiment of the fluid channeling device, and fig. 9 is a top view of an embodiment of the fluid channeling device. Referring to fig. 9, the fluid channeling device 200 provided by the present application is a three-dimensional structure, and includes a plurality of grooves 210 uniformly flowing along a fluid direction, and baffles 212 are disposed on two sides of the plurality of grooves 210 uniformly flowing along the fluid direction, and the baffles 212 are used for making a fluid having a plurality of micro light emitting diodes flow over the grooves of the driving back plate to contact, so as to increase the probability of the micro light emitting diodes reaching the driving back plate. In the specific embodiment, the depth of the groove 210 is greater than the width of the groove 210, so that the efficiency of the micro light emitting diode 300 entering the groove 210 can be ensured, and two micro light emitting diodes 300 can be prevented from entering the groove 210 in parallel and being stuck in the groove 210.
Optionally, the bottom of each trench 210 is provided with an upper through hole 211 corresponding to the recess of the driving backplane one by one, and the diameter of the upper through hole 211 is greater than or equal to the diameter of the recess of the driving backplane. Optionally, the fluid channeling device 200 of the present embodiment is configured as a groove structure corresponding to the array of grooves on the driving backplate, so that when the fluid with micro leds flows from the upper right to the lower left of the container, it can be ensured that the fluid flows and contacts sufficiently above the grooves of the driving backplate.
S130, the driving back plate is placed into a fluid with a plurality of micro light-emitting diodes, a plurality of grooves are formed in one surface of the driving back plate, a magnetic coil is arranged at the bottom of each groove or below the bottom of each groove, one end of each micro light-emitting diode is a light-emitting surface, and a magnetic material is arranged at the other end, far away from the light-emitting surface, of each micro light-emitting diode.
The driving back plate 100 has a plurality of grooves a on a surface thereof, a magnetic coil B is disposed at the bottom of each groove a, and a magnet is disposed at one end of the micro light emitting diode 300, which is a light emitting surface, and at the other end thereof, which is far from the light emitting surface. And the step S130 specifically includes placing the driving backplate 100 carrying the fluid channel device 200 into a fluid having a plurality of micro light emitting diodes 300, and making the extending direction of the grooves 210 in the fluid channel device 200 consistent with the flow direction of the fluid. Alternatively, the container 400 may be a beaker, as in fig. 7, for holding a suspension fluid having a plurality of micro-leds 300.
Referring to fig. 7, the fluid channel device 200 is adjusted to align the upper and lower through holes 211 with the grooves a, and optionally, in order to prevent the fluid channel device 200 from directly pressing on the driving backplate 100 to damage the driving backplate 100 in the specific embodiment, a buffer layer 410 is disposed between the fluid channel device 200 and the driving backplate 100 in this embodiment, as shown in fig. 7, the buffer layer 410 is disposed on the protrusions M between the adjacent grooves a, and the buffer layer 410 is used to support the fluid channel device 200 on the driving backplate 100.
And S140, electrifying the magnetic coil with current in a preset direction.
Optionally, in this embodiment, the magnetic coil B may be specifically an electrically controlled magnetic coil, and a current in a preset direction is applied to the magnetic coil B to generate a magnetic force, so that the end of the micro light emitting diode 300, where the magnetic material is disposed, is attracted into the groove a under the influence of the magnetic force generated by the magnetic coil B and is fixed on the driving back plate 100. Wherein, the bottom of the groove a of the driving backplate 100 is provided with a driving electrode (not shown), the polarity of the surface of the driving electrode contacting with the second electrode 320 of the micro light emitting diode 300 is opposite, one end of the micro light emitting diode 300 provided with a magnetic material is absorbed into the groove a under the influence of the magnetic force generated by the electrically controlled magnetic coil B, and is in potential bonding with the driving electrode of the groove a.
Alternatively, the magnetic coil B may be driven by an external power source, or may be driven by a driving power source integrated inside the driving backplate 100, which is not limited herein. In other embodiments, the magnetic coil B may also be a magnetic material, such as one of an alnico permanent magnetic alloy, an iron-chromium-cobalt permanent magnetic alloy, a permanent magnetic ferrite, a rare earth permanent magnetic material, and a composite permanent magnetic material, which is not limited herein. And the magnetic material is adopted as the magnetic coil B, so that the magnetic force can be generated to realize the adsorption of the micro light-emitting diode 300 without additionally arranging a driving power supply inside or outside the driving backboard, so that the micro light-emitting diode is fixed in the groove A of the driving backboard 100.
Optionally, the micro light emitting diode 300 flows along with the fluid in the fluid channel device 200, and falls into the groove a on the driving backplate 100 under the combined action of the gravity of the micro light emitting diode 300 and the magnetic force generated by the magnetic coil B of the driving backplate 100, so that the time for the micro light emitting diode 300 to fall into the groove a of the driving backplate 100 can be shortened, the probability that the micro light emitting diode 300 reaches the groove a of the driving backplate 100 can be increased, the transfer efficiency of the micro light emitting diode 300 can be improved, and the mass transfer can be realized.
Further, after the micro light emitting diode 300 is fixed in the groove a of the driving back plate 100, the method further includes:
s150, taking out the driving back plate from the fluid.
After the grooves on the driving back plate 100 and the micro light emitting diodes 300 are fixed, the magnetic coil B is continuously driven to generate magnetic force after the container is kept still for a preset time, so that all the grooves a on the driving back plate 100 are ensured to be fixed with the micro light emitting diodes 300.
Further, the fluid channel device 200 is slowly taken out of the fluid, and the driving backplate 100 is taken out of the fluid while the magnetic coil B is continuously kept energized with a current in a predetermined direction, at this time, the second electrode 320(P electrode) on the micro light emitting diode 300 and the electrode on the driving backplate 100 are in complete contact. Alternatively, when the driving back plate 100 of the transferred micro light emitting diode 300 is taken out of the fluid, the micro light emitting diode 300 is stabilized by the magnetic force and is not easily dropped, so that the following welding process is performed.
And S160, forming a micro light-emitting diode display panel based on the taken out driving back plate.
And disconnecting the power supply to the magnetic coil B, and forming the micro light-emitting diode display panel based on the taken out driving back plate. Specifically, after the driving back plate 100 is taken out, the residual fluid on the driving back plate 100 is removed and dried in the sun, and then the driving back plate 100 may be placed in a reflow apparatus, for example, a reflow furnace for reflow soldering, so as to fix the micro light emitting diodes 300 in the pixel grooves of the driving back plate 100, thereby completing the mass transfer of the micro light emitting diodes 300 and realizing the preparation of the micro light emitting diode display panel.
In the above embodiment, the magnetic coil is arranged at the bottom of the groove of the driving backboard, magnetic force is generated in the power-on state of the magnetic coil, the micro light-emitting diode with magnetic material can be attracted, and the micro light-emitting diode can accurately fall into and be fixed on the substrate under the dual actions of self weight and magnetic force, so that the time for the micro light-emitting diode to fall into the groove of the driving backboard is shortened, the probability for the micro light-emitting diode to reach the groove of the driving backboard is increased, the transfer efficiency of the micro light-emitting diode is improved, and the mass transfer of the micro light-emitting diode is realized.
In summary, it is easily understood by those skilled in the art that the present application provides a micro light emitting diode display panel and a method for manufacturing the same, in which a magnetic coil is disposed at the bottom of a groove of a driving backplane, and the magnetic coil generates a magnetic force when the magnetic coil is energized, so as to attract a micro light emitting diode having a magnetic material, and the micro light emitting diode can accurately fall into and be fixed on a substrate under the dual actions of its own weight and magnetic force, thereby shortening the time for the micro light emitting diode to fall into the groove of the driving backplane, increasing the probability for the micro light emitting diode to reach the groove of the driving backplane, improving the transfer efficiency of the micro light emitting diode, and realizing the mass transfer of the micro light emitting diode.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (9)
1. A micro light emitting diode display panel, comprising:
the magnetic force sensor comprises a driving back plate, a magnetic force coil and a magnetic force coil, wherein a plurality of grooves are formed in one surface of the driving back plate, and a magnetic force coil is arranged at the bottom of each groove or below the bottom of each groove;
the micro light-emitting diode is mounted on the driving back plate and embedded into the groove, one end of the micro light-emitting diode is a light-emitting surface, the other end, far away from the light-emitting surface, of the micro light-emitting diode is provided with a magnetic material, and the magnetic material is located in a magnetic field range generated by electrifying the magnetic coil;
and the cross-sectional area of the groove is larger than that of the magnetic coil along the plane of the driving back plate.
2. The display panel of claim 1, wherein the driving back plate comprises a first base layer, an insulating layer and a second base layer, the first base layer, the insulating layer and the second base layer are stacked, the groove is disposed on a surface of the second base layer, and the magnetic coil is disposed in the insulating layer.
3. The display panel of claim 2, wherein the magnetic coil is an electrically controlled magnetic coil, and the driving backplane is provided with a wire connecting the magnetic coil and an external driving circuit; or
And a driving power supply is arranged in the driving back plate and used for driving the magnetic coil.
4. The display panel according to any one of claims 1 to 3, wherein the micro light emitting diode is partially received in the groove.
5. A method for preparing a micro light-emitting diode display panel is characterized by comprising the following steps:
putting a driving back plate into a fluid with a plurality of micro light-emitting diodes, wherein a plurality of grooves are formed in one surface of the driving back plate, a magnetic coil is arranged at the bottom of each groove or below the bottom of each groove, one end of each micro light-emitting diode is a light-emitting surface, and a magnetic material is arranged at the other end, far away from the light-emitting surface, of each micro light-emitting diode;
current in a preset direction is conducted to the magnetic coil;
removing the drive back plate from the fluid;
and forming a micro light-emitting diode display panel based on the taken out driving back plate.
6. The production method according to claim 5,
before the step of placing the driving back plate into the fluid with the micro light emitting diodes, the method further comprises:
placing a fluid channel device above the driving back plate, wherein the fluid channel device comprises a plurality of grooves, and the bottom of each groove is provided with a through hole which corresponds to the groove of the driving back plate one by one;
the step of placing the driving back plate into a fluid with a plurality of micro light emitting diodes specifically comprises:
and putting the driving back plate carrying the fluid channel device into fluid with a plurality of micro light-emitting diodes, and enabling the extending direction of the groove in the fluid channel device to be consistent with the flow direction of the fluid.
7. The method of claim 6, wherein the depth of the trench is greater than the width of the trench.
8. The method of claim 6, further comprising a buffer layer between the fluid channel device and the driving backplate, wherein the buffer layer is configured to support the fluid channel device on the driving backplate.
9. The production method according to claim 5,
the step of removing the drive back plate from the fluid comprises:
taking out the driving back plate from the fluid under the state that the magnetic coil is kept to be electrified with current in a preset direction;
the step of forming a micro-led display panel based on the taken out driving backplane includes:
and disconnecting the power supply to the magnetic coil, and forming a micro light-emitting diode display panel based on the taken out driving back plate.
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| TWI760007B (en) * | 2020-12-14 | 2022-04-01 | 晶呈科技股份有限公司 | Alignment module and alignment method for magnetic light emitting diode die transfer |
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