CN110379753B - 基板传输***、存储介质以及基板传输方法 - Google Patents
基板传输***、存储介质以及基板传输方法 Download PDFInfo
- Publication number
- CN110379753B CN110379753B CN201910169163.5A CN201910169163A CN110379753B CN 110379753 B CN110379753 B CN 110379753B CN 201910169163 A CN201910169163 A CN 201910169163A CN 110379753 B CN110379753 B CN 110379753B
- Authority
- CN
- China
- Prior art keywords
- door
- foup
- efem
- space
- substrate transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
基板传输***的示例包括基板传输机器人、模块,所述模块在其中容纳基板传输机器人并具有EFEM门、装载端口,所述装载端口用于将具有FOUP门的FOUP放置其上、以及控制器,所述控制器用于当FOUP位于装载端口的停靠位置时,打开EFEM门,同时关闭FOUP门。
Description
技术领域
描述了涉及基板传输***、存储介质和基板传输方法的示例。
背景技术
专利文献1(JP2006-128153)公开了在FIMS内部的开口部分的上部处设置气体供应管道,并且将清洁气体从管道喷射到容器(pod)中容纳的晶圆的上表面上,以从晶圆上去除污染物等。
在半导体制造工艺中,例如,将前开式晶圆传送盒(Front-Opening Unified Pod,FOUP)放置在装载端口上,并且将基板从FOUP中取出或放入FOUP中。例如,使用前开口接口机械标准(Front-Opening Interface Mechanical Standard,FIMS)从FOUP中取出基板或将基板放入FOUP中。如果诸如氧气或水的成分渗入FOUP,则FOUP中的环境被污染或FOUP中的基板被污染。
发明内容
本文描述的一些示例可以解决上述问题。本文描述的一些示例可以提供能够抑制FOUP的内部污染的基板传输***、存储介质和基板传输方法。
在一些示例中,一种基板传输***包括基板传输机器人、其中容纳基板传输机器人并具有EFEM门的模块、用于将具有FOUP门的FOUP放置其上的装载端口以及控制器,该控制器用于当FOUP位于装载端口的停靠位置时,打开EFEM门,同时关闭FOUP门。
附图说明
图1是设备前端模块的正视图;
图2是EFEM的侧视图;
图3是示出了FIMS门和FOUP的横截面图;
图4示出了FIMS门打开;
图5示出了FIMS门已关闭;
图6示出了FIMS门和FOUP门打开;
图7是示出了FOUP门打开的图;
图8是示出了氧气的浓度变化的图;
图9是示出了氧气的浓度变化的图;
图10是示出了硬件的示例性构造的图;以及
图11是示出了基板传输方法的示例的流程图。
具体实施方式
将参考附图描述根据实施方案的基板传输***、存储介质以及基板传输方法。相同或相应的组成元件由相同的参考标号表示,并且可以省略其重复描述。
(***构造)
图1是设备前端模块(Equipment Front End Module,EFEM)的正视图。图1描绘了EFEM的内部。该EFEM具有用于在其中提供空间10a的壳体10,并且基板传输机器人12容纳在壳体10中。在该模块的上部处设置用于吹出惰性气体的吹出部分14,并且在吹出部分14下方设置风扇16。惰性气体通过ULPA过滤器18,然后由风扇16供给到空间10a中。
到达空间10a的下部的惰性气体进入循环导管20,然后再次到达吹出部分14。如上所述,可以在空间10a中产生惰性气体的向下流动。如果需要,可以设置用于向循环导管20供应惰性气体的管线,使得可以通过阀门22打开和关闭管线。此外,如果需要,可以设置用于将空间10a中的气体排放到外部的管线,使得可以通过阀门30打开和关闭管线。前述构造提供了一种用于使惰性气体循环进入模块的循环设备。可以采用用于使惰性气体循环进入模块的另一种循环设备。此外,惰性气体不循环,而是可以周期性地交换惰性气体或者可以排出全部量的惰性气体。
图2是EFEM的侧视图。与图1类似,图2示出了EFEM的内部。该模块设置有FIMS门40。FIMS门40是EFEM门的示例。可以使用不符合FIMS的EFEM门代替FIMS门40。在壳体10的一侧上设置装载端口42。装载端口42可以用于将具有FOUP门的FOUP 44放置其上。
图3是示出了FIMS门40和FOUP 44的示例性构造的横截面图。FOUP 44具有主体44A和FOUP门44B。由主体44A提供用于容纳基板的容纳空间44a。FOUP门44B具有例如盒型形状,用于在其中提供第一空间44b。FOUP 44的第一空间44b中的空气从洁净室移出。例如,在第一空间44b中可以包含含有约21%氧气的空气。
当FOUP门44B关闭时,容纳空间44a变成封闭空间。主体44A和FOUP门44B例如通过压紧(packing)彼此接触。FOUP 44的位于停靠位置处的主体44A例如通过弹性变形的O形环52与壳体10接触。当FOUP 44位于停靠位置处时,在FOUP门44B与FIMS门之间存在第二空间44c。
在FIMS门40关闭的状态下,FIMS门40与FOUP门44B相对。FIMS门40包括主体40A、吸力垫40B以及闩锁键(latch key)40C。吸力垫40B是例如真空吸附机构,其适于被吸至FOUP门44B。在FIMS门40关闭的状态下,主体40A通过弹性变形的O形环54与壳体10的内壁接触。O形环52和54可以用另外的密封部件代替。
(基板传输方法)
首先,通过高架转移(Overhead Transfer,OHT)将FOUP 44放置在装载端口42上的脱离位置处。此时,诸如氮气的惰性气体可以从装载端口42供应到FOUP 44的容纳空间44a中以吹扫容纳空间44a。例如,通过在主体44A的底表面中形成的从而可打开且可关闭的孔,将容纳空间44a中的气体排出到外部,同时通过在主体44A的底表面中形成的从而可打开且可关闭的另一孔,将惰性气体供应到容纳空间44a中。
随后,如图3所示,将放置在装载端口42上的FOUP 44移动到停靠位置,从而将FOUP门44B和FIMS门40定位成彼此相对。因此,O形环52被***并在FOUP44与壳体10之间弹性变形。
随后,仅打开FIMS门40。图4示出了在FOUP门44B关闭的状态下打开FIMS门40。当仅打开FIMS门40时,用作第一空间44b和第二空间44c的空间与壳体10的空间10a互通。结果,第一空间44b和第二空间44c中的气体被空间10a中的诸如氮气的惰性气体代替,惰性气体循环到该空间10a中。例如,第一空间44b和第二空间44c中的诸如氧气的气体和水被诸如氮气的惰性气体代替。在该处理期间,FOUP门44B关闭,从而防止第一空间44b和第二空间44c中的诸如氧气的气体和水渗入容纳空间44a。
随后,FIMS门40关闭。图5示出了FIMS门40已经关闭。此时,诸如氮气的惰性气体填充在第一空间44b和第二空间44c中。
随后,FIMS门40和FOUP门44B打开。图6示出了FIMS门40和FOUP门44B打开。具体地,例如通过吸力垫40B,将FIMS门40固定至FOUP门44B,并且打开FIMS门40和FOUP门44B。此外,当打开FIMS门40和FOUP门44B时,还进行基于闩锁键40C的闩锁释放。
使与FOUP门44B集成的FIMS门40向下移动,以使容纳空间44a和空间10a互通。在打开门之后,用作第一空间44b和第二空间44c的空间中的一定量的惰性气体被供应至壳体10的空间10a。随后,通过图1所示的基板传输机器人12将FOUP 44中的基板移动到壳体10中。或者,将基板传输到FOUP 44中。
通过如上所述的在打开FOUP门44B之前仅打开FIMS门40,可以用惰性气体代替第一空间44b和第二空间44c中的用作污染源的诸如氧气的气体或水的气体。因此,当打开FOUP门44B时,可以防止FOUP 44的内部被氧气、水等污染。此外,在确认空间10a中的氧气和水的浓度小于预定值之后,可以打开FOUP门44B。
图7是示出了在不用惰性气体代替第一空间44b和第二空间44c中的气体的情况下打开FOUP门44B的图。在这种情况下,第一空间44b和第二空间44c中的污染源诸如氧气或水渗入容纳空间44a,导致FOUP 44的内部污染。然而,这一问题可以通过提供仅打开FIMS门40的处理而解决。
在参考图4描述的仅打开FIMS门40的步骤中要吹扫的空间不限于第一空间44b和第二空间44c。根据基板传输***的构造,可以仅存在第一空间44b和第二空间44c中的一个,或者可以存在与第一空间44b和第二空间44c不同的空间。通过提供仅打开FIMS门40的步骤可以吹扫这些空间中的污染源。此外,污染源不限于氧气或水,而是被认为不希望接触FOUP内部的基板的所有气体均适于作为污染源。
只要能够获得前述动作,就可以自由地改变用于实现上述处理的基板传输***的构造。上述每一处理均不需要基板传输***的构造的任何改变,而是可以通过仅改变操作规范来实现。
(提高/降低氧气浓度)
图8是示出了当FOUP门44B打开而没有经过仅打开FIMS门40的步骤时FOUP中的氧气的浓度变化的图。图8中标记为“FOUP”的曲线示出了FOUP中的氧气的浓度变化。图8中标记为“EFEM”的曲线示出了壳体10中的氧气的浓度变化。当没有提供仅打开FIMS门40的处理时,例如,氧气从第一空间44b和第二空间44c渗入FOUP,并且FOUP中的氧气浓度超过目标值。例如,FOUP中O2浓度的峰值达到1000ppm。此外,EFEM中的O2浓度可以达到200ppm,但是通过增加EFEM中的N2的吹扫量可以降低EFEM中的O2浓度。即使当不仅FIMS门40打开而且FOUP门44B也打开时,其中氧气浓度不超过目标值的说明书(specification)也可以应用于壳体10的空间10a。
图9是示出了当首先仅打开FIMS门40然后打开FOUP门44B时FOUP中的氧气的浓度变化的图。图9中标记为“FOUP”的曲线代表FOUP中的氧气的浓度变化。图9中标记为“EFEM”的曲线代表壳体10中的氧气的浓度变化。由于执行仅打开FIMS门40的处理,因此可以在一些示例中抑制由于打开FOUP门44B而使氧气渗入FOUP。因此,可以防止基板暴露于高浓度的氧气气氛中。
(存储介质)
图10是示出了硬件的示例性构造的图。可以基于计算机可读存储介质中记录的程序来执行前述系列处理。例如,在模块控制器60的存储介质60a中记录这种程序。存储介质60a中记录的程序使得由CPU构造的计算机60b执行以下步骤。
(1)将放置在装载端口42上并具有FOUP门44B的FOUP 44移动到停靠位置,以使FOUP门44B和FIMS门40彼此相对定位。
(2)当FOUP 44位于装载端口42的停靠位置处时,打开FIMS门40,同时关闭FOUP门44B。
此外,还可以使计算机执行以下步骤。
(3)将惰性气体供应到位于装载端口42的脱离位置处的FOUP 44中。
除了前述步骤(1)至(3)之外,可以使模块控制器60执行上述任何可选步骤。当模块控制器60实现各个功能时,可以仅改变现有的装载端口操作命令以执行前述处理。前述处理可以由装载端口42的存储介质和计算机执行。
用于实现前述处理的控制器可以是模块控制器60或装载端口42。可以选择是否执行仅打开FIMS门40的处理或者每次在装载端口42上放置新的FOUP44时根据要求执行处理。在这种情况下,控制器选择停用吸力垫40B的功能并打开FIMS门40的步骤,或者启动吸力垫40B的功能并打开FIMS门40的步骤。此外,控制器可以在打开FIMS门40同时关闭FOUP门44B然后模块中的氧气浓度下降到预定值以下之后关闭FIMS门40。通过在壳体10中设置传感器来测量模块中的氧气浓度。
(流程图)
图11是示出了基板传输方法的示例的流程图。在第一步骤S1中,吹扫FOUP44的内部。随后,在步骤S2中,将FOUP 44移动到停靠位置。随后,在步骤S3中,仅打开FIMS门40,并且例如,吹扫第一空间44b和第二空间44c。随后,在步骤S4中,确定作为EFEM中的空间的空间10a中的氧气浓度和水浓度是否等于或小于预定值。例如,通过在壳体10的内壁上设置用于测量氧气浓度的传感器和用于测量水浓度的传感器,可以检测空间10a中的氧气浓度和水浓度。除非空间10a中的氧气浓度和水浓度等于或小于预定值,否则处理不会进入下一步骤。
当可以检查到空间10a中的氧气浓度和水浓度等于或小于预定值时,处理进入步骤S5。在步骤S5中,关闭FIMS门40。随后,在步骤S6中,FOUP门44B与FIMS门40一起打开。由于通过步骤S4的处理保证了空间10a中的氧气浓度和水浓度保持足够低,因此防止FOUP的内部由于打开FOUP门44B而被污染。
Claims (6)
1.一种基板传输***,包括:
基板传输机器人;
模块,所述模块在其中容纳所述基板传输机器人并具有EFEM门;
装载端口,用于将具有FOUP门的FOUP放置其上;
控制器,用于当所述FOUP位于所述装载端口的停靠位置时,打开所述EFEM门,同时关闭所述FOUP门;以及
用于使惰性气体循环到所述模块中的循环设备,
其中,所述控制器打开所述EFEM门,同时关闭所述FOUP门,由此所述FOUP门中的第一空间和所述FOUP门与所述EFEM门之间的第二空间与所述模块中的空间互通。
2.根据权利要求1所述的基板传输***,其中,所述EFEM门具有吸力垫,所述吸力垫被吸至所述FOUP门,并且所述控制器选择停用所述吸力垫的功能并打开所述EFEM门,或者启动所述吸力垫的功能并打开所述EFEM门。
3.根据权利要求1或2所述的基板传输***,其中,在打开所述EFEM门同时关闭所述FOUP门然后所述模块中的氧气浓度下降到预定值之下之后,所述控制器关闭所述EFEM门。
4.一种计算机可读存储介质,具有记录在其中的程序,所述程序使计算机执行:
将放置在装载端口上并具有FOUP门的FOUP移动到停靠位置,以使所述FOUP门和EFEM门彼此相对定位;
当所述FOUP位于所述装载端口的所述停靠位置时,打开所述EFEM门,同时关闭所述FOUP门;以及
将惰性气体供应到位于所述装载端口的脱离位置的所述FOUP中。
5.一种基板传输方法,包括:
将放置在装载端口上并具有FOUP门的FOUP移动到停靠位置,以使所述FOUP门和EFEM门彼此相对定位;
当所述FOUP位于所述装载端口的所述停靠位置时,打开所述EFEM门,同时关闭所述FOUP门;
关闭所述EFEM门;
将所述EFEM门固定至所述FOUP门并打开所述EFEM门和所述FOUP门;
通过设置在壳体中的基板传输机器人取出所述FOUP中的基板;以及
打开所述EFEM门,同时关闭所述FOUP门,从而用惰性气体代替所述FOUP门中的第一空间中的气体和所述FOUP门与所述EFEM门之间的第二空间中的气体。
6.根据权利要求5所述的基板传输方法,还包括将惰性气体循环到所述壳体中。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/951,882 | 2018-04-12 | ||
US15/951,882 US10403514B1 (en) | 2018-04-12 | 2018-04-12 | Substrate transporting system, storage medium and substrate transporting method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110379753A CN110379753A (zh) | 2019-10-25 |
CN110379753B true CN110379753B (zh) | 2023-10-10 |
Family
ID=67770090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910169163.5A Active CN110379753B (zh) | 2018-04-12 | 2019-03-06 | 基板传输***、存储介质以及基板传输方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10403514B1 (zh) |
KR (1) | KR20190119540A (zh) |
CN (1) | CN110379753B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI819953B (zh) * | 2023-01-13 | 2023-10-21 | 科嶠工業股份有限公司 | 前開式物料盒的潔淨度檢測方法及其裝置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106856664A (zh) * | 2014-09-05 | 2017-06-16 | 日商乐华股份有限公司 | 装载口及装载口的气氛置换方法 |
CN107591352A (zh) * | 2016-07-08 | 2018-01-16 | 昕芙旎雅有限公司 | 加载端口及包括加载端口的基板输送*** |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2229247T3 (es) * | 1995-03-28 | 2005-04-16 | Brooks Automation Gmbh | Estacion de carga y descarga para instalaciones de tratamiento de semiconductores. |
JP3425592B2 (ja) | 1997-08-12 | 2003-07-14 | 東京エレクトロン株式会社 | 処理装置 |
US20020006322A1 (en) * | 2000-03-06 | 2002-01-17 | Applied Materials, Inc. | Pod door opener |
JP2002261150A (ja) * | 2001-03-06 | 2002-09-13 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2003332402A (ja) * | 2002-05-10 | 2003-11-21 | Kondo Kogyo Kk | ミニエンバライメント方式の半導体製造装置 |
US6984839B2 (en) * | 2002-11-22 | 2006-01-10 | Tdk Corporation | Wafer processing apparatus capable of mapping wafers |
KR100583726B1 (ko) * | 2003-11-12 | 2006-05-25 | 삼성전자주식회사 | 기판 처리 장치 및 기판 처리 방법 |
WO2005124853A1 (ja) * | 2004-06-21 | 2005-12-29 | Right Mfg,Co.,Ltd. | ロードポート |
JP4012190B2 (ja) | 2004-10-26 | 2007-11-21 | Tdk株式会社 | 密閉容器の蓋開閉システム及び開閉方法 |
JP4891538B2 (ja) * | 2004-11-04 | 2012-03-07 | 株式会社日立ハイテクノロジーズ | ロードポート |
US20060285944A1 (en) * | 2005-06-21 | 2006-12-21 | Varian Semiconductor Equipment Associates, Inc. | FOUP loading load lock |
US7585144B2 (en) * | 2006-07-10 | 2009-09-08 | Asyst Technologies, Inc. | Variable lot size load port |
US20080008570A1 (en) * | 2006-07-10 | 2008-01-10 | Rogers Theodore W | Bridge loadport and method |
WO2008008737A2 (en) * | 2006-07-10 | 2008-01-17 | Asyst Technologies, Inc. | Variable lot size load port |
US8186927B2 (en) * | 2008-05-27 | 2012-05-29 | Tdk Corporation | Contained object transfer system |
JP2010232560A (ja) * | 2009-03-27 | 2010-10-14 | Sinfonia Technology Co Ltd | マッピング機構、foup、及びロードポート |
JP6045946B2 (ja) * | 2012-07-13 | 2016-12-14 | 株式会社Screenホールディングス | 基板処理装置、プログラムおよび記録媒体 |
US20140157722A1 (en) * | 2012-12-04 | 2014-06-12 | Tdk Corporation | Lid opening/closing system for closed container, and substrate processing method using the same |
JP5718379B2 (ja) * | 2013-01-15 | 2015-05-13 | 東京エレクトロン株式会社 | 基板収納処理装置及び基板収納処理方法並びに基板収納処理用記憶媒体 |
JP6106501B2 (ja) * | 2013-04-12 | 2017-04-05 | 東京エレクトロン株式会社 | 収納容器内の雰囲気管理方法 |
KR20160043027A (ko) * | 2013-08-12 | 2016-04-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 팩토리 인터페이스 환경 제어들을 갖는 기판 프로세싱 시스템들, 장치, 및 방법들 |
JP2015142008A (ja) * | 2014-01-29 | 2015-08-03 | Tdk株式会社 | ロードポート装置 |
JP6204226B2 (ja) * | 2014-02-24 | 2017-09-27 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法 |
JP6287515B2 (ja) * | 2014-04-14 | 2018-03-07 | Tdk株式会社 | Efemシステム及び蓋開閉方法 |
KR20210080633A (ko) * | 2014-11-25 | 2021-06-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 캐리어 및 퍼지 챔버 환경 제어들을 이용하는 기판 프로세싱 시스템들, 장치, 및 방법들 |
JP6455239B2 (ja) * | 2015-03-06 | 2019-01-23 | シンフォニアテクノロジー株式会社 | ドア開閉装置 |
JP6536090B2 (ja) * | 2015-03-06 | 2019-07-03 | シンフォニアテクノロジー株式会社 | 搬送装置 |
TWI681915B (zh) * | 2015-08-04 | 2020-01-11 | 日商昕芙旎雅股份有限公司 | 裝載埠 |
TWI708309B (zh) * | 2015-08-04 | 2020-10-21 | 日商昕芙旎雅股份有限公司 | 門開閉系統及具備門開閉系統之載入埠 |
JP6679907B2 (ja) * | 2015-12-11 | 2020-04-15 | Tdk株式会社 | ロードポート装置及びロードポート装置における容器内への清浄化ガス導入方法 |
JP6752163B2 (ja) * | 2017-02-13 | 2020-09-09 | 東京エレクトロン株式会社 | 基板処理システム及び基板搬送方法 |
US11171028B2 (en) * | 2017-06-23 | 2021-11-09 | Applied Materials, Inc. | Indexable side storage pod apparatus, heated side storage pod apparatus, systems, and methods |
-
2018
- 2018-04-12 US US15/951,882 patent/US10403514B1/en active Active
-
2019
- 2019-03-06 CN CN201910169163.5A patent/CN110379753B/zh active Active
- 2019-04-11 KR KR1020190042635A patent/KR20190119540A/ko not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106856664A (zh) * | 2014-09-05 | 2017-06-16 | 日商乐华股份有限公司 | 装载口及装载口的气氛置换方法 |
CN107591352A (zh) * | 2016-07-08 | 2018-01-16 | 昕芙旎雅有限公司 | 加载端口及包括加载端口的基板输送*** |
Also Published As
Publication number | Publication date |
---|---|
KR20190119540A (ko) | 2019-10-22 |
US10403514B1 (en) | 2019-09-03 |
CN110379753A (zh) | 2019-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11782404B2 (en) | Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls | |
US20220392789A1 (en) | Substrate processing systems, apparatus, and methods with factory interface environmental controls | |
JP3880343B2 (ja) | ロードポート、基板処理装置および雰囲気置換方法 | |
JP7193748B2 (ja) | ロードポート | |
US11328938B2 (en) | Substrate processing apparatus and methods with factory interface chamber filter purge | |
JP2024050991A (ja) | ドア開閉システムおよびドア開閉システムを備えたロードポート | |
JP7436448B2 (ja) | 改良されたロードポートのためのシステム、装置、及び方法 | |
JP2024041810A (ja) | 側方収納ポッド、機器フロントエンドモジュール、及び、基板を処理する方法 | |
KR19990023508A (ko) | 처리장치 및 처리장치내의 기체의 제어방법 | |
JP2012094822A (ja) | 密閉型容器及び半導体製造装置 | |
KR20190122161A (ko) | 배기 노즐 유닛, 로드 포트 및 efem | |
US11610794B2 (en) | Side storage pods, equipment front end modules, and methods for operating the same | |
US11521879B2 (en) | Load port apparatus, semiconductor manufacturing apparatus, and method of controlling atmosphere in pod | |
CN110379753B (zh) | 基板传输***、存储介质以及基板传输方法 | |
US20240006200A1 (en) | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium | |
JP2011159833A (ja) | クリーンゲートを備えたロードポート並びに搬送装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |