CN109968166A - The grinding method and grinding device of circuit board plug socket resin - Google Patents
The grinding method and grinding device of circuit board plug socket resin Download PDFInfo
- Publication number
- CN109968166A CN109968166A CN201910206171.2A CN201910206171A CN109968166A CN 109968166 A CN109968166 A CN 109968166A CN 201910206171 A CN201910206171 A CN 201910206171A CN 109968166 A CN109968166 A CN 109968166A
- Authority
- CN
- China
- Prior art keywords
- brush
- circuit board
- nonwoven fabric
- polish
- plug socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
The present invention relates to a kind of grinding method and grinding devices of circuit board plug socket resin.Wherein the grinding method of circuit board plug socket resin makes the buffed surface of plug socket resin close to the surface of the circuit board the following steps are included: using the first nonwoven fabric brush to circuit board polishing.Ceramics brush polishing at least twice is carried out to circuit board and uses the second nonwoven fabric brush smooth to circuit board surface to circuit board polishing.The grinding method of foregoing circuit board plug socket resin avoids circuit board when polishing relatively thin circuit board and plate face recess occurs, the phenomenon of another plate face protrusion, and then avoid subsequent polish-brush to asterism leakage substrate phenomenon caused by the plate face grinding excess of the protrusion of circuit board or unclean phenomenon is ground to the plate face of recess.
Description
Technical field
The present invention relates to circuit board making technical fields, a kind of grinding method more particularly to circuit board plug socket resin and
Grinding device.
Background technique
With the continuous renewal of electronics techniques, electronic product develops towards lightweight, micromation, high speed direction,
To printed circuit board, more stringent requirements are proposed.In order to save printed circuit board space surface, improve printed circuit board welding
Reliability, more and more printed circuit panel products used the design method of hole surface production copper PAD.For this kind of design
Printed circuit panel products need the mode using filling holes with resin, will need in the via hole resin plug for crossing hole surface production copper PAD
Full, plug is put down.The conventional processing procedure of filling holes with resin mainly includes drilling, plating, consent, solidification, grinding, plates hole after drilling and leads to, connects
Carry out plug socket resin solidification again, it is polished finally by grinding.
With the development of electronics industry, the plate thickness of printed circuit board is more and more thinner, and traditional circuit board plug socket resin is ground
The mill method circuit board grainding capacity relatively thin for plate thickness is poor, and scrappage is higher, is easy to appear circuit board single side asterism leakage base
Material or the unclean phenomenon of nog plate, and the grinding method of traditional circuit board plug socket resin needs to improve nog plate quality to electricity
Road plate is repeatedly ground, and inefficiency is caused.
Summary of the invention
Based on this, it is necessary to for the grinding quality problem for how improving circuit board plug socket resin, provide a kind of circuit board
The grinding method and grinding device of plug socket resin.
A kind of grinding method of circuit board plug socket resin, comprising the following steps:
Using the first nonwoven fabric brush to circuit board polishing, make the buffed surface of plug socket resin close to the surface of the circuit board；
Ceramics brush grinding at least twice is carried out to the circuit board；
Surfacing is ground to the circuit board using the second nonwoven fabric brush.
The grinding method of foregoing circuit board plug socket resin is by the first nonwoven fabric brush to plug socket resin raised on circuit board
It is tentatively polished, so that the buffed surface of plug socket resin close to the surface of circuit board, avoids grinding device snap-gauge and just
Circuit board is refined in subsequent ceramics brush.Since the first nonwoven fabric brush is soft brush, can be kept away when being ground to circuit board
Exempt from relatively thin circuit board and plate face recess, the phenomenon of another plate face protrusion occurs, and then avoids subsequent polish-brush to circuit board
Asterism leakage substrate problem or the unclean problem of plate face grinding to recess caused by the plate face grinding excess of protrusion.Meanwhile
Second nonwoven fabric brush can be polished to the recess that ceramics brush cannot be polished to, clean so as to which plug socket resin is polished, and ensure that
Circuit board surface is smooth.And the second nonwoven fabric brush plays polishing action to circuit board, reduces circuit board surface tension, thus
The quality of circuit board later period coating can be improved.Further, the grinding method of foregoing circuit board plug socket resin has carried out at least two
Secondary ceramics brush polishing is ground to can grind plug socket resin completely in a grinding process relative to needing to be repeated as many times
The grinding method of process is ground, the grinding method efficiency of foregoing circuit board plug socket resin is faster.
The technical solution of the application is further described below:
The operating current of the first nonwoven fabric brush is 0.2A-0.5A in one of the embodiments, subtracts amount of copper control and is
Less than 0.5 μm.
The granularity of the first nonwoven fabric brush is 400#-600# in one of the embodiments,.
In one of the embodiments, it is described ceramics brush operating current be 1.0A-2.0A, subtract amount of copper control for 1.5 μm-
2.5μm。
The granularity of the ceramics brush is 600#-800# in one of the embodiments,.
The operating current of the second nonwoven fabric brush is 1.0A-2.0A in one of the embodiments, subtracts amount of copper control and is
1μm-1.5μm。
The granularity of the second nonwoven fabric brush is 600#-800# in one of the embodiments,.
In addition, the application also provides a kind of grinding device, including for transmitting circuit plate transport mechanism and along the biography
The first nonwoven fabric brush assemblies, at least two ceramic brush assemblies, the second nonwoven fabric brush group for sending the direction of transfer of mechanism to set gradually
Part.
Above-mentioned grinding device has set gradually the first nonwoven fabric brush assemblies, at least two ceramics brushes along circuit board direction of transfer
Component and the second nonwoven fabric brush assemblies.Plug socket resin raised on circuit board can tentatively be beaten by the first nonwoven fabric brush
Mill.Since the first nonwoven fabric brush is soft brush, it is recessed to be avoided that a plate face occurs for relatively thin circuit board when grinding to circuit board
It falls into, the phenomenon of another plate face protrusion, and then avoids subsequent ceramics brush and grind excessive to the plate face of the protrusion of circuit board and cause
Asterism leakage substrate phenomenon or unclean phenomenon is ground to the plate face of recess.Meanwhile above-mentioned grinding device is provided at least two
A ceramics brush assemblies, so as to carry out ceramics brush polishing at least twice to circuit board, thus in a grinding process
Plug socket resin polishing is clean, improve grinding efficiency.Further, above-mentioned grinding device is also provided with after ceramic brush assemblies
Second nonwoven fabric brush assemblies.Since the second nonwoven fabric brush is soft brush, it can be polished to the recess that ceramics brush cannot be polished to, thus
The standby polishing of energy plug socket resin is clean, ensure that circuit board surface is smooth.And the second nonwoven fabric brush plays polishing to circuit board and makees
With circuit board surface tension being reduced, so as to improve the quality of circuit board later period coating.
The grinding device further includes at least one of following in one of the embodiments:
The first nonwoven fabric brush assemblies include polish-brush and the first lower polish-brush on first, and on described first polish-brush with
And polish-brush is shifted to install along the direction of transfer in the two sides of the transport mechanism under described first；
The ceramics brush assemblies include upper ceramic brush and lower ceramics brush, and the upper ceramics are brushed and the lower ceramics
Brush is shifted to install along the direction of transfer in the two sides of the transport mechanism；And
Polish-brush and the second lower polish-brush on the second nonwoven fabric brush assemblies second, and polish-brush and institute on described second
The second lower polish-brush is stated to shift to install along the direction of transfer in the two sides of the transport mechanism.
In one of the embodiments, further include cleaning equipment after the second nonwoven fabric brush assemblies are set and sets
Set the dry plate equipment after the cleaning equipment.
Detailed description of the invention
Fig. 1 is the flow chart of the grinding method of the circuit board plug socket resin of an embodiment；
Fig. 2 is the structural schematic diagram of the grinding device of an embodiment.
Description of symbols:
100, grinding device；110, transport mechanism；120, the first nonwoven fabric brush assemblies；121, polish-brush on first；122,
Polish-brush once；123, first for pinch roller；124, second for pinch roller；130, ceramic brush assemblies；131, upper ceramics brush；132, lower ceramics
Brush；133, third is for pinch roller；134, the 4th for pinch roller；140, the second nonwoven fabric brush assemblies；141, polish-brush on second；142, second
Lower polish-brush；143, the 5th for pinch roller；144, the 6th for pinch roller；150, cleaning equipment；160, dry plate equipment.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Referring to Fig. 1, the embodiment of the present application provides a kind of grinding method of circuit board plug socket resin, comprising the following steps:
S110: using the first nonwoven fabric brush to circuit board polishing, make the buffed surface of plug socket resin close to the surface of circuit board.
Specifically, the particle size range of the first nonwoven fabric brush is 400# to 600#.Since the granularity of nonwoven fabric brush is smaller, tangentially
Power is bigger, so the first nonwoven fabric brush is preferably 400# nonwoven fabric brush, to guarantee that the first nonwoven fabric will brushed with enough tangential forces
After circuit board resin consent protrusion resin tentatively polished so that plug socket resin buffed surface close to circuit board table
Face.The operating current of the first nonwoven fabric brush is controlled between 0.2A to 0.5A, so that the first nonwoven fabric brush of control is applied to circuit
The lower pressure of plate, and then guarantee that circuit board subtracts amount of copper less than 0.5 μm.Further, first is used in one of the embodiments,
Nonwoven fabric brush is less than 0.1mm to the surface height difference of circuit board to circuit board polishing to plug socket resin, so that polishing be avoided to fill
Snap-gauge is set, while circuit board is refined convenient for subsequent.
S120: ceramics brush polishing at least twice is carried out to circuit board.
Specifically, it is polished again using ceramics brush circuit board, with consent raised on further polish-brush circuit board
Resin.Ceramic brush particle size range is 600# to 800#, and ceramics brush is preferably 600# ceramics brush.Controlling the operating current that ceramics are brushed is
Between 1.0A to 2.0A, so that controlling ceramics brush is applied to the lower pressure of circuit board, and then guarantee that circuit board subtracts amount of copper control and exists
1.5μm-0.5μm.Further, it is polished at least twice using ceramics brush circuit board, so that circuit board protruded above
Plug socket resin polishing is clean.Avoid simultaneously because once polish it is clean due to needs application pressure is excessive on circuit boards caused by
Circuit board damage phenomenon.Specifically, carrying out ceramics brush polishing twice to circuit board in one of the embodiments, make pottery for the first time
The polishing of porcelain brush roughly grinds circuit board using 600# ceramics brush, and operating current control is 2.0A, is polishing to plug socket resin and electricity
Road plate surface difference in height is less than 0.03mm.Second of ceramics brush polishing refines circuit board using 600# ceramics brush, works
Current control is 1.0A, and it is clean that circuit board is protruded above resin polishing.
S130: using the second nonwoven fabric brush to the circuit board polishing to surfacing.
Specifically, it is made of due to ceramics brush ceramic block, i.e., ceramics brush is hard brush.It is arranged second after ceramic brush step
Nonwoven fabric brush polishes to circuit board, the second nonwoven fabric brush can to the plug socket resin of recess that ceramics brush can not be polished into
Row polishing, guarantees that circuit board surface is polished completely.Further, the particle size range of the second nonwoven fabric brush is 600# to 800#,
Second nonwoven fabric brush is preferably 600# nonwoven fabric brush.The operating current of the first nonwoven fabric brush is controlled between 1.0A to 2.0A, from
And it controls the first nonwoven fabric brush and is applied to the lower pressure of circuit board, and then guarantee that circuit board subtracts amount of copper control at 1 μm -1.5 μm.
The grinding method of foregoing circuit board plug socket resin is by the first nonwoven fabric brush to plug socket resin raised on circuit board
It is tentatively polished, so that the buffed surface of plug socket resin close to the surface of circuit board, avoids grinding device snap-gauge and just
Circuit board is refined in subsequent ceramics brush.Since the first nonwoven fabric brush is soft brush, can be kept away when being ground to circuit board
Exempt from relatively thin circuit board and plate face recess, the phenomenon of another plate face protrusion occurs, and then avoids subsequent polish-brush to circuit board
Asterism leakage substrate phenomenon or the unclean phenomenon of plate face polishing to recess, improve caused by the plate face polishing excess of protrusion
To the nog plate ability compared with thin laminate circuit.Meanwhile second nonwoven fabric brush can be polished to the recess that cannot be polished to of ceramics brush, thus
The standby polishing of energy plug socket resin is clean, ensure that circuit board surface is smooth.And the second nonwoven fabric brush plays polishing to circuit board and makees
With circuit board surface tension being reduced, so as to improve the quality of circuit board later period coating.Further, foregoing circuit plate plug
The grinding method of hole resin carries out ceramics brush polishing at least twice, to can grind plug socket resin in a grinding process
Completely, relative to the grinding method for needing repeatedly grinding process, the grinding method efficiency of foregoing circuit board plug socket resin is more
Fastly.
Referring to fig. 2, the application also provides a kind of grinding device 100, for beating the circuit board 200 after filling holes with resin
Mill, to remove plug socket resin raised on circuit board 200.Specifically, the grinding device 100 of an embodiment includes transport mechanism
110, the ceramic brush assemblies 130 of the first nonwoven fabric brush assemblies 120, at least two and the second nonwoven fabric brush assemblies 140.Wherein, it passes
Send mechanism 110 for transmitting circuit plate 200, so that circuit board 200 is successively by the first nonwoven fabric brush assemblies 120, ceramics brush
Component 130 and the second nonwoven fabric brush assemblies 140.Further, the transmission of transport mechanism 110 in one of the embodiments,
Mode is band transmission.In another embodiment, the transmission mode of transport mechanism 110 is idler wheel transmission.
Specifically, the ceramic brush assemblies 130 of the first nonwoven fabric brush assemblies 120, at least two and the second nonwoven fabric brush assemblies
140 set gradually along the direction of transfer of transport mechanism 110.I.e. when circuit board 200 enters grinding device 100 by first position
Afterwards, the preliminary polishing of the first nonwoven fabric brush assemblies 120 can be first passed through, guarantees that plug socket resin and 200 surface height difference of circuit board are small
In 0.1mm.Then circuit board 200 is successively polished by ceramic brush assemblies 130 at least twice with transport mechanism 110, so that electric
The plug socket resin of 200 surface bulge of road plate is polished completely.Then circuit board 200 can pass through the second nonwoven fabric brush assemblies 140
Sanding and polishing so that the polishing of ceramic brush assemblies 130 less than the resin of 200 recess of circuit board be polished completely.And the
Two nonwoven fabric brush assemblies 140 can to circuit board 200 generate polishing action so that 200 surface of circuit board be polished it is smooth, with reduce
200 surface tension of circuit board improves the quality of later period coating.Last circuit board 200 is transferred out grinding with transport mechanism 110
Device 100.
The first nonwoven fabric brush assemblies 120 include being separately positioned on 110 two sides of transport mechanism in one of the embodiments,
Polish-brush 121 and the first lower polish-brush 122 on first.Wherein, polish-brush 121 is used to polish the upper face of circuit board 200 on first, the
Once polish-brush 122 is used for the lower face of polish-brush circuit board 200.Further, polish-brush 121 and the first lower polish-brush 122 on first
It is dislocatedly distributed in the transmission direction in the two sides of transport mechanism 110, i.e. the upper face polishing with lower face polishing point of circuit board 200
Do not carry out, so as to avoid circuit board 200 upper face and lower face polish simultaneously caused by 200 inconsistent phenomenon of circuit board.
Further, the first nonwoven fabric brush assemblies 120 further include first for pinch roller 123 and second for pinch roller 124, first
Polish-brush 121 is oppositely arranged on standby pinch roller 123 and first, and second is oppositely arranged for pinch roller 124 and the first lower polish-brush 122.First is standby
Pinch roller 123 and second plays support and transmitting circuit plate 200 for pinch roller 124.
Specifically, the nonwoven fabric brush that the particle size range of polish-brush 121 and the first lower polish-brush 122 is 400#-600# on first,
Since the granularity of nonwoven fabric brush is smaller, tangential force is bigger, needs for plug socket resin to be polishing to plug when circuit board 200 is tentatively polished
Hole resin and 200 surface height difference of circuit board are less than 0.1mm, so polish-brush 121 and the first lower polish-brush 122 are preferably on first
400# nonwoven fabric brush.Specifically, polish-brush 121 and the first lower polish-brush 122 are roller type on first in one of the embodiments
Polish-brush carries out polish-brush in face of circuit board by week.In another embodiment, polish-brush 121 and the first lower polish-brush 122 on first
For board-type polish-brush, polish-brush is carried out to circuit board by end face.Further, pass through polish-brush 121 and first in control first
The operating current of lower polish-brush 122 to control the lower pressure of polish-brush 121 and the first lower polish-brush 122 on first, and then controls first
Upper polish-brush 121 and the first lower polish-brush 122 subtract amount of copper to circuit board.
Similarly, ceramic brush assemblies 130 include be separately positioned on 110 two sides of transport mechanism it is upper ceramics brush 131 and under
Ceramics brush 132.Upper ceramics brush 131 upper face for circuit board 200 of polishing, and lower ceramics brush 132 for polish-brush circuit board 200
Lower face.Further, upper ceramics brush 131 and lower ceramics brush 132 are dislocatedly distributed in the transmission direction in transport mechanism 110
Two sides, i.e., ceramic brush assemblies 130 carry out the upper face polishing of circuit board 200 with lower face polishing respectively, so as to avoid electricity
200 inconsistent phenomenon of circuit board caused by the upper face and lower face of road plate 200 are polished simultaneously.
Further, ceramic brush assemblies 130 further include third for pinch roller 133 and the 4th for pinch roller 134, third is for pinch roller
133 are oppositely arranged with upper ceramics brush 131, and the 4th is oppositely arranged for pinch roller 124 and lower ceramics brush 132.Third for pinch roller 133 and
4th plays support and transmitting circuit plate 200 for pinch roller 134.
Further, the particle size range of upper ceramics brush 131 and lower ceramics brush 132 is 600#-800#.Upper ceramics brush 131
And lower ceramics brush 132 preferably 600# ceramics brush.Upper ceramics brush 131 and lower ceramics brush 132 in one of the embodiments
For roller type polish-brush, polish-brush is carried out in face of circuit board by week.In another embodiment, upper ceramics brush 131 and lower ceramics
Brush 132 is board-type polish-brush, carries out polish-brush to circuit board by end face.Further, by control upper ceramics brush 131 and under
The operating current of ceramics brush 132, can control the lower pressure of ceramics brush 131 and lower ceramics brush 132, and then control upper ceramics
132 pairs of circuit boards of brush 131 and lower ceramics brush subtract amount of copper.
Similarly, the second nonwoven fabric brush assemblies 140 include polish-brush on be separately positioned on 110 two sides of transport mechanism second
Polish-brush 142 under 141 and second.Wherein, polish-brush 141 is used to polish the upper face of circuit board 200 on second, the second lower polish-brush
142 are used for the lower face of polish-brush circuit board 200.Further, on second polish-brush 141 and the second lower polish-brush 142 in sender
It is dislocatedly distributed upwards in the two sides of transport mechanism 110, i.e. the second nonwoven fabric brush assemblies 140 polish to the upper face of circuit board 200
With lower face polishing carry out respectively, so as to avoid circuit board 200 upper face and lower face polish simultaneously caused by circuit
200 inconsistent phenomenon of plate.
Further, the second nonwoven fabric brush assemblies 140 further include the 5th for pinch roller 141 and the 6th for pinch roller 142, the 5th
Polish-brush 141 is oppositely arranged on standby pinch roller 141 and second, and the 6th is oppositely arranged for pinch roller 142 and the second lower polish-brush 142.5th is standby
Pinch roller 141 and the 6th play support and transmitting circuit plate 200 for pinch roller 142.
Specifically, the nonwoven fabric brush that the particle size range of polish-brush 141 and the second lower polish-brush 142 is 600#-800# on second.
Further, polish-brush 141 and the second lower polish-brush 142 are preferably 600# nonwoven fabric brush on second.In one of the embodiments,
Polish-brush 141 and the second lower polish-brush 142 are roller type polish-brush on second, carry out polish-brush in face of circuit board by week.At another
In embodiment, polish-brush 141 and the second lower polish-brush 142 are board-type polish-brush on second, carry out polish-brush to circuit board by end face.
Further, by polish-brush 141 in control second and the operating current of the second lower polish-brush 142, it can control polish-brush on second
141 and second lower polish-brush 142 lower pressure, and then control on second polish-brush 141 and the second lower polish-brush 142 to circuit board
Subtract amount of copper.
Grinding device 100 further includes cleaning equipment 150 and dry plate equipment 160 in one of the embodiments,.It is wherein clear
It washes equipment 150 to be arranged after the second nonwoven fabric brush assemblies 140, for carrying out circuit board 200 after circuit board 200 is polished
Cleaning, to remove the polishing clast on circuit board 200, specifically, cleaning equipment 150 is washing equipment.Dry plate equipment 160 is arranged
After cleaning equipment 150, for the circuit board 200 after cleaning to be dried.
Above-mentioned grinding device 100 has set gradually the first nonwoven fabric brush assemblies 120, at least along 200 direction of transfer of circuit board
Two ceramic brush assemblies 130 and the second nonwoven fabric brush assemblies 140.It can be to raised on circuit board 200 by the first nonwoven fabric brush
Plug socket resin tentatively polished.Due to the first nonwoven fabric brush be soft brush, be avoided that when being ground to circuit board 200 compared with
One plate face recess, the phenomenon of another plate face protrusion occur for thin circuit board 200, and then avoid subsequent ceramics brush to circuit board
Asterism leakage substrate phenomenon or the unclean phenomenon of plate face grinding to recess caused by the plate face grinding excess of 200 protrusion.
Meanwhile above-mentioned grinding device 100 is provided at least two ceramic brush assemblies 130, so as to carry out at least two to circuit board 200
Secondary ceramics brush polishing improves grinding efficiency so that it is clean that plug socket resin can be polished in a grinding process.Further
Ground, above-mentioned grinding device 100 are provided with the second nonwoven fabric brush assemblies 140 after ceramic brush assemblies 130.Due to the second nonwoven fabric brush
For soft brush, it can be polished to the recess that ceramics brush cannot be polished to, it is clean so as to the standby polishing of plug socket resin, it ensure that circuit board
200 surfacings.And the second nonwoven fabric brush plays polishing action to circuit board 200, reduces 200 surface tension of circuit board,
So as to improve the quality of 200 later period of circuit board coating.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of grinding method of circuit board plug socket resin, which comprises the following steps:
Using the first nonwoven fabric brush to circuit board polishing, make the buffed surface of plug socket resin close to the surface of the circuit board；
Ceramics brush polishing at least twice is carried out to the circuit board；
Using the second nonwoven fabric brush to the circuit board polishing to surfacing.
2. the grinding method of circuit board plug socket resin according to claim 1, which is characterized in that the first nonwoven fabric brush
Operating current be 0.2A-0.5A, subtract amount of copper control as less than 0.5 μm.
3. the grinding method of circuit board plug socket resin according to claim 1, which is characterized in that the first nonwoven fabric brush
Granularity be 400#-600#.
4. the grinding method of circuit board plug socket resin according to claim 1, which is characterized in that the work of the ceramics brush
Electric current is 1.0A-2.0A, and subtracting amount of copper control is 1.5 μm -2.5 μm.
5. the grinding method of circuit board plug socket resin according to claim 1, which is characterized in that the granularity of the ceramics brush
For 600#-800#.
6. the grinding method of circuit board plug socket resin according to claim 1, which is characterized in that the second nonwoven fabric brush
Operating current be 1.0A-2.0A, subtract amount of copper control as 1 μm -1.5 μm.
7. the grinding method of circuit board plug socket resin according to claim 1, which is characterized in that the second nonwoven fabric brush
Granularity be 600#-800#.
8. a kind of grinding device, which is characterized in that including the transport mechanism for transmitting circuit plate and along the transport mechanism
Direction of transfer the first nonwoven fabric brush assemblies, at least two ceramic brush assemblies, the second nonwoven fabric brush assemblies that set gradually.
9. grinding device according to claim 8, which is characterized in that further include at least one of following:
The first nonwoven fabric brush assemblies include polish-brush and the first polish-brush, and polish-brush and institute on described first down on first
The first lower polish-brush is stated to shift to install along the direction of transfer in the two sides of the transport mechanism；
The ceramics brush assemblies include upper ceramics brush and lower ceramic brush, and the upper ceramics brush and the lower ceramics brush edge
The direction of transfer is shifted to install in the two sides of the transport mechanism；And
Polish-brush and the second lower polish-brush on the second nonwoven fabric brush assemblies second, and polish-brush and described the on described second
Two lower polish-brushes are shifted to install along the direction of transfer in the two sides of the transport mechanism.
10. grinding device according to claim 8, which is characterized in that further include being arranged in the second nonwoven fabric brush group
Cleaning equipment after part and the dry plate equipment being arranged in after the cleaning equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910206171.2A CN109968166A (en) | 2019-03-19 | 2019-03-19 | The grinding method and grinding device of circuit board plug socket resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910206171.2A CN109968166A (en) | 2019-03-19 | 2019-03-19 | The grinding method and grinding device of circuit board plug socket resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109968166A true CN109968166A (en) | 2019-07-05 |
Family
ID=67079251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910206171.2A Pending CN109968166A (en) | 2019-03-19 | 2019-03-19 | The grinding method and grinding device of circuit board plug socket resin |
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| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
| CN112492764A (en) * | 2021-01-27 | 2021-03-12 | 四川英创力电子科技股份有限公司 | Method for eliminating solder resist ink in through hole of printed circuit board |
| CN112739046A (en) * | 2020-11-07 | 2021-04-30 | 奥士康科技股份有限公司 | PCB manufacturing method for solving corner rolling deformation of outer layer circuit of Server-like PCB |
| CN114423173A (en) * | 2021-12-13 | 2022-04-29 | 南通威斯派尔半导体技术有限公司 | Copper-clad ceramic substrate with high bonding strength and preparation process thereof |
| CN114885527A (en) * | 2022-04-26 | 2022-08-09 | 深圳明阳电路科技股份有限公司 | PCB high-speed material and manufacturing method thereof |
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| CN112739046A (en) * | 2020-11-07 | 2021-04-30 | 奥士康科技股份有限公司 | PCB manufacturing method for solving corner rolling deformation of outer layer circuit of Server-like PCB |
| CN112492764A (en) * | 2021-01-27 | 2021-03-12 | 四川英创力电子科技股份有限公司 | Method for eliminating solder resist ink in through hole of printed circuit board |
| CN114423173A (en) * | 2021-12-13 | 2022-04-29 | 南通威斯派尔半导体技术有限公司 | Copper-clad ceramic substrate with high bonding strength and preparation process thereof |
| CN114885527A (en) * | 2022-04-26 | 2022-08-09 | 深圳明阳电路科技股份有限公司 | PCB high-speed material and manufacturing method thereof |
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