CN109845294B - 压力传感器,特别是具有改进布局的麦克风 - Google Patents
压力传感器,特别是具有改进布局的麦克风 Download PDFInfo
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- CN109845294B CN109845294B CN201780061393.9A CN201780061393A CN109845294B CN 109845294 B CN109845294 B CN 109845294B CN 201780061393 A CN201780061393 A CN 201780061393A CN 109845294 B CN109845294 B CN 109845294B
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- Pressure Sensors (AREA)
Abstract
特别是麦克风类型的机电压力传感器***,包括:机电换能器、信号处理装置、用于接纳机电换能器和/或信号处理装置的至少一个支撑件(20,30)的基板(1)、布置在基板(1)的上部面(3)上的保护盖(40),机电换能器和/或信号处理装置的支撑件(20,30)被容纳在位于基板的下部面上的至少一个腔室中。
Description
技术领域
本申请涉及机电***领域,更具体地涉及压力传感器***领域,并且有利地涉及设置有至少一个微机电***(“microelectromechanical systems”,MEMS)机电部件和/或纳机电***(“nano-electromechanical systems”,NEMS)机电部件的麦克风。
背景技术
压力传感器的MEMS和/或NEMS部件、特别是麦克风的MEMS和/或NEMS部件包括通常呈振荡膜的形式的敏感元件,该敏感元件在其两个面之间的压差的作用下变形。膜通常在偏离平面的方向(即垂直于机电部件的主平面)上变形。在麦克风类型的压力传感器中,由输入声波引起的移动的开始转换为电信号,例如转换为由于在固定电极和附接到膜或由膜形成的可动电极之间的电容变化引起的信号。
机电部件通常与诸如芯片或专用集成电路(“Application-Specific IntegratedCircuit”,ASIC)的电子部件相关联并且连接,该电子部件设置有用于处理来自机电部件的信号的装置。电子部件和机电部件通常设置在组装基板上并且放置在由组装基板和保护盖形成的外壳中。组装基板可以包括连接件,并且可以被致使转移到电子板。
出于成本和体积的原因,试图使压力传感器或麦克风的体积变得越来越小。
此外,这种***的性能中的一个重要因素是后室的容积,其表示位于膜的后部面的后方或者位于膜的后部面一侧上(也就是位于与称为前部面的面相对的面一侧上)的外壳中的容积,穿过输入端口的声波首先到达该前部面。后室的该容积或“后部容积”表示当膜振荡时的补偿容积。通常试图使该后部容积最大化,以便提高麦克风的性能,特别是在信噪比和低频率响应方面的性能。通常试图同时使***的另一容积最小化,该另一容积称为“前室容积”或“前部容积”并且关于敏感元件位于与后部容积相对的位置。
文献US9 264 815 B2提供了一种麦克风形成***,其中,为了减小体积,ASIC设置在位于组装基板的上部面一侧上的腔室中,而机电部件设置在ASIC上方。在这种***中,声波的输入端口是设置在盖中的孔口,该盖设置在基板的上部面上。由于ASIC在腔室中的存在,这种***具有减小的后室容积,这可能不利于其性能。
在文献US2015/0189443 A1中,对于体积问题的替代解决方案包括:将机电部件放置在位于组装基板的上部面一侧上的腔室中,而ASIC叠置在机电部件上。在这种***中,声波的输入端口因此是设置在基板的下部面处并且与腔室连通的孔口,可以引起寄生谐振的前室容积仍然相对大。另外,由于ASIC在后室中的存在,这种***具有减小的后室容积,这也可能不利于其性能。此外,这种***不适用于其中盖用作声波的输入端口的构造。
存在的问题是找到一种新的压力传感器结构,该压力传感器结构相对于上述缺点得到改善,特别是对于给定的压力传感器体积增加后室容积。
发明内容
本发明的一个实施例提供了一种压力传感器机电***,包括:
-机电换能器,该机电换能器设置有敏感元件,该敏感元件能够在该敏感元件的面之间的压差的作用下移动,
-信号处理装置,该信号处理装置用于处理由敏感元件的移动产生的信号,
-基板,该基板用于容纳机电换能器和/或信号处理装置的至少一个支撑件,基板具有上部面和与上部面相对的下部面,下部面设置有至少一个能够与电子板连接的导电区域,基板进一步包括穿过其厚度的孔口,孔口包括在基板的上部面处开口的第一孔,且在该第一孔的延伸部分中,第一腔室在基板的下部面处开口,第一腔室具有的宽度大于第一孔的宽度以便形成肩部,机电换能器的和/或信号处理装置的支撑件被容纳在第一腔室中,使得支撑件的前部面的一区段抵靠肩部的支承区域。
在换能器集成到所述支撑件的情况下,第一腔室可以形成声波的输入端口。
在信号处理装置集成到所述支撑件并且机电换能器集成到设置在基板的上部面上的另一个支撑件的另一种情况下,***的布置可以使得第一孔被所述支撑件密封,而盖包括形成声波的输入端口的孔口。有利地,与第一孔不同的第二孔位于第一腔室的延伸部分中。因此,支撑件可以通过穿过第二孔的导线连接到基板。
根据另一方面,本发明特别涉及一种压力传感器机电***,包括:
-第一结构,该第一结构包括机电换能器,该机电换能器设置有敏感元件,该敏感元件能够在敏感元件的面之间的压差的作用下移动,
-第二结构,该第二结构包括信号处理装置,该信号处理装置用于处理由敏感元件的移动产生的信号,
-用于容纳第一结构和第二结构的基板,基板包括上部面和与上部面相对的下部面,第一结构和第二结构设置在一个或更多个腔室中,该腔室形成于基板中并且开口至基板的面中的至少一个面,下部面设置有至少一个连接导电区域,
在所述腔室中的设置有第一结构的第一腔室开口至基板的下部面,所述第一腔室与第一孔连通,第一孔在所述第一腔室和基板的上部面之间穿过基板,腔室具有的宽度大于所述第一孔的宽度以便形成肩部,第一结构的前部面抵靠肩部的支承区域。这样的肩部 能够便于基板和第一结构之间的组装,该基板和第一结构可以是彼此独立的部件。
这种***可以形成麦克风或者集成到麦克风。支撑件的这种布置允许增加紧凑性。
机电***可以设置有布置在基板的上部面上的保护盖。
肩部的支承区域特别是在位于第一腔室和第一孔之间的界面处或边界处的平面
中的区域。在这样的区域上的布置使得第一结构能够被稳固地保持。
根据可能的实施方式,***可以包括在位于基板的下部面上的导电区域和第一结构的支撑件的导电区域之间的连接结构,连接结构包括穿过基板的至少一个导电元件。连接结构的这种布置也允许增加***的紧凑性。
根据一个实施例,连接结构包括穿过第一孔的导线,该导线连接位于基板的上部面上的导电区域和第一结构的支撑件的导电区域。
根据连接结构的另一实施例,导电元件穿过基板并且具有弯曲的形状,导电元件布置成连接肩部的支承区域和位于基板的下部面上的所述导电区域。这种布置使得连接结构不能在外壳的位于盖和基板之间的工作容积中占据太多的空间。
根据一个可能的实施方式,机电换能器集成到支撑件,并且敏感元件设置在该支撑件的前部面一侧上。敏感元件相对于肩部的这种布置允许具有大容积的后室。
根据信号处理装置的一种可能的布置,这些信号处理装置可以与换能器集成到相同的支撑件。
根据另一种可能的布置,机电换能器集成到第一支撑件,信号处理装置集成到与第一支撑件不同的第二支撑件。
在此情况下,第二支撑件可以有利地设置在第二腔室中,该第二腔室在基板的下部面处开口,第二腔室与第二孔连通,第二孔具有的宽度小于第二腔室的宽度,并且该第二孔在基板的上部面处开口。利用这种布置,进一步减小了体积,同时提供了更大的后室容积。
替代地,信号处理装置集成到设置在与第一腔室不同的另一个腔室中的第二支撑件,该另一个腔室在基板的上部面处开口。这种布置允许增加紧凑性并且适于如下构型,即,声波的输入端口位于盖处。
当换能器集成到第一支撑件并且信号处理装置集成到第二支撑件时,第一支撑件可以通过穿过第一孔的导线连接到第二支撑件的前部面。第二支撑件可以通过另一条导线连接到基板。
第二支撑件可以设置有一个或更多个穿透导电元件,以使得能够在该第二支撑件的前部面和后部面之间建立连接。在此情况下,连接第一支撑件和第二支撑件的导线和/或将第二支撑件连接到基板的另一条导线可以分别连接到穿过第二支撑件的导电元件。
附图说明
通过阅读示例性实施例将更好地理解本发明,该示例性实施例仅以说明而非限制目的、并且参照附图给出,在附图中:
-图1示出了形成具有改进布置的麦克风的机电***的一个示例,其中MEMS和/或NEMS机电部件被容纳在位于组装基板的下部面上的腔室中;
-图2示出了***的另一示例性实施方式,该***具有在机电部件和组装基板的下部面之间的具有紧凑布置连接结构;
-图3示出了具有电子部件的***的另一示例性实施方式,该电子部件设置有用于处理来自MEMS和/或NEMS部件的信号的装置,该电子部件被容纳在基板的腔室中,该基板的腔室不同于机电部件所在的腔室;
-图4示出了一个替代实施方式,其中电子部件设置有穿透通孔以允许在电子部件的位于基板的下部面一侧上的后面处发生接触;
-图5示出了机电***的另一示例性实施方式,其中后室在孔中延伸,该孔设置在基板中并且位于机电部件和电子部件之间,该电子部件设置在位于基板的下部面一侧上的腔室中;
-图6示出了机电***的一种替代布置,其中电子部件在其后部面处设置有导电球;
-图7示出了机电***的另一示例性实施方式,其中机电部件设置在位于基板的下部面一侧上的腔室中,而电子部件布置在位于基板的上部面一侧上的腔室中;
-图8示出了机电***的另一示例性实施方式,其中机电部件和电子部件分别布置在位于基板的下部面一侧上的一个腔室和另一个腔室中,这些部件通过图2的实施例的那些类型的连接件连接到基板;
-图9A至图9E示出了用于制造根据本发明的一个实施例实现的压力传感器机电***的示例性方法;
不同附图中的相同、相似或等效部件具有相同的附图标记,以便于从一个幅附图切换到其它附图。
附图中示出的不同部件并非一定按相同比例绘制,以便使附图更加易读。
进一步地,在下文的描述中,考虑到结构在附图中以图示的方式定向,应用了取决于例如“上部”、“下部”、“下”、“上”的结构取向的术语。
具体实施方式
图1中示出了形成麦克风的机电***的一个示例,该麦克风用于将压力变化转换成电信号变化。
机电***包括组装基板1,该组装基板可以是基于可能填充的聚合材料或者基于陶瓷材料或诸如硅的半导体材料的。基板1的厚度(在与基板1的主平面正交并且与正交坐标系[O;x;y;z]的轴线z平行的方向上测量的尺寸)可以在100μm至700μm之间。“主平面”指的是穿过基板并且平行于平面[O;x;y]的平面。
在该基板的面中的一个称为“下部面”5的面处,组装基板1包括凹部12或腔室12,在该凹部或腔室的延伸部分中设置有在基板1的上部面3处开口的孔13,该上部面即是与底面5相对的面。腔室12设置有大于孔13的宽度W2的宽度W1,以便形成肩部。宽度W1和宽度W2是平行于基板1的主平面(换句话说是平面[O;x;y])测量的尺寸。
MEMS和/或NEMS机电部件20设置在腔室12中。容纳在腔室12中的MEMS和/或NEMS型机电部件20呈支撑件(例如由硅制成)的形式,并且设置有敏感元件,该敏感元件诸如为能够在声波的作用下振动的膜21。膜21位于支撑件的称为“前部面”23的面一侧上。前部面23的围绕膜21定位的周界区段抵靠基板1的称为“支承区域”的区域15,该支承区域位于腔室12的底部处并且形成台阶或肩部。该支承区域15位于定位在孔13和腔室12之间的界面处的平面P中。支承区域15与基板1的主平面的法线成非零角度。在图1中示出的特定示例中,支承区域15平行于基板1的主平面。该支承区域15使得能够便于与机电部件20之间进行组装,特别是可以通过粘接和/或钎焊和/或焊接来实现该组装。这种构造类型使得能够预见独立于彼此地制造容纳基板1和机电部件,然后组装该基板和机电部件。该支承区域还使得机电部件20能够稳固地保持在容纳基板上。
在该示例性实施例中,腔室12用作使得膜21能够振动的声波的输入端口,。因此,声波穿过机电部件20的后部面25,该后部面即是机电部件20的与前部面23相对的面。
因此,腔室12和孔13在该孔的延伸部分中形成穿过基板1的厚度的孔口,并且该孔口至少部分地被机电部件20的膜21密封。在孔13的延伸部分中,位于机电部件20的前部面一侧上和基板1的前部面一侧上且由盖40界定的容积形成压力传感器***的后室。盖40可以例如由金属、或陶瓷、或塑料材料制成或者是诸如硅的半导体,并且盖40设置在基板1的前部面3处,以便形成保护外壳8,盖优选地是封闭的,并且在此示例中不包括孔口。
机电部件20在腔室12中的布置使得能够具有大容积的后室,膜21旨在该后室中振荡。优选地机电部件20的布置被设置成在膜21的前部面和基板1的下部面5之间具有小的容积。如果必要的话,机电部件20可以从基板1的下部面突出。
在该示例性实施例中,机电部件20通过穿过孔13的至少一条导线27电连接到组装基板1。导线27是弯曲的并且将位于MEMS和/或NEMS部件20的前部面23处的导电区域22连接到基板1的上部面3的导电区域14。为了能够将位于基板1的下部面5上的导电区域16电连接到位于该基板的上部面3一侧上的导电区域14,基板1可以设置有至少一个穿透导电元件17,也称为“通孔”(“via”),该穿透导电元件在基板1的厚度中延伸。为了便于将***可能转移和连接到诸如应用电子板的另一装置,可以在基板1的下部面5上、特别是在导电区域16(例如呈垫片的形式)上设置一个或更多个导电球19或焊球。
图2中示出的一种替代布置提供了基板1和机电部件20之间的互连结构,该布置更稳固并且具有减小的体积。在该示例中,机电部件20和基板1之间的互连结构基本上在基板1的厚度中延伸,并且使得基板1的下部面5能够电连接到机电部件20的前部面23。
位于MEMS部件20的前部面的周界处的区段23a是导电的,并且通过导电球52连接到基板1的导电区域14’,该导电区域14’在腔室12的底部位于肩部处。
为了将MEMS部件20电连接到位于基板1的下部面5上的导电区域16,在基板1的厚度中设置穿透导电元件57。该导电元件57包括第一导电部分57a,该第一导电部分从连接区域16在第一方向上延伸,该第一方向与基板1的主平面成非零角度,第一方向通常与基板1的主平面正交。第一导电部分57a连接到第二导电部分57b,该第二导电部分在第二方向上延伸,该第二方向通常与基板1的主平面平行。因此,部分57a、部分57b形成角度或弯曲。第二导电部分57b延伸到孔13并且可以连接到第三导电部分57c,该第三导电部分朝向腔室12的底部延伸直到到达位于肩部处的导电区域14’。在图2的特定示例中,导电元件57因此具有弯曲的形状,特别是U形形状。
作为刚刚描述的示例的替代例,也可以设想导电部分与肩部齐平,以及导电元件与MEMS部件20的侧边缘紧密地配合并且由此形成L。
在刚刚描述的任一示例中,机电部件20可以设置有集成信号处理装置。“信号处理”指的是对信号进行放大和/或滤波、和/或整形中的至少一个功能。因此,在相同的支撑件上存在具有机电换能器的、特别是声电换能器的结构,以及存在具有用于对由使机电部件20的膜21振动而产生的信号进行处理的装置的另一结构。
替代地,信号处理装置集成在与MEMS和/或NEMS部件20不同的支撑件中,该支撑件特别是诸如芯片或ASIC的电子部件30。因此,在第一支撑件上存在换能器结构,以及在不同于第一支撑件的第二支撑件上存在包括信号处理装置的另一结构。
在图3中示出的示例性布置中,电子部件30设置在第二腔室112中,该第二腔室设置在基板1的下部面5,并且该第二腔室与容纳有MEMS部件20的腔室12分开。通过这种布置,获得了更大的后室容积。
在第二腔室112的延伸部分中,设置有在基板1的上部面3处开口的第二孔113,该上部面3即是与下部面5相对的面。腔室112还设置有大于第二孔113的宽度的宽度,以便形成肩部。
部件30的一区段抵靠基板1的支承区域115,该支承区域115位于腔室112的底部处并且形成肩部。该支承区域115位于定位在第二孔113和第二腔室112之间的界面处的平面P’中。在该特定示例中,支承区域115平行于基板1的主平面。
机电部件20和电子部件30通过导电元件彼此连接。导电元件通常是弯曲形状的导线67,该导线67在封闭的外壳中延伸并且穿过在基板1中形成的孔13。导线67延伸到布置在基板1中的第二孔113,并且该第二孔位于用于容纳电子部件30的第二腔室112的延伸部分中。因此,导线67连接机电部件20的前部面23和电子部件30的前部面33。为了使得电子部件30能够连接到基板1和使机电部件20能够间接地连接到基板1,另一条弯曲形状的导线77从电子部件30的前部面33延伸到位于基板1的上部面3上的导电区域14。
该导电区域14自身可以例如通过穿透通孔(未在图3中示出,但可以是图1中标记17的类型)电连接到位于基板1的下部面处的导电区域16。
先前描述的布置的一种替代例在电子部件30的位于基板1的下部面5一侧上的后部面35(即与前部面33相对的面)处提供电接触。
因此,通常呈导电球89a、89b形式的一个或更多个导电区域设置在电子部件30的后部面35处,以允许例如与设置在基板1的下部面5上的电子板进行连接和可能的组装。为了允许设置在电子部件30的后部面处的导电区域89a、导电区域89b和位于该部件30的前部面处的元件之间的连接,可以提供穿过部件30的厚度的导电元件87,该导电元件87例如呈穿透硅通孔(“through silicon via”,TSV)的形式。
在图4中示出的特定示例性实施例中,将MEMS和/或NEMS部件20与电子部件30连接的导线67自身通过穿透导电元件87a连接到电子部件30的后部面。连接电子部件30和基板1的导线77自身可以通过另一个穿透导电元件87b连接到电子部件30的后部面35。
在刚刚描述的示例性实施例中,声波的输入端口位于基板1的下部面5一侧上。根据一种替代布置,声波的输入端口可以设置在盖40处。因此,盖40包括至少一个孔口43,而基板1的后部面5可以是封闭的。
在图5的特定示例性实施例中示出了如下构造类型,在该构造类型中,机电部件20在此设置在基板1的上部面3上,膜21悬置在基板1的上部面3上方并且远离该基板的上部面3悬置。
电子部件30进而被容纳在基板1的腔室212中,在该腔室的延伸部分中设置有孔213、孔313。孔313用于使一条或更多条导线177穿过,以允许电子部件30与基板1连接。机电部件20的膜21面向通过基板部分与孔313分开的另一个孔213延伸。该另一个孔213在该示例中形成麦克风的后室的一部分。电子部件30可以布置成在基板1的下部面一侧上对孔213、孔313进行密封,其中,外壳仅可以在设置在盖中的孔口43一侧上开口。
在这种构造中,基板1和机电部件20通过诸如弯曲的导线167的导电元件连接,该弯曲的导线167连接位于MEMS和/或NEMS部件的前部面23处的导电区域22和基板1的上部面3的导电区域14。为了允许将位于基板的下部面5上的导电区域16连接到位于该基板的上部面3一侧上的导电区域14,基板1可以设置有至少一个穿透导电元件,该穿透导电元件连接基板1的上部面3和下部面5。还可以预见到建立导电微布线,以用于允许将电子部件30连接到MEMS部件20。
此时,在图6中示出了类似的布置,导电球89a、导电球89b使得能够在电子部件30的后部面35处建立接触以及与另一装置(特别是电子板)建立可能的组装。
在图7中示出了另一种示例性构造,该示例性构造使得能够获得减小的体积和大的后部容积。如在先前结合图3和图4描述的示例中那样,***包括位于基板1的下部面5一侧上的输入端口。此时,电子部件30设置在位于基板1的上部面3一侧上的腔室412中。MEMS部件20和电子部件30的相应的腔室12和腔室412是分开的,并且彼此不连通。
在图8中示出的示例性布置中,MEMS部件20布置在位于基板1的下部面5处的腔室12中,而电子部件30布置在设置在下部面5处的另一个腔室112中。这种布置与先前结合图3和图4所描述的布置不同,不同之处特别是在于:机电部件20和电子部件30通过穿过基板的导电元件57连接到基板。这些导电元件57是先前结合图2描述的那些导电元件的类型。导电元件57在基板1中延伸并且在该基板的下部面5开口到导电区域16。
如在图2的示例性实施例中那样,位于MEMS部件20的前部面的周界处的区段23a是导电的,并且通过导电区域连接到基板1的导电区域14’,该导电区域14’在腔室12的底部位于肩部处。同样地,在电子部件30的前部面的周界处,电子部件30包括导电区域,该导电区域连接到基板1的导电区域14”,该导电区域14”在腔室12的底部位于腔室112的肩部处。
现将结合图9A至图9E描述用于制造形成麦克风的机电***的方法的一个示例。
该方法的可能的起始结构在图9A中以基板1的形式示出,该基板可以例如是印刷电路板(“Printed Circuit Board”,PCB)。在该基板的下部面5处,基板1包括至少一个腔室12和与腔室12连通的孔13,孔13的宽度小于腔室12的宽度,该孔在基板1的上部面3处开口。起始基板1还包括在其上部面3上的一个或更多个导电区域14和位于其下部面5上的一个或更多个导电区域16,导电区域14通常通过通孔17连接到导电区域16。
然后,图9B示出了将机电部件20转移到腔室12中的步骤,该部件设置有诸如膜21的悬置结构。通常使用粘合剂29进行转移,使得机电部件20的前部面23的一区段抵靠基板1的形成台阶或肩部的区域放置。腔室12在平行于基板1的主平面的平面中的尺寸被设想为大于机电部件20的尺寸,以便将该部件20容纳或压配合在腔室中并且使组装更容易。
然后,在图9C中,在机电部件20和基板1之间建立连接。可以实施引线键合(“wirebonding”)方法,以便使导线67连接机电部件20的前部面23和基板1的上部面3,该前部面和上部面基本上平行但彼此位于不同的高度处。
然后,如在图9D中示出那样,将盖40转移到基板1的前部面3。盖40设置在基板1上,使得该盖在机电部件20的顶部上形成保护外壳。
通常使用可以是导电粘合剂的粘合剂49来将盖40和基板1组装在一起,特别是当盖40是金属材质的时候。
可选地,一个或更多个导电球19可以设置在基板1的下部面5上。这种导电球19可以呈焊球的形式,以允许***可能转移到诸如应用电子板C(图9E)的另一个支撑件。
诸如先前描述的麦克风可应用于许多领域中并且可以集成到例如通讯装置(诸如移动电话)或计算装置(诸如平板电脑)。根据其他示例,根据先前描述的任一实施例的***可以集成在机动车辆或医疗装置(特别是助听器)中。
Claims (15)
1.一种压力传感器机电***,包括:
-第一结构(20),所述第一结构包括机电换能器,所述机电换能器设置有敏感元件(21),所述敏感元件能够在所述敏感元件的面之间的压差的作用下移动,
-第二结构(30),所述第二结构包括信号处理装置,所述信号处理装置用于处理由所述敏感元件(21)的移动产生的信号,
-用于容纳所述第一结构和所述第二结构(20,30)的基板(1),所述基板包括上部面和与所述上部面相对的下部面(5),所述第一结构和所述第二结构设置在开口至所述基板的面中的至少一个面的第一腔室中,或者分别设置在形成于所述基板(1)中的第一腔室和第二腔室中并且每个腔室开口至所述基板的面中的至少一个面,所述下部面设置有至少一个连接导电区域(16),
设置有所述第一结构的所述第一腔室开口至所述基板的所述下部面,所述第一腔室与第一孔(12-13,112-113)连通,所述第一孔在所述第一腔室和所述基板的所述上部面之间穿过所述基板,所述腔室(12)具有的宽度(W1)大于所述第一孔(13)的宽度(W2)以便形成肩部,所述第一结构(20)的前部面抵靠所述肩部的支承区域,所述支承区域位于所述腔室和所述第一孔之间的界面的平面中,
所述机电***进一步包括布置在所述基板(1)的所述上部面(3)上的保护盖(40)。
2.根据权利要求1所述的机电***,所述保护盖(40)是金属的。
3.根据权利要求1或2所述的***,所述***包括在位于所述基板(1)的所述下部面上的所述导电区域(16)和所述第一结构(20)的导电区域(22)之间的连接结构,所述连接结构包括穿过所述基板(1)的至少一个导电元件(17,57)。
4.根据权利要求3所述的机电***,其中,所述连接结构包括至少一条导线(27),所述至少一条导线穿过所述第一孔(12)并且连接位于所述基板(1)的所述上部面(3)上的导电区域(14)和所述第一结构(20)的导电区域(22)。
5.根据权利要求4所述的机电***,其中,穿过所述基板的导电元件(57)具有弯曲的形状,所述导电元件布置成连接所述肩部的所述支承区域和位于所述基板(1)的所述下部面(5)上的导电区域(16)。
6.根据权利要求1所述的机电***,其中,所述敏感元件(21)设置在所述第一结构(20)的前部面一侧上。
7.根据权利要求1所述的机电***,其中,所述第一结构和所述第二结构集成到同一支撑件。
8.根据权利要求1所述的机电***,其中,所述第一结构(20)集成到第一支撑件(20),所述第二结构(30)集成到与所述第一支撑件不同的第二支撑件,所述第二支撑件设置在第二腔室(112)中,所述第二腔室在所述基板(1)的所述下部面(5)处开口,所述第二腔室(112)与第二孔(113)连通,所述第二孔(113)具有的宽度小于所述第二腔室的宽度,并且所述第二孔在所述基板(1)的所述上部面(3)处开口;所述第一结构(20)集成到所述第一支撑件,所述第二结构(30)集成到与所述第一支撑件不同的第二支撑件,所述第二支撑件(30)设置在与所述第一腔室不同的另一个腔室(412)中,所述另一个腔室(412)在所述基板(1)的所述上部面(3)处开口。
9.根据权利要求8所述的机电***,其中,所述第一支撑件通过穿过所述第一孔(123)的至少一条导线(67)连接到所述第二支撑件的前部面,所述第二支撑件通过至少一条另一条导线(77)连接到所述基板(1)。
10.根据权利要求9所述的机电***,所述导线(67)和/或所述另一条导线(77)连接到穿过所述第二支撑件的元件(87a,87b)。
11.根据权利要求1所述的机电***,其中,所述第一腔室形成声波的输入端口。
12.根据权利要求1所述的机电***,其中,所述基板是基于聚合材料或陶瓷材料的。
13.一种用于制造根据权利要求1所述的***的方法,其中,所述第一结构集成到第一支撑件(20),所述方法包括将所述第一支撑件(20)组装在所述第一腔室(12)中,所述第一结构和所述基板(1)特别地通过粘合或焊接组装在所述第一腔室(12)中。
14.一种压力传感器机电***,包括:
-第一结构(20),所述第一结构包括机电换能器,所述机电换能器设置有敏感元件(21),所述敏感元件能够在所述敏感元件的面之间的压差的作用下移动,
-第二结构(30),所述第二结构包括信号处理装置,所述信号处理装置用于处理由所述敏感元件(21)的移动产生的信号,
-用于容纳所述第一结构和所述第二结构(20,30)的基板(1),所述基板包括上部面和与所述上部面相对的下部面(5),所述第一结构和所述第二结构被设置在开口至所述基板的面中的至少一个面的第一腔室中,或者分别设置在形成于所述基板(1)中第一腔室和第二腔室中并且每个腔室开口至所述基板的面中的至少一个面,所述下部面设置有至少一个连接导电区域(16),
设置有所述第一结构的所述第一腔室开口至所述基板的所述下部面,所述第一腔室与第一孔(12-13,112-113)连通,所述第一孔在所述第一腔室和所述基板的所述上部面之间穿过所述基板,所述腔室(12)具有的宽度(W1)大于所述第一孔(13)的宽度(W2)以便形成肩部,所述第一结构(20)的前部面抵靠所述肩部的支承区域,所述支承区域位于所述腔室和所述第一孔之间的界面的平面中,
其中,所述第一腔室形成声波的输入端口。
15.一种压力传感器机电***,包括:
-第一结构(20),所述第一结构包括机电换能器,所述机电换能器设置有敏感元件(21),所述敏感元件能够在所述敏感元件的面之间的压差的作用下移动,
-第二结构(30),所述第二结构包括信号处理装置,所述信号处理装置用于处理由所述敏感元件(21)的移动产生的信号,
-用于容纳所述第一结构和所述第二结构(20,30)的基板(1),所述基板包括上部面和与所述上部面相对的下部面(5),所述第一结构和所述第二结构被设置在开口至所述基板的面中的至少一个面的第一腔室中,或者分别设置在形成于所述基板(1)中第一腔室和第二腔室中并且每个腔室开口至所述基板的面中的至少一个面,所述下部面设置有至少一个连接导电区域(16),
设置有所述第一结构的所述第一腔室开口至所述基板的所述下部面,所述第一腔室与第一孔(12-13,112-113)连通,所述第一孔在所述第一腔室和所述基板的所述上部面之间穿过所述基板,所述腔室(12)具有的宽度(W1)大于所述第一孔(13)的宽度(W2)以便形成肩部,所述第一结构(20)的前部面抵靠所述肩部的支承区域,所述支承区域位于所述腔室和所述第一孔之间的界面的平面中,其中所述敏感元件(21)设置在所述第一结构(20)的前部面一侧上。
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2016
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- 2017-10-03 EP EP17792115.2A patent/EP3523986A1/fr not_active Ceased
- 2017-10-03 WO PCT/FR2017/052709 patent/WO2018065717A1/fr unknown
- 2017-10-03 CN CN201780061393.9A patent/CN109845294B/zh active Active
- 2017-10-03 US US16/335,740 patent/US10822227B2/en active Active
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WO2016102924A1 (en) * | 2014-12-23 | 2016-06-30 | Cirrus Logic International Semiconductor Limited | Mems transducer package |
CN204442602U (zh) * | 2015-02-15 | 2015-07-01 | 歌尔声学股份有限公司 | 一种mems传感器 |
Also Published As
Publication number | Publication date |
---|---|
WO2018065717A1 (fr) | 2018-04-12 |
EP3523986A1 (fr) | 2019-08-14 |
US20190233278A1 (en) | 2019-08-01 |
FR3056978B1 (fr) | 2019-08-16 |
US10822227B2 (en) | 2020-11-03 |
FR3056978A1 (fr) | 2018-04-06 |
CN109845294A (zh) | 2019-06-04 |
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