CN110034035B - 一种晶圆生产集质检与修复一体的光刻胶涂敷检测装置 - Google Patents
一种晶圆生产集质检与修复一体的光刻胶涂敷检测装置 Download PDFInfo
- Publication number
- CN110034035B CN110034035B CN201910165723.XA CN201910165723A CN110034035B CN 110034035 B CN110034035 B CN 110034035B CN 201910165723 A CN201910165723 A CN 201910165723A CN 110034035 B CN110034035 B CN 110034035B
- Authority
- CN
- China
- Prior art keywords
- frame
- quality inspection
- bin
- plate
- scanning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910165723.XA CN110034035B (zh) | 2019-03-06 | 2019-03-06 | 一种晶圆生产集质检与修复一体的光刻胶涂敷检测装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910165723.XA CN110034035B (zh) | 2019-03-06 | 2019-03-06 | 一种晶圆生产集质检与修复一体的光刻胶涂敷检测装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110034035A CN110034035A (zh) | 2019-07-19 |
CN110034035B true CN110034035B (zh) | 2021-06-15 |
Family
ID=67235782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910165723.XA Active CN110034035B (zh) | 2019-03-06 | 2019-03-06 | 一种晶圆生产集质检与修复一体的光刻胶涂敷检测装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110034035B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1466707A (zh) * | 2000-09-22 | 2004-01-07 | �Ƚ�װ�ù�˾ | 利用光阻流修补针孔缺陷 |
CN101416099A (zh) * | 2006-05-16 | 2009-04-22 | 夏普株式会社 | 显示面板的制造方法、显示面板的制造装置和显示面板 |
CN102253506A (zh) * | 2010-05-21 | 2011-11-23 | 京东方科技集团股份有限公司 | 液晶显示基板的制造方法及检测修补设备 |
CN102809839A (zh) * | 2012-08-31 | 2012-12-05 | 深圳市华星光电技术有限公司 | 阵列基板的图形修补装置及方法 |
CN109119375A (zh) * | 2018-07-30 | 2019-01-01 | 惠科股份有限公司 | 阵列面板的检测修复方法和光阻修补装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8211717B1 (en) * | 2011-01-26 | 2012-07-03 | International Business Machines Corporation | SEM repair for sub-optimal features |
-
2019
- 2019-03-06 CN CN201910165723.XA patent/CN110034035B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1466707A (zh) * | 2000-09-22 | 2004-01-07 | �Ƚ�װ�ù�˾ | 利用光阻流修补针孔缺陷 |
CN101416099A (zh) * | 2006-05-16 | 2009-04-22 | 夏普株式会社 | 显示面板的制造方法、显示面板的制造装置和显示面板 |
CN102253506A (zh) * | 2010-05-21 | 2011-11-23 | 京东方科技集团股份有限公司 | 液晶显示基板的制造方法及检测修补设备 |
CN102809839A (zh) * | 2012-08-31 | 2012-12-05 | 深圳市华星光电技术有限公司 | 阵列基板的图形修补装置及方法 |
CN109119375A (zh) * | 2018-07-30 | 2019-01-01 | 惠科股份有限公司 | 阵列面板的检测修复方法和光阻修补装置 |
Also Published As
Publication number | Publication date |
---|---|
CN110034035A (zh) | 2019-07-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201653918U (zh) | 晶片外观检测设备 | |
CN211416667U (zh) | 一种石墨电极加工用在线检测打号装置 | |
CN110286133A (zh) | 偏光片检测装置 | |
CN110034035B (zh) | 一种晶圆生产集质检与修复一体的光刻胶涂敷检测装置 | |
CN208443375U (zh) | 一种玻璃检测台 | |
CN114965283A (zh) | 一种自动上下料的线路板测试设备 | |
CN107044986A (zh) | 背光源成品检测装置和检测方法 | |
CN209027458U (zh) | 一种自动上下料的图像尺寸测量仪 | |
CN108010864A (zh) | 一种光伏电池片缺陷分选装置及其分选方法 | |
CN209707406U (zh) | 一种注塑件缺料影像ccd检测设备 | |
CN207114445U (zh) | 一种冲压件外观缺陷检测装置 | |
CN110411945A (zh) | 一种用于流水线零件检测的图像采集摄像头 | |
CN101762596A (zh) | 晶片外观检测方法 | |
CN220635359U (zh) | 一种粉饼检测用不合格品回收利用装置 | |
CN209238467U (zh) | O型圈检测装置及设备 | |
CN209356385U (zh) | 一种角度可调式玻璃检验板放置装置 | |
CN208736661U (zh) | 一种螺纹检查机 | |
CN213181296U (zh) | 一种胶囊灯检机 | |
CN221148489U (zh) | 一种超薄基板玻璃缺陷测量装置 | |
CN114280067B (zh) | 一种识别mask破片及裂纹的检测装置及检测方法 | |
CN218298072U (zh) | 一种方杯破损检测设备 | |
CN213813376U (zh) | 一种塑料袋生产设备用检测机构 | |
CN217520429U (zh) | 一种多功能自动检测机 | |
CN211718139U (zh) | 一种具有调节性能的手机主板光学检测设备 | |
CN219122070U (zh) | 一种橡胶加工用批量检测结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210518 Address after: 404100 no.117-609, Yunhan Avenue, Beibei District, Chongqing Applicant after: Chongqing Huiju Chengjiang information technology partnership (L.P.) Address before: 362100 Fujian province Quanzhou investment zone Luoyang town apricot village sea scarf people create space 30 Applicant before: QUANZHOU TAIWANESE INVESTMENT ZONE LEIMO DESIGN Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211022 Address after: 401121 rowing technology, 15 / F, building D4, Yuxing Plaza, Huangshan Avenue, Yubei District, Chongqing Patentee after: Chongqing rockboat Technology Co.,Ltd. Address before: 404100 no.117-609, Yunhan Avenue, Beibei District, Chongqing Patentee before: Chongqing Huiju Chengjiang information technology partnership (L.P.) |