CN109554135B - 包含金属纳米线的透明导电性粘接剂膜及其制造方法 - Google Patents

包含金属纳米线的透明导电性粘接剂膜及其制造方法 Download PDF

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Publication number
CN109554135B
CN109554135B CN201811117129.5A CN201811117129A CN109554135B CN 109554135 B CN109554135 B CN 109554135B CN 201811117129 A CN201811117129 A CN 201811117129A CN 109554135 B CN109554135 B CN 109554135B
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China
Prior art keywords
transparent
adhesive film
dielectric layer
conductive adhesive
transparent conductive
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CN201811117129.5A
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English (en)
Chinese (zh)
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CN109554135A (zh
Inventor
琴同基
金浚河
卓光龙
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Dongwoo Fine Chem Co Ltd
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Dongwoo Fine Chem Co Ltd
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Publication of CN109554135A publication Critical patent/CN109554135A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
CN201811117129.5A 2017-09-26 2018-09-25 包含金属纳米线的透明导电性粘接剂膜及其制造方法 Active CN109554135B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170123979A KR102089637B1 (ko) 2017-09-26 2017-09-26 금속 나노 와이어를 포함하는 투명 도전성 접착제 필름 및 그 제조방법
KR10-2017-0123979 2017-09-26

Publications (2)

Publication Number Publication Date
CN109554135A CN109554135A (zh) 2019-04-02
CN109554135B true CN109554135B (zh) 2021-05-18

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CN201811117129.5A Active CN109554135B (zh) 2017-09-26 2018-09-25 包含金属纳米线的透明导电性粘接剂膜及其制造方法

Country Status (2)

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KR (1) KR102089637B1 (ko)
CN (1) CN109554135B (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102067245A (zh) * 2008-07-04 2011-05-18 户田工业株式会社 透明导电性转印版的制造方法、透明导电性转印版、利用透明导电性转印版的透明导电性基材的制造方法、透明导电性基材以及利用透明导电性基材的成型体
CN103080876A (zh) * 2010-07-05 2013-05-01 Dic株式会社 带透明导电层的基体及其制造方法、以及触控面板用透明导电膜层叠体、触控面板
JP2014063444A (ja) * 2012-09-24 2014-04-10 Toppan Printing Co Ltd 透明導電性フィルム、タッチパネル、及び透明導電性フィルムの製造方法
JP2016081318A (ja) * 2014-10-17 2016-05-16 コニカミノルタ株式会社 透明導電体及びタッチパネル

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101132076B1 (ko) * 2003-08-04 2012-04-02 나노시스, 인크. 나노선 복합체 및 나노선 복합체로부터 전자 기판을제조하기 위한 시스템 및 프로세스
KR101482780B1 (ko) 2013-08-29 2015-01-15 (주)탑나노시스 전도성 나노와이어필름 제조 방법 및 상기 제조방법으로 제조된 전도성 나노와이어 필름을 포함하는 터치패널

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102067245A (zh) * 2008-07-04 2011-05-18 户田工业株式会社 透明导电性转印版的制造方法、透明导电性转印版、利用透明导电性转印版的透明导电性基材的制造方法、透明导电性基材以及利用透明导电性基材的成型体
CN103080876A (zh) * 2010-07-05 2013-05-01 Dic株式会社 带透明导电层的基体及其制造方法、以及触控面板用透明导电膜层叠体、触控面板
JP2014063444A (ja) * 2012-09-24 2014-04-10 Toppan Printing Co Ltd 透明導電性フィルム、タッチパネル、及び透明導電性フィルムの製造方法
JP2016081318A (ja) * 2014-10-17 2016-05-16 コニカミノルタ株式会社 透明導電体及びタッチパネル

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Publication number Publication date
CN109554135A (zh) 2019-04-02
KR20190035120A (ko) 2019-04-03
KR102089637B1 (ko) 2020-03-16

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