CN109643189B - Printed wiring - Google Patents

Printed wiring Download PDF

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Publication number
CN109643189B
CN109643189B CN201780052487.XA CN201780052487A CN109643189B CN 109643189 B CN109643189 B CN 109643189B CN 201780052487 A CN201780052487 A CN 201780052487A CN 109643189 B CN109643189 B CN 109643189B
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China
Prior art keywords
wave line
line
wiring
width direction
wiring element
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Application number
CN201780052487.XA
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Chinese (zh)
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CN109643189A (en
Inventor
坂上彰利
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Japan Aviation Electronics Industry Ltd
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Japan Aviation Electronics Industry Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256Electrical insulation details, e.g. around high voltage areas
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/26Printing on other surfaces than ordinary paper
    • B41M1/34Printing on other surfaces than ordinary paper on glass or ceramic surfaces
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/04164Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/10Intaglio printing ; Gravure printing
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09227Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09245Crossing layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09263Meander
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979Redundant conductors or connections, i.e. more than one current path between two points

Abstract

A printed wiring is formed of a film of cured conductive ink formed on a surface of a base material, and includes at least one wave line, a first wiring element located on one of two sides across the wave line in a width direction, and a second wiring element located on the other of the two sides and adjacent to the wave line, wherein an extra wave line is provided between the wave line and the first wiring element, the extra wave line being another wave line adjacent to the wave line, extending in parallel with the wave line, connected to the wave line, and having the same potential as the wave line.

Description

Printed wiring
Technical Field
The present invention relates to a printed wiring having a wiring pattern formed by printing.
Background
In recent years, printing methods have been used for forming electrode patterns and wiring patterns of various electronic devices such as touch panels, touch sensors, membrane switches, and organic EL devices, which have excellent productivity and are advantageous in terms of manufacturing cost. Among them, gravure offset printing has attracted attention as a printing method suitable for forming a high-definition pattern.
Patent document 1 describes forming a touch sensor by gravure offset printing in this manner, and fig. 1 and 2 show a structure of a touch key provided with a touch sensor described in patent document 1 and a gravure offset printing press used for manufacturing the touch sensor.
As shown in fig. 1, the touch key includes a touch sensor 10 and a touch sensor driving circuit 15. The touch sensor 10 includes a substrate 11, a plurality of mesh-shaped electrodes 12 formed on the substrate 11, outer edge wiring 13 provided on the outer edge of the mesh-shaped electrodes 12, and connection wiring 14 connecting the outer edge wiring 13 to a touch sensor drive circuit 15. The mesh-like electrode 12 has a mesh shape, and the outer edge wiring 13 is formed to extend along the upper side of the mesh-like electrode 12 in fig. 1.
The mesh-like electrodes 12, the outer edge wirings 13, and the connection wirings 14 are formed by printing simultaneously on the substrate 11 using an offset gravure printing press, and then curing.
As shown in fig. 2, the offset gravure printing press 20 includes a plate table 21, a substrate table 22, a blade 23, a transfer roller 24, a device frame 25, and a dispenser (not shown). An intaglio (intaglio) plate 27 is placed on and fixed to the plate table 21, the intaglio plate 27 has a concave pattern 26 formed thereon, the concave pattern 26 has mesh-like recesses 26a, outer edge recesses 26b, and connecting recesses 26c corresponding to the mesh-like electrodes 12, outer edge wires 13, and connecting wires 14 of the touch sensor 10, respectively, and the substrate 11 as a printing object is placed on and fixed to the base table 22. The blade 23 and the transfer roller 24 are movable along the X axis and the Z axis, and the dispenser is also movable along the X axis and the Z axis.
The conductive paste 28 is filled into the concave pattern 26 of the depressed plate 27 by sliding the squeegee 23 on the depressed plate 27 along the X axis while supplying the conductive paste 28 onto the depressed plate 27 by the dispenser. The conductive paste 28 filled in the concave pattern 26 is received by the transfer roller 24, and the print pattern held by the transfer roller 24 is transferred onto the substrate 11. The printed pattern transferred onto the substrate 11 is cured by heating, thereby completing the mesh-like electrodes 12, the outer edge wiring 13, and the connection wiring 14 of the touch sensor 10.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2015-45890
Disclosure of Invention
Technical problem to be solved by the invention
As described above, patent document 1 describes that a wiring pattern of a touch sensor is formed by gravure offset printing, but in the wiring pattern shown in fig. 1, a wiring element for connecting a mesh-like electrode 12 formed of a fine mesh and a connection wiring 14 in the middle is a linear outer edge wiring 13, and as shown in fig. 2, an outer edge concave portion 26b of an intaglio 27 corresponding to the outer edge wiring 13 and a squeegee 23 are parallel, and therefore, in the process of squeegee application, there is a possibility that the squeegee 23 falls into the outer edge concave portion 26b and scrapes out conductive paste (conductive ink).
Therefore, in order to avoid such a problem, the following structure may be considered: the wiring element, which connects the mesh-like electrode 12 and the connection wiring 14 in the middle, is not formed as the linear outer edge wiring 13 but is formed as a pad formed by a fine wire mesh formed by a line segment that is oblique to the line direction of the edge (upper side) of the mesh-like electrode 12, that is, a line segment that is oblique to the extending direction of the squeegee 23, and the portion of the connection wiring 14 that extends parallel to the extending direction of the squeegee 23 is formed as a wavy line.
In view of the above, in a touch panel having a wiring pattern including sensor electrode rows arranged in a sensor region, lead wires for external connection provided on a side frame portion surrounding the sensor region, and pads for realizing connection between the sensor electrode rows and the lead wires in the middle, the sensor electrode rows are formed by a first fine wire mesh, the pads are formed by a second fine wire mesh having a higher density than the first fine wire mesh, and a portion of the lead wires extending in parallel to the extending direction of a squeegee is set as a wavy line, so that when the wiring pattern is formed by gravure offset printing, a problem that the squeegee falls into a concave portion of a gravure plate to scrape off ink is eliminated, but the following new problems are found: in the lead line formed of the wavy line, which is located in the immediate downstream region of the wiring element (pad, electrode) formed of the fine mesh in the direction of the doctor blade, a large bleed-out of the inherent form occurs due to the scraped residue of the ink. Since the lead lines drawn from the sensor electrode rows are present in the vicinity of each other in the frame portion of the touch panel, the bleeding may cause a serious problem that adjacent lead lines are short-circuited.
The invention aims to: provided is a printed wiring capable of preventing the occurrence of short-circuit failure due to such bleeding.
Means for solving the problems
The printed wiring of the present invention is a printed wiring formed by a film of a conductive ink cured on a surface of a base material, comprising: a wave line; a first wiring element; a second wiring element; a redundant wave line, which is arranged in parallel with the wave line. The first wiring element is located on one of both sides in the width direction of the one wave line. The second wiring element is located on the other of the two sides and adjacent to the one wave line. The one extra wave line is located between the one wave line and the first wiring element and adjacent to the one wave line. The one extra wave line is connected to the one wave line, and the potential of the one extra wave line is the same as the potential of the one wave line.
The printed wiring of the present invention is a printed wiring formed by a film of a conductive ink cured on a surface of a base material, comprising: a wave line; a first wiring element; a second wiring element; a redundant wave line, which is arranged in parallel with the wave line. The first wiring element is located on one of both sides in the width direction of the one wave line. The second wiring element is located on the other of the two sides and adjacent to the one wave line. The one extra wave line is located between the one wave line and the first wiring element and adjacent to the one wave line. The one extra wave line is insulated from the one wave line.
Effects of the invention
According to the present invention, since one extra wavy line is provided, even if bleeding in a specific form occurs in a wavy line drawn immediately downstream of the first wiring element when printed wiring is formed by gravure offset printing, for example, such bleeding occurs only in the extra wavy line, and therefore, occurrence of short-circuit failure due to bleeding can be prevented, and improvement of yield can be achieved in this respect.
Drawings
Fig. 1 is a diagram showing a conventional configuration example of a touch sensor.
Fig. 2 is a view showing an offset gravure printing press used for manufacturing the touch sensor shown in fig. 1.
Fig. 3 is a diagram for explaining a schematic configuration of the touch panel.
Fig. 4 is a partially enlarged view showing details of the first sensor electrode array, the pads, and the lead lines of the touch panel shown in fig. 3.
Fig. 5 is a partially enlarged view showing details of the second sensor electrode column of the touch panel shown in fig. 3.
Fig. 6 is a partially enlarged view showing details of a lead line of the touch panel shown in fig. 3.
Fig. 7A is a diagram for explaining a large bleed-out caused by the lead lines formed of wavy lines.
Fig. 7B is a diagram for explaining a configuration for preventing occurrence of short-circuit failure due to bleeding shown in fig. 7A.
Fig. 8 is a partially enlarged view showing the first embodiment of the printed wiring.
Fig. 9 is a partially enlarged view showing a second embodiment of the printed wiring.
Fig. 10 is a partially enlarged view showing a third embodiment of the printed wiring.
Fig. 11A is a diagram showing a wiring pattern formed of wave lines.
Fig. 11B is a diagram for explaining tailing and bleeding of ink.
Fig. 12A is a diagram showing a first modification of the wave line shape of the wiring pattern.
Fig. 12B is a diagram showing a second modification of the wave line shape of the wiring pattern.
Fig. 12C is a diagram showing a third modification of the wave line shape of the wiring pattern.
Fig. 13A is a diagram showing a structural example of an intaglio corresponding to a wiring pattern formed by wavy lines.
Fig. 13B is a diagram showing another example of the structure of an intaglio corresponding to a wiring pattern formed by wave lines.
Detailed Description
First, a description will be given of a configuration of a capacitance type touch panel which is a trigger for finding a new problem that a large bleeding of an inherent form occurs due to scraping residue of ink in a lead line formed of a wavy line located in a region immediately downstream of a pad formed of a fine wire mesh and a sensor electrode row in a blade direction.
Fig. 3 shows a schematic structure of a capacitive touch panel. In fig. 3, 30 denotes a transparent substrate. A capacitive touch panel has a structure in which a first conductor layer, an insulating layer, a second conductor layer, and a protective film are sequentially formed on a transparent substrate 30.
The sensor electrode array includes a plurality of first sensor electrode arrays and a plurality of second sensor electrode arrays, and details of the sensor electrode arrays are not shown in fig. 3, in which the plurality of first sensor electrode arrays are formed of a first conductor layer, and the plurality of second sensor electrode arrays are formed of a second conductor layer insulated from the first conductor layer by an insulating layer. In fig. 3, a portion surrounded by a rectangular frame indicates a sensor region 40 where the sensor electrode column is located. The outer side of the rectangular frame forms a frame portion 50 surrounding the sensor region 40.
Fig. 4 shows details of the first sensor electrode column 61, the dummy electrodes 62, the lead-out lines 63, and the pads 64 formed of the first conductor layer, and fig. 5 shows details of the second sensor electrode column 71 and the dummy electrodes 72 formed of the second conductor layer. Fig. 4 and 5 show the upper left portion of the sensor region 40 in fig. 3 together with a part of the frame portion 50.
In the sensor region 40, as shown in fig. 4, a dummy electrode 62 is formed together with the first sensor electrode row 61, and as shown in fig. 5, a dummy electrode 72 is formed together with the second sensor electrode row 71. The dummy electrodes 62 and 72 are formed so as to make the first sensor electrode array 61 and the second sensor electrode array 71 inconspicuous, respectively.
The first sensor electrode array 61, the dummy electrodes 62, the second sensor electrode array 71, and the dummy electrodes 72 are formed of a fine wire mesh (first fine wire mesh) of the same specification formed of line segments that are oblique to the sides of the rectangular sensor region 40, and the first sensor electrode array 61 insulated from the dummy electrodes 62 and the second sensor electrode array 71 insulated from the dummy electrodes 72 are formed by breaking predetermined portions of the fine wire mesh. The unit cell of the first fine line mesh is a diamond shape whose one side is 400 μm in this example, and the line width of the fine line constituting the mesh is 7 μm. The first sensor electrode array 61 and the dummy electrode 62, and the second sensor electrode 71 and the dummy electrode 72 are separated and insulated from each other at intervals of about 20 μm.
The first sensor electrode array 61 includes a plurality of island-shaped electrodes 61a arranged in the X direction parallel to the long side 41 of the rectangular sensor region 40, and a connecting portion 61b connecting adjacent island-shaped electrodes 61 a. The first sensor electrode array 61 is provided in plural in parallel in the Y direction parallel to the short side 42 of the rectangular sensor region 40. The second sensor electrode row 71 includes a plurality of island-shaped electrodes 71a arranged in the Y direction and a connecting portion 71b connecting adjacent island-shaped electrodes 71 a. The second sensor electrode row 71 is provided in plurality in parallel in the X direction.
The first sensor electrode column 61 and the second sensor electrode column 71 cross each other in an insulated state. The coupling portion 61b and the coupling portion 71b are located at positions overlapping each other.
As shown in fig. 3, the frame portion 50 is formed with lead wires 63 and 73, terminals 81, and ground wirings 82, and pads, although not shown in fig. 3. The lead lines 63 are led out from both ends in the X direction of each first sensor electrode array 61 via pads 64 (see fig. 4), and the lead lines 73 are led out from one end in the Y direction of each second sensor electrode array 71 via pads. In fig. 3, only the lead wires at both ends of the array are shown for the lead wires 63 and 73 provided in the frame portion 50 in an array, and the lead wires other than the both ends are not shown.
The terminals 81 are arranged and formed at the central portion of one long side of the transparent substrate 30 having a rectangular shape, and the lead-out wires 63, 73 are extended to the terminals 81 and connected to the terminals 81. The ground wiring 82 is formed on the peripheral edge of the frame 50 so as to surround the lead wires 63 and 73. The ground wiring 82 is also connected to the terminal 81.
The lead wire 73 and the terminal 81 are formed of the first conductor layer, and the ground wiring 82 is formed of both the first conductor layer and the second conductor layer, as in the lead wire 63.
The pads 64, which connect the first sensor electrode array 61 and the lead lines 63 in between, and the pads, which connect the second sensor electrode array 71 and the lead lines 73 in between although not shown, are both formed by a fine wire mesh (second fine wire mesh) formed by line segments that are oblique to the long sides 41 and the short sides 42 of the sensor region 40, and the second fine wire mesh is set at a higher density than the first fine wire mesh that forms the first sensor electrode array 61 and the second sensor electrode array 71. In this example, the unit cell of the second fine line mesh is a square having a side length of about 40 μm, and the line width of the fine line constituting the mesh is 10 μm.
Although not shown in detail, the terminals 81 and the ground wirings 82 are formed of a fine wire mesh having a higher density than the first fine wire mesh constituting the first sensor electrode array 61 and the second sensor electrode array 71, similarly to the pads 64.
On the other hand, the lead lines 63, 73 are provided as linear wirings and are not provided as a grid, and in this example, as shown in fig. 4, the lead lines 63, 73 constitute portions of the lead lines 63, which are drawn from the pads 64 and extend in parallel with the short sides 42 of the sensor region 40, in other words, long in the Y direction, by wave lines. Fig. 6 shows a portion where the extension direction of a plurality of lead lines 63 arranged in the lower left portion of the frame portion 50 in fig. 3 transits from the Y direction to the X direction.
The first conductor layer and the second conductor layer having the above-described structure are formed by printing using conductive ink containing conductive particles such as silver by gravure offset printing. As indicated by the arrows in fig. 3, a squeegee direction S of a squeegee pair intaglio defining a wiring pattern of a conductor layer is set to an X direction parallel to the long side 41 of the sensor region 40.
In this example, as described above, the wiring patterns other than the lead wires 63 and 73 are formed by the fine line mesh constituted by the line segments that are oblique to the squeegee direction S of the squeegee, and the portions of the lead wires 63 and 73 that extend long in the Y direction of the lead wires 63 (the extending direction of the blade edge of the squeegee) are formed by the wavy lines, so that it is possible to eliminate the occurrence of a problem that the conductive ink is scraped off by the squeegee falling into the concave portion of the depressed plate that defines these wiring patterns.
On the other hand, in the touch panel of such a structure, as described above, the following phenomenon occurs: in the lead line 63 formed of wavy lines, which is located in the area immediately downstream of the land 64 formed of fine mesh in the doctor blade direction S, a large bleeding of an inherent form occurs due to the scraped residue of ink.
Fig. 7A is an enlarged view of a portion a in fig. 4, showing the occurrence of the bleeding, and fig. 7A shows a bleeding a in a portion where a dot is marked. The bleeding a occurs only in the lead line 63 located on the upstream side in the blade coating direction S, and does not occur in the lead line 63 located on the downstream side, of the two lead lines 63. The occurrence of the bleeding a causes the two adjacent lead lines 63 to be in a short-circuited state as shown in fig. 7A.
The bleeding a of the intrinsic morphology shown in fig. 7A has the following two properties.
(1) This occurs only when, in the wavy line traversing the blade coating direction, there is a wiring element that generates a large frictional resistance to the blade relatively near upstream of the blade coating.
(2) Even when a plurality of parallel wave lines are provided downstream of the wiring element that generates a large frictional resistance, only one wave line is generated upstream.
The definition of "relatively close upstream" is based on the following presumption that the bleeding a is hard to occur if the distance between the wave line and the wiring element existing upstream is wide: if the interval with the flat land surface is sufficient, the oozing a is not generated any more.
The term "wiring element generating a large frictional resistance against the squeegee" is defined based on the presumption of the inventor, and the wiring elements located upstream when such bleeding a actually occurs are only the pads 64 and the electrodes (the first sensor electrode row 61 and the dummy electrodes 62) formed of the fine wire mesh.
The mechanism of the occurrence of the oozing a is considered to be that, if dense unevenness which generates a large frictional resistance to the blade is present on the depressed plate, the tip of the blade passing through the dense unevenness is slightly raised from the depressed plate surface, but the mechanism of the occurrence of the oozing a with respect to only one wave line on the most upstream side is not clear at present.
If another wiring element such as a wave line is present in the vicinity of the downstream side in the direction of the blade coating of the wave line where the bleeding a occurs, a short circuit occurs with the other wiring element, which is a cause of a serious problem. This is shown in the short-circuited state of the two lead lines 63 formed of wavy lines shown in fig. 7A.
Therefore, in order to prevent the occurrence of the short-circuit failure due to the bleeding a, in this embodiment, in view of the properties of the above (1) and (2), in the wave line sandwiched between the first wiring element causing the blade to be slightly raised (floated) and the second wiring element to be short-circuited, another wave line adjacent to the wave line and extending in parallel with the wave line is provided as an extra wave line on the upstream side in the blade direction of the wave line, that is, on the side where the first wiring element is located. Thus, the bleeding a is generated only in the extra wave line, and the bleeding a which causes a short circuit with the second wiring element is not generated in the wave line.
Fig. 7B shows a state where the extra wave line 91 is provided for the structure shown in fig. 7A and the oozing a occurs at the extra wave line 91. Even if the extra wave line 91 is short-circuited to the lead line 63 due to the bleeding a, no electrical defect occurs.
Fig. 8 shows a specific configuration in which an unnecessary wave line 91 is provided on the touch panel, and fig. 7B corresponds to a portion a of fig. 8.
The pad 64 includes a linear portion 64a along the edge of the first sensor electrode array 61 and a protruding portion 64b protruding from the linear portion 64a in the outer edge direction of the frame portion 50 and connected to the lead line 63. In this example, as shown in fig. 8, the extra wavy line 91 extends between the protruding portions 64b of the adjacent pads 64 adjacent to the lead line 63 and in parallel with the lead line 63, and is provided upstream of the lead line 63 in the doctor blade direction S.
In this example, one end (upper end) of each of the extra wavy lines 91 is connected to the protruding portion 64b of the pad 64, the other end is connected to the lead line 63, and the extra wavy lines 91 are connected in parallel to the lead line 63.
With the above configuration, the extra wave line 91 is caused to have the bleeding a in the inherent form generated in the wave line, and even if the extra wave line 91 is short-circuited to the adjacent lead line 63 due to the bleeding a, since only the lead line 63 connected in parallel and having the same potential is short-circuited, no electrical problem occurs.
Further, the lead line 63 led out from the uppermost pad 64 does not have a second wiring element to be short-circuited, and therefore, it can be said that the extra wave line 91 is not necessary to be provided, but if a detection circuit for a touch panel not having such an extra wave line 91 is used as it is as a detection circuit for a touch panel, it is necessary to maintain a difference in resistance values of the plurality of lead lines 63 (reason 1), and therefore, the extra wave line 91 is provided.
In this example, as described above, the lead lines 63 are led out from both ends of each first sensor electrode array 61 in the X direction via the pads 64, respectively, and the lead lines 63 arranged on the opposite side to the X direction as shown in fig. 8 are located on the upstream side of the pads 64 in the blade coating direction S, and due to this positional relationship, the oozing a does not occur, and there is no technical problem, but since it is desirable that the resistance, capacitance, and other electrical characteristics are all symmetrical in the touch panel (reason 2), the same extra wave lines are symmetrically provided also for the lead lines 63 on the opposite side to the X direction, and detailed illustration is omitted.
The extra wave line 91 is provided in parallel with the lead line 63 in fig. 8, but this arrangement state is not necessarily required. Fig. 9 and 10 show other installation states, and in fig. 9, unlike the unnecessary wave line 91 shown in fig. 8, one end (upper end) of the unnecessary wave line 91' is not connected to the pad 64, and only the other end is connected to the lead line 63. In fig. 10, both one end and the other end of the unnecessary wave line 91 ″ are not connected to the pad 64 and the lead line 63, and are insulated from the lead line 63.
The redundant wave lines can be configured as shown in fig. 9 and 10. In addition, when the extra wavy line 91' of the form shown in fig. 9 and the extra wavy line 91 ″ of the form shown in fig. 10 are provided, the above-described reasons 1 and 2 do not need to be considered, and therefore the extra wavy lines 91', 91 ″ provided for the lead lines 63 drawn from the uppermost pad 64 in fig. 9 and 10, respectively, may not be provided for the lead lines 63 located on the other end side in the X direction, and the extra wavy lines 91', 91 ″ may not be provided for the lead lines 63 located on the other end side in the X direction.
In the above, the printed wiring of the embodiment has been described taking the wiring pattern of the first conductor layer of the touch panel as an example, and the embodiment is characterized in that: another wave line (excess wave line) is provided between the wave line and the first wiring element, and the other wave line is adjacent to the wave line and extends in parallel with the wave line, wherein the printed wiring is formed of a film of cured conductive ink formed on a surface of a base material, and includes at least one wave line, a first wiring element located on one of two sides across the wave line in a width direction, and a second wiring element located on the other of the two sides and adjacent to the wave line.
The wiring element refers to a constituent element of a wiring formed of a conductor, such as a wiring, an electrode, a pad, or a part thereof, and in the structure of the touch panel shown in fig. 8 to 10, the pad 64 formed of a high-density fine wire mesh corresponds to a first wiring element, and the lead line 63 (the other wave line) located on the opposite side of the unnecessary wave line 91 (91 ', 91 ") adjacent to the lead line 63 provided adjacent to the unnecessary wave line 91 (91', 91") corresponds to a second wiring element. The term "adjacent" means that no other wiring element is interposed therebetween.
Next, a description will be given of a wave shape to which a portion of the lead wire 63 extending long in the Y direction (extending direction of the blade tip of the squeegee) and a wiring pattern of a wave such as an extra wave 91 are applied.
The wiring pattern 100 forming the wave line shown in fig. 11A is a wiring pattern in which the wave line is composed of a triangular wave.
When the wave line forming the wiring pattern of the wave line is a triangular wave as shown in fig. 11A, the printed wiring pattern 100 is likely to have a shape defect as shown in fig. 11B. That is, the folded-back portion (bent portion) of the triangular wave located on the downstream side in the blade coating direction S tends to generate a tail of the conductive ink denoted by b, and the folded-back portion of the triangular wave tends to generate a bleeding of the conductive ink denoted by c.
Such a large amount of tailing b and bleeding c of the conductive ink causes contact with adjacent wiring patterns and causes short-circuit failure, which is a factor that prevents the reduction of the pitch of the wiring patterns.
In order to reduce the risk of the tails b and the oozing C contacting the adjacent wiring patterns, the wavy lines of the wiring patterns 110, 120, and 130 shown in fig. 12A to 12C are notched at the apexes of the folded portions of the triangular waves located on the downstream side in the doctor blade direction S and protruding in the direction orthogonal to the extending direction thereof.
The wiring pattern 110 shown in fig. 12A has V-shaped notches 111 formed in the folded portion, and the wiring pattern 120 shown in fig. 12B has notches 121 formed by linearly cutting the folded portion. In the wiring pattern 130 shown in fig. 12C, a W-shaped notch 131 is formed in the folded portion. If the notch is provided in this way, even if the ink tailing b and bleeding c occur, the size of these is small, and therefore the degree of risk of contact with the adjacent wiring pattern can be reduced, and therefore the pitch of the wiring pattern can be made small. In addition, the wiring patterns 110, 120, and 130 shown in fig. 12A to 12C are each also cut linearly at folded portions protruding in a direction opposite to the folded portions where the notches 111, 121, and 131 are formed, and notches 112, 122, and 132 are formed, respectively.
On the other hand, in order to prevent such tailing b and bleeding c, it is effective to form the convex portion 202 in the concave portion 201 of the depressed plate 200 corresponding to the wavy wiring pattern 100 to reduce the amount of the conductive ink as shown in fig. 13A. As a result, voids (spaces without a film) or film recesses corresponding to the projections 202 of the depressed plate 200 are formed in the wiring pattern 100 of the wavy line. The convex portion 202 is preferably formed so as to be located at a folded portion of the wave line, and more preferably formed so as to be shifted in the blade coating direction S as shown in fig. 13B. The film recesses or film-free spaces are formed so that one exists in the width direction of the wavy line shape and one or more exists in the longitudinal direction.
In addition, in order to suppress the resistance value and to avoid the risk of disconnection, the linear lead lines 63 and 73 of the touch panel are formed of thicker wires than the thin lines constituting the fine line mesh, and therefore, in the gravure offset printing, printing defects due to the conductive ink remaining on the blanket are likely to occur. The formation of the convex portion 202 in the concave portion 201 of the depressed plate 200 is also preferable in preventing the occurrence of such printing defects. In this respect, the convex portion is preferably formed also in the concave portion of the depressed plate corresponding to the linear portion, without being limited to the wavy portion of the wiring pattern.

Claims (21)

1. A printed wiring formed by a film of a conductive ink cured on a surface of a base material, comprising:
a wave line;
a first wiring element;
a second wiring element;
a redundant wave line arranged in parallel with the one wave line;
the first wiring element is located on one of both sides in the width direction of the one wave line,
the second wiring element is located on the other of the two sides and adjacent to the one wave line,
the one extra wave line is located between the one wave line and the first wiring element and adjacent to the one wave line,
the one extra line is connected to the one line, the potential of the one extra line is the same as the potential of the one line,
and a notch is formed at an apex of a bending portion included in at least one of the one wave line and the one extra wave line, wherein the bending portion protrudes in a width direction of the at least one wave line, and the bending portion formed with the notch is located on at least one of both sides of the at least one wave line in the width direction.
2. A printed wiring formed by a film of a conductive ink cured on a surface of a base material, comprising:
a wave line;
a first wiring element;
a second wiring element;
a redundant wave line arranged in parallel with the one wave line;
the first wiring element is located on one of both sides in the width direction of the one wave line,
the second wiring element is located on the other of the two sides and adjacent to the one wave line,
the one extra wave line is located between the one wave line and the first wiring element and adjacent to the one wave line,
the one extra wave line is insulated from the one wave line,
and a notch formed at an apex of a bending portion included in at least one of the one wave line and the one extra wave line, wherein the bending portion protrudes in a width direction of the at least one wave line, and the bending portion formed with the notch is located on at least one of both sides in the width direction of the at least one wave line.
3. Printed wiring according to claim 1 or 2,
the first wiring element is an electrode or a wiring formed of a fine wire mesh.
4. Printed wiring according to claim 1 or 2,
one depression or one space is present in at least one of the one wave line and the one extra wave line in the width direction of the wave line shape, and one or more depressions or one or more spaces are present in the longitudinal direction of the wave line shape.
5. Printed wiring according to claim 3,
one depression or one space is present in at least one of the one wave line and the one extra wave line in the width direction of the wave line shape, and one or more depressions or one or more spaces are present in the longitudinal direction of the wave line shape.
6. Printed wiring according to claim 1 or 2,
the second wiring element is a single wave line provided in parallel with the single wave line.
7. Printed wiring according to claim 3,
the second wiring element is a single wave line provided in parallel with the single wave line.
8. Printed wiring according to claim 4,
the second wiring element is a single wave line provided in parallel with the single wave line.
9. Printed wiring according to claim 5,
the second wiring element is a single wave line provided in parallel with the single wave line.
10. Printed wiring according to claim 6,
a notch is formed at an apex of a bent portion included in the second wiring element, wherein the bent portion protrudes in the width direction of the at least one of the first and second wiring elements, and the bent portion formed with the notch is located on at least one of both sides in the width direction of the at least one of the first and second wiring elements.
11. Printed wiring according to claim 7,
a cutout is formed at an apex of a bent portion included in the second wiring element, the bent portion protruding in a width direction of the second wiring element, and the bent portion formed with the cutout is located on at least one of both sides in the width direction of the second wiring element.
12. Printed wiring according to claim 8,
a cutout is formed at an apex of a bent portion included in the second wiring element, the bent portion protruding in a width direction of the second wiring element, and the bent portion formed with the cutout is located on at least one of both sides in the width direction of the second wiring element.
13. Printed wiring according to claim 9,
a cutout is formed at an apex of a bent portion included in the second wiring element, the bent portion protruding in a width direction of the second wiring element, and the bent portion formed with the cutout is located on at least one of both sides in the width direction of the second wiring element.
14. Printed wiring according to claim 6,
in the second wiring element, one depression or one space is present in the width direction of the wavy line shape, and one or more depressions or one or more spaces are present in the length direction of the wavy line shape.
15. Printed wiring according to claim 7,
in the second wiring element, one depression or one space is present in the width direction of the wavy line shape, and one or more depressions or one or more spaces are present in the length direction of the wavy line shape.
16. Printed wiring according to claim 8,
in the second wiring element, one recess or one space is present in the width direction of the wavy line shape, and one or more recesses or one or more spaces are present in the length direction of the wavy line shape.
17. Printed wiring according to claim 9,
in the second wiring element, one depression or one space is present in the width direction of the wavy line shape, and one or more depressions or one or more spaces are present in the length direction of the wavy line shape.
18. Printed wiring according to claim 10,
in the second wiring element, one recess or one space is present in the width direction of the wavy line shape, and one or more recesses or one or more spaces are present in the length direction of the wavy line shape.
19. Printed wiring according to claim 11,
in the second wiring element, one recess or one space is present in the width direction of the wavy line shape, and one or more recesses or one or more spaces are present in the length direction of the wavy line shape.
20. Printed wiring according to claim 12,
in the second wiring element, one recess or one space is present in the width direction of the wavy line shape, and one or more recesses or one or more spaces are present in the length direction of the wavy line shape.
21. Printed wiring according to claim 13,
in the second wiring element, one recess or one space is present in the width direction of the wavy line shape, and one or more recesses or one or more spaces are present in the length direction of the wavy line shape.
CN201780052487.XA 2016-10-13 2017-09-13 Printed wiring Active CN109643189B (en)

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US20210333939A1 (en) 2021-10-28
JP2018063578A (en) 2018-04-19

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