IT201900022503A1 - Sensore ambientale incapsulato - Google Patents

Sensore ambientale incapsulato

Info

Publication number
IT201900022503A1
IT201900022503A1 IT102019000022503A IT201900022503A IT201900022503A1 IT 201900022503 A1 IT201900022503 A1 IT 201900022503A1 IT 102019000022503 A IT102019000022503 A IT 102019000022503A IT 201900022503 A IT201900022503 A IT 201900022503A IT 201900022503 A1 IT201900022503 A1 IT 201900022503A1
Authority
IT
Italy
Prior art keywords
environmental sensor
sensor encapsulated
encapsulated
environmental
sensor
Prior art date
Application number
IT102019000022503A
Other languages
English (en)
Inventor
Marco Omar Ghidoni
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT102019000022503A priority Critical patent/IT201900022503A1/it
Priority to EP20207910.9A priority patent/EP3828130A1/en
Priority to US17/102,973 priority patent/US11718519B2/en
Priority to CN202022820460.2U priority patent/CN214360244U/zh
Priority to CN202011372510.3A priority patent/CN112875636A/zh
Publication of IT201900022503A1 publication Critical patent/IT201900022503A1/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0278—Temperature sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/092—Buried interconnects in the substrate or in the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Measuring Fluid Pressure (AREA)
IT102019000022503A 2019-11-29 2019-11-29 Sensore ambientale incapsulato IT201900022503A1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT102019000022503A IT201900022503A1 (it) 2019-11-29 2019-11-29 Sensore ambientale incapsulato
EP20207910.9A EP3828130A1 (en) 2019-11-29 2020-11-16 Packaged environmental sensor
US17/102,973 US11718519B2 (en) 2019-11-29 2020-11-24 Packaged environmental sensor
CN202022820460.2U CN214360244U (zh) 2019-11-29 2020-11-30 封装环境传感器、电子***和电子设备
CN202011372510.3A CN112875636A (zh) 2019-11-29 2020-11-30 封装环境传感器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102019000022503A IT201900022503A1 (it) 2019-11-29 2019-11-29 Sensore ambientale incapsulato

Publications (1)

Publication Number Publication Date
IT201900022503A1 true IT201900022503A1 (it) 2021-05-29

Family

ID=69811822

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102019000022503A IT201900022503A1 (it) 2019-11-29 2019-11-29 Sensore ambientale incapsulato

Country Status (4)

Country Link
US (1) US11718519B2 (it)
EP (1) EP3828130A1 (it)
CN (2) CN112875636A (it)
IT (1) IT201900022503A1 (it)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6927482B1 (en) * 2003-10-01 2005-08-09 General Electric Company Surface mount package and method for forming multi-chip microsensor device
US20090314095A1 (en) * 2008-06-19 2009-12-24 Unimicron Technology Corp. Pressure sensing device package and manufacturing method thereof
US20160241953A1 (en) * 2013-07-22 2016-08-18 Infineon Technologies Ag Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals
US20190233278A1 (en) * 2016-10-05 2019-08-01 Commissariat A L'energie Atomique Et Aux Energies Alternatives Pressure sensor, in particular a microphone with improved layout

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9287882B2 (en) * 2013-11-07 2016-03-15 Kyocera Crystal Device Corporation Temperature compensated crystal oscillator
IT201600121210A1 (it) * 2016-11-30 2018-05-30 St Microelectronics Srl Modulo di trasduzione multi-dispositivo, apparecchiatura elettronica includente il modulo di trasduzione e metodo di fabbricazione del modulo di trasduzione
IT201600121223A1 (it) * 2016-11-30 2018-05-30 St Microelectronics Srl Modulo multi-trasduttore, apparecchiatura elettronica includente il modulo multi-trasduttore e metodo di fabbricazione del modulo multi-trasduttore
US10707161B2 (en) * 2017-08-07 2020-07-07 UTAC Headquarters Pte. Ltd. Cavity wall structure for semiconductor packaging
US10934159B2 (en) * 2019-06-03 2021-03-02 Sae Magnetics (H.K.) Ltd. MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6927482B1 (en) * 2003-10-01 2005-08-09 General Electric Company Surface mount package and method for forming multi-chip microsensor device
US20090314095A1 (en) * 2008-06-19 2009-12-24 Unimicron Technology Corp. Pressure sensing device package and manufacturing method thereof
US20160241953A1 (en) * 2013-07-22 2016-08-18 Infineon Technologies Ag Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals
US20190233278A1 (en) * 2016-10-05 2019-08-01 Commissariat A L'energie Atomique Et Aux Energies Alternatives Pressure sensor, in particular a microphone with improved layout

Also Published As

Publication number Publication date
US20210163283A1 (en) 2021-06-03
CN214360244U (zh) 2021-10-08
CN112875636A (zh) 2021-06-01
EP3828130A1 (en) 2021-06-02
US11718519B2 (en) 2023-08-08

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