CN110379784A - 一种半导体封装结构 - Google Patents
一种半导体封装结构 Download PDFInfo
- Publication number
- CN110379784A CN110379784A CN201910668958.0A CN201910668958A CN110379784A CN 110379784 A CN110379784 A CN 110379784A CN 201910668958 A CN201910668958 A CN 201910668958A CN 110379784 A CN110379784 A CN 110379784A
- Authority
- CN
- China
- Prior art keywords
- plastic encapsulation
- semiconductor package
- heat
- adhesive layer
- package according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 229920003023 plastic Polymers 0.000 claims abstract description 51
- 239000004033 plastic Substances 0.000 claims abstract description 51
- 238000005538 encapsulation Methods 0.000 claims abstract description 46
- 239000012790 adhesive layer Substances 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000004519 grease Substances 0.000 claims abstract description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 abstract description 2
- 229910002804 graphite Inorganic materials 0.000 abstract description 2
- 239000010439 graphite Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910668958.0A CN110379784B (zh) | 2019-07-23 | 2019-07-23 | 一种半导体封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910668958.0A CN110379784B (zh) | 2019-07-23 | 2019-07-23 | 一种半导体封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110379784A true CN110379784A (zh) | 2019-10-25 |
CN110379784B CN110379784B (zh) | 2021-05-07 |
Family
ID=68255366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910668958.0A Active CN110379784B (zh) | 2019-07-23 | 2019-07-23 | 一种半导体封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110379784B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116613110A (zh) * | 2023-06-16 | 2023-08-18 | 广东气派科技有限公司 | 一种增强散热的盖板封装结构及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2916927Y (zh) * | 2006-05-09 | 2007-06-27 | 敦南科技股份有限公司 | 半导体封装结构 |
CN1328775C (zh) * | 2001-11-27 | 2007-07-25 | 电子科学工业公司 | 阴影生成设备 |
WO2018134547A1 (fr) * | 2017-01-23 | 2018-07-26 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d'un dispositif electronique et dispositif electronique |
CN208923105U (zh) * | 2018-11-27 | 2019-05-31 | 西安航思半导体有限公司 | 表面贴装式半导体器件 |
CN208923095U (zh) * | 2018-11-27 | 2019-05-31 | 西安航思半导体有限公司 | 半导体封装结构 |
-
2019
- 2019-07-23 CN CN201910668958.0A patent/CN110379784B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1328775C (zh) * | 2001-11-27 | 2007-07-25 | 电子科学工业公司 | 阴影生成设备 |
CN2916927Y (zh) * | 2006-05-09 | 2007-06-27 | 敦南科技股份有限公司 | 半导体封装结构 |
WO2018134547A1 (fr) * | 2017-01-23 | 2018-07-26 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d'un dispositif electronique et dispositif electronique |
CN208923105U (zh) * | 2018-11-27 | 2019-05-31 | 西安航思半导体有限公司 | 表面贴装式半导体器件 |
CN208923095U (zh) * | 2018-11-27 | 2019-05-31 | 西安航思半导体有限公司 | 半导体封装结构 |
Non-Patent Citations (1)
Title |
---|
宋满仓等: "微结构塑件注塑成型的复制度分析 ", 《高分子材料科学与工程》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116613110A (zh) * | 2023-06-16 | 2023-08-18 | 广东气派科技有限公司 | 一种增强散热的盖板封装结构及其制备方法 |
CN116613110B (zh) * | 2023-06-16 | 2024-02-23 | 广东气派科技有限公司 | 一种增强散热的盖板封装结构制备方法及盖板封装结构 |
Also Published As
Publication number | Publication date |
---|---|
CN110379784B (zh) | 2021-05-07 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210414 Address after: 518000 No. 509-510, block B, Huafeng headquarters economic building, 288 Xixiang Avenue, Laodong community, Xixiang street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen youyida Electronics Co.,Ltd. Address before: 100083 Beijing City, Haidian District Institute of Rutosids No. 11 Applicant before: Wang Xin |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A semiconductor packaging structure Granted publication date: 20210507 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: Shenzhen youyida Electronics Co.,Ltd. Registration number: Y2024980022387 |