JP3123824B2 - Method for manufacturing substrate for thermal head - Google Patents
Method for manufacturing substrate for thermal headInfo
- Publication number
- JP3123824B2 JP3123824B2 JP22069592A JP22069592A JP3123824B2 JP 3123824 B2 JP3123824 B2 JP 3123824B2 JP 22069592 A JP22069592 A JP 22069592A JP 22069592 A JP22069592 A JP 22069592A JP 3123824 B2 JP3123824 B2 JP 3123824B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- glaze layer
- ridge
- thermal head
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【産業上の利用分野】本発明は、セラミック基板の片面
又は両面の全面又は一部分にグレーズ層が形成された熱
転写プリンタのサーマルヘッド用基板の製造方法に関す
る。更に詳しくはグレーズ層にＷ／Ｈが０．１〜１０の
凸条を形成するときのサーマルヘッド用基板の製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a substrate for a thermal head of a thermal transfer printer in which a glaze layer is formed on one or both surfaces of a ceramic substrate. More specifically, the present invention relates to a method for manufacturing a thermal head substrate when a ridge having a W / H of 0.1 to 10 is formed on a glaze layer.
【０００２】[0002]
【従来の技術】近年、感熱転写プリンタの印字品質の向
上及び印字速度の高速化の要求が一段と強まってきてい
る。この要求を満たすために、感熱転写プリンタに使用
されるサーマルヘッド用基板においては、基板表面に形
成されたグレーズ層の表面が平滑でうねりや欠陥のない
ことが不可欠である上、発熱抵抗体と感熱紙との接触を
大きくさせる必要がある。このために、グレーズ層の発
熱抵抗体の形成部を曲面を有する凸条にしている。この
ような凸条のグレーズ層を形成する方法としては、セラ
ミック基板の全面にガラスペーストを印刷し焼成した
後、更にその上の凸条を必要とする部分に同様のガラス
ペーストを印刷し焼成して全面グレーズ層に凸条を形成
する間接法がある。また、別の方法として、軟化点の異
なる２種類のガラスペーストを用い、まずセラミック基
板の凸条形成部以外の部分に軟化点の高いガラスペース
トを印刷して焼成し、次に凸条形成部に軟化点の低いガ
ラスペーストを所望の高さになるように印刷して焼成す
ることにより全面グレーズ層に凸条を形成する直接法が
ある。2. Description of the Related Art In recent years, there has been a growing demand for improving the printing quality and increasing the printing speed of a thermal transfer printer. In order to meet this demand, it is essential for the thermal head substrate used in the thermal transfer printer that the surface of the glaze layer formed on the substrate surface should be smooth and free of undulations and defects, and it should be used together with the heating resistor. It is necessary to increase the contact with the thermal paper. For this reason, the formation part of the heating resistor of the glaze layer is formed as a convex ridge having a curved surface. As a method of forming such a ridged glaze layer, a glass paste is printed and baked on the entire surface of the ceramic substrate, and then a similar glass paste is printed and baked on a portion where the ridges are required. There is an indirect method of forming a ridge on the entire glaze layer. As another method, two types of glass pastes having different softening points are used. First, a glass paste having a high softening point is printed and baked on portions other than the ridge forming portions of the ceramic substrate, and then the ridge forming portions are formed. There is a direct method in which a glass paste having a low softening point is printed so as to have a desired height and then fired to form a ridge on the entire glaze layer.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記間接法で
は、セラミック基板上でのガラスの流動が少ないので凸
条の曲率を比較的小さくできるが、凸条頂上部近傍のう
ねりが大きく或いはセラミック基板上に導体の微細配線
をしなければならない問題点があり、一方上記直接法で
は、平滑なグレーズ層の表面に導体配線ができるため断
線等の不具合が非常に少ない特徴がある反面、通常平滑
なグレーズ層の表面を得るためのグレーズ焼成温度では
ガラス粘度が１０4ポイズ未満で低いため、平面ガラス
上の凸条のガラスは流動しやすく凸条の曲率半径を１５
ｍｍ以下に小さくしにくい欠点があった。また、印字の
高精細性や印刷のカラー化に対する要望がますます高ま
っているが、この要望を実現するには、平滑なグレーズ
層の表面に好ましくは５ｍｍ以下の曲率半径が小さい凸
条を形成し、しかもこの凸条はその頂上部近傍のうねり
を１μｍ以下にする必要がある。しかし、前述のサーマ
ルヘッド用基板の製造方法では対応できないのが現状で
ある。本発明の目的は、Ｗ／Ｈが０．１〜１０の凸条を
形成するとき凸条の曲率半径が１ｍｍ以下であるサーマ
ルヘッド用基板の製造方法を提供することにある。本発
明の別の目的は、凸条頂上部近傍のうねりが１μｍ以下
であり、かつセラミック基板上での導体の微細配線が不
要であるサーマルヘッド用基板の製造方法を提供するこ
とにある。However, in the above-mentioned indirect method, the curvature of the ridge can be made relatively small because the flow of the glass on the ceramic substrate is small, but the undulation near the top of the ridge is large or the ceramic substrate has a large curvature. On the other hand, the direct method has a problem that fine wiring of the conductor must be performed.On the other hand, the direct method has very few defects such as disconnection because the conductive wiring can be formed on the surface of the smooth glaze layer. At the glaze baking temperature for obtaining the surface of the glaze layer, the glass viscosity is low at less than 10 4 poise, so that the convex glass on the flat glass easily flows and has a radius of curvature of 15 convex.
There was a disadvantage that it was difficult to reduce the size to less than mm. In addition, there is an increasing demand for high-definition printing and color printing, but in order to realize this demand, a convex with a small radius of curvature of preferably 5 mm or less is formed on the surface of a smooth glaze layer. In addition, it is necessary that the undulation near the top of the ridge is 1 μm or less. However, at present, the above-described method of manufacturing a substrate for a thermal head cannot be used. An object of the present invention is to provide a method for manufacturing a thermal head substrate in which a ridge having a W / H of 0.1 to 10 has a curvature radius of 1 mm or less. Another object of the present invention is to provide a method of manufacturing a thermal head substrate in which the undulation near the top of the ridge is 1 μm or less and fine wiring of a conductor on a ceramic substrate is unnecessary.
【０００４】[0004]
【課題を解決するための手段】図１に示すように、本発
明は、セラミック基板１１の片面又は両面の全面又は一
部分に表面が平滑なガラスグレーズ層１２を形成し、ガ
ラスグレーズ層１２の一部分を残して他の部分のガラス
グレーズ層を除去することにより残した一部分を凸条１
３に形成し、ガラスグレーズ層１２をそのガラスの軟化
点以上の温度で熱処理して凸条１３の頂上部近傍を曲面
に加工するサーマルヘッド用基板の製造方法の改良であ
る。その特徴ある構成は、凸条がその幅をＷとし、その
高さをＨとするとき０．１＜Ｗ／Ｈ＜１０となるように
形成され、熱処理が軟化したガラスの粘度が１０5〜１
０7ポイズになる温度で行われることにある。As shown in FIG. 1, according to the present invention, a glass glaze layer 12 having a smooth surface is formed on a whole or a part of one or both sides of a ceramic substrate 11, and a part of the glass glaze layer 12 is formed. The remaining part is removed by removing the glass glaze layer of the other part, and the part left
3 is a method for manufacturing a thermal head substrate in which the glass glaze layer 12 is heat-treated at a temperature equal to or higher than the softening point of the glass to process the vicinity of the top of the ridge 13 into a curved surface. The characteristic configuration is such that when the ridge has a width W and a height H, it is formed so that 0.1 <W / H <10, and the viscosity of the glass softened by the heat treatment is 10 5 to 10 5 . 1
0 is to be performed at 7 becomes poise temperature.
【０００５】本発明のセラミック基板の片面又は両面に
形成されるガラスグレーズ層の原料となるガラス粉末
は、感熱転写プリンタに使用されるサーマルヘッドに要
求される絶縁性及び耐熱性をともに満足するものであ
る。例えば、このガラス粉末の主成分として、Ｓｉ，Ｃ
ａ，Ｂａ，Ａｌ，Ｂがあり、またＡｌ2Ｏ3−ＢａＯ−Ｂ
2Ｏ3−ＣａＯ−ＳｉＯ2系のガラスグレーズ層を形成す
る。図１(a)に示すようにガラス粉末とバインダから成
るガラスペーストをスクリーン印刷又はスプレーにより
セラミック基板１１上に付着させ、焼成することにより
表面が平滑なガラスグレーズ層１２を得る。続いて、図
１(b)に示すようにこの平滑なガラスグレーズ層１２に
乾式又は湿式エッチング、平面研削等の研磨等により部
分的に凸条１３を形成する。部分的に凸条１３を形成す
る際、エッチング、研磨等で取除くガラスグレーズ層１
２の厚さは、セラミック基板１１上に最初に形成された
ガラスグレーズ層１２の厚さより小さくする必要があ
る。特に本発明は凸条の幅をＷ、高さをＨとするとき凸
条１３のＷ／Ｈを０．１以上１０以下に形成する場合の
製造方法である。The glass powder used as the raw material of the glass glaze layer formed on one or both sides of the ceramic substrate of the present invention is one that satisfies both the insulation and heat resistance required for a thermal head used in a thermal transfer printer. It is. For example, as main components of this glass powder, Si, C
a, Ba, Al and B, and Al 2 O 3 —BaO—B
2 O 3 to form a glass glaze layer of -CaO-SiO 2 system. As shown in FIG. 1 (a), a glass paste composed of a glass powder and a binder is adhered onto a ceramic substrate 11 by screen printing or spraying and fired to obtain a glass glaze layer 12 having a smooth surface. Subsequently, as shown in FIG. 1 (b), ridges 13 are partially formed on the smooth glass glaze layer 12 by dry or wet etching, polishing such as surface grinding, or the like. The glass glaze layer 1 which is removed by etching, polishing, etc. when forming the ridge 13 partially
2 must be smaller than the thickness of the glass glaze layer 12 formed first on the ceramic substrate 11. In particular, the present invention is a manufacturing method in the case where the width / height of the ridge 13 is H and the height / height of the ridge 13 is 0.1 to 10 inclusive.
【０００６】更に、図１(c)に示すように部分的に形成
された凸条１３を、ガラスの軟化点以上の温度でかつガ
ラスの粘度が１０5〜１０7ポイズの範囲で、熱処理を行
い図１(b)に示した矩形の凸条１３に丸みを帯びさせ
る。本発明の特徴ある点はこの熱処理にある。具体的に
は次の条件により行う。熱処理は軟化したガラスの粘度
が１０5〜１０7ポイズになる温度で行われる。ガラスの
粘度が１０5ポイズ未満になる温度では熱処理後の凸条
の曲率半径が１ｍｍを超えてしまい、一方１０7ポイズ
を超える温度では熱処理後の凸条の頂上部が完全に曲面
化されずに平坦な部分が残ってしまい、好ましくない。Further, as shown in FIG. 1 (c), a partially formed ridge 13 is subjected to a heat treatment at a temperature not lower than the softening point of the glass and at a viscosity of the glass of 10 5 to 10 7 poise. Then, the rectangular ridge 13 shown in FIG. 1B is rounded. The feature of the present invention lies in this heat treatment. Specifically, it is performed under the following conditions. The heat treatment is performed at a temperature at which the viscosity of the softened glass becomes 10 5 to 10 7 poise. At a temperature at which the viscosity of the glass becomes less than 10 5 poise, the radius of curvature of the ridge after heat treatment exceeds 1 mm, while at a temperature exceeding 10 7 poise, the top of the ridge after heat treatment is not completely curved. A flat portion remains on the surface, which is not preferable.
【０００７】[0007]
【作用】ガラスグレーズ層１２の凸条１３に丸みを帯び
させるために、ガラスグレーズ層１２のＷ（幅）とＨ
（高さ）の比Ｗ／Ｈが０．１以上１０以下の範囲に入る
ように凸条を形成した後、ガラスの粘度が１０5〜１０7
ポイズの範囲で熱処理を行うと、凸条の曲率半径を１ｍ
ｍ以下の範囲で加工することができる。The W (width) and H (width) of the glass glaze layer 12 are used to make the convex stripes 13 of the glass glaze layer 12 round.
After forming the ridge so that the ratio (W / H) of (height) falls within the range of 0.1 or more and 10 or less, the viscosity of the glass becomes 10 5 to 10 7.
When heat treatment is performed in the poise range, the radius of curvature of the ridge is 1 m
m or less.
【０００８】[0008]
【実施例】以下、実施例により本発明を詳細に説明す
る。本発明はこの実施例により制限されるものではな
い。長さ２７０ｍｍ、幅５０ｍｍ、厚さ１ｍｍのアルミ
ナ含有量９６％のセラミック基板１１を用意した。この
基板の表面に軟化点が８５５℃のガラス粉末（商品名：
ＡＳＦ１７６０、旭硝子(株)製）とエチルセルロースと
テレピネオールとを混合して得られたガラスペーストを
スクリーン印刷してガラスグレーズ層１２を形成し、こ
のガラスグレーズ層１２を１５０℃で乾燥させた後、９
５０℃で３０分間焼成した。ガラスペーストの厚さは、
焼成後に６０μｍとなるように調整した（図１(a)）。
ガラスグレーズ層１２の表面にそれぞれＷ（幅）が０．
１ｍｍ、０．１８ｍｍ、及び０．２５ｍｍで、長さが２
７０ｍｍのパターンを有するスクリーンで熱硬化性レジ
ストを印刷してエッチング用レジスト膜を形成し、エッ
チング用レジストが塗布されていない部分をふっ酸によ
り０．０３ｍｍの深さでエッチングすることにより、３
種類の幅の異なる凸条１３を形成した（図１(b)）。更
に、表１に示す９つの条件で熱処理を行い、凸条１３に
丸みを帯びさせた（図１(c)）。３種類の凸部のＷ／Ｈ
は、それぞれ３．３、６．０、及び８．３であった。エ
ッチングにより形成した矩形の部分的に凸条を有するグ
レーズ基板を、最高温度が９００℃、９５０℃、１００
０℃で、かつ最高温度での保持時間がそれぞれ１５分で
熱処理した。ここで熱処理は昇温速度、焼成時間、最高
温度での保持時間、冷却速度及び冷却時間等の焼成条件
を予備試験で予め求め、記憶装置に記憶させた焼成条件
のプロファイルのうち焼成炉の６０分プロファイルに基
づいた。 熱処理した最高温度でのこのガラスの粘度は
換算表より、９００℃では１０6. 8ポイズ、９５０℃で
は１０6.0ポイズ、及び１０００℃では１０5.2ポイズで
あった。熱処理後のガラスグレーズ層１２の表面を観察
すると、非常に平滑で無欠陥であった。また、凸条１３
が曲面化され丸みを帯びていた。更に、丸みの曲率半径
と長手方向のうねりを測定した。その結果を表１に示
す。The present invention will be described below in detail with reference to examples. The present invention is not limited by this embodiment. A ceramic substrate 11 having a length of 270 mm, a width of 50 mm, and a thickness of 1 mm and having an alumina content of 96% was prepared. A glass powder having a softening point of 855 ° C. (trade name:
ASF1760 (manufactured by Asahi Glass Co., Ltd.), ethyl cellulose, and terpineol are mixed to form a glass paste by screen printing to form a glass glaze layer 12. The glass glaze layer 12 is dried at 150 ° C.
Baking was performed at 50 ° C. for 30 minutes. The thickness of the glass paste is
The thickness was adjusted to 60 μm after firing (FIG. 1 (a)).
W (width) is set to 0. 0 on the surface of the glass glaze layer 12.
1 mm, 0.18 mm, and 0.25 mm, length 2
A thermosetting resist is printed on a screen having a pattern of 70 mm to form an etching resist film, and a portion where the etching resist is not applied is etched with hydrofluoric acid to a depth of 0.03 mm to form a 3.
Protrusions 13 of different widths were formed (FIG. 1 (b)). Further, heat treatment was performed under the nine conditions shown in Table 1 to round the ridge 13 (FIG. 1 (c)). W / H of three kinds of convex parts
Was 3.3, 6.0, and 8.3, respectively. A glaze substrate having a rectangular partially convex stripe formed by etching is subjected to a maximum temperature of 900 ° C., 950 ° C., 100 ° C.
The heat treatment was performed at 0 ° C. and the holding time at the maximum temperature was 15 minutes each. In the heat treatment, firing conditions such as a heating rate, a firing time, a holding time at the highest temperature, a cooling rate, and a cooling time are determined in advance by a preliminary test, and among the firing condition profiles stored in the storage device, 60 Based on minute profile. The viscosity of the glass at the highest temperature heat treatment from a conversion table, was 900 ° C. In 10 6.8 poise, at 950 ° C. 10 6.0 poise, and 1000 ° C. At 10 5.2 poise. When the surface of the glass glaze layer 12 after the heat treatment was observed, it was very smooth and defect-free. Also, the ridge 13
Was rounded and rounded. Further, the radius of curvature of the roundness and the undulation in the longitudinal direction were measured. Table 1 shows the results.
【０００９】[0009]
【表１】 [Table 1]
【００１０】表１の結果より、熱処理前のＷ／Ｈを３．
３〜８．３に、かつ熱処理温度をガラス粘度が特定の範
囲に入るように設定すると、、熱処理後の凸条曲率半径
が０．１〜０．９で、及び凸条頂上部のうねりがすべて
０．２μｍ以下であることが判る。From the results shown in Table 1, the W / H before heat treatment was set to 3.
When the heat treatment temperature is set to 3 to 8.3 and the glass viscosity is set in a specific range, the radius of the convex ridge after the heat treatment is 0.1 to 0.9, and the undulation of the top of the convex ridge is reduced. It can be seen that all are 0.2 μm or less.
【００１１】[0011]
【発明の効果】以上述べたように、本発明によれば、ガ
ラスグレーズ層にＷ／Ｈが０．１〜１０の凸条を形成し
た後の熱処理を特定の温度条件下で行うことにより、凸
条頂上部のガラスグレーズ層のうねりが１μｍ以下で、
凹凸がなく平滑な表面のガラスグレーズ層が得られ、か
つ凸条の曲率半径が１ｍｍ以下の曲面部を有するガラス
グレーズ層が得られるので、絶縁性と断熱性に優れかつ
蓄熱効果が大きいガラスグレーズ層を備えたサーマルヘ
ッド用基板を製造することができる。また、凸条の上に
発熱抵抗体層を形成すると、導線の微細配線を必要とせ
ずかつ抵抗値のばらつきが少ないサーマルヘッドを得る
ことができる。As described above, according to the present invention, the heat treatment after forming the ridge having a W / H of 0.1 to 10 in the glass glaze layer is performed under a specific temperature condition. The waviness of the glass glaze layer on the top of the ridge is 1 μm or less,
A glass glaze layer having a smooth surface without irregularities and a glass glaze layer having a curved portion with a radius of curvature of 1 mm or less can be obtained, so that the glass glaze has excellent heat insulating and heat insulating properties and a large heat storage effect. A substrate for a thermal head having a layer can be manufactured. In addition, when the heating resistor layer is formed on the ridge, a thermal head that does not require fine wiring of a conductive wire and has a small variation in resistance value can be obtained.
【図１】本発明のサーマルヘッド用基板の製造を工程順
に示すサーマルヘッド用基板の断面図。FIG. 1 is a cross-sectional view of a thermal head substrate showing the production of the thermal head substrate of the present invention in the order of steps.
１１ セラミック基板 １２ ガラスグレーズ層 １３ 凸条 Reference Signs List 11 ceramic substrate 12 glass glaze layer 13 ridge
───────────────────────────────────────────────────── フロントページの続き (72)発明者 須田 充 埼玉県秩父郡横瀬町大字横瀬2270番地 三菱マテリアル株式会社 セラミックス 研究所内 (72)発明者 石井 博 埼玉県秩父郡横瀬町大字横瀬2270番地 三菱マテリアル株式会社 セラミックス 研究所内 (56)参考文献 特開 平３−175057（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B41J 2/335 C04B 41/86 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Mitsuru Suda 2270 Yokoze, Yokoze-cho, Chichibu-gun, Saitama Prefecture Mitsubishi Materials Corporation Ceramics Research Laboratory (72) Inventor Hiroshi Ishii 2270 Yokoze, Yokoze-cho, Yokoze-cho, Chichibu-gun, Saitama Mitsubishi Materials (56) References JP-A-3-175057 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B41J 2/335 C04B 41/86
Claims (1)
面又は一部分に表面が平滑なガラスグレーズ層(12)を形
成し、前記ガラスグレーズ層(12)の一部分を残して他の
部分のガラスグレーズ層を除去することにより前記残し
た一部分を凸条(13)に形成し、前記ガラスグレーズ層(1
2)をそのガラスの軟化点以上の温度で熱処理して前記凸
条(13)の頂上部近傍を曲面に加工するサーマルヘッド用
基板の製造方法において、 前記凸条はその幅をＷとし、その高さをＨとするとき ０．１ ＜ Ｗ／Ｈ ＜ １０ となるように形成され、前記熱処理は軟化したガラスの
粘度が１０5〜１０7ポイズになる温度で行われることを
特徴とするサーマルヘッド用基板の製造方法。1. A glass glaze layer (12) having a smooth surface is formed on one or both surfaces of a ceramic substrate (11), or on the entire surface or on a part thereof, and a glass glaze layer (12) is left on a part of the glass glaze layer (12). By removing the glaze layer, the remaining portion is formed into a ridge (13), and the glass glaze layer (1
2) a method of manufacturing a substrate for a thermal head in which the vicinity of the top of the ridge (13) is heat-treated at a temperature equal to or higher than the softening point of the glass into a curved surface, wherein the ridge has a width W, When the height is H, the thermal treatment is performed so that 0.1 <W / H <10, and the heat treatment is performed at a temperature at which the viscosity of the softened glass becomes 10 5 to 10 7 poise. A method for manufacturing a head substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22069592A JP3123824B2 (en) | 1992-07-28 | 1992-07-28 | Method for manufacturing substrate for thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22069592A JP3123824B2 (en) | 1992-07-28 | 1992-07-28 | Method for manufacturing substrate for thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0647939A JPH0647939A (en) | 1994-02-22 |
| JP3123824B2 true JP3123824B2 (en) | 2001-01-15 |
Family
ID=16755047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22069592A Expired - Lifetime JP3123824B2 (en) | 1992-07-28 | 1992-07-28 | Method for manufacturing substrate for thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3123824B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5125620B2 (en) | 2007-03-27 | 2013-01-23 | セイコーエプソン株式会社 | Thermal head and printer |
-
1992
- 1992-07-28 JP JP22069592A patent/JP3123824B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0647939A (en) | 1994-02-22 |
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