CN105442004B - A kind of porous surface metal structure and preparation method thereof is with inlaying electroplanting device - Google Patents
A kind of porous surface metal structure and preparation method thereof is with inlaying electroplanting device Download PDFInfo
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- CN105442004B CN105442004B CN201511035097.0A CN201511035097A CN105442004B CN 105442004 B CN105442004 B CN 105442004B CN 201511035097 A CN201511035097 A CN 201511035097A CN 105442004 B CN105442004 B CN 105442004B
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- cathode base
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
Abstract
The invention belongs to technical field of composite material manufacturing, and in particular to a kind of porous surface metal structure and preparation method thereof is with inlaying electroplanting device.The present invention is based on the principles for inlaying plating, metal powder granulates after wetting are equably layered on to the cathode base surface by pretreatment, and it is compressed with gauze, it is immersed in electrolyte with together with cathode base, cathode base is connected with DC power cathode, then the anode jointed anode of DC power supply is electroplated, metal powder granulates plating is bonded on cathode base, obtains porous surface metal structure.Process of the present invention is few, easy to operate；In addition, the present invention provides it is a kind of prepare above-mentioned porous surface metal structure inlay electroplanting device, which includes DC power supply, anode, metal powder granulates, cathode base, electrolyte, gauze and electroplating bath；The porous surface metal structure being prepared can be applied to field of heat transfer.
Description
Technical field
The invention belongs to technical field of composite material manufacturing, and in particular to a kind of porous surface metal structure and its preparation side
Method is with inlaying electroplanting device.
Background technology
With the development of industrial technology, requirement of all trades and professions for material property is higher and higher.In many cases, it is single
One material is difficult to meet these requirements, so the research for composite material increasingly attracts people's attention.
Inlaying Electroplating is one kind in functional electric electroplating method, can obtain composite deposite with this method, so as to change original
There is the performance of material, meet required condition.In previous research, this method is mainly used to the hardness, resistance to of reinforcing material
Mill property, heat-resisting quantity are generally used for making cutting tool either profile tool etc. of hard material processing, such as the most often
What is seen is exactly that diamond particles make drill bit, grinding tool etc. in Inlaying Electroplating in common iron.
In past research, about influence of the Inlaying Electroplating for the formation of surface texture without carrying out excessive discussion,
Also without being prepared using the method suitable for the material needed for other aspects, such as in terms of augmentation of heat transfer.So the present invention carries
Go out, based on Inlaying Electroplating, plating metal powder particle prepares porous surface on metallic matrix.It is previous through frequently with system
The method of standby porous surface has electro-deposition, de- alloy or electrochemical corrosion etc., but the porous surface knot that these techniques are prepared
Structure is unstable, easily falls off, and its technical process is complex, less efficient, and chemical energy consumption is larger.
Invention content
For overcome the deficiencies in the prior art and shortcoming, primary and foremost purpose of the invention is to provide a kind of porous surface metal
The preparation method of structure, this method based on inlaying plating, by metal powder granulates plating be bonded on metallic matrix so as to
Obtain porous surface metal structure.
The porous surface metal structure being prepared another object of the present invention is to provide above-mentioned preparation method.
It is still another object of the present invention to provide it is a kind of prepare above-mentioned porous surface metal structure inlay electroplanting device.
The purpose of the present invention is achieved through the following technical solutions：
A kind of preparation method of porous surface metal structure, comprises the following steps：
(1) metal powder granulates are soaked to the cathode base surface being then uniformly layered on by pretreatment, then use gauze
Fixed metal powder granulates and cathode base are covered, is pressed together it, metal powder granulates can be effectively prevent to drift, is ensured
The uniformity of plating；
(2) metal powder granulates and cathode base that are fixed together in step (1) are immersed into electrolyte together with anode
In, wherein, cathode base is connected with the cathode of DC power supply, and anode is connected with the anode of DC power supply；Anode is located at cathode base
It is horizontal positioned above and below the top of body, cathode base and anode；Then it stands, then is electroplated, metal powder granulates plating is existed
On cathode base, porous surface metal structure is obtained；
The grain size of metal powder granulates described in step (1) is preferably 20~50 μm；Further preferably spherical copper powder
Particle；
Cathode base described in step (1) is conductive metal substrate；Further preferably copper plate；
The reagent of wetting described in step (1) is preferably electrolyte；
The mode of the pretreatment of cathode base described in step (1) is：It first polishes cathode base, then uses
The method of alkali cleaning and pickling removes surface impurity；Wherein, polishing is the cut in order to remove surface, prevents the enrichment for causing ion
It acts on (metal ion is avoided preferentially to be plated at cut), secondly the oxide layer on surface can be removed, ensures matrix table
The flatness in face, the chemical reaction for plating provide a good environment, reduce external interference, make the structure after plating more
Uniformly；
The solution of the alkali cleaning is preferably the NAOH solution of concentration 120g/L, and the solution of the pickling is preferably quality
Percentage is 5% HCl solution；By alkali cleaning and pickling, impurity, the reduction such as greasy dirt, oxide layer on removing matrix are extraneous dry
Factor is disturbed, particle is made more firmly to be electroplated onto on parent metal；
The roughness (Ra) of cathode base described in step (1)<0.2μm；Wherein, what different roughness was electroplated out is more
Pore structure is different, the roughness (Ra) of present invention selection cathode base<0.2 μm, the porous table that it is made finally to be prepared
Face gap is uniform, unique structure, more excellent performance；
The aperture of gauze in step (1) is preferably more than the grain size of metal powder granulates；
Anode described in step (2) is except the coated metal of oxide layer；Further preferably copper plate；
The time of standing described in step (2) is preferably 0.5h~2h；The metal powder granulates and the moon being fixed together
After pole matrix enters in electrolyte, due to the prevention of gauze, although some metallic particles do not drift directly, the moon can be floated on
The surface of pole matrix, not and substrate contact, standing are to ensure particle and substrate contact, could be electroplated so securely；
The condition of plating described in step (2) is：Current density is 0.0002~0.0006A/mm2, electroplating time is
0.5~1h；
The condition of plating described in step (2) is preferably：Current density is 0.0003A/mm2, electroplating time 0.5h；
Electrolyte described in step (2) according to the material of anode (coated metal), should select the coating gold of different pH
Belong to salting liquid as electrolyte；The electrolyte is further preferably comprising following component 0.4M CuSO4, 1.5M H2SO4；
A kind of porous surface metal structure, is prepared by above-mentioned preparation method；
The porous surface metal structure can be applied to field of heat transfer, for enhancing heat transfer；Wall superheat can be reduced
Degree improves the nucleation rate of steam bubble, reduces the detachment frequency of steam bubble, accelerates bubble departure frequency, the merging of air pocket is delayed to generate,
Make surface that there is larger heat transfer coefficient, enhance heat transfer efficiency；
It is a kind of prepare above-mentioned porous surface metal structure inlay electroplanting device, including DC power supply, anode, metal powder
Particle, cathode base, electrolyte, gauze and electroplating bath；Cathode base is connected with the cathode of DC power supply, anode and DC power supply
Anode be connected；Electrolyte, cathode base and anode are placed in electroplating bath, electrolyte submergence cathode base and anode, anode position
In the top of cathode base；Plating base is is inlayed in the top surface of cathode base upward；Metal powder granulates, which are located at, inlays plating base
Layer is above；Gauze, which covers, to be fixed on metal powder granulates to prevent metal powder granulates from floating in the electrolytic solution；
The cathode base and anode is horizontal positioned；
The aperture of the gauze is no more than the grain size of metal powder granulates；
Preferably, the gauze is copper yarn net；
Preferably, the grain size of the metal powder granulates is preferably 20~50 μm；
The annode area is sufficiently large so that cathode base obtains uniform current density；
Preferably, the electroplanting device of inlaying for preparing porous surface metal structure further includes cushion block；Cushion block is placed in electricity
Trench bottom is plated, fixed negative pole matrix on cushion block；
The present invention is had the following advantages relative to the prior art and effect：
(1) in previous research, Inlaying Electroplating is mainly used to the hardness, wearability, heat-resisting quantity of reinforcing material, general to use
In the cutting tool either profile tool etc. for making hard material processing.And the main object of the present invention is, with Inlaying Electroplating
Based on, plating metal powder particle prepares porous structure surface on metallic matrix.
(2) it is different from the past to obtain porous surface, this hair using electro-deposition, de- alloy or electrochemical corrosion technology
The bright technique for using Inlaying Electroplating for the first time, is bonded in metal base surface, so as to be had by metal powder with electric plating method
With the composite porous surface of original surface different characteristics.
(3) using the method for this invention, when selecting different electroplating parameters, the porous coating of preparation and the combination of matrix
Power is different, but for the method compared to other acquisition porous surfaces, the binding force of this method is the closest, the table of preparation
Face is stablized the most, this has great importance in engineer application.
Description of the drawings
Fig. 1 is the structure diagram for inlaying electroplanting device that the present invention prepares porous surface metal structure.
Fig. 2 is the SEM figures for the copper porous surface structure that embodiment 2 is prepared.
Fig. 3 is the SEM figures for the copper porous surface structure that embodiment 3 is prepared.
Fig. 4 is the SEM figures for the copper porous surface structure that embodiment 4 is prepared.
Fig. 5 is the SEM figures for the copper porous surface structure that embodiment 5 is prepared.
Fig. 6 is the SEM figures for the copper porous surface structure that embodiment 6 is prepared.
Fig. 7 is the SEM figures for the copper porous surface structure that embodiment 7 is prepared.
Specific embodiment
With reference to embodiment and attached drawing, the present invention is described in further detail, but embodiments of the present invention are unlimited
In this.
Embodiment 1
As shown in Figure 1, it is a kind of prepare porous surface metal structure inlay electroplanting device, including DC power supply 1, anode 2,
Metal powder granulates 3, cathode base 4, electrolyte 5, gauze 7 and electrolytic cell 8；The cathode phase of cathode base 4 and DC power supply 1
Even, anode 2 is connected with the anode of DC power supply 1；Electrolyte 5, cathode base 4 and anode 2 are placed in electroplating bath 8, and electrolyte 5 soaks
Do not have cathode base 4 and anode 2, anode 2 is located at the top of cathode base 4；Plating base is is inlayed in the top surface of cathode base 4 upward
Layer；Metal powder granulates 3, which are located at, to be inlayed above plating base；Gauze 7, which covers, to be fixed on metal powder granulates 3 to prevent metal
Powder particle 3 floats in electrolyte 5；
The cathode base 4 and anode 2 is horizontal positioned；
The aperture of the gauze 7 is no more than the grain size of metal powder granulates 3；
Preferably, the gauze 7 is copper yarn net；
Preferably, the grain size of the metal powder granulates 3 is preferably 20~50 μm；
2 area of anode is sufficiently large so that cathode base 4 obtains uniform current density；
Preferably, the electroplanting device of inlaying for preparing porous surface metal structure further includes cushion block 6；Cushion block 6 is placed in
8 bottom of electroplating bath, fixed negative pole matrix 4 on cushion block 6.
Embodiment 2
A kind of preparation method of porous surface metal structure, comprises the following steps：
(1) pretreatment of cathode base and anode：In the present embodiment, copper plate is selected to be polishing to as cathode base
Ra<0.2 μm, and dry up with alcohol rinse and quickly；Then with the NAOH solution of 120g/L and HCL that mass percent is 5%
Solution is respectively washed cathode base, every time a length of 30s during cleaning, should be by the way of pickling after first alkali cleaning in cleaning；Selection
Copper plate is as anode, and before plating, removing oxide layer is removed in polishing, dries up equally with alcohol rinse and quickly；
(2) spherical copper powder particle is immersed in by CuSO4Solution and H2SO4(wherein CuSO in the electrolyte of solution allocation4
0.4M, H2SO41.5M), copper powder particle is soaked, copper powder particle is then taken out and is uniformly layered on red copper cathode base by pretreatment
Surface covers fixed copper powder particle and red copper cathode base with copper mesh, is pressed together it, can effectively prevent copper powder particle
It drifts, ensure that the uniformity of plating；
(3) with reference to the device in embodiment 1, the copper powder particle and red copper cathode base that will be fixed together in step (2)
With in the immersion electrolyte of red copper anode slowly together, wherein, red copper cathode base is connected with the cathode of DC power supply, red copper sun
Pole is connected with the anode of DC power supply；Red copper anode is located at the top of red copper cathode base, red copper cathode base and red copper anode
It is horizontal positioned up and down；Then start to stand 0.5h；After the completion of standing, setting DC power supply electric current is 0.0003A/mm2, during plating
Between for 0.5h, start to be electroplated；
(4) after being electroplated, red copper cathode base is slowly removed from electroplating bath, with deionized water and alcohol rinse
It is clean and quickly dry up, you can to obtain being electroplate with the porous structure surface (Fig. 2) of spherical copper powder particle, between copper powder and copper powder
It is good that effect is combined between substrate, it is good to the enhancing effect of heat transfer.
Embodiment 3
Electroplating DC source electric current is 0.0002A/mm2, electroplating time 0.5h, other steps are the same as embodiment 2；It is obtained
Porous surface structure such as Fig. 3, binding force is small between copper powder, and binding force is small between copper powder and substrate.Structural instability, to heat transfer
Enhancing effect it is weak.
Embodiment 4
Electroplating DC source electric current is 0.0006A/mm2, electroplating time 0.5h, other steps are the same as embodiment 2；It is obtained
Porous surface structure such as Fig. 4, binding force is big between copper powder, and binding force is small between copper powder and substrate.Structure hole is excessively intensive, right
The enhancing effect of heat transfer is not notable.
Embodiment 5
Electroplating DC source electric current is 0.0002A/mm2, electroplating time 1h, other steps are the same as embodiment 2；It is obtained more
Hole surface structure such as Fig. 5, binding force is small between copper powder, and binding force is small between copper powder and substrate.Structural instability, the increasing to heat transfer
Potent fruit is weak.
Embodiment 6
Electroplating DC source electric current is 0.0003A/mm2, electroplating time 1h, other steps are the same as embodiment 2；It is obtained more
Hole surface structure such as Fig. 6, binding force is big between copper powder, and binding force is smaller between copper powder and substrate.Structure hole is intensive, to heat transfer
Enhancing effect it is weak.
Embodiment 7
Electroplating DC source electric current is 0.0006A/mm2, electroplating time 1h, other steps are the same as embodiment 2；It is obtained more
Hole surface structure such as Fig. 7, binding force is big between copper powder, and binding force is small between copper powder and substrate.Hole is excessively intensive, to heat transfer
Enhancing effect is not notable.
Above-described embodiment is the preferable embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any Spirit Essences without departing from the present invention with made under principle change, modification, replacement, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (8)
1. a kind of preparation method of porous surface metal structure, it is characterised in that comprise the following steps：
(1) metal powder granulates are soaked to the cathode base surface being then uniformly layered on by pretreatment, are then covered with gauze
Fixed metal powder granulates and cathode base；
(2) it will be immersed in electrolyte together with the metal powder granulates being fixed together in step (1) and cathode base and anode,
In, cathode base is connected with the cathode of DC power supply, and anode is connected with the anode of DC power supply；Anode is located at the upper of cathode base
It is square, it is horizontal positioned above and below cathode base and anode；Then it stands, then is electroplated, metal powder granulates are electroplated in cathode base
On body, porous surface metal structure is obtained；
The condition of plating described in step (2) is：Current density is 0.0002~0.0006A/mm2, electroplating time for 0.5~
1h。
2. the preparation method of porous surface metal structure according to claim 1, it is characterised in that：
The grain size of metal powder granulates described in step (1) is 20~50 μm.
3. the preparation method of porous surface metal structure according to claim 1, it is characterised in that：
The mode of the pretreatment of cathode base described in step (1) is：It first polishes cathode base, then using alkali cleaning
Surface impurity is removed with the method for pickling.
4. the preparation method of porous surface metal structure according to claim 1, it is characterised in that：
The roughness of cathode base described in step (1)<0.2μm.
5. the preparation method of porous surface metal structure according to claim 1, it is characterised in that：
The aperture of gauze in step (1) is no more than the grain size of metal powder granulates.
6. the preparation method of porous surface metal structure according to claim 1, it is characterised in that：
The time of standing described in step (2) is 0.5h~2h.
7. the preparation method of porous surface metal structure according to claim 1, it is characterised in that：
The condition of plating described in step (2) is：Current density is 0.0003A/mm2, electroplating time 0.5h.
8. a kind of porous surface metal structure is prepared by claim 1~7 any one of them preparation method.
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| CN201511035097.0A CN105442004B (en) | 2015-12-31 | 2015-12-31 | A kind of porous surface metal structure and preparation method thereof is with inlaying electroplanting device |
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| CN105442004B true CN105442004B (en) | 2018-06-22 |
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| CN106637306B (en) * | 2016-12-08 | 2018-04-17 | 淮海工学院 | A kind of composite electroformed device of advance layer paving type of powder |
| CN106917123B (en) * | 2017-03-31 | 2019-01-25 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of Wafer electroplating device and electro-plating method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1831204A (en) * | 2005-03-08 | 2006-09-13 | 上海艾比西材料科技有限公司 | Method and equipment for electroplating superthick and multiple-hole metals |
| CN104209875A (en) * | 2014-09-26 | 2014-12-17 | 郑州磨料磨具磨削研究所有限公司 | Superhard grinding tool and preparation method thereof |
| CN205329189U (en) * | 2015-12-31 | 2016-06-22 | 华南理工大学 | Preparation metal porous surface texture inlays electroplating device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5911865A (en) * | 1997-02-07 | 1999-06-15 | Yih; Pay | Method for electroplating of micron particulates with metal coatings |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1831204A (en) * | 2005-03-08 | 2006-09-13 | 上海艾比西材料科技有限公司 | Method and equipment for electroplating superthick and multiple-hole metals |
| CN104209875A (en) * | 2014-09-26 | 2014-12-17 | 郑州磨料磨具磨削研究所有限公司 | Superhard grinding tool and preparation method thereof |
| CN205329189U (en) * | 2015-12-31 | 2016-06-22 | 华南理工大学 | Preparation metal porous surface texture inlays electroplating device |
Non-Patent Citations (1)
| Title |
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| 一种节能阴极材料的制备条件研究;王宇;《北京建筑工程学院学报》;20060630;第22卷(第2期);第27-29页 * |
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