CN110024110A - 集成电路封装方法以及集成封装电路 - Google Patents
集成电路封装方法以及集成封装电路 Download PDFInfo
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- CN110024110A CN110024110A CN201680090831.XA CN201680090831A CN110024110A CN 110024110 A CN110024110 A CN 110024110A CN 201680090831 A CN201680090831 A CN 201680090831A CN 110024110 A CN110024110 A CN 110024110A
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- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
一种集成电路封装方法以及集成封装电路,其中集成电路封装方法包括:基板(100)的顶面、或者基板(100)的底面、或者基板(100)内具有电路层(110a、110b),所述电路层(110a、110b)具有电路引脚,所述基板(100)设有连接通孔(120a、120b),所述连接通孔(120a、120b)与所述电路引脚对接,将元器件(200)安放于所述基板(100),所述元器件(200)朝向所述基板(100)的一面具有器件引脚(210a、210b),使所述器件引脚(210a、210b)与所述连接通孔(120a、120b)的第一开口(120c)对接,通过所述连接通孔(120a、120b)的第二开口(120d)在所述连接通孔(120a、120b)内制作导电层(400a、400b),所述导电层(400a、400b)将所述器件引脚(210a、210b)与所述电路引脚电连接。制作工艺简单、成本低,在提升集成封装电路可靠性的同时减小体积。
Description
PCT国内申请,说明书已公开。
Claims (19)
- PCT国内申请,权利要求书已公开。
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PCT/CN2016/107832 WO2018098648A1 (zh) | 2016-11-30 | 2016-11-30 | 集成电路封装方法以及集成封装电路 |
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US (1) | US11335664B2 (zh) |
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CN112470553A (zh) * | 2018-10-11 | 2021-03-09 | 深圳市修颐投资发展合伙企业(有限合伙) | 复合工艺扇出封装方法 |
CN113155313B (zh) * | 2021-03-16 | 2023-04-07 | 中国电子科技集团公司第二十九研究所 | 一种扇出型封装温度分布原位模拟结构及方法 |
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JPH08167630A (ja) * | 1994-12-15 | 1996-06-25 | Hitachi Ltd | チップ接続構造 |
JP3176307B2 (ja) * | 1997-03-03 | 2001-06-18 | 日本電気株式会社 | 集積回路装置の実装構造およびその製造方法 |
FI122128B (fi) * | 2005-06-16 | 2011-08-31 | Imbera Electronics Oy | Menetelmä piirilevyrakenteen valmistamiseksi |
KR101053761B1 (ko) * | 2008-11-11 | 2011-08-02 | 주식회사 동부하이텍 | 이미지 센서의 제조 방법 |
JP5406389B2 (ja) * | 2012-03-01 | 2014-02-05 | 株式会社フジクラ | 部品内蔵基板及びその製造方法 |
CN102623427B (zh) | 2012-03-31 | 2014-08-20 | 苏州晶方半导体科技股份有限公司 | 半导体封装方法 |
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2016
- 2016-11-30 CN CN201680090831.XA patent/CN110024110A/zh active Pending
- 2016-11-30 WO PCT/CN2016/107832 patent/WO2018098648A1/zh active Application Filing
- 2016-11-30 US US16/465,233 patent/US11335664B2/en active Active
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US5407864A (en) * | 1992-07-24 | 1995-04-18 | Samsung Electronics Co., Ltd. | Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip |
US20090135574A1 (en) * | 2007-11-22 | 2009-05-28 | Shinko Electric Industries Co., Ltd. | Wiring board, semiconductor device having wiring board, and method of manufacturing wiring board |
CN102881799A (zh) * | 2011-07-11 | 2013-01-16 | 郭文平 | 一种高压led芯片及制作方法 |
CN103618041A (zh) * | 2013-12-11 | 2014-03-05 | 江阴长电先进封装有限公司 | 一种esd保护的led封装结构及其封装方法 |
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US11335664B2 (en) | 2022-05-17 |
WO2018098648A1 (zh) | 2018-06-07 |
US20200043886A1 (en) | 2020-02-06 |
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