CN110220449A - A kind of wiring board and conductive layer thickness detection method, detection device - Google Patents
A kind of wiring board and conductive layer thickness detection method, detection device Download PDFInfo
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- CN110220449A CN110220449A CN201910576904.1A CN201910576904A CN110220449A CN 110220449 A CN110220449 A CN 110220449A CN 201910576904 A CN201910576904 A CN 201910576904A CN 110220449 A CN110220449 A CN 110220449A
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- detection
- conductive layer
- detection layers
- thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of wiring board and conductive layer thickness detection methods, detection device, including substrate and the conductive layer being disposed on the substrate, it further include the detection layers equal with conductive layer thickness being arranged in preset length and width situation by wiring board etching process and detection layers are mutually not turned on conductive layer, external detection equipment can pass through the resistance of measurement detection layers, according to preset length value, width value and the resistivity of material of detection layers converse the thickness of detection layers to obtain the thickness of conductive layer, and detection device includes the power supply and electrical detection component for detection layers power supply, electrical detection component measures the voltage and or current in detection layers；The design is convenient for the Thickness sensitivity to conductive layer, and easy to operate, testing cost is lower.
Description
Technical field
The present invention relates to wiring board arts.
Background technique
Traditional wiring board, including substrate and conductive layer, in the manufacture craft of assist side, first printing substrate is pre- to locate
It manages conductive plate (copper foil plate or other conductive materials), the carbon dust on heat-transferring printing paper is enable firmly to be imprinted on conductive plate, transfer
Conductive plate, by transferring several times, substrate can be firmly transferred on conductive plate very much, then etching conductive plate forms conductive layer,
Conductive layer is shaped according to the route of transfer in corrosion process, and the parameter of length and width substantially with requiring is identical, but leads
Error can then occur in etching process in the thickness of electric layer, and blocked up or excessively thin conductive layer all may cause the matter of wiring board
It measures bad；
The conductive layer thickness of wiring board was detected in the past, is first to be sampled to wiring board stripping and slicing, since wiring board is directly to put
It sets and is handled in corrosive liquid, the parameter of etching process control is essentially identical, so conductive layer each position after being corroded
Thickness is essentially identical, acquires image from wiring board side by light collection component, to judge the thickness of conductive layer, this mode is grasped
It bothers, stripping and slicing sampling may cause to damage to wiring board, and light collection component costs are higher.
Summary of the invention
It is an object of the invention at least solve one of the technical problems existing in the prior art, provide a kind of convenient for detection
The wiring board of conductive layer thickness and the detection method to the conductive layer thickness of the wiring board, detection device.
The technical solution adopted by the present invention is that:
A kind of wiring board further includes by wiring board etching process including substrate and the conductive layer being disposed on the substrate
The detection layers equal with conductive layer thickness are arranged in preset length and width situation and detection layers are not led mutually with conductive layer
Logical, the head end of detection layers, which is provided with, extends the first power connection end of substrate and the tail end of detection layers is provided with and extends substrate
Second power connection end, external detection equipment can be connect with the first power connection end, the second power connection end respectively, by the electricity for measuring detection layers
Hinder the thickness to obtain conductive layer.
The detection layers are in a strip shape and equivalent width of each position along its length.
A kind of detection method of conductive layer thickness detects a kind of above-mentioned resistance of the detection layers of wiring board, according to preset
The resistivity of material of length value, width value and detection layers converses the thickness of detection layers to obtain the thickness of conductive layer.
It is passed through constant current to detection layers, detection layers both end voltage is measured, to obtain the thickness of detection layers.
A kind of detection device, the thickness of the conductive layer for detecting a kind of above-mentioned wiring board characterized by comprising
Power supply can be electrically connected respectively with the first power connection end and the second power connection end to export constant current or perseverance
Constant voltage；
Electrical detection component can be electrically connected with detection layers to measure the voltage and or current in detection layers, thus
The thickness of conductive layer out.
The power supply is constant-current supply, and the electrical detection component includes connecing electricity with the first power connection end, second respectively
Hold the voltage check part being electrically connected.
It further include current-limiting resistance R, constant-current supply is connect by current-limiting resistance R with detection layers.
The electrical detection component further includes current detecting part, and current detecting part is connect to detect and flow through with detection layers
The current value of detection layers.
The power supply is constant voltage source, and the electrical detection component includes connecing electricity with the first power connection end, second respectively
Hold the current detecting part being electrically connected.
A technical solution in above-mentioned technical proposal at least has the following advantages that or one of beneficial effect:
Wiring board of the present invention is provided with the detection layers of preset length and width on substrate, and the detection layers and conductive layer are all
It is to be formed under the etching process of the conductive plate assist side by transfer, is equivalent to and is drawn on the electrically conductive when manufacturing wiring board
Divide the subregion for forming detection layers, then due to the characteristic of the etching process of wiring board, the thickness of detection layers and the thickness base of conductive layer
This is consistent, and detection layers are mutually isolated with conductive layer, eliminates the interference of the circuit layout of conductive layer complexity, and detection layers draw first
Power connection end, the second power connection end, outside access power detecting, the resistance for detection layers that you can get it can then converse detection layers
Thickness, the wiring board of the design are convenient for the Thickness sensitivity to conductive layer, and easy to operate, testing cost is lower；
The invention also discloses conductive layer thickness detection methods, the resistance for the detection detection layers that are first powered, according to preset length
The resistivity of material of angle value, width value and detection layers converses the thickness of detection layers to obtain the thickness of conductive layer, operation side
Just, cost is relatively low, is easy to factory's operation；
The invention also discloses detection devices, are detection layers power supply, the measurement detection of electrical detection component using power supply
Voltage and or current on layer converses the thickness of detection layers to obtain the resistance of detection layers, to obtain conductive layer
Thickness, device structure is simple, easy to operate, and cost is relatively low.
Detailed description of the invention
A specific embodiment of the invention is described further with reference to the accompanying drawing.
Fig. 1 is the structural schematic diagram of wiring board of the present invention.
Fig. 2 is the structural schematic diagram of detection device of the present invention.
Specific embodiment
This part will be described in specific embodiments of the present invention, and the preferred embodiments of the invention is shown in the accompanying drawings, attached
The effect of figure be with figure remark additionally book word segment description, enable a person to intuitively, visually understand of the invention
Each technical characteristic and overall technical architecture, but it should not be understood as limiting the scope of the invention.
In the description of the present invention, it is to be understood that, be related to orientation description, for example, above and below, front, rear, left and right etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of the description present invention and letter
Change description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation construct and
Operation, therefore be not considered as limiting the invention.
In the description of the present invention, several to be meant that one or more, it is multiple to be meant that two or more, be greater than,
Be less than, more than etc. be interpreted as not including this number, it is above, following, within etc. be interpreted as including this number.If there is being described to first,
Second is only intended to for the purpose of distinguishing technical characteristic, is not understood to indicate or imply relative importance or implicitly indicates institute
The quantity of the technical characteristic of instruction or the precedence relationship for implicitly indicating indicated technical characteristic.
In description of the invention, unless otherwise restricted clearly, the words such as setting, installation, connection be shall be understood in a broad sense, institute
Above-mentioned word in the present invention specific can rationally be determined with the particular content of combination technology scheme by belonging to technical field technical staff
Meaning.
Referring to Fig.1, a kind of wiring board, the conductive layer 2 including substrate 1 and setting on substrate 1, further includes passing through route
Plate etching process preset length and width situation be arranged with the detection layers 4 equal with 2 thickness of conductive layer and detection layers 4 with
Conductive layer 2 is mutually not turned on, and the head end of detection layers 4, which is provided with, extends the first power connection end 5 of substrate 1 and the tail end of detection layers 4
Be provided with the second power connection end 6 for extending substrate 1, external detection equipment can respectively with the first power connection end 5, the second power connection end 6
Connection, by measuring the resistance of detection layers 4 to obtain the thickness of conductive layer 2.
In certain embodiments, when manufacturing wiring board, the setting of layer 4 can be will test on substrate 1, can also reserve and prolong
Stretch the subregion of plate 3, and detection layers are arranged on 4 extension boards, equally pretreatment conductive plate, when printing substrate and transfer conductive plate with
The partiting step of conductive layer similarly divides detection layers, and is arranged by preset length and width, and detection layers and conductive layer are all
It is to be formed under the etching process of the conductive plate assist side by transfer, that is, on the electrically conductive when manufacturing wiring board
A subregion for forming detection layers is divided, then due to the characteristic of the etching process of wiring board, the thickness of detection layers and the thickness of conductive layer
Spend almost the same, detection layers are mutually isolated with conductive layer, eliminate the interference of the circuit layout of conductive layer complexity, and detection layers are drawn
First power connection end, the second power connection end, outside access power detecting, the resistance for detection layers that you can get it can then converse detection
The thickness of layer, the wiring board of the design are convenient for the Thickness sensitivity to conductive layer, and easy to operate, testing cost is lower.
In certain embodiments, detection layers are in a strip shape and equivalent width of each position along its length, thus changing
The resistance of strip can be regarded when calculation, convenient for calculating the thickness of detection layers.
The specific embodiment of the invention also discloses a kind of detection method of conductive layer thickness, and it is public to detect any of the above-described embodiment
A kind of resistance of the detection layers for the wiring board opened is changed according to the resistivity of material of preset length value, width value and detection layers
The thickness of detection layers is calculated to obtain the thickness of conductive layer.
Conversion method herein are as follows:
According to the structural property of detection layers, the length of detection layers is L, width W, with a thickness of H, the cross-sectional area of detection layers
For S；
The then thickness H=S/W of detection layers；
And the resistive impedance of detection layers is R, the resistivity of material of detection layers is ρ, and detection layers are identical with conductive layer herein
Material, using copper foil is applied, the Ohms sq millimeters meter of resistivity of material ρ=0.0175 (at 25 DEG C of room temperature) is fixed using resistance
Restrain R=ρ * L/S；
It from which further follows that, the cross-sectional area of detection layers is S=ρ * L/R；
That is, the thickness H=ρ * L/ (R*W) of detection layers；
Further, when measuring the resistive impedance R of detection layers, constant current I, measurement detection can be passed through to detection layers
Layer both end voltage U, to obtain the thickness of detection layers, i.e. R=U/I, the thickness formula for substituting into above-mentioned detection layers obtains thickness H.
The invention also discloses conductive layer thickness detection methods, the resistance for the detection detection layers that are first powered, according to preset length
The resistivity of material of angle value, width value and detection layers converses the thickness of detection layers to obtain the thickness of conductive layer, operation side
Just, cost is relatively low, is easy to factory's operation.
The specific embodiment of the invention also discloses a kind of detection device, as shown in Fig. 2, for detecting any of the above-described embodiment
A kind of thickness of the conductive layer of disclosed wiring board, comprising:
Power supply 7, can be electrically connected respectively with the first power connection end 5 and the second power connection end 6 with export constant current or
Person's constant voltage；
Electrical detection component 8, can with detection layers 4 be electrically connected to measure the voltage and or current in detection layers 4, from
And obtain the thickness of conductive layer 2.
It is detection layers power supply using power supply 7, electrical detection component 8 measures the voltage and or current in detection layers 4,
To obtain the resistance of detection layers, the thickness of detection layers is conversed, to obtain the thickness of conductive layer 2, device structure is simple, behaviour
Facilitate, cost is relatively low.
In certain embodiments, power supply 7 be constant-current supply, electrical detection component 8 include respectively with the first power connection end
5, the voltage check part 81 that the second power connection end 6 is electrically connected, voltage check part 8 can be conventional voltmeter.
When carrying out qualified measurement again, without conversing the thickness of conductive layer really, convert to qualified thickness range,
Obtain qualified resistance range value or voltage range values or current range value, measuring the signals such as the resistance of detection layers can obtain
Whether conductive layer is qualified out.
It in certain embodiments, further include current-limiting resistance R, constant-current supply is connect by current-limiting resistance R with detection layers 4, by
It is lower in the impedance of detection layers 4, and series limiting resistor R can prevent short circuit.
In certain embodiments, electrical detection component 8 further includes current detecting part 82, current detecting part 82 and detection
For 4 connection of layer to detect the current value for flowing through detection layers, current detecting part can be ammeter, Current Mutual Inductance equipment etc., by
In power supply constant-current supply output there are errors, actual current can be measured by current detecting part, so that result is more smart
It is quasi-.
In certain embodiments, power supply is constant voltage source, and the electrical detection component includes connecing electricity with first respectively
The current detecting part that end, the second power connection end are electrically connected, and current detecting part can be common ammeter herein.
Those skilled in the art will readily recognize that above-mentioned preferred embodiment can be freely under the premise of not conflicting
Combination and superposition.
The embodiment of the present invention is explained in detail above in conjunction with attached drawing, but the present invention is not limited to the above embodiments,
The technical field those of ordinary skill within the scope of knowledge, can also make without departing from the purpose of the present invention
Various change out.
Claims (9)
1. a kind of wiring board, including substrate and the conductive layer being disposed on the substrate, which is characterized in that further include passing through wiring board
Etching process is arranged with the detection layers equal with conductive layer thickness and detection layers and conductive in preset length and width situation
Layer is mutually not turned on, and the head end of detection layers, which is provided with, extends the first power connection end of substrate and the tail end of detection layers is provided with extension
Second power connection end of substrate out, external detection equipment can be connect with the first power connection end, the second power connection end respectively, be examined by measurement
The resistance of layer is surveyed to obtain the thickness of conductive layer.
2. a kind of wiring board according to claim 1, which is characterized in that the detection layers are in a strip shape and along its length
The equivalent width of each position.
3. a kind of detection method of conductive layer thickness, which is characterized in that one described in detection claim 1-2 any claim
The resistance of the detection layers of kind wiring board, converses inspection according to the resistivity of material of preset length value, width value and detection layers
The thickness of layer is surveyed to obtain the thickness of conductive layer.
4. a kind of detection method of conductive layer thickness according to claim 3, which is characterized in that be passed through to detection layers constant
Electric current measures detection layers both end voltage, to obtain the thickness of detection layers.
5. a kind of detection device, for detecting a kind of conductive layer of wiring board as described in claim 1-2 any claim
Thickness characterized by comprising
Power supply can be electrically connected respectively with the first power connection end and the second power connection end to export constant current or constant electricity
Pressure；
Electrical detection component can be electrically connected to measure the voltage and or current in detection layers with detection layers, lead to obtain
The thickness of electric layer.
6. a kind of detection device according to claim 5, which is characterized in that the power supply is constant-current supply, described
Electrical detection component includes the voltage check part being electrically connected respectively with the first power connection end, the second power connection end.
7. a kind of detection device according to claim 6, which is characterized in that further include current-limiting resistance R, constant-current supply passes through
Current-limiting resistance R is connect with detection layers.
8. a kind of detection device according to claim 6, which is characterized in that the electrical detection component further includes electric current inspection
Component is surveyed, current detecting part is connect to detect the current value for flowing through detection layers with detection layers.
9. a kind of detection device according to claim 5, which is characterized in that the power supply is constant voltage source, described
Electrical detection component includes the current detecting part being electrically connected respectively with the first power connection end, the second power connection end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910576904.1A CN110220449A (en) | 2019-06-28 | 2019-06-28 | A kind of wiring board and conductive layer thickness detection method, detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910576904.1A CN110220449A (en) | 2019-06-28 | 2019-06-28 | A kind of wiring board and conductive layer thickness detection method, detection device |
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| Publication Number | Publication Date |
|---|---|
| CN110220449A true CN110220449A (en) | 2019-09-10 |
Family
ID=67815452
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910576904.1A Pending CN110220449A (en) | 2019-06-28 | 2019-06-28 | A kind of wiring board and conductive layer thickness detection method, detection device |
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| CN101769713A (en) * | 2008-12-29 | 2010-07-07 | 天津普林电路股份有限公司 | Internal resistance detection method of internal layer line layer copper thickness in multi-layer printing circuit board |
| CN103376047A (en) * | 2012-04-16 | 2013-10-30 | 安华高科技通用Ip(新加坡)公司 | Apparatus and method for measuring thickness of printed circuit board |
| CN104142117A (en) * | 2013-05-09 | 2014-11-12 | 安华高科技通用Ip(新加坡)公司 | Method and apparatus for measuring thickness of layer in printed circuit board |
| KR20150011761A (en) * | 2013-07-23 | 2015-02-02 | 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 | Pcb loading apparatus for measuring thickness of printed circuit board stack |
| CN104425303A (en) * | 2013-09-05 | 2015-03-18 | 中芯国际集成电路制造(上海)有限公司 | Method for measuring thickness of conductive layer |
| CN105865319A (en) * | 2016-03-31 | 2016-08-17 | 华为技术有限公司 | PCB testing method, PCB manufacturing method and PCB |
| CN205561751U (en) * | 2016-05-06 | 2016-09-07 | 鹤山市中富兴业电路有限公司 | Multilayer PCB board dielectric layer thickness detection device based on capacitance measurement |
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2019
- 2019-06-28 CN CN201910576904.1A patent/CN110220449A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101769713A (en) * | 2008-12-29 | 2010-07-07 | 天津普林电路股份有限公司 | Internal resistance detection method of internal layer line layer copper thickness in multi-layer printing circuit board |
| CN103376047A (en) * | 2012-04-16 | 2013-10-30 | 安华高科技通用Ip(新加坡)公司 | Apparatus and method for measuring thickness of printed circuit board |
| CN104142117A (en) * | 2013-05-09 | 2014-11-12 | 安华高科技通用Ip(新加坡)公司 | Method and apparatus for measuring thickness of layer in printed circuit board |
| KR20150011761A (en) * | 2013-07-23 | 2015-02-02 | 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 | Pcb loading apparatus for measuring thickness of printed circuit board stack |
| CN104425303A (en) * | 2013-09-05 | 2015-03-18 | 中芯国际集成电路制造(上海)有限公司 | Method for measuring thickness of conductive layer |
| CN105865319A (en) * | 2016-03-31 | 2016-08-17 | 华为技术有限公司 | PCB testing method, PCB manufacturing method and PCB |
| CN205561751U (en) * | 2016-05-06 | 2016-09-07 | 鹤山市中富兴业电路有限公司 | Multilayer PCB board dielectric layer thickness detection device based on capacitance measurement |
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Application publication date: 20190910 |
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