CN1746034A - Thermal sensitive head and manufacture thereof - Google Patents
Thermal sensitive head and manufacture thereof Download PDFInfo
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- CN1746034A CN1746034A CN 200510099866 CN200510099866A CN1746034A CN 1746034 A CN1746034 A CN 1746034A CN 200510099866 CN200510099866 CN 200510099866 CN 200510099866 A CN200510099866 A CN 200510099866A CN 1746034 A CN1746034 A CN 1746034A
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Abstract
The present invention provides a thermal head and its manufacturing method enabling reduction in size of the head without increasing electrode resistance and free from a print flaw. The thermal head is equipped with two or more resistor strips arranged with specified spaces, two or more insulating barrier layers for covering part of each resistor strip and defining heating resistors generating heat by energization and a plurality of connection conductors electrically connecting the ends of a pair of the resistor strips, and the connecting conductors comprises a pair of parallel conductor sections extended on the ends of the two adjoining conductors and an insulating barrier layer and a connecting conductor section for connecting the two parallel conductor sections at least at the edge of the heating resistor side.
Description
Technical field
The present invention relates to be installed in thermal head and manufacture method thereof on the heat transfer write type printer for example.
Background technology
Thermal head has on the good substrate of thermal diffusivity: the recuperation layer of being made by the contour heat-barrier material of for example glass, a plurality of heating resistors of heating power, the public electrode that is connected with the common conducting of all heating resistors, a plurality of absolute electrodes that are connected with each heating resistor conducting respectively, print action by being crimped on colour band or the print media (heat-sensitive paper) by the heating resistor of public electrode and absolute electrode heating.Thermal head in the past makes substrate itself become convex shape or form convex shape with recuperation layer on smooth substrate in order to improve printing quality mostly, print media is applied the type of the convex substrate of contact stress when printing.And, public electrode and absolute electrode generally are connected to the two ends of the resistance length direction of heating resistor, be configured to and the length direction of this resistance shape in alignment, but for the size that can dwindle substrate and the end that heating resistor can be configured in substrate, also proposition has the scheme (with reference to patent documentation) of the structure of folding public electrode.
Figure 16 represents the thermal head of foldable structure in the past, (a) is cutaway view, (b) is vertical view (having removed protective layer).In foldable structure, 2 heating resistor 105a, 105b being connected with each other by conductor 111 1 ends that are folded into the U font constitute a print point D, the other end of a heating resistor 105a is connecting absolute electrode 107, and the other end of another heating resistor 105b is connecting public electrode 108.Each public electrode 108 is connected with the common line 109 that extends abreast along the orientation of print point D, from the two ends power supply of the length direction of common line 109.This thermal head shown in Figure 16 can form by for example following operation.
At first, preparation has the substrate 202 of the recuperation layer 103 of part shape for lugs.Then on whole of recuperation layer 103, form resistive layer 104 and Al conductor layer C, remove the part of Al conductor layer C and resistive layer 104 then, stay Al conductor layer C and resistive layer 104 that shape is roughly folded conductors, absolute electrode, public electrode and the common line that should form.In order to reduce electrode resistance (suppressing the electrode resistance that the thermal head miniaturization causes increases), the thickness formation of Al conductor layer C about with 1 μ m.Then, remove the Al conductor layer C on the shape for lugs of being positioned at of recuperation layer 103, form the opening portion α that allows the part on surface of resistive layer 104 expose.The zone is exposed respectively as heating resistor 105 in the surface of resistive layer 104.Al conductor layer C connect by this opening portion α and conducting adjacent a pair of heating resistor 105 (105a, 105b) a distolateral U font folded conductors 111 with separate with another distolateral continuous absolute electrode 107 and public electrode 108 in identical direction with a pair of heating resistor 105a, 105b.Public electrode 108 and common line 109 form as one.After having formed opening portion α, form the wear-resistant protective layer 110 that covers folded conductors 111, absolute electrode 107, public electrode 108 and common line 109.Because the thickness of Al conductor layer C is about 1 μ m; therefore at the two ends of opening portion α; the intersection that is heating resistor 105 and folded conductors 111 and absolute electrode 107 and public electrode 108 produces step, and this step also occurs as stage portion 110a on the surface of wear-resistant protective layer 110.If because near heating resistor 105, have step then the contacting efficiency of heating resistor 105 and print media with regard to variation, so stage portion 110a of attrition process wear-resistant protective layer 110 makes the face that contacts with print media smooth.Obtain the thermal head of Figure 16 thus.
In structure in the past, between folded conductors 111 (Al conductor layer C) and the recuperation layer 103 that exposes from the zone that this folded conductors 111 surrounds, promptly the recess area of folded conductors 111 produces the degree of depth and reaches the above bag γ of 1 μ m.Be formed with on the wear-resistant protective layer 110 and the corresponding bag of this bag γ shape recess.Bag shape recess is the recess of print media feeding direction sealing.Therefore find; in order to make face with the print media crimping smooth and lapping rejects when grinding the step 110a of wear-resistant protective layer 110 enters the bag shape recess of wear-resistant protective layer 110; it is medium perhaps to bring the dust at the print media or the colour band back side into this bag shape recess, produces the print defective during printing.For fear of this phenomenon; can consider bag shape recess of when grinding the step 110a of wear-resistant protective layer 110, pruning simultaneously; but because the step 110a of wear-resistant protective layer 110 is positioned on the shape for lugs of recuperation layer 103, bag shape recess that therefore is difficult to prune can not be eliminated fully.And, though if make the Al conductor layer C attenuation that constitutes folded conductors 111 if reduce the thickness of Al conductor layer C, then increase resistance so that bag shape recess shoals.Particularly owing to promote the head miniaturization that electrode area is dwindled in recent years, so electrode resistance increases significantly, and the printing quality of thermal head is worsened.
No. 2588957 communique of [patent documentation 1] Japanese Patent Laid
No. 2731445 communiques of [patent documentation 2] Japanese Patent Laid
[patent documentation 3] Japanese patent laid-open 3-161361 communique
Summary of the invention
The present invention is exactly in view of the above problems, its objective is will obtain a kind ofly not increase electrode resistance and can realize the head miniaturization, can prevent the thermal head and the manufacture method thereof of print defective.
Technical scheme
The present invention recognizes that the recess that forms on the protective layer is that a bag shape recess (recesses of three direction bag shapes airtight, an only direction opening) and the direction of sending at print media are airtight; and be the easy main cause of being detained of lapping rejects that causes the print defective about the dark about 1 μ m of bag shape recess, therefore be conceived to make this bag shape recess not produce.
That is, the 1st scheme of thermal head of the present invention is for to have: with a plurality of resistor stripes of predetermined arranged spaced Cheng Liezhuan; Cover the part of each resistor stripe, a plurality of insulation barriers of heating resistor that separate provision is generated heat by energising; And conducting connects a plurality of connection conductors of the end of adjacent a pair of resistor stripe; It is characterized in that, be communicated with conductor and have: extend to the end of adjacent a pair of resistor stripe and the pair of parallel conductor part on the insulation barrier and connect this bonding conductor part at least at the edge on heating resistor side the parallel conductor part.
If adopt this mode, owing to be communicated with the edge that the bonding conductor part of conductor is positioned at heating resistor at least, therefore can not produce print media and send into bag shape recess airtight on the direction, bag shape recess can transcription be formed into the surface of wear-resistant protective layer.Therefore, lapping rejects is not easy to be trapped in the surface of wear-resistant protective layer, can prevent the print defective that lapping rejects causes.And, overlayed on the insulation barrier owing to be communicated with the pair of parallel conductor part of conductor, therefore conducting positively connects into right heating resistor.
Be specially, preferably make a plurality of resistor stripes be linearity independently separately, the bonding conductor that is communicated with conductor partly covers the tip-clearance of adjacent a pair of resistor stripe and connects the pair of parallel conductor part.If adopt this mode, because resistor stripe do not have foldable structure, a distolateral conductor that is connected to a pair of resistor stripe and gap thereof of insulation barrier covers, so can not produce a bag shape recess between a pair of resistor stripe.Though between adjacent a pair of resistor stripe, produce the recess of linearity,,, also can not increase the concave depth that produces between the resistor stripe even therefore increase the thickness that is communicated with conductor in order to reduce electrode resistance owing to also be formed with the connection conductor on this recess.The concave depth that produces between a pair of resistor stripe and the thickness of resistor stripe are unanimous on the whole.Because the thickness of the resistor stripe of present situation is about 0.2 μ m, thus shallow to the negligible degree of depth with the corresponding transcription of recess between the resistor stripe to the concave depth on the wear-resistant protective layer.
As other mode, can make a plurality of resistor stripes is to possess the pair of straight line resistance bar separately and the rugosity of the connection strap of an end that is connected this pair of straight line resistance bar; Insulation barrier covers an end separately of pair of straight line resistance bar and stipulates each heating resistor to the part of connection strap; Thereby the pair of parallel conductor part that is communicated with conductor covers connection strap and is overlayed on the insulation barrier, is connected with the connecting conductor branch on this connection strap and insulation barrier at least.If adopt this mode and since be communicated with conductor not with the contacts side surfaces of pair of straight line resistance bar, can prevent leakage current by this connection conductor, the resistance value that can suppress heating resistor is unbalanced.Above-mentioned connection strap be insulated zone that the barrier layer covers at the length dimension on the direction vertical with the orientation of resistor stripe below 5 μ m.If within this scope, the zone that the barrier layer covers that is insulated of pair of straight line resistance bar has the function of independently actual heating portion respectively, promptly uses this connection strap to connect pair of straight line resistance bar and also can obtain print result identical when pair of straight line resistance bar is set separately.
As other a mode again, also can make a plurality of resistor stripes be linearity independently separately, the bonding conductor part that is communicated with conductor is not connected the pair of parallel conductor part contiguously with insulation barrier.If adopt this mode and since be communicated with conductor not with the contacts side surfaces of pair of straight line resistance bar, can prevent leakage current by this connection conductor, the resistance value that can suppress heating resistor is unbalanced.The bonding conductor part of above-mentioned connection conductor and the distance between the insulation barrier preferably are set in below the 5 μ m at interval.If within this scope; even be formed on the recess airtight on the direction of sending into of print media by bonding conductor part that is communicated with conductor and pair of straight line resistance bar; this recess also can be removed when the attrition process wear-resistant protective layer; therefore lapping rejects can not be trapped in the surface of wear-resistant protective layer, can not produce the print defective.
The 2nd scheme of thermal head of the present invention has a plurality of resistor stripes with predetermined arranged spaced Cheng Liezhuan, cover the part of each resistor stripe, a plurality of insulation barriers of heating resistor that separate provision is generated heat by energising, conducting connects a plurality of connection conductors of the end of adjacent a pair of resistor stripe; It is characterized in that, resistor stripe is a linearity, is communicated with conductor and has end and the pair of parallel conductor part on the insulation barrier that extends to adjacent a pair of resistor stripe and this bonding conductor part to the parallel conductor part of the tip-clearance that covers adjacent a pair of resistor stripe ground connection.
The 3rd scheme of thermal head of the present invention has: with a plurality of resistor stripes of predetermined arranged spaced Cheng Liezhuan; Cover the part of each resistor stripe, a plurality of insulation barriers of heating resistor that separate provision is generated heat by energising; And conducting connects a plurality of connection conductors of the end of adjacent a pair of resistor stripe; It is characterized in that resistor stripe is to possess pair of straight line resistance bar separately and be connected this rugosity to the connection strap of an end of straight line resistor stripe; Thereby insulation barrier covers an end separately of pair of straight line resistance bar and stipulates each heating resistor to the part of connection strap; Being communicated with conductor has the end that extends to adjacent a pair of resistor stripe and the pair of parallel conductor part on the insulation barrier and is connected this to parallel conductor bonding conductor part partly on connection strap and insulation barrier.Connection strap be insulated zone that the barrier layer covers at the length dimension on the direction vertical with the orientation of resistor stripe preferably below 5 μ m.
In the present invention of above-mentioned the 1st～the 3rd scheme, can make to be communicated with being shaped as of conductor: the length dimension on the direction vertical with the orientation of resistor stripe is at the pair of parallel conductor portion office ratio plane U font big in the connecting conductor office; Or with the vertical direction of the orientation of resistor stripe on length dimension at connecting conductor office and the planar I font that equates in pair of parallel conductor portion office.
The 4th scheme of thermal head of the present invention has: with a plurality of resistor stripes of predetermined arranged spaced Cheng Liezhuan; Cover the part of each resistor stripe, a plurality of insulation barriers of heating resistor that separate provision is generated heat by energising; And conducting connects a plurality of connection conductors of the end of adjacent a pair of resistor stripe; It is characterized in that, be communicated with conductor and have end and the pair of parallel conductor part on the insulation barrier that extends to adjacent a pair of resistor stripe and be not connected this bonding conductor part contiguously the parallel conductor part with insulation barrier.
Be communicated with that the bonding conductor part of conductor is preferred not to be connected the pair of parallel conductor part contiguously with insulation barrier and adjacent a pair of resistor stripe.Perhaps the edge of preferred heating resistor one side is positioned at the end of adjacent a pair of resistor stripe.If adopt these modes, can prevent that the resistance value that can suppress heating resistor is unbalanced by being communicated with the leakage current of conductor.
Being communicated with the bonding conductor part of conductor and the distance between the insulation barrier preferably is predefined in below the 5 μ m at interval.
The shape of above-mentioned connection conductor is specifically as follows plane H font.
In the thermal head of above-mentioned the 1st～the 4th mode, the length dimension that preferably is communicated with the vertical direction of conductor and orientation resistor stripe is bigger than the width dimensions on the direction parallel with this orientation.If adopt this mode, can improve the heat dissipation characteristics that is communicated with conductor, can make the separately more clear of print point.And, being generally a plurality of resistor stripes and being formed on the recuperation layer with shape for lugs, each heating resistor is formed on the shape for lugs of this recuperation layer.
The 1st mode of manufacture method of the present invention is characterised in that, comprises following operation: the operation that forms resistive layer on whole of recuperation layer; The operation of the insulation barrier of the plane sizes of the heating resistor that the formation regulation should form on this resistive layer; Remove the part of insulation barrier and resistive layer, a plurality of resistor stripes of row shape are lined up at predetermined interval and by the operation that is insulated a plurality of heating resistors that zone that the barrier layer covers constitutes of each resistor stripe thereby obtain to separate; On resistor stripe, insulation barrier and recuperation layer whole, form the operation of conductor layer; And, remove the part of conductor layer, thereby form the opening portion allow insulation barrier expose, connection conductor that conducting connects a pair of heating resistor that forms on the adjacent a pair of resistor stripe simultaneously, make the absolute electrode that a pair of heating resistor switches on and the operation of public electrode by this connections conductor; Resistor stripe forms linearity; Conductor covers adjacent a pair of resistor stripe and the gap is overlayed on the insulation barrier thereby be communicated with.
More specifically be to be communicated with conductor preferably to have end and the pair of parallel conductor part on the insulation barrier that extends to adjacent a pair of resistor stripe and to cover connecting this with gap the graphics shape of the bonding conductor part of parallel conductor part being formed of adjacent a pair of resistor stripe end.
The 2nd mode of manufacture method of the present invention is characterised in that, comprises following operation: the operation that forms resistive layer on whole of recuperation layer; The operation of the insulation barrier of the plane sizes of the heating resistor that the formation regulation should form on this resistive layer; Remove the part of insulation barrier and resistive layer, a plurality of resistor stripes of row shape are lined up at predetermined interval and by the operation that is insulated a plurality of heating resistors that zone that the barrier layer covers constitutes of this resistor stripe thereby obtain to separate; On resistor stripe, insulation barrier and recuperation layer whole, form the operation of conductor layer; And, remove the part of conductor layer, thereby form the opening portion allow insulation barrier expose, connection conductor that conducting connects an end of adjacent a pair of resistor stripe simultaneously, the absolute electrode of heating resistor being switched on by this connections conductor and the operation of public electrode; The resistive element figure with have separately pair of straight line resistance bar be connected this rugosity of the connection strap of an end of straight line resistor stripe formed; Insulation barrier covers the partially formation of an end separately of pair of straight line resistance bar to connection strap; Thereby the connection conductor covers the connection strap that exposes and is overlayed on the insulation barrier.
More specifically be to be communicated with conductor and preferably the graphics shape of the bonding conductor part of parallel conductor part to be formed to have the pair of parallel conductor part that extends on connection strap and the insulation barrier and on connection strap and insulation barrier, to connect this.And the insulation barrier that insulation barrier is stayed on the connection strap preferably defines below 5 μ m at the length dimension of the direction vertical with the orientation of the resistor stripe end from pair of straight line resistance bar.
The 3rd mode of manufacture method of the present invention is characterised in that, comprises following operation: the operation that forms resistive layer on whole of recuperation layer; The operation of the insulation barrier of the plane sizes of the heating resistor that the formation regulation should form on this resistive layer; Remove the part of insulation barrier and resistive layer, a plurality of resistor stripes of row shape are lined up at predetermined interval and by the operation that is insulated a plurality of heating resistors that zone that the barrier layer covers constitutes of this resistor stripe thereby obtain to separate; On resistor stripe, insulation barrier and recuperation layer whole, form the operation of conductor layer; And, remove the part of conductor layer, thereby form the opening portion allow insulation barrier expose, connection conductor that conducting connects an end of adjacent a pair of resistor stripe simultaneously, the absolute electrode of a pair of heating resistor being switched on by this connections conductor and the operation of public electrode; Resistor stripe forms linearity; Be communicated with conductor and the graphics shape of the bonding conductor part of parallel conductor part formed, and make the edge of heating resistor one side of bonding conductor part not contact, be positioned at insulation barrier on the end of adjacent a pair of resistor stripe to have end and the pair of parallel conductor part on the insulation barrier that extends to adjacent a pair of resistor stripe and to connect this.
Be specially, be communicated with the bonding conductor part of conductor and the distance between the insulation barrier and preferably define below 5 μ m at interval.
In the manufacture method of above-mentioned the 1st～the 3rd mode, preferably make the length dimension on the vertical direction of all or part of edge and the orientation of straight line resistor stripe that be communicated with conductor form greatlyyer than the width dimensions on the direction parallel with this orientation.
The effect of invention:, can obtain a kind ofly not increase electrode resistance and can realize head miniaturization, the thermal head that can prevent the print defective and manufacture method thereof if adopt the present invention.
Brief description of drawings
Fig. 1 is the vertical view of the thermal head (remove and hold protective layer) of expression the 1st embodiment of the present invention.
Fig. 2 (a) is the cutaway view of the absolute electrode side of the above-mentioned thermal head of expression, (b) for representing the cutaway view of public electrode side
Fig. 3 is an operation of the manufacture method of the above-mentioned thermal head of expression, (a) is cutaway view, (b) is vertical view
Fig. 4 is the next operation of expression operation shown in Figure 3, (a) is cutaway view, (b) is vertical view.
Fig. 5 is the next operation of expression operation shown in Figure 4, (a) is cutaway view, (b) is vertical view.
Fig. 6 is the next operation of expression operation shown in Figure 5, (a) is cutaway view, (b) is vertical view.
Fig. 7 is the next operation of expression operation shown in Figure 6, (a) is cutaway view, (b) is vertical view.
Fig. 8 is the vertical view of the thermal head of expression the 2nd embodiment of the present invention.
Fig. 9 is the vertical view of the thermal head of expression the 3rd embodiment of the present invention.
Figure 10 is the vertical view of the thermal head of expression the 4th embodiment of the present invention.
Figure 11 is respectively along (A) A-A line of Figure 10, (B) B-B line, (C) cutaway view of C-C line.
Figure 12 is the vertical view of the thermal head of expression the 5th embodiment of the present invention.
Figure 13 is respectively along (A) A-A line of Figure 12, (B) B-B line, (C) cutaway view of C-C line.
Figure 14 is the vertical view of the bonding conductor part of expression and the 5th embodiment different modes.
Figure 15 is the vertical view of the bonding conductor part of expression and the another different modes of the 5th embodiment.
Figure 16 represents the foldable structure thermal head of prior art, (a) is cutaway view, (b) is vertical view.
The specific embodiment
Fig. 1～Fig. 7 represents the thermal head of the 1st embodiment of the present invention.Fig. 1 is the vertical view of the thermal head 1 (removing the state of protective layer) of the 1st embodiment, and Fig. 2 is the cutaway view of this thermal head 1.Thermal head 1 possesses a plurality of print point D that separate predetermined arranged spaced Cheng Liezhuan along the above-below direction of Fig. 1, by the heat of each print point D being paid heat-sensitive paper or colour band prints action.
The recuperation layer 3 usefulness for example heat-barrier material of glass and so on form, and have the convex shaped part 3a and the 3b of homogeneous film thickness portion continuous with this convex shaped part 3a, uniform film thickness of the convex of forming at an end of substrate 2.A plurality of heating resistors 5 are positioned at the presumptive area of the vertex position O on the convex shaped part 3a that comprises recuperation layer 3, pass through heating power.The plane sizes of each heating resistor 5 (length dimension L, width dimensions W), promptly the resistance of each heating resistor 5 is by each insulation barrier 6 regulation.Insulation barrier 6 usefulness are SiO for example
2, insulating materials such as SiON, SiAlON form.
A plurality of straight line resistor stripes 4 do not have foldable structure for the above-below direction along Fig. 1 separates the linearity resistor stripe that small interval (gap area β) forms separately between the adjacent bar.Exposing among the gap area β has recuperation layer 3.In each straight line resistor stripe 4, the two side areas of the length direction of a pair of heating resistor 5a, 5b is respectively terminal join domain 4A and electrode join domain 4B, 4C.
Be communicated with one distolateral (right side of Fig. 1 and Fig. 2) that conductor 11 forms a pair of heating resistor 5a, the 5b that connect and compose each print point D point-blank, be terminal join domain 4A rectangular-shaped of adjacent pair of straight line resistance bar 4, cover each terminal join domain 4A and gap thereof (gap area β).This connection conductor 11 is overlayed on one distolateral (right side of Fig. 1 and Fig. 2) of insulation barrier 6, makes a pair of heating resistor 5a, 5b conducting positively.Be communicated with form on the surface of conductor 11 and adjacent pair of straight line resistance bar 4 between the corresponding recess of step (straight line resistor stripe 4 and be exposed to step between the recuperation layer 3 of gap area β), but the depth of this recess can be ignored with respect to the thickness of straight line resistor stripe 4.This is communicated with the terminal join domain 4A that conductor 11 covers adjacent pair of straight line resistance bar 4, the zone that extends on the insulation barrier 6 constitutes the pair of parallel conductor part, and the zone that the gap of landfill terminal join domain 4A extends on the insulation barrier 6 constitutes the bonding conductor part.
Each absolute electrode 7 is formed on the electrode join domain 4B of straight line resistor stripe 4 of the other end that is present in a heating resistor 5a, the end of the opposite side of a side that is connected with heating resistor 5a with link to each other with driver element 13 that substrate 2 separates.Driver element 13 has a plurality of battery lead plates of wire-bonded on each absolute electrode 7, switch by this battery lead plate and give a plurality of switch elements (drive IC) of corresponding absolute electrode 7 energising/non-energisings and a plurality of external connection terminals etc.In addition, Fig. 1 is for representing the figure of the structure of thermal head 1 briefly, and in fact the line 14 that connects the electrode pad of absolute electrode 7 and driver element 13 is provided with interval very small about about 50 μ m.
Each public electrode 8 is formed on the electrode join domain 4C of straight line resistor stripe 4 of the opposite side that is present in another heating resistor 5b, is connected jointly with common line 9 in the end of the opposition side of a side that links to each other with this heating resistor 5b.Common line 9 extends along the orientation lengthwise of print point D, and a pair of supply terminals 9a at the two ends by being arranged on this length direction (above-below direction of Fig. 1) obtains electric energy from power supply 12.Power supply 12 was arranged with substrate in 2 minutes.The electric power that provides from common line 9 offers all print point D by each public electrode 8.
Wear-resistant protective layer 10 is by for example SiAlON or Ta
2O
5The uniform wearability material forms, the friction that the conductor layer of protection insulation barrier 6 and connection conductor 11 or absolute electrode 7, public electrode 8 etc. produces when avoiding the thermal head action.Because the thickness of wear-resistant protective layer 10 is certain, therefore the concaveconvex shape transcription of substrate surface is arrived the surface of wear-resistant protective layer 10.To be specially, the level and smooth step 10a that carried out attrition process in order well contacting with print media to be set in the top position of insulation barrier 6.Though between pair of straight line resistance bar 4 (terminal join domain 4A), also produce step; but because the thickness of this step and straight line resistor stripe 4 is unanimous on the whole; be about 0.2 μ m, very shallow, shallow to for negligible degree transcription is to wear-resistant protective layer 10.In addition, Fig. 1 has omitted wear-resistant protective layer 10.
The manufacture method of thermal head illustrated in figures 1 and 21 is described below with reference to Fig. 3～Fig. 7.In Fig. 3～Fig. 7, (a) be the cutaway view of manufacturing process of expression thermal head 1, (b) be the expression and (a) vertical view of same processes.
At first, prepare on the surface of substrate, to have the substrate 2 of recuperation layer 3.The end that recuperation layer 3 has at substrate forms the convex shaped part 3a of shape for lugs and the 3b of homogeneous film thickness portion that forms continuously with uniform thickness and this convex shaped part 3a.
Then, in same vacuum on whole of recuperation layer 3 continuous film forming resistive layer 4 ' and insulation barrier 6, implement annealing in process then.Annealing in process for apply in advance big thermic load make resistive layer 4 ' the stable acceleration of resistance handle.Resistive layer 4 ' form thickness about about 0.2 μ m with the pottery alloy material that contains of Ta-Si-O, the TaSiONb of easy high resistanceization, refractory metals such as Ti-Si-O, Cr-Si-O.Insulation barrier 6 usefulness for example insulating materials such as SiO2, SiON, SiAlON form.
After annealing in process, the resist layer of the length dimension L of definite heating resistor that should form forms on insulation barrier 6, with the part that is not covered by resist layer that for example RIE (reactive ion etching) removes insulation barrier 6, removes resist layer again.Thus, insulation barrier 6 only remains in the presumptive area of the vertex position O of the convex shaped part 3a that comprises recuperation layer 3 as shown in Figure 3.
Then, picture is removed resistive layer 4 ' and the part of insulation barrier 6 with dry etching for example as shown in Figure 4, forms many straight line resistor stripes 4 lining up the row shape and as a plurality of heating resistors 5 that barrier layer 6 covers that are insulated of the part of each straight line resistor stripe 4.A pair of heating resistor 5a, the 5b that forms on the adjacent straight line resistor stripe 4 constitutes a print point D.In this operation, between each straight line resistor stripe 4, form gap area β, limit the width dimensions W of each straight line resistor stripe 4 and insulation barrier 6 (heating resistor 5) by gap area β.Recuperation layer 3 exposes in gap area β.The height of the step between the adjacent pair of straight line resistance bar 4 (step between straight line resistor stripe 4 and the recuperation layer 3 that in gap area β, exposes) for the thickness of straight line resistor stripe 4 about 0.2 μ m unanimous on the whole about.Wherein, the side at a distolateral weak point that exposes of insulation barrier 6 of each straight line resistor stripe 4 is terminal join domain 4A, is electrode join domain 4B, 4C a side of another distolateral length of exposing.
Then, as shown in Figure 5, on the whole surface of substrate, form the film of Al conductor layer C.Thus, straight line resistor stripe 4 (terminal join domain 4A, electrode join domain 4B, 4C), insulation barrier 6 and gap area β are all covered by Al conductor layer C.The film thickness of Al conductor layer C is very big in order to reduce electrode resistance, is about about 1 μ m in the present embodiment.Though form conductive layer with Al in the present embodiment, this conductive layer forms and is communicated with conductor part and common conductor, also can use conductive materials such as Cr, Cu, W to replace Al.
Then, remove the part of Al conductor layer as shown in Figure 6 with RIE, form the opening portion α that allows insulation barrier 6 expose simultaneously, conducting connects a pair of heating resistor 5a that forms on the adjacent straight line resistor stripe 4, the connection conductor 11 of 5b, makes absolute electrode 7, public electrode 8 and the common line 9 of above-mentioned a pair of heating resistor 5a, 5b energising by this connection conductor 11.At this moment, be communicated with conductor 11 and cover terminal join domain 4A and gap (the gap area β between the terminal join domain 4A) thereof of adjacent straight line resistor stripe 4, and overlayed on the distolateral and form of insulation barrier 6.In other words, by the terminal join domain 4A that covers adjacent pair of straight line resistance bar 4 and extend to pair of parallel conductor part on the insulation barrier 6 and the gap of landfill terminal join domain 4A and extend on the insulation barrier 6, the connecting conductor that is connected the pair of parallel conductor part divides and forms connection conductor 11.If adopt this covered structure,, also can connect a pair of heating resistor 5a, 5b by being communicated with conductor 11 conducting positively even because of etching produces some unevennesses.And absolute electrode 7 is formed on the electrode join domain 4B of a straight line resistor stripe 4 (heating resistor 5a one side), and public electrode 8 is formed on the electrode join domain 4C of another straight line resistor stripe 4 (heating resistor 5b one side).Common line 9 is formed on the recuperation layer 3 with public electrode 8 along the orientation lengthwise extension of straight line resistor stripe 4.
Then; in order to improve the close property with the wear-resistant protective layer that forms; make insulation barrier 6 with contrary sputter etc., be communicated with conductor 11, absolute electrode 7, public electrode 8, common line 9 and after the new face of the recuperation layer 3 (gap area β) that exposes exposes, form as shown in Figure 7 and cover insulation barrier 6, be communicated with conductor 11, the absolute electrode 7 of removing an end that is connected with driver element 13, public electrode 8, common line 9 and the wear-resistant protective layer 10 of the recuperation layer 3 that exposes.Wear-resistant protective layer 10 usefulness are SiAlON or Ta for example
2O
5The uniform wearability material forms the thickness about about 5 μ m.Comprise above-mentioned insulation barrier 6 or be communicated with conductor 11 etc. substrate surface the concaveconvex shape former state copy to the surface of wear-resistant protective layer 10.Be specially, form in the top position of insulation barrier 6 and the corresponding step 10a of the step at α two ends, opening portion (insulation barrier 6 be communicated with step, insulation barrier 6 and absolute electrode 7 between the conductor 11 and the step between the public electrode 8).The degree of depth of step 10a and absolute electrode 7, public electrode 8 and be communicated with the thickness basically identical of conductor 11 are about about 1 μ m.
Then, the vertical plane of the step 10a of attrition process wear-resistant protective layer 10 makes this step 10a arrive the upper surface of wear-resistant protective layer 10 lentamente continuously up to abrasive wire Po shown in Figure 7, makes wear-resistant protective layer 10 good with contacting of print media.
Can obtain thermal head illustrated in figures 1 and 21 by above operation.
If adopt above-mentioned present embodiment, because a plurality of straight line resistor stripes 4 and connection conductor 11 be not for there being the linearity of foldable structure, line up many straight line resistor stripes 4 of row shape ground formation with small interval after, form and cover the adjacent pair of straight line resistance bar 4 and the connection conductor 11 of gap (gap area β) thereof, so this is not to producing a bag shape depression between the straight line resistor stripe 4.Though between adjacent pair of straight line resistance bar 4, produce the recess of linearity, but be communicated with conductor 11 owing on this recess, also be formed with, even therefore in order to suppress electrode increases and further increase Al conductor layer C (connection conductor 11) with equipment miniaturization thickness, this concave depth can not increase yet.The thickness basically identical of this concave depth and straight line resistor stripe 4 is about 0.2 μ m, and is very shallow, also can ignore even copy on the wear-resistant protective layer 10.That is, the abrasive dust that produces in the time of needn't worrying the step 10a of attrition process wear-resistant protective layer 10 remains in the surface of wear-resistant protective layer 10, can prevent that this lapping rejects from causing the print defective.And, if employing present embodiment, cover on the insulation barrier 6 owing to be communicated with conductor 11,, also can be communicated with conductor 11 a pair of heating resistor 5a, 5b conducting are connected by this even therefore when forming connection conductor 11, produce unevenness because of etching.
Fig. 8 and Fig. 9 represent that adopt pair of straight line resistance bar between the same with above-mentioned the 1st embodiment do not produce bag structure of shape recess, and more can improve the 2nd embodiment of the present invention and the 3rd embodiment of the heat dissipation characteristics of bonding conductor part than the 1st embodiment.The 2nd embodiment and the 3rd embodiment possess the different connection conductor 21,31 of connection conductor 11 of shape and the 1st embodiment respectively, but other are identical with the 1st embodiment except that the shape that is communicated with conductor.In Fig. 8 and Fig. 9, the Reference numeral that the inscape interpolation identical with the 1st embodiment and Fig. 1 are identical with Fig. 2.
Fig. 8 is the vertical view of the structure of the thermal head 20 of expression the 2nd embodiment.The connection conductor 21 that possesses in the thermal head 20 forms, and the length dimension Lc vertical with the orientation of a plurality of straight line resistor stripes 4 is bigger than the width dimensions Wc parallel with this orientation, and area is also big than the connection conductor 11 in the 1st embodiment.The terminal join domain 4A of the adjacent pair of straight line resistance of the covering of this connection conductor 21 bar 4 and the zone that extends on the insulation barrier 6 constitute the pair of parallel conductor part, and the gap of landfill terminal join domain 4A and the zone that extends on the insulation barrier 6 constitute the bonding conductor part.If be provided with like this along its length with extending and be communicated with conductor 21, then a pair of heating resistor 5a, 5b (print point D) go up the heat that produces and are dispersed into easily from this heating resistor 5a, 5b place far away by being communicated with conductor 21, have improved the heat dissipation characteristics that is communicated with conductor 21.Thus, heat can not be trapped near a pair of heating resistor 5a, the 5b, and the shape of each point becomes clear.Be communicated with conductor 21 and cover adjacent straight line resistor stripe 4 and gap (gap area β) thereof to be overlayed on the insulation barrier 6 this point identical with the connection conductor 11 of the 1st embodiment, do not produce a bag shape recess between the pair of straight line resistance bar 4, can prevent the print defective.
Fig. 9 is the vertical view of the structure of the thermal head 30 of expression the 3rd embodiment.The connection conductor 31 that possesses in the thermal head 30 possesses: extend to the end of adjacent pair of straight line resistance bar 4 and the pair of parallel conductor part 31A on the insulation barrier 6, the gap that covers adjacent pair of straight line resistance bar 4 connects this bonding conductor part 31B to parallel conductor part 31A, the opening portion 31C between parallel conductor part 31A that these are paired and the bonding conductor part 31B (gap area β).Pair of parallel conductor part 31A is respectively with the width dimensions formation unanimous on the whole with the width dimensions W of straight line resistor stripe 4.Bonding conductor part 31B is with length dimension La formation for example unanimous on the whole with the length dimension L of heating resistor 5a, 5b, so that opening portion 31C is arranged on a pair of heating resistor 5a, 5b position enough far away.If adopt this connection conductor 31, can not prevent the print defective because of bonding conductor part 31B produces bag shape recess between pair of straight line resistance bar 4.And, because a pair of heating resistor 5a, 5b (print point D) go up the heat that produces and are dispersed into the outside that comprises opening portion 31C by the pair of parallel conductor part 31A that is communicated with conductor 31, therefore heat can not be trapped in this on parallel conductor part 31A and the bonding conductor part 31B, has improved the heat dissipation characteristics that is communicated with conductor 31.Particularly, pair of parallel conductor part 31A is arranged owing to dividing, so the heat distribution among each heating resistor 5a, 5b, promptly putting shape can be not smudgy, can prevent the reduction of resolution ratio.
Though it is the straight line resistor stripe 4 of the resistor stripe of heating resistor 5 as linearity that the zone that is insulated barrier layer 6 coverings is set in above-mentioned the 1st～the 3rd embodiment, but resistor stripe also makes at least near heating resistor 5, is linearity near the heating resistor 5 of promptly all terminal join domain 4A and electrode join domain 4B, 4C.
Figure 10～Figure 13 is the figure of explanation the 4th embodiment of the present invention and the 5th embodiment.Above-mentioned the 1st～the 3rd embodiment is formed by the gap (gap area β) that covers adjacent pair of straight line resistance bar 4 owing to being communicated with conductor 11,21,31, therefore the contacts side surfaces that is communicated with conductor 11,21,31 and straight line resistor stripe 4 produces leakage current, and this leakage current has the unbalanced possibility of the resistance that makes heating resistor 5.The 4th embodiment that will illustrate below and the 5th embodiment reach the embodiment that prevents to produce from the connection conductor leakage current for not produce a bag shape recess between adjacent pair of straight line resistance bar.In Figure 10～Figure 13, the Reference numeral that the inscape interpolation identical with the 1st embodiment and Fig. 1 are identical with Fig. 2.
Figure 10 and Figure 11 are the vertical view and the cutaway view of the structure of the thermal head 40 of expression the 4th embodiment.Thermal head 40 possesses folding resistor stripe 44, heating resistor 45, insulation barrier 46 and is communicated with straight line resistor stripe 4, a pair of heating resistor 5a, 5b, insulation barrier 6 and the connection conductor 11 that conductor 41 replaces Fig. 1, and inscape in addition is identical with the 1st embodiment.
The folding resistor stripe 44 of each that has on the recuperation layer 3 is made of pair of straight line resistance bar 44a that separates and the connection strap 44b that connects the end of this pair of straight line resistance bar 44a respectively, separates a plurality of row shapes that are configured in predetermined interval.Connection strap 44b linearly connects the rectangle of the end of pair of straight line resistance bar 44a, and its length dimension L44b is about 10～20 μ m.Though this connection strap 44b is formed with recess at the end of pair of straight line resistance bar 44a, the thickness of this concave depth and straight line resistor stripe 4 is unanimous on the whole, and about 0.2 μ m is very shallow, also can ignore even copy on the wear-resistant protective layer 10.
The zone that barrier layer 46 covers that is insulated that heating resistor 45 has by connection strap 44b constitutes, is connected the link 45A that is communicated with on the conductor 41, and constitutes, is connected to a pair of actual heating 45B of portion, 45C on absolute electrode 7 and the public electrode 8 by the end of pair of straight line resistance bar 44a.Wherein, the length dimension L45A of link 45A is set in below the 5 μ m.When heating resistor 45 is energized by being communicated with conductor 41, absolute electrode 7 and public electrode 8, a pair of actual heating 45b of portion, 45C heating.At this moment, though link 45A (connection strap 44b) also generates heat, the area of link 45A is compared very small with the actual heating 45b of portion, 45C, and temperature rises also few, can ignore.That is,, a pair of actual heating 45b of portion, 45C can not influence the print result, identical print result in the time of can obtaining the actual heating 45B of portion, 45C to be set with respectively independent (not linking) even connecting by the small link 45A of area yet.The heat that thermal head 40 uses a pair of actual heating 45b of portion, 45C to produce is carried out the print action.
Be communicated with conductor 41 and have a pair of end that extends to adjacent pair of straight line resistance bar 44a and the parallel conductor part 41A on the insulation barrier 46 and be connected this bonding conductor part 41B to parallel conductor part 41A on connection strap 44b and insulation barrier 46, it is shaped as the big plane U word shape of the vertical length dimension of the orientation with straight line resistor stripe 44a of pair of parallel conductor part 41A than bonding conductor part 41B.Pair of parallel conductor part 41A forms with the width dimensions W width dimensions about equally with straight line resistor stripe 44a respectively.Bonding conductor part 41B connects the rectangular shape at edge of heating resistor one side of pair of parallel conductor part 41A linearlyly, extends on connection strap 44b and the insulation barrier 46 from the recuperation layer 3 to form always.Though at this region generating degree of depth recess unanimous on the whole that parallel conductor part 41A and bonding conductor part 41B are surrounded with the thickness that is communicated with conductor 41; but because this recess is sent into the direction opening towards print media; therefore even copy on the wear-resistant protective layer 10, the lapping rejects that produces in the time of also needn't worrying to grind the step 10a of wear-resistant protective layer 10 remains in the surface of wear-resistant protective layer 10.
Be communicated with conductor 41 and guarantee that the conducting of the heating resistor 45 among bonding conductor part 41B and the connection strap 44b is connected, 44a does not contact with the straight line resistor stripe.If connection conductor 41 is not contacted with straight line resistor stripe 44a, as long as then make the paired actual heating 45b of portion, 45C by these connection conductor 41 short circuits, the resistance that just can suppress each heating resistor 45 (the actual heating 45b of portion, 45C) that leakage current causes is unbalanced.
The thermal head 40 of said structure by the following method the making method processed of the thermal head 1 of above-mentioned the 1st embodiment of Zao processed: Zai (Zhong of Fig. 3～Fig. 7) does not form Zhi line resistance bar 4 and replaces and forms the folded resistor stripe 44 of Zhe; Stay the lip-deep insulation barrier 46 from the end of adjacent pair of straight line resistance bar 44a to the part of connection strap 44b when Zai removes insulation barrier, and do not form and be communicated with conductor 11 and replace to form and have the end that extends to adjacent pair of straight line resistance bar 44a and the pair of parallel conductor part 41A on the insulation barrier 46 and the few Zai connection strap 44b of Zhi and are connected with insulation barrier and connect Zhe to the connection conductor 41 of the bonding conductor part 41B of parallel conductor part 41A.
Though the 4th embodiment possesses the connection conductor 41 of plane U font, but be communicated with the bonding conductor part 41B of conductor 41 as long as be formed on connection strap 44b and the insulation barrier 46 just passable at least, can not possess above-mentioned connection conductor 41 and possess the connection conductor that has formed the planar I word shape of bonding conductor part 41B with for example identical length dimension, the connection conductor of promptly identical rectangle with the 1st embodiment with pair of parallel conductor part 41A.
Figure 12 and Figure 13 are the vertical view and the cutaway view of the structure of the thermal head 50 of expression the 5th embodiment.Thermal head 50 does not possess the connection conductor 11 of the 1st embodiment and possesses the connection conductor 51 of plane H word shape.Inscape except that being communicated with conductor 41 is identical with the 1st embodiment.
Be communicated with conductor 51 have a pair of end (terminal join domain 4A) that extends to adjacent pair of straight line resistance bar 4 and the parallel conductor part 51A on the insulation barrier 6 and not with insulation barrier 6 with adjacent pair of straight line resistance bar 4 contacts, be connected this bonding conductor part 51B to parallel conductor part 51A.Pair of parallel conductor part 51A forms with the width dimensions slightly littler than the width dimensions W of straight line resistor stripe 4 respectively.Bonding conductor part 51B linearly connects the rectangular shape of pair of parallel conductor part 51A, is configured near the end with this pair of straight line resistance bar 4 that parallel conductor part 51A is linked to each other.Spacing distance d between this bonding conductor part 51B and the insulation barrier 6 wishes narrow as much as possible, is limited in the present embodiment below the 5 μ m.If in this scope; even then bonding conductor part 51B and pair of straight line resistance bar 4 form the recess that seals on the direction of sending into of print media; this recess also can be ground simultaneously when the step 10a of attrition process wear-resistant protective layer 10 and be removed; therefore lapping rejects can not be trapped on the wear-resistant protective layer 10, can not produce the print defective.And; though at bonding conductor part 51B and this region generating degree of depth recess unanimous on the whole that parallel conductor part 51A is surrounded with the thickness that is communicated with conductor 41; but because this recess is sent into the direction opening towards print media; therefore even copy on the wear-resistant protective layer 10, the lapping rejects in the time of also needn't worrying above-mentioned attrition process remains in the surface of wear-resistant protective layer 10.
And, be communicated with conductor 51 and guarantee to be connected with the conducting of a pair of heating resistor 5a, 5b respectively by pair of parallel conductor part 51A, do not exist in the gap of pair of straight line resistance bar 4 (gap area β).If be communicated with the gap that conductor 51 is not present in pair of straight line resistance bar 4 like this, then be communicated with conductor 51 not with this contacts side surfaces to straight line resistor stripe 4, can prevent leakage current.Thus, can suppress leakage current makes the resistance of heating resistor 5 unbalanced.
The thermal head 50 of said structure can be made by the following method: the manufacture method of the thermal head 1 of above-mentioned the 1st embodiment (do not form among Fig. 3～Fig. 7) be communicated with conductor 11 and replace form have the end that extends to adjacent pair of straight line resistance bar 4 and the pair of parallel conductor part 51A on the insulation barrier 6 and not with insulation barrier 6 with adjacent pair of straight line resistance bar 4 contacts, be connected this connection conductor 51 to the bonding conductor part 51B of parallel conductor part 51A.
Though the 5th above embodiment possesses the connection conductor 51 of plane H word shape, the bonding conductor part 51B that is communicated with conductor 51 does not form with insulation barrier 6 at least contiguously just can.As variation, can for example not possess be communicated with conductor 51 and replace possess the conductor 51 of connection as shown in figure 14 ', end that described connection conductor 51 ' possess extends to adjacent pair of straight line resistance bar 4 and the pair of parallel conductor part 51A on the insulation barrier 6 and not with insulation barrier 6 contacts and be positioned at and be connected this bonding conductor part 51B ' on the end of adjacent pair of straight line resistance bar 4, at the edge on heating resistor side to parallel conductor part 51A.And, also can be as possessing the conductor 51 of connection as shown in Figure 15 ", described connection conductor 51 " possess end and the pair of parallel conductor part 51A on the insulation barrier 6 that extends to adjacent pair of straight line resistance bar 4 and do not contact with insulation barrier 6 and pair of straight line resistance bar 4 and landfill pair of parallel conductor part 51A between bonding conductor part 51B ".
Because there is not bag shape recess airtight on the direction of sending at print media of the principal element that causes the print defective in above-mentioned the 1st～the 5th embodiment, therefore not increasing electrode resistance also can realize the thermal head miniaturization, can obtain to prevent the thermal head of print defective.
Though in above each embodiment, a plurality of heating resistors 5 are configured in the vertex position O of the convex shaped part 3a of recuperation layer 3, also a plurality of heating resistors 5 can be configured on the position of departing from this vertex position O predetermined angular.And,, also can take substrate itself is formed shape for lugs, and the structure of the recuperation layer of certain thickness is set on this convex substrate though in each embodiment, use recuperation layer 3 on substrate surface, to form shape for lugs.
Claims (26)
1. a thermal head has: with a plurality of resistor stripes of predetermined arranged spaced Cheng Liezhuan; Cover the part of each resistor stripe, a plurality of insulation barriers of heating resistor that separate provision is generated heat by energising; And conducting connects a plurality of connection conductors of the end of adjacent a pair of resistor stripe; It is characterized in that,
Above-mentioned connection conductor has: extend to the end and the pair of parallel conductor part on the above-mentioned insulation barrier of above-mentioned adjacent a pair of resistor stripe and connect this bonding conductor part to the parallel conductor part at least at the edge on above-mentioned heating resistor side.
2. thermal head as claimed in claim 1, wherein, above-mentioned a plurality of resistor stripes are linearity independently separately, the bonding conductor of above-mentioned connection conductor partly covers the tip-clearance of above-mentioned adjacent a pair of resistor stripe and connects above-mentioned pair of parallel conductor part.
3. thermal head as claimed in claim 1, wherein, above-mentioned a plurality of resistor stripes are to possess the pair of straight line resistance bar separately and the rugosity of the connection strap of an end that is connected this pair of straight line resistance bar; Above-mentioned insulation barrier covers an end separately of above-mentioned pair of straight line resistance bar and stipulates each heating resistor to the part of above-mentioned connection strap; Thereby the pair of parallel conductor part of above-mentioned connection conductor covers above-mentioned connection strap and is overlayed on the above-mentioned insulation barrier, is connected with above-mentioned connecting conductor branch on this connection strap and insulation barrier at least.
4. thermal head as claimed in claim 3, wherein, the zone that is covered by above-mentioned insulation barrier of above-mentioned connection strap with the orientation vertical direction of above-mentioned resistor stripe on length dimension below 5 μ m.
5. thermal head as claimed in claim 1, wherein, above-mentioned a plurality of resistor stripes are linearity independently separately, the bonding conductor part of above-mentioned connection conductor is not connected above-mentioned pair of parallel conductor part contiguously with above-mentioned insulation barrier.
6. thermal head as claimed in claim 5, wherein, the distance between the bonding conductor of above-mentioned connection conductor part and the above-mentioned insulation barrier is set at below the 5 μ m at interval.
7. a thermal head has a plurality of resistor stripes with predetermined arranged spaced Cheng Liezhuan; Cover the part of each resistor stripe, a plurality of insulation barriers of heating resistor that separate provision is generated heat by energising; And conducting connects a plurality of connection conductors of the end of adjacent a pair of resistor stripe; It is characterized in that,
Above-mentioned resistor stripe is a linearity;
Above-mentioned connection conductor has end and the pair of parallel conductor part on the above-mentioned insulation barrier that extends to above-mentioned adjacent a pair of resistor stripe and covers the tip-clearance of above-mentioned adjacent a pair of resistor stripe and connect this bonding conductor part to the parallel conductor part.
8. a thermal head has: with a plurality of resistor stripes of predetermined arranged spaced Cheng Liezhuan; Cover the part of each resistor stripe, a plurality of insulation barriers of heating resistor that separate provision is generated heat by energising; And conducting connects a plurality of connection conductors of the end of adjacent a pair of resistor stripe; It is characterized in that,
Above-mentioned resistor stripe is to possess pair of straight line resistance bar separately and be connected this rugosity to the connection strap of an end of straight line resistor stripe;
Thereby above-mentioned insulation barrier covers an end separately of above-mentioned pair of straight line resistance bar and stipulates each heating resistor to the part of above-mentioned connection strap;
Above-mentioned connection conductor has the end that extends to above-mentioned adjacent a pair of resistor stripe and the pair of parallel conductor part on the above-mentioned insulation barrier and be connected this bonding conductor part to the parallel conductor part on above-mentioned connection strap and above-mentioned insulation barrier.
9. thermal head as claimed in claim 8, wherein, the zone that is covered by above-mentioned insulation barrier of above-mentioned connection strap at the length dimension on the direction vertical with the orientation of above-mentioned resistor stripe below 5 μ m.
10. as each the described thermal head in the claim 1～9, wherein, being shaped as of above-mentioned connection conductor: the length dimension on the direction vertical with the orientation of above-mentioned resistor stripe is at the above-mentioned pair of parallel conductor portion office ratio plane U font big in above-mentioned connecting conductor office.
11. as each the described thermal head in the claim 1～9, wherein, being shaped as of above-mentioned connection conductor: with the vertical direction of the orientation of above-mentioned resistor stripe on length dimension at above-mentioned connecting conductor office and the planar I font that equates in above-mentioned pair of parallel conductor portion office.
12. a thermal head has: with a plurality of resistor stripes of predetermined arranged spaced Cheng Liezhuan; Cover the part of each resistor stripe, a plurality of insulation barriers of heating resistor that separate provision is generated heat by energising; And conducting connects a plurality of connection conductors of the end of adjacent a pair of resistor stripe; It is characterized in that,
Above-mentioned connection conductor has end and the pair of parallel conductor part on the above-mentioned insulation barrier that extends to above-mentioned adjacent a pair of resistor stripe and is not connected this bonding conductor part to the parallel conductor part contiguously with above-mentioned insulation barrier.
13. thermal head as claimed in claim 12, wherein, the bonding conductor of above-mentioned connection conductor part is not connected above-mentioned pair of parallel conductor part contiguously with above-mentioned insulation barrier and above-mentioned adjacent a pair of resistor stripe.
14. thermal head as claimed in claim 12, wherein, the edge of above-mentioned heating resistor one side of the bonding conductor of above-mentioned connection conductor part is positioned on the end of above-mentioned adjacent a pair of resistor stripe.
15. as each the described thermal head in the claim 12～14, wherein, the distance between the bonding conductor of above-mentioned connection conductor part and the above-mentioned insulation barrier is limited at below the 5 μ m at interval.
16. as each the described thermal head in the claim 12～15, wherein, above-mentioned connection conductor be shaped as plane H font.
17. as each the described thermal head in the claim 1～16, wherein, above-mentioned connection conductor bigger than the width dimensions on the direction parallel with this orientation with the length dimension of the vertical direction of the orientation of above-mentioned resistor stripe.
18. as each the described thermal head in the claim 1～17, wherein, above-mentioned a plurality of resistor stripes are formed on the recuperation layer with shape for lugs, above-mentioned each heating resistor is formed on the shape for lugs of this recuperation layer.
19. the manufacture method of a thermal head is characterized in that,
Comprise following operation: the operation that on whole of recuperation layer, forms resistive layer; The operation of the insulation barrier of the plane sizes of the heating resistor that the formation regulation should form on this resistive layer; Remove the part of above-mentioned insulation barrier and above-mentioned resistive layer, a plurality of resistor stripes of row shape are lined up at predetermined interval and the operation of a plurality of heating resistors of being made of the zone that is covered by above-mentioned insulation barrier of each resistor stripe thereby obtain to separate; On above-mentioned resistor stripe, above-mentioned insulation barrier and above-mentioned recuperation layer whole, form the operation of conductor layer; And, remove the part of above-mentioned conductor layer, thereby form opening portion that above-mentioned insulation barrier is exposed, connection conductor that conducting connects a pair of heating resistor that forms on the adjacent a pair of resistor stripe simultaneously, make the absolute electrode that above-mentioned a pair of heating resistor switches on and the operation of public electrode by this connections conductor;
Above-mentioned resistor stripe forms linearity; Thereby above-mentioned connection conductor covers above-mentioned adjacent a pair of resistor stripe and the gap is overlayed on the above-mentioned insulation barrier.
20. thermal head manufacture method as claimed in claim 19, wherein, above-mentioned connection conductor is to have end and the pair of parallel conductor part on the above-mentioned insulation barrier that extends to above-mentioned adjacent a pair of resistor stripe and to cover the gap of above-mentioned adjacent a pair of resistor stripe end and connect this graphics shape of the bonding conductor part of parallel conductor part is formed.
21. a thermal head manufacture method is characterized in that,
Comprise following operation: the operation that on whole of recuperation layer, forms resistive layer; The operation of the insulation barrier of the plane sizes of the heating resistor that the formation regulation should form on this resistive layer; Remove the part of above-mentioned insulation barrier and above-mentioned resistive layer, a plurality of resistor stripes of row shape are lined up at predetermined interval and the operation of a plurality of heating resistors of being made of the zone that is covered by above-mentioned insulation barrier of this resistor stripe thereby obtain to separate; On above-mentioned resistor stripe, above-mentioned insulation barrier and above-mentioned recuperation layer whole, form the operation of conductor layer; And, remove the part of above-mentioned conductor layer, thereby form opening portion that above-mentioned insulation barrier is exposed, connection conductor that conducting connects an end of adjacent a pair of resistor stripe simultaneously, the absolute electrode of above-mentioned heating resistor being switched on by this connections conductor and the operation of public electrode;
Above-mentioned resistive element figure with have separately pair of straight line resistance bar be connected this rugosity of the connection strap of an end of straight line resistor stripe formed; Above-mentioned insulation barrier covers the partially formation of an end separately of above-mentioned pair of straight line resistance bar to above-mentioned connection strap; Thereby above-mentioned connection conductor covers the above-mentioned connection strap that exposes and is overlayed on the above-mentioned insulation barrier.
22. thermal head manufacture method as claimed in claim 21, wherein, above-mentioned connection conductor forms the graphics shape of the bonding conductor part of parallel conductor part to have the pair of parallel conductor part that extends on above-mentioned connection strap and the above-mentioned insulation barrier and connect this on above-mentioned connection strap and above-mentioned insulation barrier.
23. as claim 21 or 22 described thermal head manufacture methods, wherein, the above-mentioned insulation barrier of staying on the above-mentioned connection strap is limited to below the 5 μ m at the length dimension of the direction vertical with the orientation of the above-mentioned resistor stripe end from above-mentioned pair of straight line resistance bar.
24. a thermal head manufacture method is characterized in that,
Comprise following operation: the operation that on whole of recuperation layer, forms resistive layer; The operation of the insulation barrier of the plane sizes of the heating resistor that the formation regulation should form on this resistive layer; Remove the part of above-mentioned insulation barrier and above-mentioned resistive layer, a plurality of resistor stripes of row shape are lined up at predetermined interval and the operation of a plurality of heating resistors of being made of the zone that is covered by above-mentioned insulation barrier of this resistor stripe thereby obtain to separate; On above-mentioned resistor stripe, above-mentioned insulation barrier and above-mentioned recuperation layer whole, form the operation of conductor layer; And, remove the part of above-mentioned conductor layer, thereby form opening portion that above-mentioned insulation barrier is exposed, connection conductor that conducting connects an end of adjacent a pair of resistor stripe simultaneously, the absolute electrode of above-mentioned a pair of heating resistor being switched on by this connections conductor and the operation of public electrode;
Above-mentioned resistor stripe forms linearity; Above-mentioned connection conductor forms the graphics shape of the bonding conductor part of parallel conductor part to have end and the pair of parallel conductor part on the above-mentioned insulation barrier that extends to above-mentioned adjacent a pair of resistor stripe and to connect this, and makes the edge of heating resistor one side of above-mentioned bonding conductor part not contact, be positioned on the end of above-mentioned adjacent a pair of resistor stripe with above-mentioned insulation barrier.
25. thermal head manufacture method as claimed in claim 24, wherein, the distance between the bonding conductor of above-mentioned connection conductor part and the above-mentioned insulation barrier is limited to below the 5 μ m at interval.
26. as each the described thermal head manufacture method in the claim 19～25, wherein, make above-mentioned connection conductor all or part of with the vertical direction of above-mentioned straight line resistor stripe orientation on length dimension form greatlyyer than the width dimensions on the direction parallel with this orientation.
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|---|---|---|---|---|
| CN107709021A (en) * | 2015-06-30 | 2018-02-16 | 青井电子株式会社 | Wiring substrate and thermal head |
| CN110091615A (en) * | 2019-05-10 | 2019-08-06 | 武汉晖印半导体有限公司 | A kind of the high-precision heater construction and its manufacturing process of film thermal printing head |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH08300695A (en) * | 1995-03-15 | 1996-11-19 | Printronix Inc | Printer |
| JP3576888B2 (en) * | 1999-10-04 | 2004-10-13 | キヤノン株式会社 | Substrate for inkjet head, inkjet head, and inkjet apparatus |
| EP1221372B1 (en) * | 2001-01-05 | 2005-06-08 | Hewlett-Packard Company | Integrated programmable fire pulse generator for inkjet printhead assembly |
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2005
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107709021A (en) * | 2015-06-30 | 2018-02-16 | 青井电子株式会社 | Wiring substrate and thermal head |
| CN107709021B (en) * | 2015-06-30 | 2019-09-13 | 青井电子株式会社 | Wiring substrate and thermal head |
| CN110091615A (en) * | 2019-05-10 | 2019-08-06 | 武汉晖印半导体有限公司 | A kind of the high-precision heater construction and its manufacturing process of film thermal printing head |
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| CN101284454A (en) | 2008-10-15 |
| CN101284454B (en) | 2011-04-20 |
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