CN109554135B

CN109554135B - Transparent conductive adhesive film containing metal nanowires and method for producing same

Info

Publication number: CN109554135B
Application number: CN201811117129.5A
Authority: CN
Inventors: 琴同基; 金浚河; 卓光龙
Original assignee: Dongwoo Fine Chem Co Ltd
Current assignee: Dongwoo Fine Chem Co Ltd
Priority date: 2017-09-26
Filing date: 2018-09-25
Publication date: 2021-05-18
Anticipated expiration: 2038-09-25
Also published as: CN109554135A; KR20190035120A; KR102089637B1

Abstract

The present invention provides a transparent conductive adhesive film containing metal nanowires, which is a transparent conductive adhesive film applicable to a touch sensor, and a method for manufacturing the same. The method for manufacturing a transparent conductive adhesive film of the present invention comprises: a step of forming a separation layer on a substrate; a step of forming a conductive pattern portion including a metal nanowire on the separation layer; and a step of transferring the conductive pattern portion including the metal nanowire to at least one surface of the transparent dielectric layer having an adhesive force. According to the present invention, ITO, which has been used as a transparent electrode material of a touch sensor, is replaced with metal nanowires, so that resource limitations can be overcome, an increase in resistance can be suppressed, a large area can be provided, thin film characteristics and flexibility characteristics can be improved, and a manufacturing process can be simplified, so that manufacturing costs and manufacturing time can be reduced, and product yield can be improved.

Description

Transparent conductive adhesive film containing metal nanowires and method for producing same

Technical Field

The present invention relates to a transparent conductive adhesive film containing metal nanowires and a method for manufacturing the same. More particularly, the present invention relates to a transparent conductive adhesive film including metal nanowires, which can overcome resource limitations by replacing Indium Tin Oxide (ITO), which has been used as a transparent electrode material of a touch sensor, with metal nanowires, can increase the area while suppressing an increase in resistance, improve thin film characteristics and flexibility characteristics, and can reduce manufacturing costs and manufacturing time and improve product yield by simplifying manufacturing processes, and a method for manufacturing the same.

Background

To operate a computer system, a wide variety of input devices are utilized. For example, input devices such as buttons (buttons), keys (keys), joysticks (joysticks), and touch panels are used. Since the operation of the touch sensor is simple and convenient, applications of the touch sensor are increasing while operating the computer system.

The touch sensor may constitute a touch surface of a touch input device including a touch sensor panel (touch sensor panel) which may be a transparent panel provided with a touch-sensitive surface. Such touch sensor panels are attached to the front of the display screen so that the touch-sensitive surface can cover the viewable side of the display screen. The user touches the touch screen with a finger or the like, thereby enabling the user to operate the computer system. Generally, computer systems are capable of performing algorithms by recognizing touches and touch locations on a touch screen and analyzing such touches.

In recent years, a touch sensor technology has been developed which deviates from simple two-dimensional coordinate recognition and recognizes a level of a touch pressing Force, so-called Force touch sensor.

However, according to the related art, since ITO (indium tin oxide) is mainly used as a transparent electrode material of the touch sensor, there are the following problems: there is a limitation in terms of resources, and it is difficult to increase the area of the touch sensor due to an increase in resistance, and the thin film property and the flexibility property are degraded.

Further, according to the prior art, there is a problem that the production process for forming the ITO transparent electrode is complicated, the production cost and the production time are increased, and the product yield is lowered.

Documents of the prior art

Patent document

Patent document 1: korean registered patent publication No. 10-1482780 (registration date: 2015, 01 month and 08 days, title: method for manufacturing electrically conductive nanowire film and touch panel comprising electrically conductive nanowire film manufactured by the manufacturing method)

Disclosure of Invention

Problems to be solved

The present invention has been made in an effort to provide a transparent conductive adhesive film that can be applied to a touch sensor, and can overcome resource limitations, increase resistance, increase area, and improve film properties and flexibility by replacing ITO (indium tin oxide), which has been used as a transparent electrode material of the touch sensor, with metal nanowires, and a method for manufacturing the same.

Another object of the present invention is to provide a transparent conductive adhesive film that can be applied to a touch sensor and can reduce manufacturing costs and manufacturing time and improve product yield by simplifying the manufacturing process, and a method for manufacturing the same.

Means for solving the problems

The method for manufacturing a transparent conductive adhesive film according to the present invention for solving the above technical problem includes: a separation layer forming step of forming a separation layer on a substrate; a conductive pattern portion forming step of forming a conductive pattern portion including a metal nanowire on the separation layer; and a conductive pattern portion transfer step of transferring the conductive pattern portion including the metal nanowire to at least one surface of the transparent dielectric layer having an adhesive force.

The method for producing a transparent conductive adhesive film of the present invention is characterized by further comprising a substrate separation step of separating the substrate by peeling.

The method for producing a transparent conductive Adhesive film of the present invention is characterized in that the transparent dielectric layer is an Optically Clear Adhesive (OCA).

The method for producing a transparent conductive adhesive film of the present invention is characterized in that the modulus of the transparent dielectric layer is 0.10 to 5 MPa.

The method for producing a transparent conductive adhesive film of the present invention is characterized in that the thickness restoring force of the transparent dielectric layer is 90 to 100%/sec.

The method for producing a transparent conductive adhesive film of the present invention is characterized in that the transparent dielectric layer has a modulus of 0.10 to 5MPa in a temperature range of-40 to +80 ℃.

The method for producing a transparent conductive adhesive film of the present invention is characterized in that the transparent dielectric layer has a thickness restoring force of 90 to 100%/sec in a temperature range of-40 to +80 ℃.

The method for producing a transparent conductive adhesive film of the present invention is characterized in that the thickness of the transparent dielectric layer is 10 to 150 μm.

The method for producing a transparent conductive adhesive film of the present invention is characterized in that the dielectric constant of the transparent dielectric layer is 1 to 15.

The method for producing a transparent conductive adhesive film of the present invention is characterized in that the metal nanowire contains silver (Ag) or copper (Cu).

The method for producing a transparent conductive adhesive film of the present invention is characterized in that the diameter of the metal nanowires is 1 to 100 nm.

The method for producing a transparent conductive adhesive film of the present invention is characterized in that the length of the metal nanowires is 1 to 100 um.

The method for producing a transparent conductive adhesive film of the present invention is characterized in that the bonding force between the conductive pattern portion and the separation layer is greater than the bonding force between the substrate and the separation layer.

The transparent conductive adhesive film of the present invention comprises a transparent dielectric layer having adhesive force and a conductive pattern section comprising metal nanowires bonded to at least one of both surfaces of the transparent dielectric layer.

The transparent conductive Adhesive film of the present invention is characterized in that the transparent dielectric layer is an Optically Clear Adhesive (OCA).

The transparent conductive film of the present invention further comprises a separation layer formed between the transparent dielectric layer and the conductive pattern portion.

The transparent conductive film of the present invention is characterized in that a first substrate is formed on a first surface of both surfaces of the transparent dielectric layer.

The transparent conductive film of the present invention is characterized in that a second substrate is formed on a second surface of the two surfaces of the transparent dielectric layer, the second surface being opposite to the first surface.

The transparent conductive film of the present invention is characterized in that the modulus of the transparent dielectric layer is 0.10 to 5 MPa.

The transparent conductive film of the present invention is characterized in that the thickness restoring force of the transparent dielectric layer is 90 to 100%/sec.

The transparent conductive film of the present invention is characterized in that the transparent dielectric layer has a modulus of 0.10 to 5MPa in a temperature range of-40 to +80 ℃.

The transparent conductive film of the present invention is characterized in that the transparent dielectric layer has a thickness restoring force of 90 to 100%/sec in a temperature range of-40 to +80 ℃.

The transparent conductive film of the present invention is characterized in that the thickness of the transparent dielectric layer is 10 to 150 um.

The transparent conductive film of the present invention is characterized in that the dielectric constant of the transparent dielectric layer is 1 to 15.

The transparent conductive film of the present invention is characterized in that the metal nanowire contains silver (Ag) or copper (Cu).

The transparent conductive film of the present invention is characterized in that the diameter of the metal nanowire is 1 to 100 nm.

The transparent conductive film of the present invention is characterized in that the length of the metal nanowire is 1 to 100 um.

Effects of the invention

The present invention has an effect of providing a transparent conductive adhesive film that can be applied to a touch sensor and a method for manufacturing the same: the touch sensor can overcome the resource limitation by replacing ITO, which is used as a transparent electrode material of the touch sensor, with the metal nanowire, and can increase the area while suppressing the increase of resistance, thereby improving the film property and the flexibility property.

Further, the transparent conductive adhesive film and the method for manufacturing the same can be applied to the following touch sensor: the transparent conductive adhesive film can reduce the manufacturing cost and time and improve the product yield by simplifying the manufacturing process.

Drawings

Fig. 1 is a process sequence diagram of a method for manufacturing a transparent conductive adhesive film including metal nanowires according to an embodiment of the present invention.

Fig. 2 to 8 are cross-sectional views illustrating exemplary processes of a method for manufacturing a transparent conductive adhesive film including metal nanowires according to an embodiment of the present invention.

Description of the symbols

11: a first substrate

12: second base material

21: first separation layer

22: second separation layer

31: a first conductive pattern part

32: second conductive pattern part

40: transparent dielectric layer

S10: separation layer formation step

S20: conductive pattern part forming step

S30: transfer printing step of conductive pattern part

S40: substrate separation step

Detailed Description

The specific structural or functional description of the embodiments according to the present invention described in the present specification is merely an example for explaining the embodiments according to the present invention, and the embodiments according to the present invention may be implemented in various forms without being limited to the embodiments described in the present specification.

Since various modifications and various forms can be made to the embodiments according to the concept of the present invention, the embodiments are illustrated in the drawings and described in detail in this specification. However, it is not intended to limit the embodiments according to the concept of the present invention to the particular disclosed forms, but to include all modifications, equivalents, and alternatives included in the spirit and technical scope of the present invention.

The terms such as first or second may be used to describe various components, but the components should not be limited by the terms. The above terms are intended to distinguish one component from another component, and for example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of the claims.

When a certain component is referred to as being "connected" or "in contact with" another component, it is to be understood that the component may be directly connected or in contact with the other component, and that other components may be present therebetween. On the other hand, when a certain constituent element is referred to as being "directly connected" or "directly contacting" another constituent element, it is to be understood that no other constituent element exists therebetween. Other expressions describing the relationship between the constituent elements, i.e., "between" and "only between", or "adjacent to" and "directly adjacent to", etc., should be similarly understood.

The terms used in the present specification are used only for describing specific embodiments, and are not intended to limit the present invention. Reference to the singular is not intended to include the plural if not otherwise stated in the context. In the present specification, the terms "including" or "having" are used to indicate the presence of the features, numerals, steps, operations, components, parts, or combinations thereof described in the present specification, and should not be understood to exclude the presence or possibility of addition of one or more other features, numerals, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The same terms as those defined in a general-use dictionary should be understood to have a meaning consistent with those possessed by the context of the related art, and should not be interpreted in an ideal or excessively formal sense if not explicitly defined in the present specification.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a sequence of steps of a method for manufacturing a transparent conductive adhesive film including metal nanowires according to an embodiment of the present invention, and fig. 2 to 8 are cross-sectional views of exemplary steps of the method for manufacturing a transparent conductive adhesive film including metal nanowires according to an embodiment of the present invention.

Referring to fig. 1 to 8, a method of manufacturing a transparent conductive adhesive film including metal nanowires according to an embodiment of the present invention includes a separation layer forming step S10, a conductive pattern portion forming step S20, a conductive pattern portion transferring step S30, and a substrate separating step S40.

In the following description, the first conductive pattern part 31 and the second conductive pattern part 32 functioning as electrodes of the touch sensor are transferred to both surfaces of the transparent dielectric layer 40, and the same process is performed to transfer the first conductive pattern part 31 and the second conductive pattern part 32 to the transparent dielectric layer 40. Therefore, in order to avoid redundant description, a method for manufacturing a transparent conductive adhesive film according to an embodiment of the present invention will be described below, focusing on a process of transferring the first conductive pattern part 31 to the transparent dielectric layer 40. The description of the first base material 11, the first separation layer 21, and the first conductive pattern portion 31 may be directly applied to the second base material 12, the second separation layer 22, and the second conductive pattern portion 32.

First, referring to fig. 1 and 2, in the separation layer forming step S10, a process of forming the first separation layer 21 on the first base material 11 is performed.

The first base material 11 functions as a base (base) which is a constituent element for forming the transparent conductive adhesive film. In the final step, the first substrate 11 may be peeled off and separated, or may remain as one of the constituents of the transparent conductive adhesive film. When the first substrate 11 remains, the first substrate 11 can be used as a mechanism for ensuring optical properties, durability, and the like of the transparent conductive adhesive film.

For example, the first base material 11 may be used without any particular limitation as long as it is a material that provides appropriate strength so as to be not easily bent or twisted during the process, can be fixed, and has little influence on heat or chemical treatment.

As a specific example, as the first base material 11, a hard material such as glass, quartz, a silicon wafer, stainless steel (SUS), or the like can be used.

Specifically, as another example, the first substrate 11 may be a transparent optical film, and a film having excellent transparency, mechanical strength, and thermal stability may be used. More specific examples of the transparent optical film include films made of the following thermoplastic resins: cellulose resins such as diacetylcellulose and triacetylcellulose; polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate and polybutylene terephthalate; a polycarbonate-based resin; acrylic resins such as polymethyl (meth) acrylate and polyethyl (meth) acrylate; styrene resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin resins such as polyethylene, polypropylene, polyolefins having a cyclic or norbornene structure, and ethylene-propylene copolymers; a vinyl chloride-based resin; amide resins such as nylon and aromatic polyamide; an imide-based resin; a polyether sulfone-based resin; a sulfone-based resin; a polyether ether ketone resin; polyphenylene sulfide-based resin; a vinyl alcohol resin; a vinylidene chloride resin; a vinyl butyral resin; an allylic resin; a polyoxymethylene resin; epoxy resin, etc., and a film made of a blend of the above thermoplastic resins may also be used. In addition, a film formed of a thermosetting resin such as a (meth) acrylic, urethane, acrylic urethane, epoxy, or silicone resin, or an ultraviolet-curable resin may be used. The thickness of the transparent optical film can be suitably determined, and is generally determined to be 1 to 500 μm, particularly preferably 1 to 300 μm, and more preferably 5 to 200 μm in view of workability such as strength and workability, and thin layer property.

Such transparent optical films may contain one or more suitable additives. Examples of the additives include ultraviolet absorbers, antioxidants, lubricants, plasticizers, mold release agents, coloring inhibitors, flame retardants, nucleating agents, antistatic agents, pigments, and colorants. The transparent optical film may have a structure in which a variety of functional layers such as a hard coat layer, an antireflection layer, and a gas barrier layer are included on one surface or both surfaces of the film, and the functional layers are not limited to the above-described layers, and may include a variety of functional layers depending on the application.

Further, the transparent optical film may be surface-treated as necessary. Examples of such surface treatment include dry treatment such as plasma (plasma) treatment, corona (corona) treatment, primer (primer) treatment, and chemical treatment such as alkali treatment including saponification treatment.

Further, the transparent optical Film may be an isotropic Film, a retardation Film, or a Protective Film (Protective Film).

In the case of an isotropic film, the in-plane retardation (Ro, Ro ═ nx-ny) xd ], nx, ny are the principal refractive indices in the film plane, d is the film thickness), is 40nm or less, preferably 15nm or less, and the thickness direction retardation (Rth, Rth ═ [ (nx + ny)/2-nz ] xd, nx, ny are the principal refractive indices in the film plane, nz is the refractive index in the film thickness direction, d is the film thickness.) is-90 nm to +75nm, preferably-80 nm to +60nm, particularly preferably-70 nm to +45 nm.

The retardation film is produced by a method of uniaxial stretching, biaxial stretching, polymer coating, or liquid crystal coating of a polymer film, and is generally used for improvement and adjustment of optical characteristics such as viewing angle compensation, color improvement, light leakage improvement, and color tone adjustment of a display. The type of the retardation film includes a wavelength plate such as 1/2 or 1/4, a positive C plate, a negative C plate, a positive a plate, a negative a plate, and a biaxial wavelength plate.

The protective film may be a film including an adhesive layer on at least one surface of a film made of a polymer resin, or a film having self-adhesiveness such as polypropylene, and may be used for protecting the surface of the touch sensor and improving the process characteristics.

The first separation layer 21 is formed to peel the first conductive pattern portion 31 formed on the first separation layer 21 from the first base material 11 in the process of manufacturing the transparent conductive adhesive film according to the embodiment of the present invention.

For example, the first separation layer 21 and the first substrate 11 may be separated by one of a physical method (light, heat, and the like), a chemical method (chemical reaction), a mechanical method (force and vibration), or a method combining a plurality of methods.

More specifically, the first separation layer 21 performs a function of adjusting to form a difference in adhesion between the components to be separated in the substrate separating step S40 performed after the conductive pattern portion transferring step S30 described later. For example, the bonding force between the first conductive pattern part 31 and the first separation layer 21 may be configured to be greater than the bonding force between the first substrate 11 and the first separation layer 21. With this configuration, the first base material 11 can be stably peeled from the first separation layer 21 without affecting the bonding between the first conductive pattern portion 31 and the first separation layer 21.

As an exemplary material of the first separation layer 21, the following polymer may be used: polyimide-based polymers, polyvinyl alcohol-based polymers, polyamic acid-based polymers, polyamide-based polymers, polyethylene-based polymers, polystyrene-based polymers, polynorbornene-based polymers, phenylmaleimide-based polymers, polyazobene-based polymers, polyphthalamide (polyphthalamide) polymers, polyester (polyester) polymers, polymethyl methacrylate (polymethylmethacrylate) polymers, polyacrylate (polyarylate) polymers, cinnamate (cinnamate) polymers, coumarin (coumarin) polymers, phthalimide (phthalimide) polymers, chalcone (chalcone) polymers, aromatic acetylene (aromatic acetylene) polymers, and the like, which may be used alone or in combination of two or more.

The peeling force of the first separation layer 21 is not particularly limited, and may be, for example, 0.01N/25mm or more and 1N/25mm or less, and preferably 0.01N/25mm or more and 0.1N/25mm or less. When the above range is satisfied, the first conductive pattern portion 31 or the first separation layer 21 on which the first conductive pattern portion 31 is formed can be easily peeled from the first substrate 11 without leaving any residue in the process of manufacturing the transparent conductive adhesive film, and curl (curl) and cracks due to tension generated at the time of peeling can be reduced.

The thickness of the first separation layer 21 is not particularly limited, and may be, for example, 10 to 1,000nm, preferably 50 to 500 nm. When the above range is satisfied, the peeling force is stable, and a uniform pattern can be formed.

Although not illustrated in the drawings, a first protective layer may be formed on the first separation layer 21.

The first protective layer is an optional component that can be omitted as needed, and prevents the first separation layer 21 from being damaged by exposure to process chemicals or a developing solution that may be used when forming the first conductive pattern portion 31 including the metal nanowires, a cleaning solution generated between processes, and the like in the process of manufacturing the transparent conductive adhesive film.

As a material of the first protective layer, a polymer known in the art may be used without limitation, and for example, an organic insulating film may be applied, and among them, an organic insulating film formed of a curable composition containing a polyol (polyol) and a melamine (melamine) curing agent may be used, but is not limited thereto.

Specific examples of the polyol include, but are not limited to, polyether diol (polyether diol) derivatives, polyester diol (polyester diol) derivatives, and polycaprolactone diol (polycaprolactone) derivatives.

Specific examples of the melamine curing agent include, but are not limited to, methoxymethylmelamine (methyl melamine) derivatives, methylmelamine (methyl melamine) derivatives, butylmelamine (butyl melamine) derivatives, isobutoxymelamine (isobutoxymelamine) derivatives, and butoxymelamine (butyl melamine) derivatives.

As another example, the first protective layer may be formed of an organic-inorganic blend curable composition, and in the case of using both an organic compound and an inorganic compound, it is preferable in terms of being able to reduce cracks (cracks) generated at the time of peeling.

The organic compound may be the above-mentioned one, and the inorganic compound may be, but is not limited to, silica nanoparticles, silicon nanoparticles, glass nanofibers, and the like.

Next, referring to fig. 1 and 3, in the conductive pattern portion forming step S20, a process of forming the first conductive pattern portion 31 including the metal nanowire on the first separation layer 21 is performed.

For example, the metal nanowire may include silver (Ag) or copper (Cu), the diameter of the metal nanowire may be 1 to 100nm, and the length of the metal nanowire may be 1 to 100 um. If the metal nanowires are formed in this manner, a transparent conductive adhesive film which can be applied to a touch sensor having a large area while suppressing an increase in resistance can be obtained.

Next, referring to fig. 1, 4 and 5, in the conductive pattern portion transfer step S30, a process of transferring the first conductive pattern portion 31 including the metal nanowire to one surface of the transparent dielectric layer 40 having an adhesive force is performed.

The conductive pattern transfer step S30 is performed to bond the first conductive pattern 31 including the metal nanowire to one surface of the transparent dielectric layer 40.

For example, the transparent dielectric layer 40 may be OCA (optically clear adhesive).

On the other hand, as shown in FIG. 5, the second conductive pattern part 32 can be transferred and bonded to the other surface of the transparent dielectric layer 40. In this case, the first conductive pattern portion 31 and the second conductive pattern portion 32 which are bonded and transferred to both surfaces of the transparent dielectric body function as the upper and lower electrodes of the touch sensor.

For example, the modulus (modulus) of the transparent dielectric layer 40 may be 0.10 to 5MPa, and more specifically, the modulus of the transparent dielectric layer 40 may be 0.10 to 5MPa at a temperature of-40 to 80 ℃.

The following table 1 is experimental data on the amount of change in modulus with temperature change of the transparent dielectric layer 40.

[ Table 1]

Temperature (. degree.C.)	Modulus (Mpa)
		-40	2.34
0	0.30
		25	0.19
60	0.14
		80	0.13
100	0.11

Referring to table 1, the modulus of the transparent dielectric layer 40 has a property inversely proportional to the temperature, and if the transparent dielectric layer 40 is not configured to have a modulus of 0.10 to 5Mpa at a temperature of-40 to 80 degrees, the restoring force of the transparent dielectric layer 40 is lowered, and the thickness needs to be changed in order to maintain the modulus property, so that it is difficult to make the touch sensor using the transparent conductive adhesive film thin and maintain the flexibility property.

For example, in order to maintain the performance of an electronic device to which a touch sensor is applied, including touch recognition input by a user, the thickness restoring force of the transparent dielectric layer 40 may be 90 to 100%/sec, and more specifically, the transparent dielectric layer 40 may be configured to have a thickness restoring force of 90 to 100%/sec in a temperature range of-40 to +80 degrees.

This will be described in more detail below.

The OCA (optically clear adhesive) used for the transparent dielectric layer 40 is an optical adhesive having a light transmittance of 90% or more, and when the metal nanowires are directly transferred to the OCA by adhesion, an OCA having a thickness restoring force of 90 to 100%/sec is suitable in order to prevent the surface of the OCA from being pressed by the metal nanowires and the electrical properties of the metal nanowires from being damaged.

The thickness restoring force, in other words, the Depth restoring force (DR) can be expressed by the following mathematical formula.

[ mathematical formula 1]

DR＝((hmax-hp)/hmax)*100

In equation 1, hmax is the depth at maximum load, and hp is the normal depth after load is removed.

For example, the thickness of the transparent dielectric layer 40 may be 10 to 150 μm, and the dielectric constant of the transparent dielectric layer 40 may be 1 to 15. With this configuration, since the capacitance change levels corresponding to the plurality of thickness change levels of the transparent dielectric layer 40 can be sensed and the magnitude of the touch force of the user can be sensed by using the capacitance change levels as input values, it is possible to recognize the touch force across two-dimensional coordinates and realize a force touch sensor by sensing the level of the touch force.

When the thickness of the transparent dielectric layer 40 is less than 10um, the number of levels of change in the sensible capacitance decreases, and thus the number of levels of magnitude of the touch force of the user decreases, and when the thickness of the transparent dielectric layer 40 exceeds 150um, the time required to return to the thickness before the touch increases, and it is difficult to make the film thin, and thus the optical properties such as light transmittance and flexibility are degraded.

Next, referring to fig. 1, 6 to 8, in the substrate separation step S40, a process of peeling and separating the first substrate 11 is performed.

Fig. 8 discloses a structure in which only the first base material 11 is peeled and separated, and if necessary, the first base material 11 and the second base material 12 may be peeled and separated entirely as disclosed in fig. 6, or only the second base material 12 may be peeled and separated as disclosed in fig. 7.

For example, the bonding force between the first conductive pattern part 31 and the first separation layer 21 may be greater than the bonding force between the first substrate 11 and the first separation layer 21. With this configuration, the first base material 11 can be stably peeled from the first separation layer 21 without affecting the bonding between the first conductive pattern portion 31 and the first separation layer 21.

Fig. 6 to 8 show the final result of the method for producing a transparent conductive adhesive film according to the embodiment of the present invention, and the final result is the transparent conductive adhesive film according to the embodiment of the present invention.

The description of the components of the transparent conductive adhesive film according to the embodiment of the present invention is given in detail in the description of the manufacturing method, and therefore, the overlapping description is omitted.

Claims

1. A method for manufacturing a transparent conductive adhesive film, comprising:

a separation layer forming step of forming a separation layer on a substrate;

a conductive pattern portion forming step of forming a conductive pattern portion including a metal nanowire on the separation layer; and

a conductive pattern portion transfer step of transferring the conductive pattern portion including the metal nanowire to at least one surface of the transparent dielectric layer having an adhesive force,

the bonding force between the conductive pattern part and the separation layer is greater than the bonding force between the substrate and the separation layer,

the transparent dielectric layer is an optically transparent adhesive,

the modulus of the transparent dielectric layer is 0.10 to 5MPa,

the thickness restoring force of the transparent dielectric layer is 90 to 100%/sec.

2. The method of manufacturing a transparent conductive adhesive film according to claim 1, further comprising a substrate separation step of peeling and separating the substrate.

3. The method for producing a transparent conductive adhesive film according to claim 1, wherein the thickness of the transparent dielectric layer is 10 to 150 μm.

4. The method for producing a transparent conductive adhesive film according to claim 1, wherein the dielectric constant of the transparent dielectric layer is 1 to 15.

5. The method for manufacturing a transparent conductive adhesive film according to claim 1, wherein the metal nanowire comprises silver (Ag) or copper (Cu).

6. The method for manufacturing a transparent conductive adhesive film according to claim 1, wherein the diameter of the metal nanowire is 1 to 100 nm.

7. The method for manufacturing a transparent conductive adhesive film according to claim 1, wherein the length of the metal nanowire is 1 to 100 um.

8. A transparent conductive adhesive film comprising:

a transparent dielectric layer having an adhesive force; and

a conductive pattern part including a metal nanowire and bonded to at least one of both surfaces of the transparent dielectric layer,

a separation layer formed on one surface of both surfaces of the conductive pattern portion opposite to the surface bonded to the transparent dielectric layer,

the transparent dielectric layer is an optically transparent adhesive,

the modulus of the transparent dielectric layer is 0.10 to 5MPa,

9. The transparent conductive adhesive film according to claim 8, wherein a first conductive pattern part is bonded to a first surface of both surfaces of the transparent dielectric layer,

a first separation layer is formed on the first conductive pattern portion,

a first substrate is formed on the first separation layer.

10. The transparent conductive adhesive film according to claim 9, wherein a second conductive pattern part is bonded to a second surface opposite to the first surface out of both surfaces of the transparent dielectric layer,

a second separation layer is formed on the second conductive pattern portion,

a second substrate is formed on the second separation layer.

11. The transparent conductive adhesive film according to claim 8, wherein the thickness of the transparent dielectric layer is 10 to 150 μm.

12. The transparent conductive adhesive film according to claim 8, wherein the dielectric constant of the transparent dielectric layer is 1 to 15.

13. The transparent conductive adhesive film according to claim 8, wherein the metal nanowires comprise silver (Ag) or copper (Cu).

14. The transparent conductive adhesive film according to claim 8, wherein the metal nanowires have a diameter of 1 to 100 nm.

15. The transparent conductive adhesive film according to claim 8, wherein the metal nanowires have a length of 1 to 100 um.