CN110023435A - 粘合片和其剥离方法 - Google Patents
粘合片和其剥离方法 Download PDFInfo
- Publication number
- CN110023435A CN110023435A CN201780073227.0A CN201780073227A CN110023435A CN 110023435 A CN110023435 A CN 110023435A CN 201780073227 A CN201780073227 A CN 201780073227A CN 110023435 A CN110023435 A CN 110023435A
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- bonding sheet
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- substrate sheets
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Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract
提供一种粘合片,其具备:基材片;和,可溶性粘合层,其以岛状或条纹状的图案设置于基材片的至少一个面,在上述图案为岛状的情况下,构成上述岛状的图案的各粘合性区域的外接圆的直径为0.1mm以上且10mm以下,在上述图案为条纹状的情况下,构成上述条纹状的图案的各粘合性区域的条纹宽度为0.1mm以上且10mm以下。根据该粘合片,能够保持粘合层的粘合力直至即将剥离前,并且能在任意时刻、且以不对被粘物施加过度的应力的形式容易地进行片从被粘物的剥离。
Description
技术领域
本发明涉及粘合片和其剥离方法。
背景技术
物品的粘接、临时固定等用途中广泛使用有粘合片。粘合片一般具有如下构成:在基材片上具备由粘合剂形成的粘合层。粘合片中存在有“粘接型粘合片”和“转印型粘合片”这2个类型,所述“粘接型粘合片”用于借助粘合层使基材片本身粘接于被粘物,所述“转印型粘合片”用于通过使粘合层转印至被粘物或第二基材片并将当初的基材片剥离从而对被粘物或第二基材片赋予粘合性。
已知有:在基材片上以规定的图案印刷有粘合层的粘合片。例如专利文献1(日本特开2010-174148号公报)中出于固定信封等纸类的目的而公开了一种粘合制品,其在基材上设有间歇地配置点状的粘合剂而成的粘合层。该文献中提出了如下方案:为了利用丝网印刷、凹版印刷等在基材上精确且效率良好地印刷粘合层,使用含有丙烯酸类共聚物的丙烯酸类粘合剂。另外,专利文献2(日本特开平8-333556号公报)中,作为向塑料制品、金属制品、陶瓷制品等上的利用转印的粘附、组装等中使用的粘合片,公开了一种转印型粘合片材,其具有由点形状的粘合剂的集合花纹构成的粘合层,示例了丙烯酸类、橡胶系、有机硅系等粘合剂。
因而,半导体封装体的制造工序中,为了提高薄型化的印刷电路板的操作性,也有时使用粘合片。例如专利文献3(日本特开2014-7315号公报)中公开了一种半导体封装体的制造方法,其包括如下步骤:将在耐热支撑层上具有自粘合弹性体层的耐热薄膜粘合于印刷电路板,经过半导体芯片安装、回流焊处理、树脂密封、固化处理等后,将耐热薄膜剥离。该文献中还提出了如下方案:将自粘合弹性体层形成为大致点形或大致条纹形。
现有技术文献
专利文献
专利文献1:日本特开2010-174148号公报
专利文献2:日本特开平8-333556号公报
专利文献3:日本特开2014-7315号公报
发明内容
如专利文献1~3中公开那样,已知有各种粘合片。然而,既然粘合层保持着规定的粘合力,则在将粘合片从某种被粘物剥离时,有时会对被粘物施加过度的应力。对被粘物的过度的应力在专利文献1中提及的纸类、专利文献2中提及的塑料制品中也可能不太成为问题,但在过度的应力会导致品质劣化的被粘物乃至用途(例如精密部件、电子部件)中成为问题。例如,半导体封装体制造中,在粘附粘合片而加强印刷电路板后,进行芯片安装、回流焊、压缩成型等各工序的情况下,粘合片剥离时如果对印刷电路板施加过度的应力,则产生布线层的断路、剥离,可能导致成品率的降低。
这一点,还考虑如下方法:由通过加热或紫外线照射而会使粘合力降低的材料构成粘合层,通过剥离时的加热或紫外线照射而使粘合力丧失,从而使片容易剥离,但在紫外线照射的情况下,能适应的基材片或被粘物仅限定于能透过紫外线的物质。另外,存在如下问题:在剥离工序以前由于经受的热、紫外线的照射而使粘合层的粘合力发生不期望的降低,无法维持所需的密合力。例如,热膨胀性微胶囊包含于粘合层的情况下,通过加热而使构成胶囊的壳(shell)的热塑性树脂软化,且胶囊发生膨胀和发泡成为微空心球,从而粘合层的粘合力降低。然而,该热膨胀性微胶囊无法耐受回流焊(例如260℃以上)等加热工序。
本发明人等目前获得如下见解:可以提供一种粘合片,其采用可溶性粘合层作为粘合层,且由规定尺寸的岛状或条纹状的图案构成该可溶性粘合层,从而能够保持粘合层的粘合力直至即将剥离前,并且能在任意时刻、且以不对被粘物施加过度的应力的形式容易地进行片从被粘物的剥离。
因此,本发明的目的在于,提供一种粘合片,其能够保持粘合层的粘合力直至即将剥离前,并且能在任意时刻、且以不对被粘物施加过度的应力的形式容易地进行片从被粘物的剥离。
根据本发明的一方案,提供一种粘合片,其具备:基材片;和,可溶性粘合层,其以岛状或条纹状的图案设置于该基材片的至少一个面,
前述图案为岛状的情况下,构成该岛状的图案的各粘合性区域的外接圆的直径为0.1mm以上且10mm以下,前述图案为条纹状的情况下,构成该条纹状的图案的各粘合性区域的条纹宽度为0.1mm以上且10mm以下。
根据本发明的另一方案,提供一种从粘附有前述粘合片的被粘物将前述粘合片或前述基材片剥离的方法,所述方法包括如下工序:
使能溶解前述可溶性粘合层的含醇溶液浸入前述可溶性粘合层的岛状或条纹状的图案的间隙,使前述可溶性粘合层溶解或软化的工序;和,
在前述可溶性粘合层被溶解或软化的状态下,将前述粘合片或前述基材片从前述被粘物剥离的工序。
附图说明
图1为示出本发明的粘合片的一方案的截面示意图。
图2为图1所示的粘合片的上表面示意图。
图3为用于对剥离液渗透至可溶性粘合层的图案的间隙情况进行说明的图。
图4A为示出粘合性区域的形状的一例的图。
图4B为示出粘合性区域的形状的另一例的图。
图5为用于说明点图案的节圆直径(PCD)的图。
图6A为示出岛状的图案的一例的图。
图6B为示出由1个或多个簇构成的岛状的图案的一例的图。
图6C为示出由1个或多个簇构成的岛状的图案的另一例的图。
图6D为示出由1个或多个簇构成的岛状的图案的另一例的图。
图6E为示出由1个或多个簇构成的岛状的图案的另一例的图。
图6F为示出由1个或多个簇构成的岛状的图案的另一例的图。
图7A为示出半导体封装体制造中的粘合片的使用例的工序流程图。
图7B为示出半导体封装体制造中的粘合片的使用例的工序流程图,示出图7A所示的工序以及其之后的一例。
图7C为示出半导体封装体制造中的粘合片的使用例的工序流程图,示出图7A所示的工序以及其之后的另一例。
具体实施方式
粘合片
图1和2中示意性示出本发明的粘合片。如图1和2所示那样,本发明的粘合片10具备:基材片12;和,可溶性粘合层14,其位于基材片12的至少一个面。可溶性粘合层14以岛状或条纹状的图案设置。上述图案为岛状的情况下,构成上述岛状的图案的各粘合性区域14a的外接圆的直径为0.1~10mm。另一方面,上述图案为条纹状的情况下,构成上述条纹状的图案的各粘合性区域14a的条纹宽度为0.1~10mm。需要说明的是,本说明书中,“A~B”的表述所提及的数值范围是指,A以上且B以下。如此,采用可溶性粘合层14作为粘合层,且以规定尺寸的岛状或条纹状的图案构成可溶性粘合层14,从而能够保持可溶性粘合层14的粘合力直至即将剥离前,并且能在任意时刻、且以不对被粘物施加过度的应力的形式容易地进行片从被粘物的剥离。即,本发明的粘合片10中,采用可溶性粘合层14,因此,通过浸渍于能溶解可溶性粘合层14的液体(以下,称为剥离液),从而可以使可溶性粘合层14溶解或软化。且,通过以规定尺寸的岛状或条纹状的图案构成可溶性粘合层14,从而可以使剥离液(例如含醇溶液)有效地渗透至可溶性粘合层14的各处。认为这是由于,如图3中以虚线的箭头示意性示出那样,使粘接于被粘物20(例如印刷电路板)的可溶性粘合层14浸渍于剥离液L时,剥离液L有效地渗透至可溶性粘合层14的图案的间隙,可以促进与各粘合性区域14a的接触。其结果,能容易地进行片从被粘物20的剥离。需要说明的是,关于片从被粘物20的剥离,可以利用可溶性粘合层14的溶解自动地剥离;也可以在通过可溶性粘合层14的溶解或软化而粘合力显著降低了的状态下以机械的方式剥离。
如前述,一般的粘合片中,既然粘合层保持着规定的粘合力,则在将粘合片从某种被粘物剥离时,有时会对被粘物施加过度的应力。对被粘物的过度的应力在过度的应力会导致品质劣化的被粘物乃至用途(例如精密部件、电子部件)中成为问题。例如,半导体封装体制造中,在粘附粘合片而加强印刷电路板后,进行芯片安装、回流焊、压缩成型等各工序的情况下,粘合片剥离时如果对印刷电路板施加过度的应力,则产生布线层的断路、剥离,可能导致成品率的降低。这一点,也考虑了如下方法:由通过加热或紫外线照射而会使粘合力降低的材料构成粘合层,通过剥离时的加热或紫外线照射而使粘合力丧失,从而使片容易剥离,但是,该方法存在如下问题:在剥离工序以前由于经受的热、紫外线的照射而使粘合层的粘合力发生不期望的降低,变得无法维持所需的密合力。于此相对,本发明的粘合片10中,剥离液有效地渗透至以规定尺寸的岛状或条纹状的图案设置的可溶性粘合层14的各处,因此,可以以不对被粘物施加过度的应力形式进行片的剥离。且,可溶性粘合层14直至片即将剥离前都不会浸渍于剥离液,因此,可以保持可溶性粘合层14的粘合力直至即将剥离前,即,可以避免剥离工序以前的粘合层的粘合力的降低所导致的剥离。因此,可以保持粘合层的粘合力直至即将剥离前,并且能够在任意时刻进行片从被粘物的剥离。
尤其受到研究了采用FO-WLP(扇出型晶圆级封装(Fan-Out Wafer LevelPackaging))、PLP(面板级封装(Panel Level Packaging))的近年来的技术动向,要求层叠体的薄型化。然而,层叠体薄的情况下,从利用无芯积层法等制作的层叠体的基材将基材剥离时,积层层有时局部较大地弯曲。上述积层层的大的弯曲引起积层层内部的布线层的断路、剥离,其结果,会使布线层的连接可靠性降低。为了应对积层层内部的布线层的断路、剥离,考虑了如下方案:借助粘合剥离层,使加强片层叠于层叠体。由此,可以加强层叠体以使其不会局部较大地弯曲,由此,可以提高层叠体的连接可靠性和层叠体表面的平坦性(共面性)。根据本发明,存在如下优点:可以以不对层叠体施加过度的应力的方式,效率良好地进行通过可溶性粘合层14密合于层叠体的加强片的剥离。
粘合片10为粘接型粘合片和转印型粘合片中任一者均可。因此,关于粘合片10,可以粘合片10本身粘附于被粘物、基材片12本身呈现期望的功能(例如保护功能或加强功能);也可以如后述图7A的(c)和(d)所示那样,用于将可溶性粘合层14转印至第二基材片12’(例如保护片或加强片),转印后将当初的基材片12剥离。后者的情况下,如上所述得到的在第二基材片12’上转印可溶性粘合层14而成的层叠片也作为第二粘合片10’而被包含于本发明的粘合片的范围。
可溶性粘合层14以岛状或条纹状的图案设置于基材片12中的至少一个面。需要说明的是,可以将可溶性粘合层14设置于基材片12的两面。可溶性粘合层14构成岛状的图案的情况下,各粘合性区域14a的外接圆的直径为0.1~10mm、优选0.1~5.0mm、进一步优选0.1~2.0mm。另外,可溶性粘合层14构成条纹状的图案的情况下,各粘合性区域14a的条纹宽度为0.1~10mm、优选0.1~5.0mm、进一步优选0.1~2.0mm。如果为这样的范围内,则可以充分确保剥离液浸渍前的可溶性粘合层14所产生的粘合力,并且促进剥离液向可溶性粘合层14的图案的间隙的渗透,可以通过溶解剥离等而容易进行片从被粘物的剥离。
可溶性粘合层14优选为岛状的图案。岛状的图案是指,各粘合性区域14a被存在于其周围的不存在可溶性粘合层14的非粘合性区域14b所包围而成的形状。作为构成岛状的图案的各粘合性区域14a的具体形状,可以举出多边形、圆形等各种形状,也可以为图4A所示的星形多边形那样的直线的轮廓线曲折复杂的多边形、图4B所示的曲线的轮廓线曲折复杂的异形状。岛状的图案优选为点图案,各点的形状典型地为圆,但也可以为接近圆的形状。以构成点图案的各点的外接圆的直径定义的、点直径优选10mm以下、更优选0.1~5.0mm、进一步优选0.1~2.0mm。如此,可溶性粘合层14的表面积增加,溶解性提高,结果剥离性提高。另外,点图案的节圆直径(PCD)优选0.45~3.0mm、更优选0.6~2.4mm、进一步优选0.8~2.0mm。此处,本说明书中,“点图案的节圆直径(PCD)”如图5所示那样被定义为,点图案中,能连接最接近的3个点的中心的假想圆(节圆(PC))的直径(Pitch CircleDiameter)。如果为上述范围内的PCD,则可以充分确保剥离液侵入前的可溶性粘合层14所产生的粘合力,并且促进剥离液向可溶性粘合层14的图案的间隙的侵入,可以更进一步容易进行片从被粘物的剥离。
可溶性粘合层14的厚度优选0.5~50μm、更优选1.0μm以上且低于30μm、进一步优选1.0~20μm、特别优选2.0~15μm、最优选3.0~10μm。如果为上述范围内的厚度,则剥离液迅速地渗透至可溶性粘合层14的图案的间隙,因此,在粘合片10的剥离性提高的同时,可以降低岛状或条纹状图案对被粘物的压痕。特别是,半导体封装体制造中,在粘附粘合片而加强印刷电路板后,进行芯片安装、回流焊和压缩成型的情况下,源自粘合性区域14a的压痕有时残留于印刷电路板,但可溶性粘合层14的厚度如果为7.0μm以下,则有压痕不易残留于压缩成型后的印刷电路板的优点。这一点,使可溶性粘合层14为点图案的情况下,如果点直径为0.7mm以下、且可溶性粘合层14的厚度为1.0~7.0μm,则可以更有效地实现压痕的降低与剥离性这两者,故特别优选。
在可以在各粘合性区域14a之间确保充分的间隙的方面,优选的是,粘合性区域14a的外接圆的中心间的间隔大于外接圆的直径的平均值。从上述观点出发,粘合性区域的外接圆的中心间的间隔优选0.1~20mm、更优选0.2~10mm、进一步优选0.3~5.0mm、特别优选0.4~2.0mm。通过设为这样的范围,从而剥离液迅速地渗透至可溶性粘合层14的图案的间隙,因此,剥离性提高。
岛状的图案可以由作为整体赋予多边形、圆、圆环状、带状或格子状的花纹的1个或多个簇构成,簇可以分别由3个以上的粘合性区域的集合体构成。即,岛状的图案(例如点图案)不仅可以为如图6A所示那样、遍及基材片12的整个面地均匀地设置的形式,还可以为由3个以上的粘合性区域14a的集合体构成的1个或多个簇18作为整体赋予多边形(例如图6B所示的四边形)、图6C所示的圆、图6D所示的圆环状、图6E所示的带状、或图6F所示的格子状的花纹的形式。如此,存在如下优点:不仅可以提高美观,而且可以避开无需强粘合力的部位、容易残留粘合性区域14a的压痕的部位等而形成粘合性区域14a;可以削减每1张粘合片的可溶性粘合剂的用量;剥离液迅速地侵入未形成粘合性区域14a的区域,因此,可以效率良好地溶解可溶性粘合层14等。
粘合性区域14a相对于基材片12的设有可溶性粘合层14的面的总面积的比例优选3~90面积%、更优选3~75面积%、进一步优选5~60面积%、特别优选5~40面积%。此处,本说明书中,关于“基材片12的设有可溶性粘合层14的面的总面积”,在基材片12的单面设有可溶性粘合层14的情况下,是指基材片12的与可溶性粘合层14相邻的面的总面积,在可溶性粘合层14设置于基材片12的两面的情况下,是指基材片12的两面的总面积。粘合性区域14a的比例如果为上述范围内,则可以充分确保剥离液侵入前的可溶性粘合层14所产生的粘合力,并且促进剥离液向可溶性粘合层14的图案间隙的侵入,可以更进一步容易进行片从被粘物的剥离。但是,在出于简便固定的目的,只要具有工序上最低限度的粘合力就足够的用途中,就不限定于此。
可溶性粘合层14当然在室温下呈现粘合性,且为与剥离液接触而能溶解或软化的层。因此,可溶性粘合层14优选包含溶液可溶型树脂,例如包含酸可溶型树脂或碱可溶型树脂。该溶液可溶型树脂可以通过与剥离液的接触而有效地溶解或软化,因此,可以更有效地进行片从被粘物的剥离。
优选的溶液可溶型树脂为碱可溶型树脂。这是由于,在设想了印刷电路板等在制造工序中可能与中性、酸性的溶液接触的物品的应用的情况下,期望可溶性粘合层14实质上不溶解于中性、酸性的溶液。例如,考虑可溶性粘合层14用于印刷电路板的情况下,使用溶解于中性溶液的树脂(例如水溶性树脂)作为可溶性粘合层14的情况下,有时在印刷电路板的制造工序中的水洗工序中树脂发生溶解、或者由于大气中的水分的吸收而使树脂发生变质。另外,选择仅溶解于酸性的溶液的树脂(即,不溶解于中性、碱性的溶液的树脂)的情况下,印刷电路板的制造工序中的、表面的清洗工序即微蚀刻、电路形成的蚀刻中,大多使用酸性的化学溶液,因此,会导致可溶性粘合层14的粘合力的降低。不过,关于成为被粘物的物品在制造工序中不与中性、酸性的溶液接触的物品乃至用途,当然可以使用溶解于中性、酸性的溶液的树脂。
碱可溶型树脂特别优选包含聚合物,所述聚合物含有羧基和酚性羟基中的至少一者。这样的聚合物特别容易溶解于碱性溶液,因此,可以促进可溶性粘合层14的溶解,可以在更短时间内进行片从被粘物的剥离。作为含有羧基和酚性羟基中的至少一者的聚合物的例子,可以举出含有羧基的丙烯酸类树脂、和含有酚性羟基的苯酚酚醛清漆树脂。丙烯酸类树脂系粘合剂可以如下合成:使具有羧基、且分子内具有不饱和双键的丙烯酸类单体(例如丙烯酸、甲基丙烯酸)、与丙烯酸乙酯或丙烯酸丁酯共聚,从而可以合成。合成时,通过调整丙烯酸类单体的种类和比例,从而可溶性粘合层14的粘合力和在碱性溶液中的溶解性的控制成为可能。另外,可溶性粘合层14的粘合力和在碱性溶液中的溶解性的控制也可以如下进行:对于含有羧基的丙烯酸类树脂,添加引起羧基的交联反应的树脂(例如环氧树脂),从而可以进行。即,丙烯酸类树脂中的一部分的羧基利用环氧树脂等树脂而交联,从而分子量增大,因此,耐热性提高,相反地,粘合力降低,且在碱性溶液中的溶解性降低。另一方面,使用含有酚性羟基的苯酚酚醛清漆树脂作为碱可溶型树脂的情况下,若该树脂单独使用,则可溶性粘合层14的粘合力变弱,因此,优选通过混入松香等增粘剂,从而赋予适度的粘合性。
可溶性粘合层14包含碱可溶型树脂的情况下,作为剥离液使用的碱性溶液优选氢氧化钠溶液和/或氢氧化钾溶液。这些溶液的优选浓度为0.5~50重量%。如果为该范围内,则碱性变高,溶解力提高,且即使剥离液使用时的室温低的情况下,氢氧化钠和/或氢氧化钾也变得不易析出。另外,可以单独使用或与上述溶液一起使用水溶液表现出碱性的有机物(例如乙醇胺)。
为了缩短可溶性粘合层14的溶解时间,可以在碱性溶液中,添加能溶解丙烯酸类树脂和/或酚醛清漆树脂的有机溶剂(例如2-丙醇)。该有机溶剂的优选添加量相对于碱性溶液100重量%为5~50重量%。如果为该范围内,则理想地实现溶解时间的缩短,并且降低作业中的挥散量,因此,碱性物质的浓度管理变得容易,安全性也提高。优选的有机溶剂为醇,作为醇的优选例,可以举出2-丙醇、甲醇、乙醇和2-丁醇。
可以在碱性溶液中添加适量的表面活性剂。通过添加表面活性剂,从而溶液对树脂的渗透性、湿润性提高,因此,可以实现可溶性粘合层14的溶解时间的进一步的缩短。表面活性剂的种类没有特别限定,可以为任意表面活性剂。例如,作为水溶性的表面活性剂,阴离子系、阳离子系和非离子系的表面活性剂中任一者均可使用。
基材片12的形态不限定于一般被称为片的形态,可以为薄膜、板、箔等其他形态。基材片12也可以为层叠有这些片、薄膜、板和箔等的形态。另外,为了调整基材片12与可溶性粘合层14之间的粘接力,可以用研磨处理、脱模剂涂布、等离子体处理等公知的方法,对基材片12的涂布有可溶性粘合层14的表面预先实施表面处理。
根据本发明的优选方案,基材片12优选由聚对苯二甲酸乙二醇酯(PET)和聚乙烯(PE)中的至少一种树脂构成,更优选为聚对苯二甲酸乙二醇酯(PET)。特别是粘合片10作为转印型粘合片使用的情况下,基材片12期望具有如下功能:保持可溶性粘合层14的功能和将可溶性粘合层14转印至另行准备的被粘物或第二基材片的功能,本方案的基材片12适用于上述用途。作为转印型粘合片使用时的基材片12的优选厚度为10~200μm、更优选20~150μm、进一步优选25~75μm。
根据本发明的另一优选方案,基材片12优选由选自由金属(优选金属板、金属箔)、玻璃、玻璃环氧树脂、聚酰亚胺树脂和酚醛树脂(电木)组成的组中的至少1种构成。在一次性使用基材片12的情况下,从成本的观点出发,基材片12优选为酚醛树脂(电木)制,在重复使用基材片12的情况下,从强度的观点出发,基材片12优选为金属制。这些材料均具有耐热性,因此,可以防止热处理工序中的劣化。特别是粘合片10作为粘接型粘合片使用的情况下,基材片12在保持可溶性粘合层14的功能的基础上,还期望作为提高半导体封装体的制造工序中的、印刷电路板的操作性和防止或抑制弯曲的加强片发挥功能,本方案的基材片12适于上述用途。从基材片12的强度保持和基材片12的操作容易性的观点出发,作为粘接型粘合片使用时的基材片12的优选厚度优选10μm~1mm、更优选50~800μm、进一步优选100~600μm。
将粘合片10作为粘接型粘合片使用的情况下,基材片12的维氏硬度优选低于被粘物(例如印刷电路板)的维氏硬度。由此,将粘合片10在被粘物(例如印刷电路板)上层叠或剥离时,基材片12本身挠曲,从而可以良好地释放层叠或剥离时可能发生的应力,其结果,可以有效地防止或抑制被粘物(例如印刷电路板)的弯曲。基材片12的维氏硬度优选为被粘物(例如印刷电路板)的维氏硬度的2~99%,更优选为6~90%、进一步优选为10~85%。基材片12的维氏硬度优选50~700HV、更优选150~550HV、进一步优选170~500HV。需要说明的是,本说明书中,维氏硬度是依据JIS Z 2244-2009中记载的“维氏硬度试验”而测定的。
作为参考,以下示例能成为候选的各种材料的维氏硬度HV:蓝宝石玻璃(2300HV)、超硬合金(1700HV)、金属陶瓷(1650HV)、石英(水晶)(1103HV)、SKH56(高速度工具钢钢材、高速)(722HV)、强化玻璃(640HV)、SUS440C(不锈钢)(615HV)、SUS630(不锈钢)(375HV)、钛合金60种(64合金)(280HV前后)、铬镍铁合金(耐热镍合金)(150~280HV)、S45C(机械结构用碳钢)(201~269HV)、哈氏合金(耐腐蚀镍合金)(100~230HV)、SUS304(不锈钢)(187HV)、SUS430(不锈钢)(183HV)、铸铁(160~180HV)、钛合金(110~150HV)、黄铜(80~150HV)和青铜(50~100HV)。
将粘合片10作为粘接型粘合片使用的情况下,基材片12的依据JIS H 3130-2012的重复挠曲式试验而测定的、弹簧极限值Kb0.1优选100~1500N/mm2、更优选150~1200N/mm2、进一步优选200~1000N/mm2。如果为这样的范围内,则将粘合片10在被粘物(例如印刷电路板)上层叠或剥离时,基材片12本身挠曲,从而可以良好地释放层叠或剥离时可能发生的应力,其结果,可以更有效地防止或抑制被粘物(例如印刷电路板)的弯曲。另外,层叠或剥离时挠曲的基材片12发挥其弹性而可以瞬时恢复至本来的平坦的形状,因此,可以有效地维持被粘物(例如印刷电路板)的平坦性(共面性)。且,通过有效运用基材片12的弯曲和弹性,从而可以沿剥离方向(即,从被粘物(例如印刷电路板)远离的方向)对施加了剥离力的基材片12施力,其结果,更进一步顺利的剥离成为可能。
作为参考,以下的表1和2中示例对于能成为候选的各种材料的弹簧极限值Kb0.1。
[表1]
表1
[表2]
表2
将粘合片10作为粘接型粘合片使用的情况下,基材片12优选在厚度方向上具有贯通孔。如此,将粘合片10从被粘物(例如印刷电路板)剥离时,剥离液可以通过设置于基材片12的贯通孔而侵入可溶性粘合层14的图案的间隙,因此,可溶性粘合层14更有效地溶解,作为结果,剥离性更进一步提高。
如后述的图7A的(a)所示那样,从操作变容易的方面出发,粘合片10优选还具备层叠于可溶性粘合层14上的保护膜16。另外,保护膜16的材质没有特别限定,但优选为树脂制。作为构成保护膜的树脂的优选例,可以举出聚对苯二甲酸乙二醇酯(PET)、聚乙烯(PE)或它们的组合,更优选为聚对苯二甲酸乙二醇酯(PET)。保护膜16的厚度优选10~40μm、更优选15~30μm。保护膜16用于保护可溶性粘合层14直至使用粘合片10,因此,使用时从粘合片10剥离。因此,优选可溶性粘合层14与保护膜16之间的粘接力(例如剥离强度)低于可溶性粘合层14与基材片12之间的粘接力(例如剥离强度)。如此,可以使保护膜16比基材片12优先地剥离,因此,可以稳定地保持基材片12与可溶性粘合层14的密合状态,并且更容易且顺利地剥离保护膜16。为了调整保护膜16与可溶性粘合层14之间的粘接力,可以利用研磨处理、脱模剂涂布、等离子体处理等公知的方法,对保护膜16的涂布有可溶性粘合层14的表面预先实施表面处理。
半导体封装体制造中的粘合片的使用
本发明的粘合片10可以用于需要期望的粘合性的各种被粘物,其用途没有特别限定,最优选用于半导体封装体制造中的印刷电路板的加强。图7A~C中示出使用本发明的粘合片10的半导体封装体的制造工艺。需要说明的是,紧接着图7A所示的工序可以进行图7B所示的工序,紧接着图7A所示的工序也可以进行图7C所示的工序。任意情况下,图7A所示的工艺中,均准备依次具备基材片12、可溶性粘合层14和保护膜16的粘合片10作为转印型粘合片(工序(a))。接着,将保护膜16剥离(工序(b)),通过辊层压,将可溶性粘合层14转印至具备作为加强片的功能的第二基材片12’(工序(c)),将基材片12剥离(工序(d))。如此,由转印有可溶性粘合层14的第二基材片12’形成的第二粘合片10’也作为粘接型粘合片而被包含于本发明的粘合片的范围。然后,通过真空层压,将第二粘合片10’安装于印刷电路板20p(工序(e))。对于所得层叠体,对印刷电路板20p实施焊膏印刷后,如图7B所示那样,浸渍于碱性溶液(工序(i)),将第二基材片12’(加强片)剥离(工序(j)),或者也可以如图7C所示那样,实施半导体芯片22的安装(芯片安装)(工序(f))、回流焊(工序(g))和压缩成型(工序(h))后,浸渍于碱性溶液(工序(i)),可以将第二基材片12’(加强片)剥离(工序(j))。需要说明的是,如图7C所示那样,工序(h)中,半导体芯片22可以用绝缘树脂24密封。任意情况下,第二基材片12’均作为加强片发挥功能,因此,可以提高印刷电路板20p的连接可靠性和表面的平坦性(共面性),可以实现工序简略化、成品率提高。且,在直至剥离工序为止的期间,可以保持可溶性粘合层14的粘合力,因此,不会产生对操作造成妨碍的预料不到的剥离。并且,最后,浸渍于碱性溶液,从而可以以不对印刷电路板20p施加过度的应力的形式将第二基材片12’容易地从印刷电路板20p剥离。
粘合片的剥离方法
本发明的粘合片10可以通过粘附于任意被粘物20而使用。而且,从粘附有粘合片10的被粘物20剥离粘合片10或基材片12可以优选以如下步骤进行。
首先,使能溶解可溶性粘合层14的含醇溶液浸入可溶性粘合层14的岛状或条纹状的图案的间隙,使可溶性粘合层14溶解或软化。含醇溶液向间隙的浸入可以如下进行:通过浸渍等,使粘附有粘合片10的被粘物20的整体或一部分与作为剥离液的含醇溶液接触,从而进行。作为能溶解可溶性粘合层14的含醇溶液中所含的醇的优选例,可以举出2-丙醇、甲醇、乙醇和2-丁醇,从在水中的溶解性良好、且得到良好的剥离性的观点出发,最优选2-丙醇。含醇溶液中的醇浓度优选5~90重量%、更优选10~70重量%、进一步优选20~50重量%。如果为这样的范围内,则可以使可溶性粘合层14更有效地溶解或软化,且由于降低了醇浓度而更不易着火,安全性提高。从控制剥离性且稳定化的观点出发,优选含醇溶液为包含KOH、NaHCO3、Na2CO3、NaOH等碱性物质的溶液,含醇溶液中的上述碱性物质的优选浓度为0.1~30重量%,更优选0.5~20重量%、进一步优选1.0~15重量%。因此,含醇溶液可以包含前述的碱性溶液。
接着,在可溶性粘合层14被溶解或软化的状态下,将粘合片10或基材片12从被粘物20剥离。关于片从被粘物20的剥离,可以通过可溶性粘合层14的溶解而自动地剥离,也可以在通过可溶性粘合层14的溶解或软化而粘合力显著降低了的状态下以机械的方式剥离。
粘合片的制作方法
准备可溶性粘合剂,以岛状或条纹状的图案将该可溶性粘合剂印刷至基材片12上,形成可溶性粘合层14,从而可以制作粘合片10。可溶性粘合层14的图案和各粘合性区域14a的大小、形状与印刷中的版的设计基本等同,因此,通过适宜变更版的设计,从而可以形成期望的可溶性粘合层14。印刷方法利用点图案印刷、丝网印刷、凹版印刷(gravureprinting)等公知的方法进行即可,没有特别限定,从能进行稳定的连续印刷的方面、和能以卷对卷(Roll to Roll)方式进行印刷且量产性高的方面出发,优选使用凹版印刷。
实施例
根据以下的例子对本发明进一步具体进行说明。
例1~3
(1)粘合片的制作
在含羧基的丙烯酸类树脂(CoponylTM、日本合成化学工业株式会社制、N-2584)中,添加固化剂(TETRAD-C、三菱瓦斯化学株式会社制)1重量%,制备包含含有羧基的聚合物的可溶性粘合剂。将该可溶性粘合剂以表3所示的规定的点图案凹版印刷至聚对苯二甲酸乙二醇酯(PET)片,得到粘合片。该凹版印刷如下进行:使用雕刻有满足表3所示的样式(点直径(即,各点的外接圆的直径)、节圆直径(PCD)和粘合性区域比例)的点图案的印刷图像的版(印刷宽度约700mm、直径200mm的滚筒),以基材片与可溶性粘合层的总计厚度成为100μm的方式进行。
(2)粘合片的评价
对于所得粘合片,进行以下的各种评价。
<评价1-1:剥离性(碱性溶液)>
依据图7A和7B所示的工序流程图,进行碱性溶液中的剥离性评价。即,在粘合片10的设有可溶性粘合层14的面上层叠作为第二基材片12’的不锈钢板(工序(c)),之后,从该层叠体将基材片12剥离(工序(d))。如此,将粘合片10的可溶性粘合层14转印至作为第二基材片12’的不锈钢板。然后,借助可溶性粘合层14,将第二基材片12’(不锈钢板)粘附于印刷电路板20p,作为评价用层叠体26(工序(e))。在静置的状态下,使评价用层叠体26浸渍于剥离液(10重量%氢氧化钠溶液)(工序(i))。测定从浸渍开始至第二基材片12’(不锈钢板)从印刷电路板20p剥离所需的时间(最大18小时)(工序(j)),以以下的基准进行等级评价。结果如表3所示。
-评价AA:直至可溶性粘合层溶解、不锈钢板剥离为止的时间为30分钟以内。即,可溶性粘合层极快地溶解,因此,可以期待生产率的大幅提高。
-评价A:直至可溶性粘合层溶解、不锈钢板剥离为止的时间超过30分钟且为1小时以内。即,可溶性粘合层快速地溶解,因此,可以期待生产率的提高。
-评价B:直至可溶性粘合层溶解、不锈钢板剥离为止的时间超过1小时且为3小时以内。在不特别要求工艺高速化的情况下,该程度的剥离性就是充分的。
-评价C:浸渍18小时后,不锈钢板也不剥离。
<评价1-2:剥离性(含醇溶液)>
仅对于例2,作为剥离液,使用1.5重量%氢氧化钾和25重量%2-丙醇的混合液(即,含醇溶液)代替碱性溶液,除此之外,与评价1-1同样地进行剥离性评价。结果如表3所示。
<评价2:压痕残留(压缩成型后)>
依据图7A和7C所示的工序流程图,进行压缩成型后的压痕残留评价。即,以与评价1同样的步骤,制作评价用层叠体26(工序(c)~(e)),在评价用层叠体26的印刷电路板20p上安装半导体芯片22(工序(f)),进行回流焊(工序(g)),之后,以175℃、8MPa进行压缩成型(模制)(工序(h)),作为压痕残留评价用层叠体28。在静置的状态下,使该压痕残留评价用层叠体28浸渍于剥离液(10重量%氢氧化钠溶液)(工序(i)),从印刷电路板20p将第二基材片12’(不锈钢板)剥离(工序(j))。之后,对残留于印刷电路板20p的压痕进行显微镜观察,以以下的基准进行等级评价。结果如表3所示。
-评价A:压痕深度低于5μm。
-评价B:压痕深度为5μm以上且10μm以下。该程度的压痕深度对后续工序无影响,但外观不良。
-不能评价:浸渍18小时后,不锈钢板也不剥离,因此,无法评价压痕残留。
例4(比较)
使用未雕刻印刷图像的版(滚筒),整面涂布形成可溶性粘合层,除此之外,与例1同样地进行粘合片的制作以及评价1-1和2。结果如表3所示。
[表3]
Claims (19)
1.一种粘合片,其具备:基材片;和,可溶性粘合层,其以岛状或条纹状的图案设置于该基材片的至少一个面,
在所述图案为岛状的情况下,构成该岛状的图案的各粘合性区域的外接圆的直径为0.1mm以上且10mm以下,在所述图案为条纹状的情况下,构成该条纹状的图案的各粘合性区域的条纹宽度为0.1mm以上且10mm以下。
2.根据权利要求1所述的粘合片,其中,所述可溶性粘合层包含溶液可溶型树脂。
3.根据权利要求2所述的粘合片,其中,所述溶液可溶型树脂为碱可溶型树脂。
4.根据权利要求3所述的粘合片,其中,所述碱可溶型树脂包含聚合物,所述聚合物含有羧基和酚性羟基中的至少一者。
5.根据权利要求1~4中任一项所述的粘合片,其中,所述可溶性粘合层的厚度为0.5μm以上且50μm以下。
6.根据权利要求5所述的粘合片,其中,所述可溶性粘合层的厚度为3.0μm以上且低于10μm。
7.根据权利要求1~6中任一项所述的粘合片,其中,所述可溶性粘合层为所述岛状的图案。
8.根据权利要求1~7中任一项所述的粘合片,其中,所述岛状的图案为点图案。
9.根据权利要求8所述的粘合片,其中,所述点图案的点直径为0.7mm以下,且所述可溶性粘合层的厚度为1.0μm以上且7.0μm以下。
10.根据权利要求8或9所述的粘合片,其中,所述点图案的节圆直径(PCD)为0.45mm以上且3.0mm以下。
11.根据权利要求1~10中任一项所述的粘合片,其中,所述粘合性区域的外接圆的中心间的间隔大于所述外接圆的直径的平均值,且为0.1mm以上且20mm以下。
12.根据权利要求1~11中任一项所述的粘合片,其中,所述岛状的图案由作为整体赋予多边形、圆、圆环状、带状或格子状的花纹的1个或多个簇构成,所述簇分别由3个以上的所述粘合性区域的集合体构成。
13.根据权利要求1~12中任一项所述的粘合片,其中,所述粘合性区域相对于所述基材片的设有所述可溶性粘合层的面的总面积的比例为3~90面积%。
14.根据权利要求1~13中任一项所述的粘合片,其中,所述基材片由聚对苯二甲酸乙二醇酯(PET)和聚乙烯(PE)中的至少一种树脂构成。
15.根据权利要求1~13中任一项所述的粘合片,其中,所述基材片由选自由金属、玻璃、玻璃环氧树脂、聚酰亚胺树脂和酚醛树脂组成的组中的至少1种构成。
16.根据权利要求15所述的粘合片,其中,所述基材片在厚度方向具有贯通孔。
17.根据权利要求1~14中任一项所述的粘合片,其还具备保护膜,所述保护膜层叠于所述可溶性粘合层上。
18.根据权利要求17所述的粘合片,其中,所述保护膜由聚对苯二甲酸乙二醇酯(PET)和聚乙烯(PE)中的至少一种树脂构成。
19.一种从粘附有权利要求1~18中任一项所述的粘合片的被粘物将所述粘合片或所述基材片剥离的方法,所述方法包括如下工序:
使能溶解所述可溶性粘合层的含醇溶液浸入所述可溶性粘合层的岛状或条纹状的图案的间隙,使所述可溶性粘合层溶解或软化的工序;和,
在所述可溶性粘合层被溶解或软化的状态下,将所述粘合片或所述基材片从所述被粘物剥离的工序。
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US20190292415A1 (en) | 2019-09-26 |
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WO2018097265A1 (ja) | 2018-05-31 |
JP6496882B2 (ja) | 2019-04-10 |
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US11525073B2 (en) | 2022-12-13 |
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