CN109548311A

CN109548311A - A kind of component radiation hardened method

Info

Publication number: CN109548311A
Application number: CN201811194703.7A
Authority: CN
Inventors: 朱勤辉; 张�林; 赵星
Original assignee: JIANGSU WEBEST MICRO-ELECTRONICS Ltd
Current assignee: JIANGSU WEBEST MICRO-ELECTRONICS Ltd
Priority date: 2018-10-15
Filing date: 2018-10-15
Publication date: 2019-03-29

Abstract

The present invention relates to a kind of component radiation hardened methods, comprising the following steps: step 1: PCB design prepares, step 2: the molding of irradiation resistant material；Step 3: pre-fixing；Step 4: trial assembly；Step 5: welding；Step 6: reinforcing；7th step is examined.Component radiation hardened method provided by the invention, structure is simple, technically simple, strong operability, reliable operation and long service life.

Description

A kind of component radiation hardened method

Technical field

The present invention relates to a kind of radiation hardened methods, are related specifically to a kind of component radiation hardened method.

Background technique

Due to satellite, airship, the spacecrafts such as space station are in space motion, departing from the protection of atmosphere, directly exposure Under space environment, electronic equipment will receive the impact of radiation and high energy particle from the outer space and various radiation effects occur It answers, causes the exception of work, from the statistical number both at home and abroad to space flight accident it has been found that about 40% failure is derived from space spoke It penetrates.Therefore, special Flouride-resistani acid phesphatase processing must be carried out, to it when using space flight device to ensure the reliability of its work.

The method of space flight device Flouride-resistani acid phesphatase processing is also relatively more, has based on chip design and special material application, such as makes With sapphire substrates or the device of insulator-base bottom technique, but this complex process and at high cost, or use shielding layer To increase the anti-radiation performance of space flight device, this method is more complicated.

Summary of the invention

1, technical problem to be solved:

Existing Flouride-resistani acid phesphatase processing method complex process, it is at high cost.

2, technical solution:

In order to solve problem above, the present invention provides a kind of component radiation hardened methods, comprising the following steps: first Step: PCB design prepares, step 2: the molding of irradiation resistant material；Step 3: pre-fixing；Step 4: trial assembly；Step 5: welding； Step 6: reinforcing；It includes layout designs that the PCB design, which prepares, pad design, encapsulation designs, component periphery is reserved and tied up The design of Wiring technology hole；The lead flake completed for molding that pre-fixes needs to be pre-fixed between component, makes One entirety, method are as follows: temporarily fixed between component and lead flake with the double-sided adhesive that an area is slightly less than mounting surface, use high temperature resistant Binding wire laterally or longitudinally carries out at least twice binding along component, and point Q98-1 blasting gelatine carries out locking fixation, institute at node The method for stating reinforcing are as follows: utilize PCB technology for binding hole reserved in advance, with high temperature resistant binding wire, the component that welding machine is completed Together with wiring board binding and fixing, locking processing is carried out with Q98-1 blasting gelatine at node.

The molding method of the irradiation resistant material are as follows: the 1. molding of lead flake: will be with a thickness of the mm's of 0.5 mm~2.0 Lead flake is cut out and is formed with size by the shape of handling components to be reinforced, and lead flake edge is carried out chamfered；2. marking Know: carrying out mark on the lead flake that molding is completed with laser marking machine or shell machine；3. cleaning and drying: with dehydrated alcohol to mark Know the lead flake completed to be cleaned, removes surface grease and molding and the mark remaining metal fillings of link, be then placed in drying box Interior drying；4. trial assembly: the lead flake and component that molding is completed carry out trial assembly, check whether direction, batch are consistent with model, inspection Look into compact dimensions whether be bent it is identical.

The mark includes component direction, model and batch.

There are also checking procedure after 6th step, specifically: after the completion of sealing, the component of reinforcing is comprehensively examined, Identify whether clear, whether direction is correct including component, whether welding is qualified and whether reinforcing is firm.

3, the utility model has the advantages that

Component radiation hardened method provided by the invention, structure is simple, technically simple, strong operability, reliable operation and Long service life.

Specific embodiment

Below by embodiment, the present invention is described in detail.

The present invention provides a kind of component radiation hardened methods, comprising the following steps: step 1: PCB design prepares, Step 2: the molding of irradiation resistant material；Step 3: pre-fixing；Step 4: trial assembly；Step 5: welding；Step 6: reinforcing.

Embodiment 1

A kind of component radiation hardened method, first PCB design prepare, and PCB design prepares to set including layout designs, pad The design of wiring fabrication hole is reserved on meter, encapsulation design, component periphery, and PCB is most important step, if PCB design cannot expire Sufficient demand influences whether the stability reinforced.PCB design prepares, into the molding of second step irradiation resistant material, the anti-spoke of the present invention According to material selection lead, method is the molding method of irradiation resistant material are as follows: the 1. molding of lead flake: will be with a thickness of 0.5 mm~2.0 The lead flake of mm is cut out and is formed with size by the shape of handling components to be reinforced, and lead flake edge is carried out chamfered；② Mark: mark is carried out on the lead flake that molding is completed with laser marking machine or shell machine；The mark include component direction, 3. model and batch are cleaned and are dried: being cleaned with the lead flake that dehydrated alcohol completes mark, remove surface grease and molding With the mark remaining metal fillings of link, it is then placed in drying in drying box；4. trial assembly: will molding complete lead flake and component into Row trial assembly checks whether direction, batch are consistent with model, and it is identical to check whether compact dimensions are bent.

Subsequently into third step, pre-fix.Before molding is completed, it is ensured that component and lead flake are an entirety.Method Are as follows: it is temporarily fixed between component and lead flake with the double-sided adhesive that an area is slightly less than mounting surface, with high temperature resistant binding wire along first device Part laterally or longitudinally carries out at least twice binding, the locking fixation of point Q98-1 blasting gelatine progress at node, after the completion of third step, Into the 4th step, trial assembly can check whether PCB design is reasonable, and whether each pin deforms during trial assembly, if It is unreasonable, reenter the first step.

After the completion of 4th step, into the 5th step, component is fixedly connected by welding with the part of connection.After welding It is reinforced into the 6th, the reinforcement means is that will be welded using PCB technology for binding hole reserved in advance with high temperature resistant binding wire The component that machine is completed carries out locking processing with Q98-1 blasting gelatine at node together with wiring board binding and fixing.It reinforces Purpose is the requirement for making component meet mechanical test.

Last 7th step is examined, and after the completion of sealing, is comprehensively examined to the component of reinforcing, including component mark Whether knowledge is clear, whether direction is correct, and whether welding is qualified and whether reinforcing is firm.

Into seven steps more than excessively, the Flouride-resistani acid phesphatase of component is strengthened.

From the above, it can be seen that component radiation hardened method provided by the invention, structure is simple, it is technically simple, Strong operability, reliable operation and long service life.

Although the present invention has been described by way of example and in terms of the preferred embodiments, they be not it is for the purpose of limiting the invention, it is any ripe This those skilled in the art is practised, without departing from the spirit and scope of the invention, can make various changes or retouch from working as, therefore guarantor of the invention Shield range should be subject to what claims hereof protection scope was defined.

Claims

1. a kind of component radiation hardened method, comprising the following steps: step 1: PCB design prepares, step 2: Flouride-resistani acid phesphatase The molding of material；Step 3: pre-fixing；Step 4: trial assembly；Step 5: welding；Step 6: reinforcing；The PCB design is quasi- Standby includes layout designs, pad design, encapsulation design, the reserved wiring fabrication hole design in component periphery；It is described pre-fix for The lead flake that molding is completed needs to be pre-fixed between component, makes an entirety, method are as follows: in component and lead It is temporarily fixed between piece with the double-sided adhesive that an area is slightly less than mounting surface, is laterally or longitudinally carried out with high temperature resistant binding wire along component At least twice are bound, and point Q98-1 blasting gelatine carries out locking fixation, the method for the reinforcing at node are as follows: are reserved using prior PCB technology for binding hole, with high temperature resistant binding wire, the component that welding machine is completed is saving together with wiring board binding and fixing Locking processing is carried out with Q98-1 blasting gelatine at point.

2. the method as described in claim 1, it is characterised in that: the molding method of the irradiation resistant material are as follows: 1. lead flake Molding: by with a thickness of the lead flake of the mm of 0.5 mm~2.0, cut out and formed with size by the shape of handling components to be reinforced, And lead flake edge is subjected to chamfered；2. mark: carrying out mark on the lead flake that molding is completed with laser marking machine or shell machine Know；3. cleaning and drying: being cleaned with the lead flake that dehydrated alcohol completes mark, remove surface grease and molding and identification rings Remaining metal fillings is saved, drying in drying box is then placed in；4. trial assembly: the lead flake and component that molding is completed carry out trial assembly, Check whether direction, batch are consistent with model, it is identical to check whether compact dimensions are bent.

3. method according to claim 2, it is characterised in that: in 2., the mark includes component direction, model and criticizes It is secondary.

4. the method as described in claim 1-3 any claim, it is characterised in that: there are also checking procedure, tools after the 6th step Body are as follows: after the completion of sealing, the component of reinforcing is comprehensively examined, including whether component identifies whether clear, direction Correctly, whether welding is qualified and whether reinforcing is firm.