CN201623098U - Packaging structure of printed circuit board with flip chip connected with external radiator - Google Patents
Packaging structure of printed circuit board with flip chip connected with external radiator Download PDFInfo
- Publication number
- CN201623098U CN201623098U CN2010201200905U CN201020120090U CN201623098U CN 201623098 U CN201623098 U CN 201623098U CN 2010201200905 U CN2010201200905 U CN 2010201200905U CN 201020120090 U CN201020120090 U CN 201020120090U CN 201623098 U CN201623098 U CN 201623098U
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- CN
- China
- Prior art keywords
- chip
- radiator
- circuit board
- printed circuit
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a packaging structure of a printed circuit board with a flip chip connected with an external radiator, which comprises a chip (3), a single or a plurality of printed circuit board(s) (9) supported below the chip, a metal convex block (10) for signal interconnection of the chip and the printed circuit board(s) and a conductive or non-conductive heat-conducting bonding substance I (2) between the chip and the printed circuit board(s). The packaging structure is characterized in that a radiator (11) is arranged above the chip (3), a conductive or non-conductive heat-conducting bonding substance II (6) is embedded between the radiator (11) and the chip (3), and the chip (3) and the metal convex block (10) are enclosed in the area surrounded by the radiator (11) and the printed circuit board(s) (9). The utility model can enhance the radiating capability so that the heat of the chip can be rapidly transmitted out of the packaging body.
Description
(1) technical field
The utility model relates to a kind of chip of printed circuit board upside-down mounting external radiator packaging structure.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability strong chip of printed circuit board upside-down mounting external radiator packaging structure.
The purpose of this utility model is achieved in that a kind of chip of printed circuit board upside-down mounting external radiator packaging structure, include chip, the single or multiple lift printed substrate that is carried of chip below, metal coupling and the conduction between chip and the described single or multiple lift printed substrate or the nonconducting heat conduction bonding material I that chip is used to the signal interconnection of single or multiple lift printed substrate, it is characterized in that above described chip, being provided with radiator, be equipped with conduction or nonconducting heat conduction bonding material II between this radiator and the described chip; This radiator is encapsulated in described chip and metal coupling in the zone that is surrounded by this radiator and described single or multiple lift printed substrate.
The beneficial effects of the utility model are:
The utility model is served as the function of the heat radiation of high heat by addition radiator above chip, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the utility model chip of printed circuit board upside-down mounting external radiator packaging structure schematic diagram.
Reference numeral among the figure:
Conduction or nonconducting heat conduction bonding material I 2, chip 3, conduction or nonconducting heat conduction bonding material II 6, printed substrate 9, metal coupling 10, radiator 11.
(5) embodiment
Referring to Fig. 5, Fig. 5 is the utility model chip of printed circuit board upside-down mounting external radiator packaging structure schematic diagram.As seen from Figure 5, the utility model chip of printed circuit board upside-down mounting external radiator packaging structure, include chip 3, the single or multiple lift printed substrate 9 that is carried of chip below, metal coupling 10 and the conduction between chip 3 and the described single or multiple lift printed substrate or the nonconducting heat conduction bonding material I 2 that chip is used to the signal interconnection of single or multiple lift printed substrate, above described chip 3, be provided with radiator 11, be equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiator 11 and the described chip 3; This radiator 11 is encapsulated in described chip 3 and metal coupling 10 in the zone that is surrounded by this radiator 11 and described single or multiple lift printed substrate 9.
The material of described metal coupling 10 can be tin, gold or alloy etc.
The material of described radiator 11 can be copper, aluminium, pottery or alloy etc.
Claims (3)
1. chip of printed circuit board upside-down mounting external radiator packaging structure, include the single or multiple lift printed substrate (9) that is carried of chip (3), chip below, metal coupling (10) that chip is used to the signal interconnection of single or multiple lift printed substrate and conduction or the nonconducting heat conduction bonding material I (2) between chip and the described single or multiple lift printed substrate, it is characterized in that being provided with radiator (11), be equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiator (11) and the described chip (3) in described chip (3) top; This radiator (11) is encapsulated in described chip (3) and metal coupling (10) in the zone that is surrounded by this radiator (11) and described single or multiple lift printed substrate (9).
2. a kind of chip of printed circuit board upside-down mounting external radiator packaging structure according to claim 1, the material that it is characterized in that described metal coupling (10) is tin, gold or alloy.
3. a kind of chip of printed circuit board upside-down mounting external radiator packaging structure according to claim 1, the material that it is characterized in that described radiator (11) is copper, aluminium, pottery or alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201200905U CN201623098U (en) | 2010-01-30 | 2010-01-30 | Packaging structure of printed circuit board with flip chip connected with external radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201200905U CN201623098U (en) | 2010-01-30 | 2010-01-30 | Packaging structure of printed circuit board with flip chip connected with external radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201623098U true CN201623098U (en) | 2010-11-03 |
Family
ID=43026555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201200905U Expired - Fee Related CN201623098U (en) | 2010-01-30 | 2010-01-30 | Packaging structure of printed circuit board with flip chip connected with external radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201623098U (en) |
-
2010
- 2010-01-30 CN CN2010201200905U patent/CN201623098U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101103 Termination date: 20140130 |