CN110091615A - A kind of the high-precision heater construction and its manufacturing process of film thermal printing head - Google Patents
A kind of the high-precision heater construction and its manufacturing process of film thermal printing head Download PDFInfo
- Publication number
- CN110091615A CN110091615A CN201910390570.9A CN201910390570A CN110091615A CN 110091615 A CN110091615 A CN 110091615A CN 201910390570 A CN201910390570 A CN 201910390570A CN 110091615 A CN110091615 A CN 110091615A
- Authority
- CN
- China
- Prior art keywords
- heater
- layer
- printing head
- thermal printing
- film thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33515—Heater layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3359—Manufacturing processes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electronic Switches (AREA)
Abstract
The invention discloses a kind of high-precision heater of film thermal printing head and its manufacturing process, belong to thermal printing head production technical field.Including the heater being located on base layer, the heater includes heater layer and the insulating layer on heater layer, and conductor layer is located on the base layer of the heater two sides, and the conductor layer extends to the beveled top end.The beneficial effects of the present invention are: the area and resistance value variations of heat generating spot are minimum, it is ensured that within ± 0.5%；The resistance value of each heater is determined by the shape of heater layer, is not influenced by the shape of conductor layer, to ensure that the uniformity of the resistance value of final products.
Description
Technical field
The present invention relates to a kind of film thermal printing heads for extending the service life, belong to thermal printing head production technical field.
Background technique
When being produced and processed to film thermal printing head, in the case that on surface, square resistance (Rs) is certain, single-point hair
The resistance value of hot body is determined by the fever bulk area after etching, i.e. the length (L) of heater and wide (W) determines heater
Resistance value size (as shown in Figure 1).When usually producing, after magnetron sputtering technique continuous film forming heater layer and conductor layer,
It reuses wet etching process and generates topping wire (fine aluminium) shape, it is raw by dry etching process then using conductor layer as mask
At bottom heater (compound of tantalum) shape, still, since wet etching process such as has at tropisms, and the etch quantity
(OVERETHING) it is easy to be influenced by etching solution temperature and concentration, so all the points between all the points and product in same product
Wire shape can be variant, it is uneven using conducting wire to will cause fever shape in the process of mask etching heater in this way, from
And make in same product that all the points resistance value variations are bigger between product, it can be more than 15% when serious, can not meet colored beat
The requirement of the letter qualities such as print.
Summary of the invention
To solve defect of the existing technology, that the object of the present invention is to provide a kind of resistance value variations is small, meets Gao Pin
The high-precision heater construction and its manufacturing process for the film thermal printing head that matter printing requires.
The technical scheme is that the manufacturing process of the high-precision heater of kind film thermal printing head, including it is as follows
Step:
S1) pass through magnetron sputtering technique on base layer into film heater layer；
S2 it) is formed a film on heater layer insulating layer by magnetron sputtering technique；
S3 photoresist) is coated on the insulating layer, is formed by semiconductor photolithography in photoresist photomask surface to be etched
Heater pattern；
S4) insulating layer and heater layer are etched along heater pattern to be etched using semiconductor dry etching technology；
S5) by magnetron sputtering technique in heater and base layer surface filming conductor layer；
S6) conducting wire layer surface coats photoresist, is formed by semiconductor photolithography in photoresist photomask surface to be etched
Wire pattern；
S7) wire shape is etched along wire pattern to be etched using semiconductor wet etch techniques.
The base layer is aluminum oxide material.
The heater layer is tantalum compound.
The conductor layer material is aluminium.
The insulating layer material is silica.
A kind of high-precision heater structure of film thermal printing head using the preparation of above-mentioned technique is also claimed in the present invention
It makes.
A kind of high-precision heater construction of film thermal printing head, including the heater being located on base layer, the hair
Hot body includes heater layer and the insulating layer on heater layer, and conductor layer is located on the base layer of the heater two sides,
The conductor layer extends to the beveled top end.
The beneficial effects of the present invention are: since dry corrosion is carved with good anisotropic, so forming the length and width ruler of heater
Very little stable uniform, that is, the area and resistance value variations of all heat generating spots are minimum, it is ensured that within ± 0.5%.Heater layer table
There is insulating layer in face, so conductor layer is connected simply by the side of heater layer, i.e., the resistance value of each heater is by generating heat
What the shape of body layer determined, it is not influenced by the shape of conductor layer, to ensure that the uniformity of the resistance value of final products.
Detailed description of the invention
Fig. 1 is the structure chart of existing film thermal printing head heater；
Fig. 2 is the top view of film thermal printing head heater of the invention；
Fig. 3 is the sectional side view of Fig. 2.
Appended drawing reference is as follows in figure: 1, base layer, 2, heater layer, 3, conductor layer, 4, insulating layer, 5, current direction.
Specific embodiment
The present invention will be further described by 2-3 with reference to the accompanying drawing:
A kind of manufacturing process of the high-precision heater of film thermal printing head, includes the following steps:
S1) pass through magnetron sputtering technique on base layer 1 into film heater layer 2；
S2 it) is formed a film on heater layer 2 insulating layer 4 by magnetron sputtering technique；
S3 photoresist) is coated on insulating layer 4, is formed by semiconductor photolithography in photoresist photomask surface to be etched
Heater pattern；
S4) insulating layer 4 and heater layer 2 are lost along heater pattern to be etched using semiconductor dry etching technology
It carves；
S5) by magnetron sputtering technique in 1 surface filming conductor layer 3 of heater and base layer；
S6) 3 surface of conductor layer coats photoresist, forms conducting wire figure to be etched in photoresist photomask surface by photoetching technique
Case；
S7) wire shape is etched along wire pattern to be etched using semiconductor wet etch techniques.
The base layer 1 is aluminum oxide material, the heat generated when conducting lettering.The heater layer 2 is tantalum
Object is closed, generates high temperature after energization.3 material of conductor layer is aluminium, constitutes the conducting wire of power circuit.4 material of insulating layer is
Silica.
A kind of high-precision heater structure of film thermal printing head using the preparation of above-mentioned technique is also claimed in the present invention
It makes.
A kind of high-precision heater construction of film thermal printing head, including the heater being located on base layer 1, the hair
Hot body includes heater layer 2 and the insulating layer 4 on heater layer 2, and conductor layer 3 is located at the base layer of the heater two sides
On 1, the conductor layer 3 extends to the beveled top end.
Dry corrosion is carved with good anisotropic, so forming the length and width dimensions stable uniform of heater, that is, all heat generating spots
Area and resistance value variations it is minimum, it is ensured that within ± 0.5%.Heater layer surface has insulating layer, so conductor layer is only
It is that (as shown in Figure 3) is connected by the side of heater layer, i.e., the resistance value of each heater is determined by the shape of heater layer
Fixed, it is not influenced by the shape of conductor layer, to ensure that the uniformity of the resistance value of final products.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvements and modifications, these improvements and modifications can also be made
Also it should be regarded as protection scope of the present invention.
Claims (7)
1. a kind of manufacturing process of the high-precision heater of film thermal printing head, which comprises the steps of:
S1) pass through magnetron sputtering technique on base layer (1) at film heater layer (2)；
S2 it) is formed a film on heater layer (2) insulating layer (4) by magnetron sputtering technique；
S3 photoresist) is coated on insulating layer (4), hair to be etched is formed in photoresist photomask surface by semiconductor photolithography
Hot body pattern；
S4) insulating layer (4) and heater layer (2) are lost along heater pattern to be etched using semiconductor dry etching technology
It carves；
S5) by magnetron sputtering technique in heater and base layer (1) surface filming conductor layer (3)；
S6) conductor layer (3) surface coats photoresist, forms to be etched lead in photoresist photomask surface by semiconductor photolithography
Line pattern；
S7) wire shape is etched along wire pattern to be etched using semiconductor wet etch techniques.
2. the manufacturing process of the high-precision heater of film thermal printing head according to claim 1, which is characterized in that institute
Stating base layer (1) is aluminum oxide material.
3. the manufacturing process of the high-precision heater of film thermal printing head according to claim 1, which is characterized in that institute
Stating heater layer (2) is tantalum compound.
4. the manufacturing process of the high-precision heater of film thermal printing head according to claim 1, which is characterized in that institute
Stating conductor layer (3) material is aluminium.
5. the manufacturing process of the high-precision heater of film thermal printing head according to claim 1, which is characterized in that institute
Stating insulating layer (4) material is silica.
6. a kind of high-precision heater of film thermal printing head, which is characterized in that using manufacture work as described in claim 1
Skill is prepared.
7. the high-precision heater of film thermal printing head according to claim 6 constructs, which is characterized in that including being located at
Heater on base layer (1), the heater include heater layer (2) and be located at heater layer (2) on insulating layer (4),
Conductor layer (3) is located on the base layer (1) of the heater two sides, and the conductor layer (3) extends to the beveled top end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910390570.9A CN110091615A (en) | 2019-05-10 | 2019-05-10 | A kind of the high-precision heater construction and its manufacturing process of film thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910390570.9A CN110091615A (en) | 2019-05-10 | 2019-05-10 | A kind of the high-precision heater construction and its manufacturing process of film thermal printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110091615A true CN110091615A (en) | 2019-08-06 |
Family
ID=67447746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910390570.9A Pending CN110091615A (en) | 2019-05-10 | 2019-05-10 | A kind of the high-precision heater construction and its manufacturing process of film thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110091615A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498767A (en) * | 2002-11-08 | 2004-05-26 | 阿尔卑斯电气株式会社 | Heat-sensitive probe and its mfg. method |
| CN1636748A (en) * | 2004-01-07 | 2005-07-13 | 阿尔卑斯电气株式会社 | Thermal head, method for manufacturing the same, and method for adjusting dot aspect ratio of thermal head |
| CN1746034A (en) * | 2004-09-08 | 2006-03-15 | 阿尔卑斯电气株式会社 | Thermal sensitive head and manufacture thereof |
| CN101143521A (en) * | 2006-09-12 | 2008-03-19 | 阿尔卑斯电气株式会社 | Thermal headand method of manufacturing the same |
| US20130088557A1 (en) * | 2011-10-06 | 2013-04-11 | Seiko Instruments Inc. | Thermal head and method of manufacturing the same, and thermal printer |
| CN109693451A (en) * | 2019-01-28 | 2019-04-30 | 山东华菱电子股份有限公司 | A kind of thermal printing head heating base plate and its manufacturing method |
-
2019
- 2019-05-10 CN CN201910390570.9A patent/CN110091615A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1498767A (en) * | 2002-11-08 | 2004-05-26 | 阿尔卑斯电气株式会社 | Heat-sensitive probe and its mfg. method |
| CN1636748A (en) * | 2004-01-07 | 2005-07-13 | 阿尔卑斯电气株式会社 | Thermal head, method for manufacturing the same, and method for adjusting dot aspect ratio of thermal head |
| CN1746034A (en) * | 2004-09-08 | 2006-03-15 | 阿尔卑斯电气株式会社 | Thermal sensitive head and manufacture thereof |
| CN101143521A (en) * | 2006-09-12 | 2008-03-19 | 阿尔卑斯电气株式会社 | Thermal headand method of manufacturing the same |
| US20130088557A1 (en) * | 2011-10-06 | 2013-04-11 | Seiko Instruments Inc. | Thermal head and method of manufacturing the same, and thermal printer |
| CN109693451A (en) * | 2019-01-28 | 2019-04-30 | 山东华菱电子股份有限公司 | A kind of thermal printing head heating base plate and its manufacturing method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200605 Address after: 110179 no.19-8, Hunnan East Road, Hunnan New District, Shenyang City, Liaoning Province (1-1-1) Applicant after: Shenyang Huiyin Electronic Technology Co., Ltd Address before: 430000 Room 2F-205, Guanggu Wisdom Park, No. 7 Finance Port Road, Donghu New Technology Development Zone, Hongshan District, Wuhan City, Hubei Province Applicant before: Wuhan Huiyin Semiconductor Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190806 |