CN110370750B - 高导热覆铜板及制备方法 - Google Patents

高导热覆铜板及制备方法 Download PDF

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CN110370750B
CN110370750B CN201910594760.2A CN201910594760A CN110370750B CN 110370750 B CN110370750 B CN 110370750B CN 201910594760 A CN201910594760 A CN 201910594760A CN 110370750 B CN110370750 B CN 110370750B
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bonding sheet
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CN110370750A (zh
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黄帅民
李国法
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Jiangxi Pinsheng Electronics Co ltd
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Abstract

本发明实施例提供了一种高导热覆铜板及制备方法。该覆铜板包括芯料导热粘结片，所述芯料导热粘结片上下表面分别设置有面料导热粘结片，所述面料导热粘结片上设置有铜箔层。本发明实施例提供的高导热覆铜板，通过适当的结构和组分配比，通过适当配比的环氧树脂、固化剂、填料、阻燃剂和溶剂，制备得到了导热系数大于1.5W/mk、剥离强度大于1.2kgf/cm、耐热性(300℃)>120s、阻燃性UL 94为V0和CTI高达600的高导热覆铜板，解决了目前良好导热的覆铜板存在的制造成本居高不下、生产难度大的问题，组分不复杂，制备工艺简单，制备条件不苛刻，生产成本低。

Description

高导热覆铜板及制备方法
技术领域
本发明属于印制电路板制备技术领域，具体涉及高导热覆铜板及制备方法。
背景技术
印制电路板(Printed Circuit Board，简称PCB)是搭载电子元器件及实现电信号传输的载体，在电子产品中处于不可或缺的地位。高分子聚合物是PCB中最重要的电介质材料之一，PCB最基础的基材—敷铜箔层压板即是以高分子聚合物涂布(或浸渍)玻璃纤维布后再与铜箔热压制成。PCB常用的高分子聚合物材料有酚醛树脂、环氧树脂、氰酸酯、聚酰亚胺、聚四氟乙烯、双马来酰亚胺三嗪树脂及聚苯醚树脂等，每种高分子聚合物均有各自的优势和特点。随着微电子高密度组装技术和集成技术的迅猛发展，电子设备的组装密度得以迅速提高，使电子元器件、逻辑电路体积成千万倍地缩小，此时电子设备所产生的热量将急剧增加，而在周围环境温度下，要使电子元器件仍能以高可靠性正常工作，具有高散热性能的导热绝缘材料是热设计中必不可少的关键环节。此外，对于高功率LED、新能源汽车电源***等，为了提高***的可靠性和寿命，要求***中的PCB材料具有良好的导热性。而覆铜板除了要拥有优异的绝缘性和热-机械性能之外，还应具备良好的导热、散热功能。
现有技术中，金属基覆铜板虽拥有最好的散热能力，但其制造成本居高不下、生产难度大，多用于高电流模块。而氧化铝基、氮化铝基和氮化硅基等陶瓷基板也拥有良好的热导率，但其机械性能较差。
发明内容
本发明实施例通过提供一种高导热覆铜板，解决了现有技术中金属基覆铜板制造成本居高不下、生产难度大的问题。
本发明实施例之一提供了高导热覆铜板，包括芯料导热粘结片，所述芯料导热粘结片上下表面分别设置有面料导热粘结片，所述面料导热粘结片上设置有铜箔层。
具体来说，上述高导热覆铜板的结构从上往下依次是铜箔层、面料导热粘结片、芯料导热粘结片、面料导热粘结片和铜箔层。
优选地，所述芯料导热粘结片包括玻璃纤维毡以及涂覆于所述玻璃纤维毡上的芯料导热组合物。
芯料导热粘结片的制备方法为：将玻璃纤维毡在水平上胶机上芯料导热组合物，并烘干得到芯料导热粘结片，上胶速度为5～15m/min。
进一步优选地，所述芯料导热组合物包括以下重量份计的原料：
双酚A环氧树脂10～35份，
固化剂5～10份，
填料50～80份，
阻燃剂10～30份，
溶剂10～20份。
双酚A环氧树脂是环氧树脂中产量最大、使用最广的一种品种，具有很高的透明度，是由双酚A和环氧氯丙烷在氢氧化钠存在下反应生成的。双酚A环氧树脂的加入可以提高剥离强度。
双酚A环氧树脂包括GelR28E(宏昌电子材料股份有限公司，环氧当量：185g/eq)、GESR901(宏昌电子材料股份有限公司，环氧当量：475g/eq)、KET4131A70(Kolon，环氧当量：215.5g/eq)、jER1256(三菱化学株式会社，环氧当量：7800g/eq)、KEB-3165(Kolon，环氧当量：220g/eq)。
优选地，所述面料导热粘结片包括玻璃纤维布以及涂覆于所述玻璃纤维布上的面料导热组合物。
面料导热粘结片的制备方法为：将玻璃纤维布在水平上胶机上芯料导热组合物，并烘干得到面料导热粘结片，上胶速度为5～15m/min。
玻璃纤维毡厚度比玻璃纤维布大，玻璃纤维毡成本比玻璃纤维布低。
进一步优选地，所述面料导热组合物包括以下重量份计的原料：
面料环氧树脂10～35份，
固化剂5～10份，
填料30～50份，
阻燃剂10～30份，
溶剂10～20份。
进一步优选地，所述面料环氧树脂为联苯型环氧树脂和萘环型环氧树脂按质量比为1：(1～4)的混合树脂。
联苯型环氧树脂具有低熔融粘度、高填充性、低吸水性、低热膨性以及高强度的性能，是高耐热性、低吸潮性和低应力环氧树脂的典型代表。联苯型环氧树脂的加入可以提高耐热性。
联苯型环氧树脂包括NC-3000(日本化药，环氧当量：280g/eq)。
萘环型环氧树脂包括NPTE4000(湖南嘉盛德，环氧当量：225g/eq)。
固化剂为酸酐、4,4-二氨基二苯酚和双氰胺类固化剂中的至少一种。
优选地，所述填料为氧化铝和氧化硼按质量比为1:1的混合。
其中，氧化铝为球形或不规则形，氧化铝颗粒的粒径为2～15μm。
氧化硼为六方氮化硼，氮化硼颗粒的粒径为2～8μm。
进一步优选地，所述填料还包括碳化硅和氮化铝。
碳化硅为碳化硅晶须或不规则碳化硅，碳化硅的粒径为2～10μm。
氮化铝为片状或不规则形状，氮化铝的粒径为2～10μm。
优选地，所述阻燃剂包括氢氧化铝和二氧化硅中的至少一种。
氢氧化铝和二氧化硅的粒径为2～10μm。
阻燃剂还包括含磷阻燃剂或含氮阻燃剂，含磷阻燃剂优选OP930，德国克莱恩生产。含氮阻燃剂优选三聚氰胺类含氮阻燃剂。
进一步优选地，阻燃剂为氢氧化铝和OP930按质量比为1:1的混合物。
优选地，所述溶剂包括丙酮、丁酮和DMF中的一种。
面料导热组合物中的填料添加量少于芯料导热组合物中的填料。芯料填料高有利于提高导热性能，但面料导热填料高时，覆铜板的剥离强度较小。采用面料导热组合物中的填料添加量少于芯料导热组合物中的填料的组合方式在保证高导热性的前提下，提高剥离强度。
本发明另一实施例提供了上述高导热覆铜板的制备方法，将所述芯料导热粘结片、面料导热粘结片和铜箔层叠合后加热压合，即得所述高导热覆铜板，所述加热的温度为130～220℃，所述压合的时间为120～200min。
具体来说，将两张面料导热粘结片和一张或一张以上的芯料导热粘结片叠合后，在面料导热粘结片上覆盖铜箔，然后在真空高温压机中进行压合固化，压合参数为：真空度：0～0.01MPa，压力400～600PSI，升温速率2～5℃/min，热盘温度为130～220℃，压合时间120～200min。
上述结构和组分的高导热覆铜板中，通过适当配比的环氧树脂、填料、阻燃剂和溶剂，制备得到了导热系数大于1.5W/mk、剥离强度大于1.2kgf/cm、耐热性(300℃)>120s、阻燃性UL 94为V0和CTI高达600的高导热覆铜板。
本发明实施例的有益效果
1、本发明实施例提供的高导热覆铜板，通过适当的结构和组分配比，通过适当配比的环氧树脂、填料、阻燃剂和溶剂，制备得到了导热系数大于1.5W/mk、剥离强度大于1.2kgf/cm、耐热性(300℃)>120s、阻燃性UL 94为V0和CTI高达600的高导热覆铜板，解决了目前良好导热的覆铜板存在的制造成本居高不下、生产难度大的问题；
2、本发明实施例提供的高导热覆铜板，组分不复杂，制备工艺简单，制备条件不苛刻，生产成本低。
附图说明
图1是本发明实施例高导热覆铜板的结构示意图。
图2是本发明实施例高导热覆铜板的制备流程示意图。
具体实施方式
本发明实施例通过提供一种高导热覆铜板，解决了现有技术中良好导热的覆铜板存在的制造成本居高不下、生产难度大的问题。
为了更好的理解上述技术方案，下面将结合具体的实施方式对上述技术方案进行详细地说明。
实施例1
本例提供了一种高导热覆铜板，该覆铜板包括芯料导热粘结片1，所述芯料导热粘结片1上下表面分别设置有面料导热粘结片2，所述面料导热粘结片2上设置有铜箔层3。
具体来说，如图1所示，上述高导热覆铜板的结构从上往下依次是铜箔层3、面料导热粘结片2、芯料导热粘结片1、面料导热粘结片2和铜箔层3。
实施例2
本例提供了一种高导热覆铜板，该覆铜板包括芯料导热粘结片1，所述芯料导热粘结片1上下表面分别设置有面料导热粘结片2，所述面料导热粘结片2上设置有铜箔层3。
具体来说，如图1所示，上述高导热覆铜板的结构从上往下依次是铜箔层3、面料导热粘结片2、芯料导热粘结片1、面料导热粘结片2和铜箔层3。
其中，芯料导热粘结片包括玻璃纤维毡以及涂覆于所述玻璃纤维毡上的芯料导热组合物。芯料导热粘结片的制备方法为：将玻璃纤维毡在水平上胶机上芯料导热组合物，并烘干得到芯料导热粘结片，上胶速度为5～15m/min。
其中，芯料导热组合物包括以下重量份计的原料：
双酚A环氧树脂20份，固化剂8份，填料65份，阻燃剂20份，溶剂15份。
面料导热粘结片包括玻璃纤维布以及涂覆于所述玻璃纤维布上的面料导热组合物。面料导热粘结片的制备方法为：将玻璃纤维布在水平上胶机上芯料导热组合物，并烘干得到面料导热粘结片，上胶速度为5～15m/min。
面料导热组合物包括以下重量份计的原料：
面料环氧树脂20份，固化剂8份，填料40份，阻燃剂20份，溶剂15份。
面料环氧树脂为联苯型环氧树脂和萘环型环氧树脂按质量比为1：(1～4)的混合树脂。
联苯型环氧树脂包括NC-3000(日本化药，环氧当量：280g/eq)。
萘环型环氧树脂包括NPTE4000(湖南嘉盛德，环氧当量：225g/eq)。
固化剂为4,4-二氨基二苯砜。
填料为氧化铝和氧化硼按质量比为1:1的混合。氧化铝为球形或不规则形，氧化铝颗粒的粒径为2～15μm。氧化硼为六方氮化硼，氮化硼颗粒的粒径为2～8μm。
阻燃剂包括氢氧化铝和二氧化硅中的至少一种。氢氧化铝和二氧化硅的粒径为2～10μm。
溶剂为丙酮。
实施例3
本例提供了上述高导热覆铜板的制备方法，将所述芯料导热粘结片、面料导热粘结片和铜箔层叠合后加热压合，即得所述高导热覆铜板，所述加热的温度为130～220℃，所述压合的时间为120～200min。流程如图2所示。
具体来说，将两张面料导热粘结片和一张或一张以上的芯料导热粘结片叠合后，在面料导热粘结片上覆盖铜箔，然后在真空高温压机中进行压合固化，压合参数为：真空度：0～0.01MPa，压力400～600PSI，升温速率2～5℃/min，热盘温度为130～220℃，压合时间120～200min。
对比例1
本例提供了一种高导热覆铜板，该覆铜板包括芯料导热粘结片1，所述芯料导热粘结片1上下表面分别设置有面料导热粘结片2，所述面料导热粘结片2上设置有铜箔层3。
具体来说，如图1所示，上述高导热覆铜板的结构从上往下依次是铜箔层3、面料导热粘结片2、芯料导热粘结片1、面料导热粘结片2和铜箔层3。
其中，芯料导热粘结片包括玻璃纤维毡以及涂覆于所述玻璃纤维毡上的芯料导热组合物。芯料导热粘结片的制备方法为：将玻璃纤维毡在水平上胶机上芯料导热组合物，并烘干得到芯料导热粘结片，上胶速度为5～15m/min。
其中，芯料导热组合物包括以下重量份计的原料：
双酚A环氧树脂20份，固化剂8份，填料30份，阻燃剂20份，溶剂15份。
面料导热粘结片包括玻璃纤维布以及涂覆于所述玻璃纤维布上的面料导热组合物。面料导热粘结片的制备方法为：将玻璃纤维布在水平上胶机上芯料导热组合物，并烘干得到面料导热粘结片，上胶速度为5～15m/min。
面料导热组合物包括以下重量份计的原料：
面料环氧树脂20份，填料40份，阻燃剂20份，溶剂15份。
面料环氧树脂为联苯型环氧树脂和萘环型环氧树脂按质量比为1：(1～4)的混合树脂。
联苯型环氧树脂包括NC-3000(日本化药，环氧当量：280g/eq)。
萘环型环氧树脂包括NPTE4000(湖南嘉盛德，环氧当量：225g/eq)。
固化剂为双氰胺。
填料为氧化铝和氧化硼按质量比为1:1的混合。氧化铝为球形或不规则形，氧化铝颗粒的粒径为2～15μm。氧化硼为六方氮化硼，氮化硼颗粒的粒径为2～8μm。
阻燃剂包括氢氧化铝和二氧化硅中的至少一种。氢氧化铝和二氧化硅的粒径为2～10μm。
溶剂为丙酮。
检测例
根据实施例3提供的方法，采用实施例2和对比例1的配方，制备的得到了对应编号的2种高导热覆铜板。测试了2种高导热覆铜板的性能，结果如表1所示。
表1高导热覆铜板性能测试结果
Figure BDA0002117230370000071

Claims (4)

1.高导热覆铜板，其特征在于，包括芯料导热粘结片，所述芯料导热粘结片上下表面分别设置有面料导热粘结片，所述面料导热粘结片上设置有铜箔层；
所述芯料导热粘结片包括玻璃纤维毡以及涂覆于所述玻璃纤维毡上的芯料导热组合物；
所述芯料导热组合物包括以下重量份计的原料：
双酚A环氧树脂10~35份，
固化剂5~10份，
填料50~80份，
阻燃剂10~30份，
溶剂10~20份；
所述面料导热粘结片包括玻璃纤维布以及涂覆于所述玻璃纤维布上的面料导热组合物；
所述面料导热组合物包括以下重量份计的原料：
面料环氧树脂10~35份，
固化剂5~10份，
填料30~50份，
阻燃剂10~30份，
溶剂10~20份；
氧化铝颗粒的粒径为2~15 µm，氮化硼颗粒的粒径为2~8 µm，面料导热组合物中的填料添加量少于芯料导热组合物中的填料；
所述面料环氧树脂为联苯型环氧树脂和萘环型环氧树脂按质量比为1：（1~4）的混合树脂；所述填料为氧化铝和氧化硼按质量比为1:1的混合。
2.根据权利要求1所述的高导热覆铜板，其特征在于，所述阻燃剂包括氢氧化铝和二氧化硅中的至少一种。
3.根据权利要求1所述的高导热覆铜板，其特征在于，所述溶剂包括丙酮、丁酮和DMF中的一种。
4.根据权利要求1~3任一项所述高导热覆铜板的制备方法，其特征在于，将所述芯料导热粘结片、面料导热粘结片和铜箔层叠合后加热压合，即得所述高导热覆铜板，所述加热的温度为130~220℃，所述压合的时间为120~200 min。
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101848604A (zh) * 2010-05-10 2010-09-29 陕西生益科技有限公司 高导热cem-3覆铜板制备方法
CN102205675A (zh) * 2011-03-29 2011-10-05 浙江华正新材料股份有限公司 Led用高导热高耐热cem-3覆铜板
CN102516718A (zh) * 2011-12-01 2012-06-27 珠海全宝电子科技有限公司 一种树脂组合物以及该树脂组合物作为导热绝缘层的金属基覆铜板
CN103182831A (zh) * 2013-04-02 2013-07-03 陕西生益科技有限公司 一种基于无卤阻燃树脂组成物的覆铜箔层压板的制备工艺
CN104002524A (zh) * 2014-04-18 2014-08-27 南通诺德电子有限公司 高导热、高耐热、高cti fr-4覆铜板的制作方法
CN104210181A (zh) * 2014-08-14 2014-12-17 金安国纪科技股份有限公司 Led灯用高导热覆铜板及其制备方法
CN105086365A (zh) * 2015-08-03 2015-11-25 广东生益科技股份有限公司 一种覆铜板用环氧树脂组合物及其应用
CN109575523A (zh) * 2018-12-11 2019-04-05 广州联茂电子科技有限公司 一种用于覆铜板的高导热树脂组合物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101848604A (zh) * 2010-05-10 2010-09-29 陕西生益科技有限公司 高导热cem-3覆铜板制备方法
CN102205675A (zh) * 2011-03-29 2011-10-05 浙江华正新材料股份有限公司 Led用高导热高耐热cem-3覆铜板
CN102516718A (zh) * 2011-12-01 2012-06-27 珠海全宝电子科技有限公司 一种树脂组合物以及该树脂组合物作为导热绝缘层的金属基覆铜板
CN103182831A (zh) * 2013-04-02 2013-07-03 陕西生益科技有限公司 一种基于无卤阻燃树脂组成物的覆铜箔层压板的制备工艺
CN104002524A (zh) * 2014-04-18 2014-08-27 南通诺德电子有限公司 高导热、高耐热、高cti fr-4覆铜板的制作方法
CN104210181A (zh) * 2014-08-14 2014-12-17 金安国纪科技股份有限公司 Led灯用高导热覆铜板及其制备方法
CN105086365A (zh) * 2015-08-03 2015-11-25 广东生益科技股份有限公司 一种覆铜板用环氧树脂组合物及其应用
CN109575523A (zh) * 2018-12-11 2019-04-05 广州联茂电子科技有限公司 一种用于覆铜板的高导热树脂组合物

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