CN109548310A - A kind of reinforcement means of component Flouride-resistani acid phesphatase - Google Patents
A kind of reinforcement means of component Flouride-resistani acid phesphatase Download PDFInfo
- Publication number
- CN109548310A CN109548310A CN201811194700.3A CN201811194700A CN109548310A CN 109548310 A CN109548310 A CN 109548310A CN 201811194700 A CN201811194700 A CN 201811194700A CN 109548310 A CN109548310 A CN 109548310A
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- CN
- China
- Prior art keywords
- component
- molding
- lead flake
- reinforcing
- flouride
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Abstract
The present invention relates to a kind of reinforcement means of Flouride-resistani acid phesphatase component, comprising the following steps: step 1: PCB design prepares, step 2: the molding of irradiation resistant material;Step 3: pre-fixing;Step 4: trial assembly;Step 5: welding;Step 6: reinforcing;7th step is examined.The reinforcement means of Flouride-resistani acid phesphatase component provided by the invention, structure is simple, technically simple, strong operability, reliable operation and long service life.
Description
Technical field
The present invention relates to a kind of radiation hardened methods, are related specifically to a kind of reinforcement means of component Flouride-resistani acid phesphatase.
Background technique
Due to satellite, airship, the spacecrafts such as space station are in space motion, departing from the protection of atmosphere, directly exposure
Under space environment, electronic equipment will receive the impact of radiation and high energy particle from the outer space and various radiation effects occur
It answers, causes the exception of work, from the statistical number both at home and abroad to space flight accident it has been found that about 40% failure is derived from space spoke
It penetrates.Therefore, special Flouride-resistani acid phesphatase processing must be carried out, to it when using space flight device to ensure the reliability of its work.
The method of space flight device Flouride-resistani acid phesphatase processing is also relatively more, has based on chip design and special material application, such as makes
With sapphire substrates or the device of insulator-base bottom technique, but this complex process and at high cost, or use shielding layer
To increase the anti-radiation performance of space flight device, this method is more complicated.
Summary of the invention
1, technical problem to be solved:
Existing Flouride-resistani acid phesphatase processing method complex process, it is at high cost.
2, technical solution:
In order to solve problem above, the present invention provides a kind of reinforcement means of Flouride-resistani acid phesphatase component, comprising the following steps: first
Step: PCB design prepares, step 2: the molding of irradiation resistant material;Step 3: pre-fixing;Step 4: trial assembly;Step 5: welding;
Step 6: reinforcing;It includes layout designs that the PCB design, which prepares, pad design, encapsulation designs, component periphery is reserved and tied up
The design of Wiring technology hole;The lead flake completed for molding that pre-fixes needs to be pre-fixed between component, makes
One entirety, method are as follows: temporarily fixed between component and lead flake with the double-sided adhesive that an area is slightly less than mounting surface, use high temperature resistant
Binding wire laterally or longitudinally carries out at least twice binding along component, and point Q98-1 blasting gelatine carries out locking fixation, institute at node
The method for stating reinforcing are as follows: select room temperture rubber vulcanization to carry out local stickup for dual-in-line part, for selecting silicon during Surface Mount
Rubber carries out local encapsulating processing.
The molding method of the irradiation resistant material are as follows: the 1. molding of lead flake: will be with a thickness of the mm's of 0.5 mm~2.0
Lead flake is cut out and is formed with size by the shape of handling components to be reinforced, and lead flake edge is carried out chamfered;2. marking
Know: carrying out mark on the lead flake that molding is completed with laser marking machine or shell machine;3. cleaning and drying: with dehydrated alcohol to mark
Know the lead flake completed to be cleaned, removes surface grease and molding and the mark remaining metal fillings of link, be then placed in drying box
Interior drying;4. trial assembly: the lead flake and component that molding is completed carry out trial assembly, check whether direction, batch are consistent with model, inspection
Look into compact dimensions whether be bent it is identical.
The mark includes component direction, model and batch.
There are also checking procedure after 6th step, specifically: after the completion of sealing, the component of reinforcing is comprehensively examined,
Identify whether clear, whether direction is correct including component, whether welding is qualified and whether reinforcing is firm.
3, the utility model has the advantages that
Component radiation hardened method provided by the invention, structure is simple, technically simple, strong operability, reliable operation and
Long service life.
Specific embodiment
Below by embodiment, the present invention is described in detail.
The present invention provides a kind of reinforcement means of component Flouride-resistani acid phesphatase, comprising the following steps: step 1: PCB design is quasi-
It is standby, step 2: the molding of irradiation resistant material;Step 3: pre-fixing;Step 4: trial assembly;Step 5: welding;Step 6: reinforcing.
Embodiment 1
A kind of reinforcement means of component Flouride-resistani acid phesphatase, first PCB design prepare, and PCB design prepares to set including layout designs, pad
The design of wiring fabrication hole is reserved on meter, encapsulation design, component periphery, and PCB is most important step, if PCB design cannot expire
Sufficient demand influences whether the stability reinforced.PCB design prepares, into the molding of second step irradiation resistant material, the anti-spoke of the present invention
According to material selection lead, method is the molding method of irradiation resistant material are as follows: the 1. molding of lead flake: will be with a thickness of 0.5 mm~2.0
The lead flake of mm is cut out and is formed with size by the shape of handling components to be reinforced, and lead flake edge is carried out chamfered;②
Mark: mark is carried out on the lead flake that molding is completed with laser marking machine or shell machine;The mark include component direction,
3. model and batch are cleaned and are dried: being cleaned with the lead flake that dehydrated alcohol completes mark, remove surface grease and molding
With the mark remaining metal fillings of link, it is then placed in drying in drying box;4. trial assembly: will molding complete lead flake and component into
Row trial assembly checks whether direction, batch are consistent with model, and it is identical to check whether compact dimensions are bent.
Subsequently into third step, pre-fix.Before molding is completed, it is ensured that component and lead flake are an entirety.Method
Are as follows: it is temporarily fixed between component and lead flake with the double-sided adhesive that an area is slightly less than mounting surface, with high temperature resistant binding wire along first device
Part laterally or longitudinally carries out at least twice binding, the locking fixation of point Q98-1 blasting gelatine progress at node, after the completion of third step,
Into the 4th step, trial assembly can check whether PCB design is reasonable, and whether each pin deforms during trial assembly, if
It is unreasonable, reenter the first step.
After the completion of 4th step, into the 5th step, component is fixedly connected by welding with the part of connection.After welding
It is reinforced into the 6th, the method for the reinforcing are as follows: select room temperture rubber vulcanization to carry out local stickup, needle for dual-in-line part
It handles selecting silicon rubber to carry out local encapsulating during Surface Mount.The purpose of reinforcing is the requirement for making component meet mechanical test.
Reinforcement means process consistency provided by the invention is good, and operation is reliable, reinforcing is firm, resistance to mechanical vibrating effect is good.The mesh of reinforcing
Be the requirement for making soft copy meet mechanical test
Last 7th step is examined, and after the completion of sealing, is comprehensively examined to the component of reinforcing, including component mark is
It is no it is clear, whether direction correct, welding it is whether qualified and reinforce it is whether firm.
Into seven steps more than excessively, the Flouride-resistani acid phesphatase of component is strengthened.
From the above, it can be seen that the reinforcement means of component Flouride-resistani acid phesphatase provided by the invention, structure is simple, technology is simple
List, strong operability, reliable operation and long service life.
Although the present invention has been described by way of example and in terms of the preferred embodiments, they be not it is for the purpose of limiting the invention, it is any ripe
This those skilled in the art is practised, without departing from the spirit and scope of the invention, can make various changes or retouch from working as, therefore guarantor of the invention
Shield range should be subject to what claims hereof protection scope was defined.
Claims (4)
1. a kind of reinforcement means of Flouride-resistani acid phesphatase component, comprising the following steps: step 1: PCB design prepares, step 2: anti-spoke
According to the molding of material;Step 3: pre-fixing;Step 4: trial assembly;Step 5: welding;Step 6: reinforcing;The PCB design
Prepare to include layout designs, pad design, encapsulation design, the reserved wiring fabrication hole design in component periphery;Described pre-fixes
For molding complete lead flake need and component between pre-fixed, make an entirety, method are as follows: component with
Temporarily fixed between lead flake with the double-sided adhesive that an area is slightly less than mounting surface, with high temperature resistant binding wire along component laterally or longitudinally into
Row at least twice are bound, and point Q98-1 blasting gelatine carries out locking fixation, the method for the reinforcing at node are as follows: straight for biserial
Plug-in unit selects room temperture rubber vulcanization to carry out local stickup, carries out local encapsulating processing for selection silicon rubber during Surface Mount.
2. the method as described in claim 1, it is characterised in that: the molding method of the irradiation resistant material are as follows: 1. lead flake
Molding: by with a thickness of the lead flake of the mm of 0.5 mm~2.0, cut out and formed with size by the shape of handling components to be reinforced,
And lead flake edge is subjected to chamfered;2. mark: carrying out mark on the lead flake that molding is completed with laser marking machine or shell machine
Know;3. cleaning and drying: being cleaned with the lead flake that dehydrated alcohol completes mark, remove surface grease and molding and identification rings
Remaining metal fillings is saved, drying in drying box is then placed in;4. trial assembly: the lead flake and component that molding is completed carry out trial assembly,
Check whether direction, batch are consistent with model, it is identical to check whether compact dimensions are bent.
3. method according to claim 2, it is characterised in that: in 2., the mark includes component direction, model and criticizes
It is secondary.
4. the method as described in claim 1-3 any claim, it is characterised in that: there are also checking procedure, tools after the 6th step
Body are as follows: after the completion of sealing, the component of reinforcing is comprehensively examined, including whether component identifies whether clear, direction
Correctly, whether welding is qualified and whether reinforcing is firm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811194700.3A CN109548310A (en) | 2018-10-15 | 2018-10-15 | A kind of reinforcement means of component Flouride-resistani acid phesphatase |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811194700.3A CN109548310A (en) | 2018-10-15 | 2018-10-15 | A kind of reinforcement means of component Flouride-resistani acid phesphatase |
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CN109548310A true CN109548310A (en) | 2019-03-29 |
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CN201811194700.3A Pending CN109548310A (en) | 2018-10-15 | 2018-10-15 | A kind of reinforcement means of component Flouride-resistani acid phesphatase |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113327913A (en) * | 2021-05-28 | 2021-08-31 | 四川省星时代智能卫星科技有限公司 | Anti-irradiation packaging structure of satellite chip and manufacturing method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103456719A (en) * | 2012-06-01 | 2013-12-18 | 上海航天设备制造总厂 | Electronic device radiation-resistant reinforcing packaging structure |
CN206558498U (en) * | 2017-02-27 | 2017-10-13 | 奥肯思(北京)科技有限公司 | A kind of chip packing-body of radiation hardened |
CN108511402A (en) * | 2018-05-31 | 2018-09-07 | 西北核技术研究所 | CMOS technology device radiation hardening method based on temperature |
-
2018
- 2018-10-15 CN CN201811194700.3A patent/CN109548310A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103456719A (en) * | 2012-06-01 | 2013-12-18 | 上海航天设备制造总厂 | Electronic device radiation-resistant reinforcing packaging structure |
CN206558498U (en) * | 2017-02-27 | 2017-10-13 | 奥肯思(北京)科技有限公司 | A kind of chip packing-body of radiation hardened |
CN108511402A (en) * | 2018-05-31 | 2018-09-07 | 西北核技术研究所 | CMOS technology device radiation hardening method based on temperature |
Non-Patent Citations (1)
Title |
---|
孙慧,徐抒岩,孙守红,张伟: "航天电子元器件抗辐照加固工艺", 《电子工艺技术》 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113327913A (en) * | 2021-05-28 | 2021-08-31 | 四川省星时代智能卫星科技有限公司 | Anti-irradiation packaging structure of satellite chip and manufacturing method thereof |
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