CN110268103A - The forming method of coating - Google Patents
The forming method of coating Download PDFInfo
- Publication number
- CN110268103A CN110268103A CN201780085930.3A CN201780085930A CN110268103A CN 110268103 A CN110268103 A CN 110268103A CN 201780085930 A CN201780085930 A CN 201780085930A CN 110268103 A CN110268103 A CN 110268103A
- Authority
- CN
- China
- Prior art keywords
- cathode
- coating
- anode
- particle
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
Abstract
Slurry made of particle is mixed in electroplate liquid in the coated on one side of cathode, guarantor's liquid component of the electroplate liquid has been impregnated in the one side configuration of anode, keep cathode opposite with anode, make protect liquid component be in contact with each other with slurry, by between cathode and anode apply voltage and cathode one side formation coating.
Description
Technical field
This disclosure relates to the forming method of coating.
Background technique
In patent document 1, a kind of forming method of coating is disclosed, that is, in electroless coating epithelium or electroless multiple
Close coating epithelium on formed have 5 μm of film thickness below fluororesin film plating epithelium when, using pass through cationic interface
Solution that activating agent is dispersed in water fluororesin particle forms fluororesin film.
Also, Patent Document 2 discloses the lower positions of the vertical direction in electroplating bath to configure cathode, makes to be dispersed in
Dispersed particle in electroplate liquid gradually settles the forming method for the coating accumulated on cathode to cathode.
Existing technical literature
Patent document
Patent document 1:(Japan) special open 2007-39711 bulletin
Patent document 2:(Japan) special open 2016-141862 bulletin
Summary of the invention
The technical problems to be solved by the invention
However, being infiltrated on substrate, electrode in electroplating bath in the forming method of the coating in order to form coating
In the electroplate liquid of storage.Such problems big and at high cost accordingly, there exist equipment scale.Furthermore, it is desirable to a large amount of electroplate liquid
Liquid waste processing is safeguarded or carried out, also results in cost increase in this point.
Also, in the latter method, in order to be supplemented the coated metal consumed near cathode and to electroplate liquid
It is stirred, but the particle in electroplate liquid moves, it is difficult to form the plating epithelium of high concentration.Also, exist have to by
Restriction in the structures such as cathode is horizontally disposed.
Disclosure technical problem to be solved be to provide it is a kind of can be by using the simple of a small amount of electroplate liquid
And the equipment of low price come formed high concentration plating epithelium coating forming method.
For solving the technical solution of technical problem
In the disclosure, as the technical solution for solving above-mentioned technical problem, a kind of formation side of coating is provided
Method, wherein
Slurry made of particle is mixed in electroplate liquid in the coated on one side of cathode,
It has been impregnated with guarantor's liquid component of the electroplate liquid in the one side configuration of anode,
Keep the cathode opposite with the anode, guarantor's liquid component made to be in contact with each other with the slurry,
By applying voltage between the cathode and the anode, so that the one side in the cathode forms coating.
According to the disclosure, liquid component is protected in the one side configuration of anode, in the coated on one side slurry of cathode, therefore is not needed big
The equipment of type and a large amount of electroplate liquid can be cost effectively formed the plating epithelium of high concentration.
Detailed description of the invention
Fig. 1 is that the coating of present embodiment forms the outline figure of device.
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to embodiment of the present disclosure.It should be noted that following explanation is substantially only
To illustrate, the disclosure is not intended to be applicable in it object or its purposes limits.Also, attached drawing is only schematical description, is deposited
In the situation different from reality such as ratio of each size.
Fig. 1 shows be present embodiment coating formed device.The coating formed device in, the anode 1 of plate with
The cathode 2 of plate is configured in plate face mode relative to each other, has been impregnated with electricity in the opposed faces configuration opposite with cathode 2 of anode 1
Guarantor's liquid component 3 of plating solution 6 makes guarantor's liquid component 3 connect with slurry 4 in the opposed faces coating sizing-agent 4 opposite with anode of cathode 2
Touching.
Anode 1 has used the plate being made of insoluble platinum positive electrode.Herein, anode 1 has used insoluble anode 1,
But the dissolubilities material such as be also able to use Ag, Au, Pd, Rh, Ni, Cr.
Cathode 2 uses the plate being made of red copper (C1100) negative electrode.Compared with anode 1, the one side of cathode 2 is (that is, right
Set face) surface area it is big.
DC power supply 5 is connected between anode 1 and cathode 2.
It protects liquid component 3 and has used polyurethane sponge.Polyurethane sponge is tabular, has the face roughly the same with cathode 2
It is long-pending and opposite with cathode 2.In this case, protect liquid component 3 with a thickness of 10mm or less.Thereby, it is possible to efficiently transmit
From the electric current of anode.Palladium nickel plating solution has been impregnated in protecting liquid component 3.Wherein, the electroplate liquid 6 that can be impregnated with is without being limited thereto, energy
It is enough to use other various electroplate liquids 6 such as Ag electroplate liquid or Au electroplate liquid depending on the application.
Slurry 4 has used the substance that particle 7 is mixed in electroplate liquid 6.That is, slurry 4 is based on electroplate liquid 6 and particle 7
Ingredient can be coated on the surface of cathode 2 for becoming object, can be tieed up pressure by brush after coating
Coating shape is held, and conductive.Electroplate liquid 6 is able to use substance identical with the substance being impregnated in protecting liquid component 3,
Used herein is palladium nickel plating solution.Particle 7 has used the zinc oxide for being coated with silica.The primary grain of the partial size of particle 7
Sub- diameter is 0.6 μm or less.0.6 μm of purpose below of partial size of particle 7 is set to be to keep the filling for the particle being electroplated in epithelium close
It spends fully high.
Wherein, as the particle 7, it is not limited to zinc oxide, is also able to use metal material, fluororesin, nylon, polyethylene
Etc. synthetic resin materials, compounds such as graphite, fluorographite, molybdenum dioxide, boron nitride etc..In this case, for example, if
Using fluororesin, other than the performance of existing metal plating epithelium, additionally it is possible to make it have wetability.
Also, in slurry 4, electroplate liquid 6 and particle 7, use interfacial agent as dispersing aid.As can make
Interfacial agent, for example, comprising cationic interfacial agent, it is corresponding with the pH of electroplate liquid 6 and show cationic
Zwitterionic surfactant, non-ionic surfactant etc..Improve the wetability of plating level by using interfacial agent,
It prevents the plating defects such as no coating, hole, inhibits the electroplate liquid 6 to haze.
It is formed in device in the coating of above-mentioned composition, has been impregnated with electroplate liquid 6 in one side (that is, opposed faces) configuration of anode 1
Guarantor's liquid component 3, in one side (that is, opposite face) coating sizing-agent 4 of cathode 2.The coating of slurry 4 passes through coating machine, squeegee etc.
It carries out, with a thickness of 0.1mm to 0.5mm.It, can efficiently will be from anode by setting the thickness of slurry 4 in this way
Electric current passes to cathode 2.
Moreover, being oppositely disposed anode 1 and cathode 2, make to protect liquid component 3 and 4 face contact of slurry.In this case, may be used
So that anode 1 and cathode 2 are opposite in vertical direction, can also wait in the horizontal direction opposite on other directions.
In this state, make anode 1 and cathode 2 close, pressurize to guarantor's liquid component 3 and slurry 4.Also, make anode 1
It vibrates and vibrates slurry 4 via liquid component 3 is protected.Thereby, it is possible to condense the particle 7 in slurry 4.Then, to anode 1 and yin
Apply voltage between pole 2, forms plating epithelium on the surface of cathode 2.That is, on the surface of cathode 2, electricity included in slurry 4
Metal ion in plating solution 6 is reduced, and the particle 7 being taken into slurry 4 by the generation of electric current simultaneously forms plating epithelium.At this
In the case of kind, plating epithelium is formed by other than the property of the metal in electroplate liquid 6, also be taken into particle 7
Property has the feature as composite plating epithelium.
In this way, being impregnated in electroplate liquid 6 in 2 coating sizing-agent 4 of cathode in anode 1 and protecting liquid component 3, therefore have following excellent
Point.
(1) since electroplate liquid 6 is only contained in slurry 4 and protects in liquid component 3, electricity is retained in electroplating bath with existing
The case where plating solution 6, is compared to the usage amount that can substantially inhibit electroplate liquid 6.It therefore, there is no need to large-scale equipment, electroplate liquid can be made
6 maintenance and liquid waste processing simplify.
(2) slurry 4 has used the substance that particle 7 is mixed in electroplate liquid 6, therefore is capable of forming the plating skin of high concentration
Film.
(3) it in being formed by coating envelope, other than the constituent bring effect of electroplate liquid 6, can also play
7 bring effect of particle.For example, making fluororesin particle and Ni electroplated coating combination with high hardness, wearability height can be played and rolling
The low effect of resistance can use in mechanical sliding portion or bearing portion.Also, keep sublimation temperature low metal material (such as
Zinc oxide) the particle Ag electroplated coating combination low with resistance value, resistance is lower, and can carry out cooling and disappear to generated electric arc
Arc can use in electric contact.Make fluororesin particle and Ni electroplated coating combination with high hardness, can be improved wearability and reduce and slide
Dynamic resistance, in a mold in use, excellent release property can be played.
[embodiment]
To be formed by the following conditions the experiment of plating epithelium.
That is, anode 1 uses insoluble platinum positive electrode, cathode 2 uses red copper (C1100), protects liquid component 3 and uses polyurethane sea
Silk floss, electroplate liquid 6 are coated with silica using Pd-Ni (palladium nickel) electroplate liquid sold in the market, mixed 7 use of particle
Zinc oxide.Also, as documented by following table 1, the electroplate liquid 6 used in slurry 4 is 10ml.And in electroplate liquid
In 6 mixed particle 7 by primary particle diameter prepare 35nm (0.035 μm) and 20nm (0.02 μm) both, by weight in 1.5g
Prepare four kinds in the range of~8.5g.Electroplating time is 5,10,15 minutes, current density between anode 1 and cathode 2 is 5~
25A/dm2。
[table 1]
It is clear that according to table 1, by reducing the primary particle diameter of particle, can be improved contained weight increase
It is formed by plating epithelium composite plating particle concentration.Also, by improving current density, it is capable of increasing obtained plating skin
The film thickness of film.
More than, the various embodiments in the disclosure are illustrated in detail referring to attached drawing, finally, to the disclosure
Various forms are illustrated.It should be noted that in the following description, as an example, being labelled with appended drawing reference and carrying out
Explanation.
In the coating forming method of the first form of the disclosure,
Cathode 2 coated on one side in electroplate liquid 6 slurry 4 made of stuff and other stuff 7,
It has been impregnated with guarantor's liquid component 3 of the electroplate liquid 6 in the one side configuration of anode 1,
Keep the cathode 2 opposite with the anode 1, guarantor's liquid component 3 made to be in contact with each other with the slurry 4,
By applying voltage between the cathode 2 and the anode 1, so that the one side in the cathode 2 forms coating.
According to the coating forming method of the first form, liquid component 3 is protected in the one side configuration of anode 1, only by cathode 2
Coated on one side slurry 4 is just capable of forming plating epithelium.Therefore, there is no need to large-scale equipment and a large amount of electroplate liquid 6 can be low
Form to cost plating epithelium.
In the coating forming method of the second form of the disclosure,
Interfacial agent is mixed in the slurry 4.
According to the coating forming method of the second form, the wetability of plating level can be improved, prevent no coating, hole etc. from plating
Layer defects inhibit electroplate liquid 6 to haze.
In the coating forming method of disclosure third form, the grain is constituted by any in metal or resin
Son 7.
In the coating forming method of the 4th form of the disclosure, the particle 7 is below with 0.02 μm or more and 0.6 μm
Partial size.
According to the coating forming method of the 4th form, make 0.02 μm of partial size of particle 7 or more and 0.6 μm of model below
It encloses, therefore electric current flows among particle, can efficiently be circulated this effect.
In the coating forming method of the 5th form of the disclosure, the particle 7 relative to the slurry 4 be 10 weight % with
Upper and 72 weight % or less.
According to the coating forming method of the 5th form, due to being slurry 4, particle 7 can be contained in high concentration, therefore
It is capable of forming the plating epithelium of high concentration.
In the coating forming method of the 6th form of the disclosure, guarantor's liquid component 3 uses sponge.
It should be noted that by suitable to embodiment or variation arbitrary in above-mentioned various embodiment or variations
Locality is combined, it can be made to play respectively possessed effect.Further, it is possible to being combined each other to embodiment, being right
Embodiment is combined each other or is combined to embodiment and embodiment, also can be by different embodiments or embodiment
In feature be combined each other.
The disclosure has been sufficiently carried out explanation to preferred embodiment referring to attached drawing, but those skilled in the art are come
It says and is obviously able to carry out various modifications or amendment.Such deformation or amendment are without departing from defined by the appended claims
The scope of the present disclosure just should be understood as being contained therein.
Industrial applicibility
The forming method of the coating of the disclosure can be used in a variety of materials such as mechanical slide connecting part, electric contact, die surfaces
Surface formed plating epithelium.
Description of symbols
1 ... anode；
2 ... cathodes；
3 ... protect liquid component；
4 ... slurries；
5 ... DC power supplies；
6 ... electroplate liquids；
7 ... particles.
Claims (6)
1. a kind of forming method of coating is mixed with slurry made of particle in the coated on one side of cathode in electroplate liquid,
It has been impregnated with guarantor's liquid component of the electroplate liquid in the one side configuration of anode,
Keep the cathode opposite with the anode, guarantor's liquid component made to be in contact with each other with the slurry,
By applying voltage between the cathode and the anode, so that the one side in the cathode forms coating.
2. the forming method of coating according to claim 1, wherein
Interfacial agent is mixed in the slurry.
3. the forming method of coating according to claim 1 or 2, wherein
The particle is made of any one of metal or resin.
4. the forming method of coating according to any one of claim 1 to 3, wherein
The particle has 0.02 μm or more and 0.6 μm of partial size below.
5. the forming method of coating according to any one of claim 1 to 4, wherein
The particle is 10 weight % or more and 72 weight % or less relative to the slurry.
6. the forming method of coating according to any one of claim 1 to 5, wherein
Guarantor's liquid component is sponge.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-047763 | 2017-03-13 | ||
| JP2017047763A JP2018150587A (en) | 2017-03-13 | 2017-03-13 | Plating forming method |
| PCT/JP2017/044723 WO2018168129A1 (en) | 2017-03-13 | 2017-12-13 | Method for forming plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110268103A true CN110268103A (en) | 2019-09-20 |
Family
ID=63522051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780085930.3A Pending CN110268103A (en) | 2017-03-13 | 2017-12-13 | The forming method of coating |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20200010971A1 (en) |
| JP (1) | JP2018150587A (en) |
| CN (1) | CN110268103A (en) |
| DE (1) | DE112017007235T5 (en) |
| WO (1) | WO2018168129A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114197027A (en) * | 2021-11-29 | 2022-03-18 | 深圳市鼎华芯泰科技有限公司 | Board grinding method and board grinding equipment for circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7306344B2 (en) | 2020-07-29 | 2023-07-11 | トヨタ自動車株式会社 | Method for forming silver film |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53137078A (en) * | 1977-05-06 | 1978-11-30 | Inoue Japax Res Inc | Electrode for electrolysis |
| JPH04157197A (en) * | 1990-10-19 | 1992-05-29 | Kawasaki Steel Corp | Electrolytic treatment of surface of metallic material and electrode used the same |
| CN1291243A (en) * | 1997-09-03 | 2001-04-11 | 塞米图尔公司 | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| CN101407929A (en) * | 2008-11-10 | 2009-04-15 | 徐嘉 | Local electroplating method of large-scale parts weld joint |
| CN104853578A (en) * | 2015-05-16 | 2015-08-19 | 常德鑫鸿金属材料有限公司 | Electromagnetic shielding-used conductive foam sponge and preparation method thereof |
| CN106149038A (en) * | 2016-08-16 | 2016-11-23 | 江苏博敏电子有限公司 | A kind of VCP electroplating clamp drying equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2548723B2 (en) * | 1987-05-07 | 1996-10-30 | エヌティエヌ株式会社 | MEKING METHOD AND DEVICE THEREOF |
| JPH01234590A (en) * | 1988-03-16 | 1989-09-19 | Toshiba Eng Co Ltd | Partial plating device |
| JP2007039711A (en) | 2005-08-01 | 2007-02-15 | Nippon Kanizen Kk | Plated film having fluorocarbon resin film thereon and production method therefor |
| JP6537130B2 (en) | 2015-02-04 | 2019-07-03 | 国立大学法人信州大学 | Method of manufacturing plated composite material |
-
2017
- 2017-03-13 JP JP2017047763A patent/JP2018150587A/en active Pending
- 2017-12-13 US US16/490,139 patent/US20200010971A1/en not_active Abandoned
- 2017-12-13 DE DE112017007235.2T patent/DE112017007235T5/en not_active Withdrawn
- 2017-12-13 CN CN201780085930.3A patent/CN110268103A/en active Pending
- 2017-12-13 WO PCT/JP2017/044723 patent/WO2018168129A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53137078A (en) * | 1977-05-06 | 1978-11-30 | Inoue Japax Res Inc | Electrode for electrolysis |
| JPH04157197A (en) * | 1990-10-19 | 1992-05-29 | Kawasaki Steel Corp | Electrolytic treatment of surface of metallic material and electrode used the same |
| CN1291243A (en) * | 1997-09-03 | 2001-04-11 | 塞米图尔公司 | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| CN101407929A (en) * | 2008-11-10 | 2009-04-15 | 徐嘉 | Local electroplating method of large-scale parts weld joint |
| CN104853578A (en) * | 2015-05-16 | 2015-08-19 | 常德鑫鸿金属材料有限公司 | Electromagnetic shielding-used conductive foam sponge and preparation method thereof |
| CN106149038A (en) * | 2016-08-16 | 2016-11-23 | 江苏博敏电子有限公司 | A kind of VCP electroplating clamp drying equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114197027A (en) * | 2021-11-29 | 2022-03-18 | 深圳市鼎华芯泰科技有限公司 | Board grinding method and board grinding equipment for circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018150587A (en) | 2018-09-27 |
| US20200010971A1 (en) | 2020-01-09 |
| DE112017007235T5 (en) | 2019-12-12 |
| WO2018168129A1 (en) | 2018-09-20 |
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Application publication date: 20190920 |