CN109860130A - A kind of packaging body reducing laminated packaging structure for communication chip - Google Patents
A kind of packaging body reducing laminated packaging structure for communication chip Download PDFInfo
- Publication number
- CN109860130A CN109860130A CN201910049020.0A CN201910049020A CN109860130A CN 109860130 A CN109860130 A CN 109860130A CN 201910049020 A CN201910049020 A CN 201910049020A CN 109860130 A CN109860130 A CN 109860130A
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- Prior art keywords
- insulation crust
- communication chip
- pin
- chip
- packaging body
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of packaging bodies that laminated packaging structure is reduced for communication chip, are related to packaging body technical field, and the heat dissipation effect to solve the problem of existing communication chip packing-body is limited to be generally required external radiator fan just and can guarantee long-time running.The upper surface of the upper insulation crust is provided with model label, the side of the upper insulation crust is provided with input pin, the other side of the upper insulation crust is provided with output pin, metal coating is provided on the outer wall of the input pin and output pin, pin slot is provided on the two sides outer wall of the upper insulation crust, and one end of input pin and one end of output pin are run through and extend to the inside of pin slot, lower insulation crust is provided with below the upper insulation crust, the lower surface of the lower insulation crust is provided with welding plate, the welding plate is internally provided with mouth of connecting trough, soldered ball is installed below the mouth of connecting trough.
Description
Technical field
The present invention relates to packaging body technical field, specially a kind of encapsulation that laminated packaging structure is reduced for communication chip
Body.
Background technique
So-called " encapsulation technology " is a kind of technology for being packaged the plastics of integrated circuit insulation or ceramic material.With CPU
For, the volume and appearance actually seen is not the size and looks of real CPU core, but the elements such as CPU core pass through
Product after crossing encapsulation, encapsulation technology is necessary and vital for chip, because chip must be with the external world
Isolation, to prevent the impurity in air from causing electric property to decline the corrosion of chip circuit, on the other hand, the core after encapsulation
Piece is also more convenient for installing and be transported.Since the quality of encapsulation technology also directly influences the performance of chip self performance and therewith connects
The PCB's connect designs and manufactures, therefore it is vital.In addition to this, encapsulation alternatively refers to installation semiconductor collection
At the shell of circuit chip, it not only plays a part of placement, fixation, sealing, protection chip and increased thermal conductivity energy, but also
Or link up the bridge in the chip interior world and external circuit.
But the heat dissipation effect of existing communication chip packing-body is limited, generally requiring external radiator fan just can guarantee length
Time running；Therefore, it is unsatisfactory for existing demand, we have proposed one kind for communication chip reduction laminated packaging structure to this
Packaging body.
Summary of the invention
The purpose of the present invention is to provide a kind of packaging bodies that laminated packaging structure is reduced for communication chip, on solving
The heat dissipation effect for stating the existing communication chip packing-body proposed in background technique is limited, and generally requiring external radiator fan could protect
The problem of card operates for a long time.
To achieve the above object, the invention provides the following technical scheme: a kind of reduce stacked package knot for communication chip
The packaging body of structure, including upper insulation crust, the upper surface of the upper insulation crust are provided with model label, the upper insulation crust
Side be provided with input pin, the other side of the upper insulation crust is provided with output pin, the input pin and output
It is provided with metal coating on the outer wall of pin, pin slot is provided on the two sides outer wall of the upper insulation crust, and input
The inside of pin slot, the lower section setting of the upper insulation crust are run through and extended in one end of pin and one end of output pin
There is lower insulation crust, the lower surface of the lower insulation crust is provided with welding plate, and the welding plate is internally provided with mouth of connecting trough, institute
It states and soldered ball is installed below mouth of connecting trough, be provided with strip through-hole on the front end face and rear end face of the lower insulation crust,
The inside of the strip through-hole is equipped with non-woven fabrics strainer, and the outer wall surrounding of the non-woven fabrics strainer is provided with edge sealing, described
The inside of upper insulation crust and lower insulation crust is provided with encapsulation glue-line, and the encapsulation glue-line is internally provided with communication core
Piece, the upper surface of the communication chip are provided with solder joint, and there are six solder joint settings, are equipped with core below the communication chip
Plate base is provided with upper layer chip carrier below the chip substrate, is provided with lower layer chip below the upper layer chip carrier
Seat, the upper layer chip carrier are fixedly connected by connecting column with lower layer chip seat, the upper layer chip carrier, connecting column, lower layer's core
It is provided with tin protective layer on the outer wall of bar, heat dissipation cavity, institute are provided between the upper layer chip carrier and lower layer chip seat
The inside for stating heat dissipation cavity is equipped with cooling fin, is provided with heat-conducting silicone grease between the cooling fin and upper layer chip carrier.
Preferably, the upper insulation crust is fixedly connected by sealant with lower insulation crust.
Preferably, the soldered ball is internally provided with column-like projection block, and column-like projection block is fixed by mouth of connecting trough and welding plate
Connection.
Preferably, one end of the column-like projection block is provided with spherical solder, and the vertical center line of column-like projection block and spherical shape
The vertical center line of solder joint is overlapped.
Preferably, the two sides of the non-woven fabrics strainer are mounted on U-shaped card plate, and U-shaped card plate and lower insulation crust is interior
Wall is welded to connect.
Preferably, the U-shaped card plate is internally provided with card slot, and non-woven fabrics strainer is fixed by card slot and U-shaped snap-gauge
Connection.
Preferably, the communication chip is electric with one end of input pin and one end of output pin respectively by plain conductor
Property connection.
Preferably, bonding elargol layer is provided between the chip substrate and upper layer chip carrier, and chip substrate is by gluing
Elargol layer is closed to be fixedly connected with upper layer chip carrier.
Preferably, there are three the input pin and output pin are respectively provided with, and input pin and output pin are about logical
Believe that the vertical center line of chip is symmetrical.
Preferably, there are six the strip through-hole settings, and adjacent bar through-hole is equally spaced.
Compared with prior art, the beneficial effects of the present invention are:
1, it is empty to be provided with heat dissipation by using the chip carrier of up-down structure by the present invention between upper layer chip carrier and lower layer chip seat
Chamber, and the inside for the cavity that radiates is equipped with cooling fin, when communication chip driving, the inside of packaging body can generate heat, at this time
The heat that packaging body issues can be more effectively transmitted to the inside of heat dissipation cavity by cooling fin, then pass through lower insulation crust outer wall
On strip through-hole be dispersed into surrounding air, to increase the sinking path of the communication chip packaging body, and then improve
The radiating efficiency of packaging body, the inside of strip through-hole are equipped with non-woven fabrics strainer, and non-woven fabrics strainer good permeability can be in not shadow
Dust-proof effect is played while ringing strip through-hole heat dissipation performance.
2, by the way that tin protective layer is arranged on the outer wall of chip carrier, because chip carrier is up-down structure, upper layer chip carrier is under
It is provided with cavity between layer chip carrier, so can inevitably contact with air, the use of tin protective layer, helps to prevent chip carrier quilt
Oxidation, to improve the service life of packaging part to a certain extent.
3, by installing upper layer and lower layer insulation crust on the outer wall of packaging body, insulation crust can be inside protection packaging body
Communication chip, improve the bend resistance ability of packaging part entirety, and upper insulation crust and lower insulation crust are fixed by sealant
Connection, sealant can be improved the air-tightness of shell, prevent air from touching the communication chip of package interior, cause oxidation anti-
It answers.
4, by the way that metal coating is arranged on the outer wall of input pin and output pin, input pin and output are drawn on outer wall
Metal coating the moisture-proof heat-insulation performance of pin can be improved, make pin will not be by such environmental effects, and metal coating can
Make pin easier and welding circuit board, to improve its electric conductivity.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is schematic diagram of internal structure of the invention；
Fig. 3 is strip through-hole schematic diagram of internal structure of the invention；
Fig. 4 is present invention looks up structural representation of the invention；
Fig. 5 is partial enlarged view at A of the invention；
In figure: 1, upper insulation crust；2, model label；3, pin slot；4, lower insulation crust；5, strip through-hole；6, non-woven fabrics is filtered
Net；601, edge sealing；602, U-shaped card plate；603, card slot；7, welding plate；8, input pin；9, output pin；10, sealant；11, golden
Belong to plated film；12, glue-line is encapsulated；13, communication chip；14, solder joint；15, plain conductor；16, chip substrate；17, elargol layer is bonded；
18, tin protective layer；19, upper layer chip carrier；20, connecting column；21, cooling fin；22, heat-conducting silicone grease；23, radiate cavity；24, lower layer
Chip carrier；25, soldered ball；251, mouth of connecting trough；252, column-like projection block；253, spherical solder.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Fig. 1-5 is please referred to, a kind of embodiment provided by the invention: a kind of to reduce laminated packaging structure for communication chip
Packaging body, including upper insulation crust 1, the upper surface of upper insulation crust 1 are provided with model label 2, and model label 2 can conveniently pair
The specification of the communication chip is identified that the side of upper insulation crust 1 is provided with input pin 8, and input pin 8 can be by circuit
Electric current in plate introduces, and the other side of upper insulation crust 1 is provided with output pin 9, and output pin 9 can will be in communication chip 13
The electric current in portion leads back circuit board, is provided with metal coating 11, metal coating 11 on the outer wall of input pin 8 and output pin 9
The moisture-proof heat-insulation electric conductivity of pin can be improved, pin slot 3 is provided on the two sides outer wall of upper insulation crust 1, and input
The inside of pin slot 3, the lower section setting of upper insulation crust 1 are run through and extended in one end of pin 8 and one end of output pin 9
There is lower insulation crust 4, the lower surface of lower insulation crust 4 is provided with welding plate 7, and welding plate 7 is internally provided with mouth of connecting trough 251, even
The lower section of access slot mouth 251 is equipped with soldered ball 25, and packaging part is connect by soldered ball 25 with welding circuit board, before lower insulation crust 4
Strip through-hole 5 is provided on end face and rear end face, strip through-hole 5 plays the role of heat dissipation, and the inside of strip through-hole 5 is equipped with
Non-woven fabrics strainer 6,6 good permeability of non-woven fabrics strainer can play dust-proof while not influencing 5 heat dissipation performance of strip through-hole
Effect, the outer wall surrounding of non-woven fabrics strainer 6 are provided with edge sealing 601, and the inside of upper insulation crust 1 and lower insulation crust 4 is all provided with
It is equipped with encapsulation glue-line 12, encapsulation glue-line 12 is internally provided with communication chip 13, and the upper surface of communication chip 13 is provided with solder joint
14, and there are six the settings of solder joint 14, communication chip 13 is welded to connect by solder joint 14 and plain conductor 15, under communication chip 13
Side is equipped with chip substrate 16, and chip substrate 16 plays the role of fixed communication chip 13, and the lower section of chip substrate 16 is provided with
Upper layer chip carrier 19, the lower section of upper layer chip carrier 19 are provided with lower layer chip seat 24, upper layer chip carrier 19 and lower layer chip seat 24
Play the role of supporting communication chip 13, upper layer chip carrier 19 is fixedly connected by connecting column 20 with lower layer chip seat 24, upper layer
Chip carrier 19, connecting column 20, lower layer chip seat 24 outer wall on be provided with tin protective layer 18, tin protective layer 18 helps to prevent
Chip carrier is oxidized, so that the service life of packaging part is improved to a certain extent, upper layer chip carrier 19 and lower layer chip seat
Heat dissipation cavity 23 is provided between 24, the inside of heat dissipation cavity 23 is equipped with cooling fin 21, and cooling fin 21 can send out packaging body
Heat out is more effectively transmitted to the inside of heat dissipation cavity, then is dispersed into week by the strip through-hole on lower insulation crust outer wall
It encloses in air, heat-conducting silicone grease 22 is provided between cooling fin 21 and upper layer chip carrier 19, heat-conducting silicone grease 22 can be improved cooling fin
21 heating conduction.
Further, upper insulation crust 1 is fixedly connected by sealant 10 with lower insulation crust 4, upper insulation crust 1 and lower exhausted
Edge shell 4 plays the role of protecting internal communication chip 13, improves the buckle resistance energy of packaging body, will be upper using sealant 10
Insulation crust 1 is fixedly connected with that air-tightness is good with lower insulation crust 4, and air can be effectively prevent to touch the communication of package interior
Chip 13.
Further, soldered ball 25 is internally provided with column-like projection block 252, and column-like projection block 252 passes through mouth of connecting trough 251 and weldering
Plate 7 is fixedly connected, and column-like projection block 252 can prevent pad excessively close from packaging body, is damaged to the bottom of packaging body, mouth of connecting trough
251 can make column-like projection block 252 and the connection of welding plate 7 more firm.
Further, one end of column-like projection block 252 is provided with spherical solder 253, and the vertical center line of column-like projection block 252 with
The vertical center line of spherical solder 253 is overlapped, and packaging body is connect by spherical solder 253 with welding circuit board.
Further, the two sides of non-woven fabrics strainer 6 are mounted on U-shaped card plate 602, and U-shaped card plate 602 and lower insulation crust 4
Inner wall be welded to connect, 6 good permeability of non-woven fabrics strainer can play anti-while not influencing 5 heat dissipation performance of strip through-hole
Non-woven fabrics strainer 6 can be fixed on the inner wall of lower insulation crust 4 by the effect of dirt, U-shaped card plate 602.
Further, U-shaped card plate 602 is internally provided with card slot 603, and non-woven fabrics strainer 6 passes through card slot 603 and U-shaped card
Plate 602 is fixedly connected, and non-woven fabrics strainer 6 is mounted in U-shaped card plate 602 using card slot 603, structure is simple, fixed.
Further, communication chip 13 passes through the one end with one end of input pin 8 and output pin 9 respectively of plain conductor 15
It being electrically connected, the electric current on circuit board returns to circuit board by output pin 9 again into communication chip 13 by input pin 8, with
Activation communication chip 13 completes operation to reach, and handles the effect of task.
Further, bonding elargol layer 17 is provided between chip substrate 16 and upper layer chip carrier 19, and chip substrate 16 is logical
It crosses bonding elargol layer 17 to be fixedly connected with upper layer chip carrier 19, upper layer chip carrier 19 plays the role of supporting chip substrate 16, adopts
It is fixed with bonding elargol layer 17, connection between the two can be made more firm.
Further, there are three input pin 8 and output pin 9 are respectively provided with, and input pin 8 and output pin 9 are about logical
Believe that the vertical center line of chip 13 is symmetrical, input pin 8 plays the role of input current, and output pin 9 plays output electric current
Effect, input pin 8 and output pin 9 together constitute the interface of communication chip 13.
Further, there are six the settings of strip through-hole 5, and adjacent bar through-hole 5 is equally spaced, and strip through-hole 5 plays as envelope
The effect of body internal heat dissipating is filled, six strip through-holes 5, which are arranged, can effectively improve its heat dissipation performance.
Working principle: in use, the soldered ball 25 by package bottom welds the corresponding position on packaging body and circuit board
It connecing in succession, is internally provided with column-like projection block 252 because of soldered ball 25, column-like projection block 252 can prevent pad excessively close from packaging body,
Be damaged to the bottom of packaging body, after welding, by input pin 8 and output pin 9 respectively on circuit board input terminal and
The connection of output end electric wire, is provided with metal coating 11 on the outer wall of input pin 8 and output pin 9, and metal coating 11 can be with
The moisture-proof heat-insulation performance for improving pin makes pin more easily and welding circuit board, improves its electric conductivity, the electric current on circuit board
Circuit board is returned to by output pin 9 again into communication chip 13 by input pin 8, reaches and completes to activate communication chip 13
Operation handles the effect of task, and when communication chip 13 drives, package interior can generate heat, because chip carrier is using knot up and down
Structure, be provided between upper layer chip carrier 19 and lower layer chip seat 24 heat dissipation cavity 23, and radiate cavity 23 inside be equipped with it is scattered
The heat that packaging body issues can be more effectively transmitted to the inside of heat dissipation cavity 23 by backing 21, cooling fin 21, then under passing through
Strip through-hole 5 on 4 outer wall of insulation crust is dispersed into surrounding air, to increase the heat dissipation way of the communication chip packaging body
Diameter, and then the radiating efficiency of packaging body is improved, the inside of strip through-hole 5 is equipped with non-woven fabrics strainer, can not influence item
Dust-proof effect is played while shape 5 heat dissipation performance of through-hole, dispenses and is provided with insulation crust on the outer wall of body, insulation crust can
Communication chip inside protection packaging part improves the bend resistance ability of packaging part entirety.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
Claims (10)
1. a kind of packaging body for reducing laminated packaging structure for communication chip, including upper insulation crust (1), it is characterised in that:
The upper surface of the upper insulation crust (1) is provided with model label (2), and the side of the upper insulation crust (1) is provided with input
The other side of pin (8), the upper insulation crust (1) is provided with output pin (9), the input pin (8) and output pin
(9) it is provided on outer wall metal coating (11), is provided with pin slot on the two sides outer wall of the upper insulation crust (1)
(3), and the inside of pin slot (3) is run through and extended in one end of input pin (8) and one end of output pin (9), described
It is provided with lower insulation crust (4) below upper insulation crust (1), the lower surface of the lower insulation crust (4) is provided with welding plate
(7), the welding plate (7) is internally provided with mouth of connecting trough (251), below the mouth of connecting trough (251) is equipped with soldered ball
(25), it is provided with strip through-hole (5) on the front end face and rear end face of the lower insulation crust (4), the strip through-hole (5)
Inside is equipped with non-woven fabrics strainer (6), and the outer wall surrounding of the non-woven fabrics strainer (6) is provided with edge sealing (601), described exhausted
The inside of edge shell (1) and lower insulation crust (4) is provided with encapsulation glue-line (12), the inside setting of encapsulation glue-line (12)
Have communication chip (13), the upper surface of the communication chip (13) is provided with solder joint (14), and there are six solder joint (14) settings, institute
It states and is equipped with below communication chip (13) chip substrate (16), be provided with upper layer chip carrier below the chip substrate (16)
(19), it is provided with lower layer chip seat (24) below the upper layer chip carrier (19), the upper layer chip carrier (19) passes through connection
Column (20) is fixedly connected with lower layer chip seat (24), the upper layer chip carrier (19), connecting column (20), lower layer chip seat (24)
It is provided on outer wall tin protective layer (18), it is empty that heat dissipation is provided between the upper layer chip carrier (19) and lower layer chip seat (24)
The inside of chamber (23), heat dissipation cavity (23) is equipped with cooling fin (21), the cooling fin (21) and upper layer chip carrier (19)
Between be provided with heat-conducting silicone grease (22).
2. a kind of packaging body for reducing laminated packaging structure for communication chip according to claim 1, it is characterised in that:
The upper insulation crust (1) is fixedly connected by sealant (10) with lower insulation crust (4).
3. a kind of packaging body for reducing laminated packaging structure for communication chip according to claim 1, it is characterised in that:
The soldered ball (25) is internally provided with column-like projection block (252), and column-like projection block (252) passes through mouth of connecting trough (251) and welding plate
(7) it is fixedly connected.
4. a kind of packaging body for reducing laminated packaging structure for communication chip according to claim 3, it is characterised in that:
One end of the column-like projection block (252) is provided with spherical solder (253), and the vertical center line of column-like projection block (252) and spherical shape
The vertical center line of solder joint (253) is overlapped.
5. a kind of packaging body for reducing laminated packaging structure for communication chip according to claim 1, it is characterised in that:
The two sides of the non-woven fabrics strainer (6) are mounted on U-shaped card plate (602), and U-shaped card plate (602) and lower insulation crust (4) is interior
Wall is welded to connect.
6. a kind of packaging body for reducing laminated packaging structure for communication chip according to claim 5, it is characterised in that:
The U-shaped card plate (602) is internally provided with card slot (603), and non-woven fabrics strainer (6) passes through card slot (603) and U-shaped snap-gauge
(602) it is fixedly connected.
7. a kind of packaging body for reducing laminated packaging structure for communication chip according to claim 1, it is characterised in that:
The communication chip (13) is electric with one end of input pin (8) and one end of output pin (9) respectively by plain conductor (15)
Property connection.
8. a kind of packaging body for reducing laminated packaging structure for communication chip according to claim 1, it is characterised in that:
Bonding elargol layer (17) is provided between the chip substrate (16) and upper layer chip carrier (19), and chip substrate (16) is by gluing
Elargol layer (17) are closed to be fixedly connected with upper layer chip carrier (19).
9. a kind of packaging body for reducing laminated packaging structure for communication chip according to claim 1, it is characterised in that:
There are three the input pin (8) and output pin (9) are respectively provided with, and input pin (8) and output pin (9) are about communication core
The vertical center line of piece (13) is symmetrical.
10. a kind of packaging body for reducing laminated packaging structure for communication chip according to claim 1, feature exist
In: there are six strip through-hole (5) settings, and adjacent bar through-hole (5) is equally spaced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910049020.0A CN109860130A (en) | 2019-01-18 | 2019-01-18 | A kind of packaging body reducing laminated packaging structure for communication chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910049020.0A CN109860130A (en) | 2019-01-18 | 2019-01-18 | A kind of packaging body reducing laminated packaging structure for communication chip |
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| CN109860130A true CN109860130A (en) | 2019-06-07 |
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| CN201910049020.0A Pending CN109860130A (en) | 2019-01-18 | 2019-01-18 | A kind of packaging body reducing laminated packaging structure for communication chip |
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Cited By (1)
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| CN113573508A (en) * | 2021-07-22 | 2021-10-29 | 深圳市联明电源有限公司 | DC/DC power module with self-destruction disposable mounting pin |
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| CN208173577U (en) * | 2018-06-07 | 2018-11-30 | 上海滢立电子科技有限公司 | A kind of encapsulating structure of chip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573508A (en) * | 2021-07-22 | 2021-10-29 | 深圳市联明电源有限公司 | DC/DC power module with self-destruction disposable mounting pin |
| CN113573508B (en) * | 2021-07-22 | 2022-04-26 | 深圳市联明电源有限公司 | DC/DC power module with self-destruction disposable mounting pin |
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