CN111276592A - Preparation method and preparation system of Micro-LED array substrate - Google Patents
Preparation method and preparation system of Micro-LED array substrate Download PDFInfo
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- CN111276592A CN111276592A CN202010100091.1A CN202010100091A CN111276592A CN 111276592 A CN111276592 A CN 111276592A CN 202010100091 A CN202010100091 A CN 202010100091A CN 111276592 A CN111276592 A CN 111276592A
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
The application discloses a preparation method and a preparation system of a Micro-LED array substrate, wherein the method firstly obtains Micro-LED core particles with a vertical structure, the Micro-LED core particles with the vertical structure can be made smaller, and the problem of current crowding existing in the Micro-LED core particles is solved; then obtain the fixed baseplate that has a plurality of spacing wells, this fixed baseplate includes first holding area and at least one second holding area, and the width that the second held the district is less than the width that first holds the district, make when Micro-LED core grain is fixed with fixed baseplate, only have the first electrode of certain difference in height can be held by the second holding area, avoided the misconnection of first electrode and second electrode and first articulamentum and second articulamentum, realize improving the purpose of the counterpoint precision of Micro-LED core grain and fixed baseplate in the huge transfer process.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a preparation method and a preparation system of a Micro-LED array substrate.
Background
Micro-LEDs (Micro light emitting diodes) have the advantages of low power consumption, high color saturation, high reaction speed, etc., and are important display devices in the new generation of display technologies.
After the Micro-LED core (or Micro-LED chip) is prepared, a large number of Micro-LED cores need to be fixed on a fixed substrate, and this process is called bulk transfer printing (or bulk transfer), and the mainstream bulk transfer printing methods nowadays include a precision picking method (Fine Pick/Place), a selective release method (Self-Assembly), a Self-Assembly method (Self-Assembly), and the like.
However, in the prior art, the problem that the error of the fixed position of the Micro-LED core particles and the fixed substrate is large easily occurs in the process of mass transfer printing, that is, the electrodes of the Micro-LED core particles cannot be fixedly connected with the corresponding connecting layers on the fixed substrate, so that the prepared Micro-LED array substrate has many bad points, and the use requirements are difficult to meet.
Disclosure of Invention
In order to solve the technical problems, the application provides a preparation method and a preparation system of a Micro-LED array substrate, so as to achieve the purpose of improving the alignment precision of Micro-LED core particles and a fixed substrate in a mass transfer process and solve the problem of current crowding existing in the Micro-LED core particles.
In order to achieve the technical purpose, the embodiment of the application provides the following technical scheme:
a preparation method of a Micro-LED array substrate comprises the following steps:
obtaining Micro-LED core particles; the Micro-LED core particle comprises an epitaxial structure, the epitaxial structure comprises a first surface and a second surface which are oppositely arranged, a first electrode is arranged on the first surface, a second electrode is arranged on the second surface, and the thickness of the first electrode is larger than or equal to a preset thickness;
obtaining a fixed substrate, wherein the fixed substrate comprises a plurality of limiting wells, each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, the width of each second accommodating area is smaller than that of each first accommodating area, and each second accommodating area is used for accommodating the first electrode;
and fixing the Micro-LED core particles and the limiting wells on the fixed substrate by using a fluid assembly method, wherein when the Micro-LED core particles are fixed with the fixed substrate, the first electrode is positioned in the second accommodating area.
Optionally, the acquiring the Micro-LED core particles includes:
providing an epitaxial substrate;
forming an epitaxial layer on the epitaxial substrate;
etching the light emitting areas and the isolation grooves of the epitaxial layers to form a plurality of epitaxial structures, wherein the first surfaces of the epitaxial structures are the light emitting areas;
forming passivation layers on two sides of the light emitting region of the epitaxial structure;
forming a first metal on the surface of a light emitting region of the epitaxial structure, wherein the orthographic projection of the first metal on the epitaxial substrate is positioned in the orthographic projection of the epitaxial structure on the epitaxial substrate, and the thickness of the first metal is greater than the preset thickness;
bonding the first surface of the epitaxial structure with a temporary substrate by using a bonding process, and removing the epitaxial substrate after bonding to expose the second surface of the epitaxial structure;
forming a second metal on a second surface of the epitaxial structure;
removing the temporary substrate to obtain a plurality of Micro-LED core particles.
Optionally, the obtaining the fixed substrate includes:
providing a substrate to be processed;
forming a mask layer on the substrate to be processed;
forming a plurality of limiting wells on the substrate to be processed by taking the mask layer as a mask, wherein each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, the width of each second accommodating area is smaller than that of each first accommodating area, and each second accommodating area is used for accommodating the first electrode;
forming a first connection layer in the first accommodation region;
a second connection layer is formed in the second receiving region.
Optionally, the fixing the Micro-LED core particles and the limiting wells on the fixing substrate by using a fluidic assembly method includes:
and enabling fluid to flow along a preset direction on the surface of one side of the fixed substrate, which comprises the limiting well, wherein the fluid comprises the Micro-LED core particles, so that the first electrodes of the Micro-LED core particles are embedded in the second accommodating area.
Optionally, after the Micro-LED core particles are fixed to the limiting wells on the fixing substrate by using a fluid assembly method, the method further includes:
fixedly connecting the first electrode with the second connecting layer;
and fixedly connecting the second electrode with the first connecting layer.
A preparation system of a Micro-LED array substrate comprises:
the core grain acquisition module is used for acquiring Micro-LED core grains; the Micro-LED core particle comprises an epitaxial structure, the epitaxial structure comprises a first surface and a second surface which are oppositely arranged, a first electrode is arranged on the first surface, a second electrode is arranged on the second surface, and the thickness of the first electrode is larger than or equal to a preset thickness;
the substrate obtaining module is used for obtaining a fixed substrate, the fixed substrate comprises a plurality of limiting wells, each limiting well comprises a first containing area and at least one second containing area, a first connecting layer is arranged in each first containing area, a second connecting layer is arranged in each second containing area, the width of each second containing area is smaller than that of each first containing area, and each second containing area is used for containing the first electrode;
and the assembly module is used for fixing the Micro-LED core particles and the limiting well on the fixed substrate by using a fluid assembly method, and when the Micro-LED core particles are fixed with the fixed substrate, the first electrode is positioned in the second accommodating area.
Optionally, the core particle obtaining module is used for obtaining Micro-LED core particles,
providing an epitaxial substrate;
forming an epitaxial layer on the epitaxial substrate;
etching the light emitting areas and the isolation grooves of the epitaxial layers to form a plurality of epitaxial structures, wherein the first surfaces of the epitaxial structures are the light emitting areas;
forming passivation layers on two sides of the light emitting region of the epitaxial structure;
forming a first metal on the surface of a light emitting region of the epitaxial structure, wherein the orthographic projection of the first metal on the epitaxial substrate is positioned in the orthographic projection of the epitaxial structure on the epitaxial substrate, and the thickness of the first metal is greater than the preset thickness;
bonding the first surface of the epitaxial structure with a temporary substrate by using a bonding process, and removing the epitaxial substrate after bonding to expose the second surface of the epitaxial structure;
forming a second metal on a second surface of the epitaxial structure;
removing the temporary substrate to obtain a plurality of Micro-LED core particles.
Optionally, the substrate obtaining module is specifically used for obtaining a fixed substrate,
providing a substrate to be processed;
forming a mask layer on the substrate to be processed;
forming a plurality of limiting wells on the substrate to be processed by taking the mask layer as a mask, wherein each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, the width of each second accommodating area is smaller than that of each first accommodating area, and each second accommodating area is used for accommodating the first electrode;
forming a first connection layer in the first accommodation region;
a second connection layer is formed in the second receiving region.
Optionally, the assembly module fixes the Micro-LED core particles and the limiting wells on the fixing substrate by using a fluid assembly method,
and enabling fluid to flow along a preset direction on the surface of one side of the fixed substrate, which comprises the limiting well, wherein the fluid comprises the Micro-LED core particles, so that the first electrodes of the Micro-LED core particles are embedded in the second accommodating area.
Optionally, the method further includes:
and the fixing module is used for fixedly connecting the first electrode with the second connecting layer and fixedly connecting the second electrode with the first connecting layer.
A Micro-LED array substrate, comprising:
the fixed substrate comprises a plurality of limiting wells, each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, and the width of each second accommodating area is smaller than that of each first accommodating area;
the Micro-LED core grain is positioned in the limiting well and comprises an epitaxial structure, the epitaxial structure comprises a first surface and a second surface which are oppositely arranged, the first surface is provided with the first electrode, the first electrode is positioned in the second containing area and is electrically connected with the second connecting layer, the second surface is provided with the second electrode, the second electrode is positioned in the first containing area and is electrically connected with the first connecting layer, and the thickness of the first electrode is larger than or equal to the preset thickness.
According to the technical scheme, the embodiment of the application provides a preparation method and a preparation system of a Micro-LED array substrate, wherein the preparation method of the Micro-LED array substrate firstly obtains Micro-LED core particles with a vertical structure, the Micro-LED core particles with the vertical structure can be made smaller, compared with core particles with a transverse structure in the prior art, the current distribution of the Micro-LED array substrate can be more uniform, the light-emitting area can be fully utilized, and the problem of current crowding in the Micro-LED core particles is solved; and then obtaining a fixed substrate with a plurality of limiting wells, wherein the fixed substrate comprises a first accommodating area and at least one second accommodating area, and the width of the second accommodating area is smaller than that of the first accommodating area, so that only a first electrode with a certain height difference can be accommodated by the second accommodating area when the Micro-LED core particles are fixed with the fixed substrate, thereby avoiding the misconnection of the first electrode and the second electrode with the first connecting layer and the second connecting layer, and realizing the purpose of improving the alignment precision of the Micro-LED core particles and the fixed substrate in the process of mass transfer printing.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a Micro-LED array substrate according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view of a Micro-LED core particle according to one embodiment of the present application;
fig. 3 and 4 are schematic top-view structural diagrams of a fixing substrate provided in an embodiment of the present application;
FIGS. 5-7 are schematic diagrams of a fluid assembly process provided by an embodiment of the present application;
FIGS. 8-13 are schematic views illustrating a process for preparing a Micro-LED core particle according to an embodiment of the present disclosure;
FIGS. 14-15 are schematic views of the dimensions of a Micro-LED core particle provided in one embodiment of the present application;
fig. 16 is a schematic cross-sectional structure view of a Micro-LED array substrate according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a preparation method of a Micro-LED array substrate, as shown in FIG. 1, the preparation method comprises the following steps:
s101: obtaining Micro-LED core particles; the Micro-LED core particle comprises an epitaxial structure, the epitaxial structure comprises a first surface and a second surface which are oppositely arranged, a first electrode is arranged on the first surface, a second electrode is arranged on the second surface, and the thickness of the first electrode is larger than or equal to the preset thickness.
Referring to fig. 2, fig. 2 is a schematic cross-sectional structure of the Micro-LED core particle, and shows a passivation layer 40 and the like in addition to the epitaxial structure 10, the first electrode 20 and the second electrode 30.
Alternatively, the preset thickness may be a difference between a width and a thickness of the Mciro-LED core particle.
S102: obtaining a fixed substrate, wherein the fixed substrate comprises a plurality of limiting wells, each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, the width of each second accommodating area is smaller than that of each first accommodating area, and each second accommodating area is used for accommodating the first electrode;
referring to fig. 3 and 4, fig. 3 and 4 are schematic top views of the fixing substrate, and only one of the limiting wells is shown in fig. 3 and 4 for clarity.
In fig. 3, the limiting well comprises one first accommodating area and one second accommodating area, namely the limiting well is in a T shape when viewed from the top;
in fig. 4, the limiting well comprises one first accommodating area and two second accommodating areas, namely the limiting well is in a cross shape in a top view.
In fig. 3 and 4, reference numeral 50 denotes the fixing substrate, 60 denotes a first receiving area, 61 denotes the first connection layer, 70 denotes the second receiving area, and 71 denotes the second connection layer.
It should be noted that the second accommodating area is used for accommodating the first electrode, that is, the shape and size of the second accommodating area need to be matched with those of the first electrode, and in order to achieve the purpose of self-limiting, the width of the second accommodating area is smaller than that of the first accommodating area, so that when the first electrode is embedded in the second accommodating area, the purpose of self-limiting can be achieved.
S103: and fixing the Micro-LED core particles and the limiting wells on the fixed substrate by using a fluid assembly method, wherein when the Micro-LED core particles are fixed with the fixed substrate, the first electrode is positioned in the second accommodating area.
Referring to fig. 5, 6 and 7, fig. 5-7 are schematic diagrams illustrating a fluid assembly process, in the fluid assembly process, a fluid direction flows along a side surface of the fixing substrate having the limiting well, the Micro-LED core particles flow with the fluid in the fluid, and the Micro-LED core particles are moved to the vicinity of the limiting well in a manner of assisting vibration and optical acoustic fluctuation, because the first electrode and the epitaxial structure have a certain height difference, when the long side of the Micro-LED core particles falls into the long side of the limiting well, the chip on the first electrode can be rotated to a position where the first electrode faces both sides by thrust of the fluid and by assisting external additional vibration and photoacoustic tweezers, so that the first electrode is limited in the limiting well, and the purpose of fixing the Micro-LED core particles and the fixing substrate is achieved.
In summary, in the preparation method of the Micro-LED array substrate, the Micro-LED core particles with the vertical structure are obtained, the Micro-LED core particles with the vertical structure can be made smaller, compared with the core particles with the horizontal structure in the prior art, the current distribution can be more uniform, the light emitting area can be fully utilized, and the current crowding problem existing in the Micro-LED core particles is solved; and then obtaining a fixed substrate with a plurality of limiting wells, wherein the fixed substrate comprises a first accommodating area and at least one second accommodating area, and the width of the second accommodating area is smaller than that of the first accommodating area, so that only a first electrode with a certain height difference can be accommodated by the second accommodating area when the Micro-LED core particles are fixed with the fixed substrate, thereby avoiding the misconnection of the first electrode and the second electrode with the first connecting layer and the second connecting layer, and realizing the purpose of improving the alignment precision of the Micro-LED core particles and the fixed substrate in the process of mass transfer printing.
Optionally, the acquiring the Micro-LED core particles includes:
providing an epitaxial substrate;
forming an epitaxial layer on the epitaxial substrate; referring to fig. 8, fig. 8 is a schematic cross-sectional view of an epitaxial layer formed on an epitaxial substrate; in fig. 8, 80 denotes the epitaxial substrate, and 10' denotes the epitaxial layer.
Etching the light emitting areas and the isolation grooves of the epitaxial layers to form a plurality of epitaxial structures, wherein the first surfaces of the epitaxial structures are the light emitting areas; referring to fig. 9, fig. 9 is a schematic cross-sectional structure diagram after an epitaxial structure is formed, and for clarity of illustration, only one epitaxial structure is shown in fig. 9, and etching of the light emitting region of the epitaxial layer and the isolation trench may be performed in one etching process.
Forming passivation layers on two sides of the light emitting region of the epitaxial structure; referring to fig. 10, fig. 10 is a schematic cross-sectional view illustrating a passivation layer formed thereon.
Forming a first metal on the surface of a light emitting region of the epitaxial structure, wherein the orthographic projection of the first metal on the epitaxial substrate is positioned in the orthographic projection of the epitaxial structure on the epitaxial substrate, and the thickness of the first metal is greater than the preset thickness; referring to fig. 11, fig. 11 is a schematic cross-sectional view of the first metal layer after being formed.
Bonding the first surface of the epitaxial structure with a temporary substrate by using a bonding process, and removing the epitaxial substrate after bonding to expose the second surface of the epitaxial structure; referring to fig. 12, fig. 12 is a schematic cross-sectional view of the epitaxial substrate after being removed. In fig. 12, 90 denotes a temporary bonding layer, and 100 denotes the temporary substrate.
Forming a second metal on a second surface of the epitaxial structure; referring to fig. 13, fig. 13 is a schematic cross-sectional structure of the second metal after being formed.
Removing the temporary substrate to obtain a plurality of Micro-LED core particles.
Optionally, referring to fig. 14, the aspect ratio of the finally obtained Micro-LED core particle is greater than 2, and referring to fig. 15, the aspect ratio of the finally obtained Micro-LED core particle ranges from 0.5 to 2. As shown in fig. 15, the height of the Micro-LED core grain refers to the sum of the thicknesses of the epitaxial structure and the second electrode, and does not include the thickness of the first electrode.
Optionally, the obtaining the fixed substrate includes:
providing a substrate to be processed;
forming a mask layer on the substrate to be processed;
forming a plurality of limiting wells on the substrate to be processed by taking the mask layer as a mask, wherein each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, the width of each second accommodating area is smaller than that of each first accommodating area, and each second accommodating area is used for accommodating the first electrode;
forming a first connection layer in the first accommodation region;
a second connection layer is formed in the second receiving region.
Optionally, the fixing the Micro-LED core particles and the limiting wells on the fixing substrate by using a fluidic assembly method includes:
and enabling fluid to flow along a preset direction on the surface of one side of the fixed substrate, which comprises the limiting well, wherein the fluid comprises the Micro-LED core particles, so that the first electrodes of the Micro-LED core particles are embedded in the second accommodating area.
Optionally, after the Micro-LED core particles are fixed to the limiting wells on the fixing substrate by using a fluid assembly method, the method further includes:
fixedly connecting the first electrode with the second connecting layer;
and fixedly connecting the second electrode with the first connecting layer.
Referring to fig. 16, fig. 16 is a schematic cross-sectional structure diagram of the first electrode and the second electrode respectively fixed to the second connection layer and the first connection layer, and the manner of fixing the first electrode and the second electrode respectively to the second connection layer and the first connection layer may be a process such as annealing.
The system for manufacturing the Micro-LED array substrate provided in the embodiments of the present application is described below, and the system for manufacturing the Micro-LED array substrate described below may be referred to in correspondence with the method for manufacturing the Micro-LED array substrate described above.
Correspondingly, the embodiment of the application also provides a preparation system of the Micro-LED array substrate, which comprises the following steps:
the core grain acquisition module is used for acquiring Micro-LED core grains; the Micro-LED core particle comprises an epitaxial structure, the epitaxial structure comprises a first surface and a second surface which are oppositely arranged, a first electrode is arranged on the first surface, a second electrode is arranged on the second surface, and the thickness of the first electrode is larger than or equal to a preset thickness;
the substrate obtaining module is used for obtaining a fixed substrate, the fixed substrate comprises a plurality of limiting wells, each limiting well comprises a first containing area and at least one second containing area, a first connecting layer is arranged in each first containing area, a second connecting layer is arranged in each second containing area, the width of each second containing area is smaller than that of each first containing area, and each second containing area is used for containing the first electrode;
and the assembly module is used for fixing the Micro-LED core particles and the limiting well on the fixed substrate by using a fluid assembly method, and when the Micro-LED core particles are fixed with the fixed substrate, the first electrode is positioned in the second accommodating area.
Optionally, the core particle obtaining module is used for obtaining Micro-LED core particles,
providing an epitaxial substrate;
forming an epitaxial layer on the epitaxial substrate;
etching the light emitting areas and the isolation grooves of the epitaxial layers to form a plurality of epitaxial structures, wherein the first surfaces of the epitaxial structures are the light emitting areas;
forming passivation layers on two sides of the light emitting region of the epitaxial structure;
forming a first metal on the surface of a light emitting region of the epitaxial structure, wherein the orthographic projection of the first metal on the epitaxial substrate is positioned in the orthographic projection of the epitaxial structure on the epitaxial substrate, and the thickness of the first metal is greater than the preset thickness;
bonding the first surface of the epitaxial structure with a temporary substrate by using a bonding process, and removing the epitaxial substrate after bonding to expose the second surface of the epitaxial structure;
forming a second metal on a second surface of the epitaxial structure;
removing the temporary substrate to obtain a plurality of Micro-LED core particles.
Optionally, the substrate obtaining module is specifically used for obtaining a fixed substrate,
providing a substrate to be processed;
forming a mask layer on the substrate to be processed;
forming a plurality of limiting wells on the substrate to be processed by taking the mask layer as a mask, wherein each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, the width of each second accommodating area is smaller than that of each first accommodating area, and each second accommodating area is used for accommodating the first electrode;
forming a first connection layer in the first accommodation region;
a second connection layer is formed in the second receiving region.
Optionally, the assembly module fixes the Micro-LED core particles and the limiting wells on the fixing substrate by using a fluid assembly method,
and enabling fluid to flow along a preset direction on the surface of one side of the fixed substrate, which comprises the limiting well, wherein the fluid comprises the Micro-LED core particles, so that the first electrodes of the Micro-LED core particles are embedded in the second accommodating area.
Optionally, the method further includes:
and the fixing module is used for fixedly connecting the first electrode with the second connecting layer and fixedly connecting the second electrode with the first connecting layer.
Correspondingly, an embodiment of the present application further provides a Micro-LED array substrate, as shown in fig. 16, the Micro-LED array substrate includes:
the fixed substrate comprises a plurality of limiting wells, each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, and the width of each second accommodating area is smaller than that of each first accommodating area;
the Micro-LED core particle is positioned in the limiting well, the Micro-LED core particle comprises an epitaxial structure, the epitaxial structure comprises a first surface and a second surface which are oppositely arranged, the first surface is provided with the first electrode, the first electrode is positioned in the second accommodating area and is electrically connected with the second connecting layer, the second surface is provided with the second electrode, the second electrode is positioned in the first accommodating area and is electrically connected with the first connecting layer, and the thickness of the first electrode is larger than or equal to the preset thickness;
in summary, the embodiment of the present application provides a method and a system for manufacturing a Micro-LED array substrate, wherein the method for manufacturing a Micro-LED array substrate first obtains Micro-LED core particles with a vertical structure, the Micro-LED core particles with the vertical structure can be made smaller, and compared with core particles with a horizontal structure in the prior art, the current distribution of the Micro-LED array substrate can be more uniform, the light emitting area can be fully utilized, and the problem of current crowding existing in the Micro-LED core particles is solved; and then obtaining a fixed substrate with a plurality of limiting wells, wherein the fixed substrate comprises a first accommodating area and at least one second accommodating area, and the width of the second accommodating area is smaller than that of the first accommodating area, so that only a first electrode with a certain height difference can be accommodated by the second accommodating area when the Micro-LED core particles are fixed with the fixed substrate, thereby avoiding the misconnection of the first electrode and the second electrode with the first connecting layer and the second connecting layer, and realizing the purpose of improving the alignment precision of the Micro-LED core particles and the fixed substrate in the process of mass transfer printing.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (11)
1. A preparation method of a Micro-LED array substrate is characterized by comprising the following steps:
obtaining Micro-LED core particles; the Micro-LED core particle comprises an epitaxial structure, the epitaxial structure comprises a first surface and a second surface which are oppositely arranged, a first electrode is arranged on the first surface, a second electrode is arranged on the second surface, and the thickness of the first electrode is larger than or equal to a preset thickness;
obtaining a fixed substrate, wherein the fixed substrate comprises a plurality of limiting wells, each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, the width of each second accommodating area is smaller than that of each first accommodating area, and each second accommodating area is used for accommodating the first electrode;
and fixing the Micro-LED core particles and the limiting wells on the fixed substrate by using a fluid assembly method, wherein when the Micro-LED core particles are fixed with the fixed substrate, the first electrode is positioned in the second accommodating area.
2. The method for preparing a Micro-LED array substrate according to claim 1, wherein the obtaining Micro-LED core particles comprises:
providing an epitaxial substrate;
forming an epitaxial layer on the epitaxial substrate;
etching the light emitting areas and the isolation grooves of the epitaxial layers to form a plurality of epitaxial structures, wherein the first surfaces of the epitaxial structures are the light emitting areas;
forming passivation layers on two sides of the light emitting region of the epitaxial structure;
forming a first metal on the surface of a light emitting region of the epitaxial structure, wherein the orthographic projection of the first metal on the epitaxial substrate is positioned in the orthographic projection of the epitaxial structure on the epitaxial substrate, and the thickness of the first metal is greater than the preset thickness;
bonding the first surface of the epitaxial structure with a temporary substrate by using a bonding process, and removing the epitaxial substrate after bonding to expose the second surface of the epitaxial structure;
forming a second metal on a second surface of the epitaxial structure;
removing the temporary substrate to obtain a plurality of Micro-LED core particles.
3. The method for preparing a Micro-LED array substrate according to claim 1, wherein the obtaining a fixed substrate comprises:
providing a substrate to be processed;
forming a mask layer on the substrate to be processed;
forming a plurality of limiting wells on the substrate to be processed by taking the mask layer as a mask, wherein each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, the width of each second accommodating area is smaller than that of each first accommodating area, and each second accommodating area is used for accommodating the first electrode;
forming a first connection layer in the first accommodation region;
a second connection layer is formed in the second receiving region.
4. The method for preparing a Micro-LED array substrate according to claim 1, wherein the fixing the Micro-LED core particles to the limiting wells on the fixing substrate by using a fluid assembly method comprises:
and enabling fluid to flow along a preset direction on the surface of one side of the fixed substrate, which comprises the limiting well, wherein the fluid comprises the Micro-LED core particles, so that the first electrodes of the Micro-LED core particles are embedded in the second accommodating area.
5. The method for preparing a Micro-LED array substrate according to claim 1, wherein the method for assembling the Micro-LED core particles with the limiting wells on the fixing substrate by using a fluid assembly method further comprises the following steps:
fixedly connecting the first electrode with the second connecting layer;
and fixedly connecting the second electrode with the first connecting layer.
6. A preparation system of a Micro-LED array substrate is characterized by comprising the following components:
the core grain acquisition module is used for acquiring Micro-LED core grains; the Micro-LED core particle comprises an epitaxial structure, the epitaxial structure comprises a first surface and a second surface which are oppositely arranged, a first electrode is arranged on the first surface, a second electrode is arranged on the second surface, and the thickness of the first electrode is larger than or equal to a preset thickness;
the substrate obtaining module is used for obtaining a fixed substrate, the fixed substrate comprises a plurality of limiting wells, each limiting well comprises a first containing area and at least one second containing area, a first connecting layer is arranged in each first containing area, a second connecting layer is arranged in each second containing area, the width of each second containing area is smaller than that of each first containing area, and each second containing area is used for containing the first electrode;
and the assembly module is used for fixing the Micro-LED core particles and the limiting well on the fixed substrate by using a fluid assembly method, and when the Micro-LED core particles are fixed with the fixed substrate, the first electrode is positioned in the second accommodating area.
7. The system for preparing a Micro-LED array substrate according to claim 6, wherein the core particle obtaining module is used for obtaining Micro-LED core particles,
providing an epitaxial substrate;
forming an epitaxial layer on the epitaxial substrate;
etching the light emitting areas and the isolation grooves of the epitaxial layers to form a plurality of epitaxial structures, wherein the first surfaces of the epitaxial structures are the light emitting areas;
forming passivation layers on two sides of the light emitting region of the epitaxial structure;
forming a first metal on the surface of a light emitting region of the epitaxial structure, wherein the orthographic projection of the first metal on the epitaxial substrate is positioned in the orthographic projection of the epitaxial structure on the epitaxial substrate, and the thickness of the first metal is greater than the preset thickness;
bonding the first surface of the epitaxial structure with a temporary substrate by using a bonding process, and removing the epitaxial substrate after bonding to expose the second surface of the epitaxial structure;
forming a second metal on a second surface of the epitaxial structure;
removing the temporary substrate to obtain a plurality of Micro-LED core particles.
8. The system for preparing a Micro-LED array substrate according to claim 6, wherein the substrate acquisition module is used for acquiring a fixed substrate,
providing a substrate to be processed;
forming a mask layer on the substrate to be processed;
forming a plurality of limiting wells on the substrate to be processed by taking the mask layer as a mask, wherein each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, the width of each second accommodating area is smaller than that of each first accommodating area, and each second accommodating area is used for accommodating the first electrode;
forming a first connection layer in the first accommodation region;
a second connection layer is formed in the second receiving region.
9. The system for preparing a Micro-LED array substrate according to claim 6, wherein the assembly module utilizes a fluid assembly method to fix the Micro-LED core particles with the limiting wells on the fixing substrate,
and enabling fluid to flow along a preset direction on the surface of one side of the fixed substrate, which comprises the limiting well, wherein the fluid comprises the Micro-LED core particles, so that the first electrodes of the Micro-LED core particles are embedded in the second accommodating area.
10. The system for preparing a Micro-LED array substrate according to claim 6, further comprising:
and the fixing module is used for fixedly connecting the first electrode with the second connecting layer and fixedly connecting the second electrode with the first connecting layer.
11. A Micro-LED array substrate, comprising:
the fixed substrate comprises a plurality of limiting wells, each limiting well comprises a first accommodating area and at least one second accommodating area, a first connecting layer is arranged in each first accommodating area, a second connecting layer is arranged in each second accommodating area, and the width of each second accommodating area is smaller than that of each first accommodating area;
the Micro-LED core grain is positioned in the limiting well and comprises an epitaxial structure, the epitaxial structure comprises a first surface and a second surface which are oppositely arranged, the first surface is provided with the first electrode, the first electrode is positioned in the second containing area and is electrically connected with the second connecting layer, the second surface is provided with the second electrode, the second electrode is positioned in the first containing area and is electrically connected with the first connecting layer, and the thickness of the first electrode is larger than or equal to the preset thickness.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104335339A (en) * | 2012-05-08 | 2015-02-04 | 勒克斯维科技公司 | Compliant micro device transfer head |
| CN108461438A (en) * | 2018-04-03 | 2018-08-28 | 泉州市盛维电子科技有限公司 | A kind of micro-led flood tide transfer device and transfer method |
| CN109192835A (en) * | 2018-07-17 | 2019-01-11 | 友达光电股份有限公司 | Light emitting device and method for manufacturing the same |
| CN109979807A (en) * | 2017-12-28 | 2019-07-05 | 富士电机株式会社 | The manufacturing method of semiconductor device |
| CN110611018A (en) * | 2019-10-21 | 2019-12-24 | 深圳市思坦科技有限公司 | LED chip transfer method, substrate and system |
-
2020
- 2020-02-18 CN CN202010100091.1A patent/CN111276592B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104335339A (en) * | 2012-05-08 | 2015-02-04 | 勒克斯维科技公司 | Compliant micro device transfer head |
| KR20150013647A (en) * | 2012-05-08 | 2015-02-05 | 럭스뷰 테크놀로지 코포레이션 | Compliant micro device transfer head |
| CN109979807A (en) * | 2017-12-28 | 2019-07-05 | 富士电机株式会社 | The manufacturing method of semiconductor device |
| CN108461438A (en) * | 2018-04-03 | 2018-08-28 | 泉州市盛维电子科技有限公司 | A kind of micro-led flood tide transfer device and transfer method |
| CN109192835A (en) * | 2018-07-17 | 2019-01-11 | 友达光电股份有限公司 | Light emitting device and method for manufacturing the same |
| CN110611018A (en) * | 2019-10-21 | 2019-12-24 | 深圳市思坦科技有限公司 | LED chip transfer method, substrate and system |
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