CN110034035B - Photoresist coating detection device integrating wafer production quality inspection and repair - Google Patents
Photoresist coating detection device integrating wafer production quality inspection and repair Download PDFInfo
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- CN110034035B CN110034035B CN201910165723.XA CN201910165723A CN110034035B CN 110034035 B CN110034035 B CN 110034035B CN 201910165723 A CN201910165723 A CN 201910165723A CN 110034035 B CN110034035 B CN 110034035B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Abstract
The invention discloses a photoresist coating detection device integrating quality inspection and repair in wafer production, the structure of the device comprises a detection machine, a display screen, an integrated quality inspection bin and an overhaul bin, wherein the display screen is embedded in the detection machine, the detection machine is provided with an integrated quality inspection bin which is provided with an overhaul bin, the integrated quality inspection bin consists of transparent glass, a bin opening, a coating structure and a quality inspection structure, the transparent glass is connected with the bin opening through glue, the coating structure is locked on the bin opening, and the bin opening is provided with the quality inspection structure.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a photoresist coating detection device integrating quality inspection and repair in wafer production.
Background
Substances in nature are classified into conductors, insulators, and semiconductors according to their conductive ability; the semiconductor material is a functional material with conductivity between a conductive material and an insulating material at room temperature, and is widely applied to the aspects of electronic industry and the like; the wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and various circuit element structures can be manufactured on the silicon wafer to form an integrated circuit product with a specific electrical function; the wafer production process uses photoresist coating, and the photoresist coating process aims to establish a thin, uniform and defect-free photoresist film on the wafer surface.
In the prior art, the adhesive film is observed and detected by naked eyes of workers, so that the labor cost is high, the detection speed is low, whether the overall size, the edge size and the surface of the adhesive film are clean or not and whether a pinhole exists in the adhesive film or not can not be accurately detected, and meanwhile, the defects can not be immediately repaired.
Disclosure of Invention
The invention mainly aims to overcome the defects of the prior art and provide a photoresist coating detection device integrating wafer production quality inspection and repair, so as to solve the problems that in the prior art, the labor cost is high, the detection speed is slow, the overall size, the edge size and the surface of a glue film cannot be accurately detected, whether a pinhole exists in the glue film or not cannot be accurately detected, and meanwhile, the defect cannot be immediately repaired by naked eyes of workers.
The invention is realized by adopting the following technical scheme: the utility model provides a wafer production collection quality is examined and is restoreed integrative photoresist coating detection device, its structure is including detecting organism, display screen, integrative quality inspection storehouse, maintenance storehouse, it inlays and is equipped with the display screen to detect the organism front side, it has integrative quality inspection storehouse to detect the organism mid-mounting, it is equipped with maintenance storehouse to detect the organism front side dress, integrative quality inspection storehouse comprises clear glass, bin mouth, coating structure, quality inspection structure, the last lower extreme of clear glass is glued with the bin mouth and is connected, the locking of coating structure bottom is on the bin mouth, both ends about the quality inspection structure are installed to the bin mouth.
Further preferably, the coating structure includes storehouse frame, tiling spiral plate, storage cylinder, crowded feed cylinder, two inboards and tiling spiral plate rail coupling about the storehouse frame, tiling spiral plate and crowded feed cylinder anchor ring welding, storage cylinder bottom and crowded feed cylinder upper end lock joint and the two communicates with each other.
Further preferably, the quality inspection structure comprises a structural arc frame, a transmission gear and a scanning plate, wherein the transmission gear is arranged on the structural arc frame, the transmission gear and the structural arc frame are positioned at the same axis, the structural arc frame is provided with 3 transmission gears which are arranged in an arc shape, the bottom of each transmission gear is meshed with the scanning plate, the structural arc frame is provided with a fixed block, and the transmission gear is attached to the front side of the fixed block.
Further preferably, the overhaul bin comprises a rail frame, a lifting frame, a scanning rotary frame and an edge scanning frame, the rail frame is connected with the left end rail and the right end rail of the lifting frame, the lifting frame is locked with the bottom of the scanning rotary frame, and the lifting frame is welded with the left end of the edge scanning frame.
Further preferably, the lifting frame comprises a fixed bottom frame, a lifting shaft plate, a lifting slide rod and a movable top plate, the fixed bottom frame is connected with the bottom shaft of the lifting shaft plate, the fixed bottom frame is connected with the bottom end of the lifting slide rod in a sliding mode, the upper end of the lifting slide rod is connected with the movable top plate shaft, and the lifting shaft plate is attached to the lifting slide rod and located on the same shaft center.
Further preferably, the scanning rotating frame comprises a bottom plate, a middle shaft and a top plate, the bottom plate is fixedly connected with the middle shaft, and the middle shaft is connected with the top plate through a shaft.
Further preferably, the edge scanning frame comprises a mounting reinforcing block and a scanner, the scanner is mounted on the maintenance bin through the mounting reinforcing block, and the bottom plate, the middle shaft and the top plate are arranged from top to bottom.
Advantageous effects
The detection device is connected with production equipment, when wafers are conveyed to an integrated quality inspection bin, the wafers enter a coating structure and then run through a quality inspection structure, a transmission gear drives a scanning plate to rotate clockwise, anticlockwise, left and right circularly, the wafer adhesive films are scanned, if the scanning is abnormal, the wafer adhesive films are reprocessed according to abnormal data, if the wafer adhesive films are too thick, high-rotation coating is carried out through a tiled rotary plate, and if the wafer adhesive films are too thin, glue in a storage barrel is extruded onto the wafer adhesive films through a material extruding barrel; then the wafer is continuously conveyed (when the wafer reaches the middle of the integrated quality inspection bin), the lifting frame lifts the scanning rotary frame, so that the scanning rotary frame can conveniently scan the bottom of the wafer, and meanwhile, the top disc is rotated to be matched with the scanner to detect whether a pin hole exists in glue (the pin hole is filled by a material extruding barrel); and then, the detected wafer is continuously conveyed to the left end of the integrated quality inspection bin to enter the next procedure.
Compared with the prior art, the invention has the beneficial effects that: the wafer glued membrane realizes the scanning of 180 degrees semi-rotations in upper end, scanning of bottom are realized to the rotatory frame of scanning through the quality control structure, and the edge scanning frame carries out edge scanning to the wafer glued membrane through the rotation of scanning the frame of revolving, if directly add glue or subtract glue (crowded glue or spin coating) through the bin mouth after scanning out the product defect, has both saved the cost of labor and has improved detection efficiency and product quality again.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of a photoresist coating detection device integrating quality inspection and repair in wafer production according to the present invention.
Fig. 2 shows a side-view cut-away structural schematic diagram of the detection device of the invention.
Figure 3 shows a front cut-away schematic view of the coating structure of the present invention.
Fig. 4 shows a schematic structural diagram of a quality inspection structure according to the present invention.
Fig. 5 shows a front cut structure schematic diagram of an integrated quality inspection bin and an inspection bin of the invention.
FIG. 6 is a front view of the integrated quality inspection chamber and the inspection chamber of the present invention, which is sectioned, and is a structural view of the wafer film moving to the middle of the apparatus and the edge scanning frame rising.
In the figure: the device comprises a detection machine body 1, a display screen 2, an integrated quality inspection bin 3, an overhaul bin 4, transparent glass 30, a bin opening 31, a coating structure 32, a quality inspection structure 33, a bin frame 320, a tiled rotary plate 321, a storage barrel 322, a material extruding barrel 323, a structural arc frame 330, a transmission gear 331, a scanning plate 332, a fixed block 3330, a rail frame 40, a lifting frame 41, a scanning rotary frame 42, an edge scanning frame 43, a fixed bottom frame 410, a lifting shaft plate 411, a lifting sliding rod 412, a movable top plate 413, a bottom plate 420, a middle shaft 421, a top plate 422, an installation reinforcing block 431 and a scanner 432.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a photoresist coating detection device for wafer production integrating quality inspection and repair, comprising: its structure is including detecting organism 1, display screen 2, integrative quality inspection storehouse 3, maintenance storehouse 4, it is equipped with display screen 2 to detect organism 1 inlay, it installs integrative quality inspection storehouse 3 to detect organism 1, it has installed maintenance storehouse 4 to detect organism 1, integrative quality inspection storehouse 3 comprises clear glass 30, bin mouth 31, coating structure 32, quality inspection structure 33, clear glass 30 is glued with bin mouth 31 and is connected, coating structure 32 locking is on bin mouth 31, quality inspection structure 33 is installed to bin mouth 31, coating structure 32 includes bin frame 320, tiling rotating plate 321, storage barrel 322, crowded feed cylinder 323, bin frame 320 and tiling rotating plate 321 rail joint, tiling rotating plate 321 and crowded feed cylinder 323 welding, storage barrel 322 and crowded feed cylinder 323 lock joint and the two communicate with each other, crowded feed cylinder 323 is used for carrying out crowded glue to thin wafer glued membrane, quality inspection structure 33 includes structure arc frame 330, the inspection and maintenance device comprises a transmission gear 331 and a scanning plate 332, wherein the transmission gear 331 is installed on a structural arc frame 330, the transmission gear 331 is meshed with the scanning plate 332, a fixed block 3330 is installed on the structural arc frame 330, the transmission gear 331 is attached to the fixed block 3330, the transmission gear 331 is used for driving the scanning plate 332 to move so as to scan a wafer adhesive film, the inspection and maintenance bin 4 comprises a rail frame 40, a lifting frame 41, a scanning rotary frame 42 and an edge scanning frame 43, the rail frame 40 is in track connection with the lifting frame 41, the lifting stability of the lifting frame 41 is improved, the lifting frame 41 is locked with the scanning rotary frame 42, the lifting frame 41 is welded with the edge scanning frame 43, the lifting frame 41 comprises a fixed bottom frame 410, a lifting shaft plate 411, a lifting slide rod 412 and a movable top plate 413, the fixed bottom frame 410 is connected with the lifting shaft plate 411 through a shaft, and, the lifting slide bar 412 is connected with the movable top plate 413 through a shaft, the lifting shaft plate 411 is attached to the lifting slide bar 412 and located at the same shaft center, the bottom of the fixed bottom frame 410 slides on the fixed bottom frame 410, the upward moving stability of the scanning rotary frame 42 is improved, the scanning rotary frame 42 is used for scanning a wafer adhesive film more accurately, the scanning rotary frame 42 comprises a bottom plate 420, a middle shaft 421 and a top plate 422, the bottom plate 420 is fixedly connected with the middle shaft 421, the middle shaft 421 is connected with the top plate 422 through a shaft, the material extruding barrel 323 can realize lifting and driving the flat-laying rotary plate 321 to carry out spin coating on an over-thick wafer adhesive film under the action of the top plate 422, the edge scanning frame 43 comprises an installation reinforcing block 431 and a scanner 432, the scanner 432 is installed on the overhaul bin 4 through the installation reinforcing block 431, the top plate 422 is attached to a wafer after rising, the wafer adhesive film is scanned and the wafer is driven, so as to be matched with the edge scanning frame 43 to scan the edge of the wafer adhesive film.
The detection device is connected with production equipment, when the wafer is conveyed to the integrated quality inspection bin 3, the wafer enters the coating structure 32 and then enters the quality inspection structure 33 to operate, the transmission gear 331 drives the scanning plate 332 to rotate clockwise, anticlockwise, left and right in a circulating manner to scan the wafer adhesive film, if the scanning is abnormal, the wafer adhesive film is reprocessed according to abnormal data, if the wafer adhesive film is too thick, high-rotation coating is carried out through the flat spreading rotary plate 321, and if the wafer adhesive film is too thin, the glue in the storage barrel 322 is extruded onto the wafer adhesive film through the extruding barrel 323; then, the wafer is continuously conveyed (when the wafer reaches the middle of the integral quality inspection bin 3), the lifting frame 41 lifts the scanning rotary frame 42, so that the scanning rotary frame 42 can conveniently scan the bottom of the wafer, and meanwhile, the top disc 422 rotates to be matched with the scanner 432 to detect whether a pinhole exists in the glue (the pinhole is filled by the material extruding barrel 323); and then, the detected wafer is continuously conveyed to the left end of the integrated quality inspection bin 3 to enter the next working procedure.
Compared with the prior art, the invention has the technical progress that: the wafer glued membrane realizes 180 degrees semi-rotation scanning in upper end through quality control structure 33, the scanning of scanning spiral frame 42 realization bottom, edge scan frame 43 carries out edge scanning to the wafer glued membrane through the rotation of scanning spiral frame 42, if directly add glue or subtract glue (spin coating) through door 31 after scanning out the product defect, has both saved the cost of labor and has improved detection efficiency and product quality again.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (4)
1. The utility model provides a wafer production collection quality control and restoration integrative photoresist coating detection device, its structure is including detecting organism (1), display screen (2), integrative quality control storehouse (3), maintenance storehouse (4), it inlays and is equipped with display screen (2) to detect organism (1), it installs integrative quality control storehouse (3) to detect organism (1), it has installed maintenance storehouse (4), its characterized in that to detect organism (1):
the integrated quality inspection bin (3) consists of transparent glass (30), a bin opening (31), a coating structure (32) and a quality inspection structure (33), wherein the transparent glass (30) is connected with the bin opening (31) in an adhesive manner, the coating structure (32) is locked on the bin opening (31), and the bin opening (31) is provided with the quality inspection structure (33);
the coating structure (32) comprises a bin frame (320), a tiled rotary plate (321), a storage barrel (322) and an extrusion barrel (323), wherein the bin frame (320) is connected with the tiled rotary plate (321) in a rail way, the tiled rotary plate (321) is welded with the extrusion barrel (323), and the storage barrel (322) is buckled with the extrusion barrel (323) and communicated with the same;
the quality inspection structure (33) comprises a structural arc frame (330), a transmission gear (331) and a scanning plate (332), wherein the transmission gear (331) is installed on the structural arc frame (330), the transmission gear (331) is meshed with the scanning plate (332), a fixed block (3330) is installed on the structural arc frame (330), and the transmission gear (331) is attached to the fixed block (3330);
the overhaul bin (4) comprises a rail frame (40), a lifting frame (41), a scanning rotary frame (42) and an edge scanning frame (43), wherein the rail frame (40) is connected with the lifting frame (41) through a rail, the lifting frame (41) is locked with the scanning rotary frame (42), and the lifting frame (41) is welded with the edge scanning frame (43).
2. The wafer production photoresist coating detection device integrating quality inspection and repair as claimed in claim 1, wherein: the crane (41) comprises a fixed chassis (410), a lifting shaft plate (411), a lifting slide rod (412) and a movable top plate (413), wherein the fixed chassis (410) is connected with the shaft of the lifting shaft plate (411) in a shaft mode, the fixed chassis (410) is connected with the lifting slide rod (412) in a sliding mode, the lifting slide rod (412) is connected with the shaft of the movable top plate (413) in a shaft mode, and the lifting shaft plate (411) is attached to the lifting slide rod (412) and the lifting slide rod are located on the same shaft center.
3. The wafer production photoresist coating detection device integrating quality inspection and repair as claimed in claim 1, wherein: the scanning rotating frame (42) comprises a bottom plate (420), a middle shaft (421) and a top plate (422), the bottom plate (420) is fixedly connected with the middle shaft (421), and the middle shaft (421) is connected with the top plate (422) through a shaft.
4. The wafer production photoresist coating detection device integrating quality inspection and repair as claimed in claim 1, wherein: the edge scanning frame (43) comprises a mounting reinforcing block (431) and a scanner (432), and the scanner (432) is mounted on the maintenance bin (4) through the mounting reinforcing block (431).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910165723.XA CN110034035B (en) | 2019-03-06 | 2019-03-06 | Photoresist coating detection device integrating wafer production quality inspection and repair |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910165723.XA CN110034035B (en) | 2019-03-06 | 2019-03-06 | Photoresist coating detection device integrating wafer production quality inspection and repair |
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| Publication Number | Publication Date |
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| CN110034035A CN110034035A (en) | 2019-07-19 |
| CN110034035B true CN110034035B (en) | 2021-06-15 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1466707A (en) * | 2000-09-22 | 2004-01-07 | �Ƚ�װ�ù�˾ | Pinhole defect repair by resist blow |
| CN101416099A (en) * | 2006-05-16 | 2009-04-22 | 夏普株式会社 | Process for manufacturing display panel, display panel manufacturing apparatus and display panel |
| CN102253506A (en) * | 2010-05-21 | 2011-11-23 | 京东方科技集团股份有限公司 | Method for manufacturing liquid crystal display substrate and detecting and repairing equipment of liquid crystal display substrate |
| CN102809839A (en) * | 2012-08-31 | 2012-12-05 | 深圳市华星光电技术有限公司 | Graphic repair device and method for array substrate |
| CN109119375A (en) * | 2018-07-30 | 2019-01-01 | 惠科股份有限公司 | The detection restorative procedure and photoresist repair apparatus of arraying bread board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8211717B1 (en) * | 2011-01-26 | 2012-07-03 | International Business Machines Corporation | SEM repair for sub-optimal features |
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2019
- 2019-03-06 CN CN201910165723.XA patent/CN110034035B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1466707A (en) * | 2000-09-22 | 2004-01-07 | �Ƚ�װ�ù�˾ | Pinhole defect repair by resist blow |
| CN101416099A (en) * | 2006-05-16 | 2009-04-22 | 夏普株式会社 | Process for manufacturing display panel, display panel manufacturing apparatus and display panel |
| CN102253506A (en) * | 2010-05-21 | 2011-11-23 | 京东方科技集团股份有限公司 | Method for manufacturing liquid crystal display substrate and detecting and repairing equipment of liquid crystal display substrate |
| CN102809839A (en) * | 2012-08-31 | 2012-12-05 | 深圳市华星光电技术有限公司 | Graphic repair device and method for array substrate |
| CN109119375A (en) * | 2018-07-30 | 2019-01-01 | 惠科股份有限公司 | The detection restorative procedure and photoresist repair apparatus of arraying bread board |
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