CN102076178A - Fixture for solder paste printing and method for repairing integrated circuit board by utilizing same - Google Patents
Fixture for solder paste printing and method for repairing integrated circuit board by utilizing same Download PDFInfo
- Publication number
- CN102076178A CN102076178A CN 201010555304 CN201010555304A CN102076178A CN 102076178 A CN102076178 A CN 102076178A CN 201010555304 CN201010555304 CN 201010555304 CN 201010555304 A CN201010555304 A CN 201010555304A CN 102076178 A CN102076178 A CN 102076178A
- Authority
- CN
- China
- Prior art keywords
- chip
- solder paste
- integrated circuit
- containing groove
- supporting bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention provides a fixture for solder paste printing, and the fixture is used for fixing a chip during solder paste printing. The fixture comprises a support plate, wherein, the front face of the support plate is equipped with a plurality of chip accommodating grooves, and the bottoms of the chip accommodating grooves are equipped with pin holes which are corresponding to the pins of the accommodated chips and penetrate through the rear face of the support plate. The fixture for solder paste printing has the advantages of lowering the repair difficulty and the repair cost, solving the difficulty in solder paste printing on a repair circuit board, and reducing the local damage degree of products caused by repair.
Description
Technical field
The present invention relates to a kind of anchor clamps that chip is fixed when the print solder paste relates in particular to a kind of print solder paste anchor clamps and uses these anchor clamps to repair the method for surface-mounted integrated circuit.
Background technology
The nineties in 20th century is along with the progress of integrated technology, the improvement of equipment and the use of deep sub-micron technique, large scale integrated circuit, very lagre scale integrated circuit (VLSIC), great scale integrated circuit occur in succession, silicon single-chip integrated level improves constantly, encapsulation requires strict more to integrated circuit, the I/O number of pins sharply increases, and power consumption also increases thereupon.For satisfying the needs of development, on original encapsulation kind basis, increased BGA Package again, be called for short BGA (Ball Grid Array Package).The nineties in 20th century, chip integration improved constantly along with development of technology, and the I/O number of pins sharply increases, and power consumption also increases thereupon, and is also strict more to the requirement of integrated circuit encapsulation.In order to satisfy the needs of development, the BGA encapsulation begins to be applied to produce.BGA is the abbreviation of English Ball Grid Array Package, i.e. BGA Package.Adopt the internal memory of BGA technology encapsulation, can make internal memory memory size under the situation of constancy of volume improve two to three times, BGA has littler volume, better heat dispersion and electrical property.The BGA encapsulation technology makes memory space per square inch that very big lifting arranged, the internal memory product that adopts the BGA encapsulation technology is under same capability, chip than other packaged types has littler volume, in addition, compare with the conventional package mode, the BGA packaged type has quicker and effective heat radiation approach.The I/O terminal of BGA encapsulation is distributed in below the encapsulation by array format with circle or column solder joint, has increased though the advantage of BGA technology is the I/O number of pins, and pin-pitch does not reduce to have increased on the contrary, thereby has improved assembly yield; Though its power consumption increases, BGA can weld with the control collapsed chip method, thereby can improve its electric heating property; Thickness and weight all than before encapsulation technology reduce to some extent; Parasitic parameter reduces, and signal transmission delay is little, and frequency of utilization improves greatly; Assemble available coplane welding, the reliability height.
In production and debug process, unavoidably can be because BGA damages or other reasons replacing BGA.BGA reclamation work station can be finished the work of dismounting BGA equally.Dismounting BGA can be regarded as the reverse process of welding BGA.Different is, treat that temperature curve finishes after, BGA is siphoned away with vacuum WAND, why without other instruments,, be because will avoid because exert oneself excessive damage pad such as tweezers.The PCB that takes off BGA is carried out the detin operation while hot, why to operate while hot? because the PCB of heat is suitable and the function of preheating, can guarantee that the work of detin is more prone to.Weld new BGA then.In the prior art field, welding new BGA, a critical step is arranged is to plant ball, and the purpose of planting ball is exactly that the tin ball is implanted on the pad of BGA again, can reach and the new same arrangement effect of BGA, and the PCB that reprocesses often is not an only a few.Present circuit board integrated level height, the part of periphery is separated by too near, on the finished product circuit board print solder paste very because of difficulty, and bigger to the product local lesion when repairing.
Therefore needing a kind of can the reduction badly repairs difficulty and repair cost, solution and is reprocessing print solder paste difficulty on the circuit board, reducing and repair the print solder paste anchor clamps of product local lesion degree and use these anchor clamps to repair the method for surface-mounted integrated circuit.
Summary of the invention
One of purpose of the present invention provides a kind of can the reduction and repairs difficulty and repair cost, solution are being reprocessed print solder paste difficulty on the circuit board, reduced the print solder paste anchor clamps of repairing product local lesion degree.
Another object of the present invention provides a kind of can the reduction and repairs difficulty and repair cost, solution are being reprocessed print solder paste difficulty on the circuit board, reduced the method for repairing the repairing surface-mounted integrated circuit of product local lesion degree.
To achieve these goals, a kind of print solder paste anchor clamps of the present invention, be used for chip is fixed when the print solder paste, it comprises supporting bracket, the front of described supporting bracket offers the plurality of chips storage tank, and the back side that the bottom land of described chip containing groove runs through described supporting bracket offers and hold of the corresponding pin bores of pin of chip.
Preferably, the back side of described supporting bracket is recessed to form the brush molten tin bath over against described chip containing groove place, and described pin bores runs through described brush molten tin bath and described chip containing groove.Described brush molten tin bath splendid attire tin cream preferably is set in the back side of described supporting bracket, prevents to cause the waste of tin cream when saving operation.
Preferably, convex with raised line in the described chip containing groove.Described raised line is set can be conveniently to be gone out chip gripping in the described chip containing groove.
The present invention repairs the method for surface-mounted integrated circuit, comprises the steps:
(1) impaired old chip on the surface-mounted integrated circuit is taken off from surface-mounted integrated circuit;
(2) the chip containing groove internal fixation of new chip being put into the print solder paste anchor clamps well also passes pin bores to the pin of new chip;
(3) to the pin of the new chip that passes pin bores back up tin cream in supporting bracket;
(4) new chip that will be printed with tin cream takes out from chip containing groove;
The new chip that is printed with tin cream that (5) will take out is mounted on the position of former chip on the surface-mounted integrated circuit and carries out the circuit welding;
(6) new chip that connects of butt welding carries out the transmission inspection;
(7) judge whether the transmission check result meets the requirements, meet the requirements until the transmission check result if above-mentioned steps (2)-(6) are carried out in undesirable then circulation.
Preferably, the transmission inspection in the described step (6) is roentgen-ray transmission inspection.The penetration power of roentgen-ray is stronger, and situations such as the leakage weldering of observing chip that can be more clearly, rosin joint and empty weldering are in time made and being remedied.
Compared with prior art, in the print solder paste anchor clamps of the present invention, the back side that the bottom land of described chip containing groove runs through described supporting bracket offers and hold of the corresponding pin bores of pin of chip.Therefore, only need in described chip containing groove, to put into new chip, new pin of chip stretches into the back side of described pin bores to described supporting bracket, only need to brush tin cream at the back side of described supporting bracket, then new chip is taken out, tin cream will be stayed on the pin of new chip automatically, finish the brush process of tin of new chip easily.Therefore, reduced the repairing difficulty and the repair cost of surface-mounted integrated circuit, solved and reprocessed print solder paste difficulty on the circuit board, reducing and repair product local lesion degree.
By following description also in conjunction with the accompanying drawings, it is more clear that the present invention will become, and these accompanying drawings are used to explain embodiments of the invention.
Description of drawings
Fig. 1 is the structural representation of an embodiment of print solder paste tool of the present invention.
Fig. 2 inserts the structural representation of new chip for print solder paste tool of the present invention.
Fig. 3 is the view of another angle of print solder paste tool shown in Figure 1.
Fig. 4 is the zoomed-in view of tin cream tool A part on the chip shown in Figure 1.
Fig. 5 is the zoomed-in view of tin cream tool B part on the chip shown in Figure 3.
Fig. 6 repairs the flow chart of the method for surface-mounted integrated circuit for the present invention.
Embodiment
With reference now to accompanying drawing, describe embodiments of the invention, the similar elements label is represented similar elements in the accompanying drawing.As mentioned above, shown in Fig. 1-5, print solder paste anchor clamps 100 provided by the invention, it comprises supporting bracket 10, and the positive 10b of described supporting bracket 10 offers four chip containing groove 11, and the back side 10a of described supporting bracket 10 is recessed to form brush molten tin bath 15, described brush molten tin bath 15 and described chip containing groove 11 over against, the bottom land of described chip containing groove 11 offers pin bores 13, and described pin bores 13 runs through the back side 10a of described supporting bracket 10, and described pin bores 13 with appearance pin of chip corresponding.Particularly, described pin bores 13 runs through described brush molten tin bath 15 and described chip containing groove 11.In the back side of described supporting bracket 10 10a described brush molten tin bath 15 splendid attire tin cream preferably is set, reaches the waste that prevents to cause tin cream when repeatedly operation is saved in printing.The preferably as Fig. 1, Fig. 2 and shown in Figure 4, convexes with raised line 14 in the described chip containing groove 11.Described raised line 14 is set can conveniently be gone out described chip 20 from described chip containing groove 11 interior grippings.In the operation of reality, can described chip 20 be taken out in described chip containing groove 11 with tweezers or sorption pen.
As described in Figure 6, the present invention repairs the method for surface-mounted integrated circuit, comprises the steps:
S001 takes off impaired old chip on the surface-mounted integrated circuit from surface-mounted integrated circuit;
The chip containing groove internal fixation that S002 puts into the print solder paste anchor clamps with new chip well also passes pin bores to the pin of new chip;
S003 is to the pin of the new chip that the passes pin bores back up tin cream in supporting bracket;
The new chip that S004 will be printed with tin cream takes out from chip containing groove;
The new chip that is printed with tin cream that S005 will take out is mounted on the position of former chip on the surface-mounted integrated circuit and carries out the circuit welding;
The new chip that the S006 butt welding connects carries out the transmission inspection;
S007 judges whether the transmission check result meets the requirements, and meets the requirements until the transmission check result if above-mentioned steps S002-S006 is carried out in undesirable then circulation.
The preferably, the transmission inspection among the described step S006 is roentgen-ray transmission inspection.The penetration power of roentgen-ray is stronger, and situations such as the leakage weldering of observing chip that can be more clearly, rosin joint and empty weldering are in time made and being remedied.
In conjunction with Fig. 1-7, in the print solder paste anchor clamps 100 of the present invention, the back side 10a that the bottom land of described chip containing groove 11 runs through described supporting bracket 10 offers and hold of the corresponding pin bores 13 of pin of chip.Therefore, only need in described chip containing groove 11, to put into new chip 20, the pin of new chip 20 stretches into the back side 10a of described pin bores 13 to described supporting bracket 10, only need to brush tin cream at the back side of described supporting bracket 10 10a, then new chip 20 is taken out, tin cream will be stayed on the pin of new chip 20 automatically, finish the brush process of tin of new chip 20 easily.Therefore, reduced the repairing difficulty and the repair cost of surface-mounted integrated circuit, solved and reprocessed print solder paste difficulty on the circuit board, reducing and repair product local lesion degree.
Above invention has been described in conjunction with most preferred embodiment, but the present invention is not limited to the embodiment of above announcement, and should contain various modification, equivalent combinations of carrying out according to essence of the present invention.
Claims (5)
1. print solder paste anchor clamps, be used for chip is fixed when the print solder paste, it is characterized in that: comprise supporting bracket, the front of described supporting bracket offers the plurality of chips storage tank, and the back side that the bottom land of described chip containing groove runs through described supporting bracket offers and hold of the corresponding pin bores of pin of chip.
2. print solder paste anchor clamps as claimed in claim 1 is characterized in that: the back side of described supporting bracket is recessed to form the brush molten tin bath over against described chip containing groove place, and described pin bores runs through described brush molten tin bath and described chip containing groove.
3. print solder paste anchor clamps as claimed in claim 1 is characterized in that: convex with raised line in the described chip containing groove.
4. the method that each described print solder paste anchor clamps are repaired surface-mounted integrated circuit among use such as the claim 1-3, described method is used to change impaired chip on the surface-mounted integrated circuit, it is characterized in that: comprise the steps:
(1) impaired old chip on the surface-mounted integrated circuit is taken off from surface-mounted integrated circuit;
(2) the chip containing groove internal fixation of new chip being put into the print solder paste anchor clamps well also passes pin bores to the pin of new chip;
(3) to the pin of the new chip that passes pin bores back up tin cream in supporting bracket;
(4) new chip that will be printed with tin cream takes out from chip containing groove;
The new chip that is printed with tin cream that (5) will take out is mounted on the position of former chip on the surface-mounted integrated circuit and carries out the circuit welding; And
(6) new chip that connects of butt welding carries out the transmission inspection;
(7) judge whether the transmission check result meets the requirements, meet the requirements until the transmission check result if above-mentioned steps (2)-(6) are carried out in undesirable then circulation.
5. the method for repairing surface-mounted integrated circuit as claimed in claim 4 is characterized in that: the transmission inspection in the described step (6) is roentgen-ray transmission inspection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010555304 CN102076178B (en) | 2010-11-23 | 2010-11-23 | Fixture for solder paste printing and method for repairing integrated circuit board by utilizing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010555304 CN102076178B (en) | 2010-11-23 | 2010-11-23 | Fixture for solder paste printing and method for repairing integrated circuit board by utilizing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102076178A true CN102076178A (en) | 2011-05-25 |
| CN102076178B CN102076178B (en) | 2013-05-08 |
Family
ID=44034465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010555304 Expired - Fee Related CN102076178B (en) | 2010-11-23 | 2010-11-23 | Fixture for solder paste printing and method for repairing integrated circuit board by utilizing same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102076178B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014139099A1 (en) * | 2013-03-13 | 2014-09-18 | China Sunergy (Nanjing) Co., Ltd. | Soldering system |
| CN104722879A (en) * | 2015-03-06 | 2015-06-24 | 天津七一二通信广播有限公司 | Fixture for welding patch component to heat dissipation metal strip |
| CN108262547A (en) * | 2018-03-22 | 2018-07-10 | 深圳捷创电子科技有限公司 | A kind of soldering appliance and welding method of Type-C connectors |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1641850A (en) * | 2004-01-09 | 2005-07-20 | 威宇科技测试封装有限公司 | Method for replanting ball of integrated circuit packaged by ball grid array |
| CN2881949Y (en) * | 2005-12-28 | 2007-03-21 | 宏连国际科技股份有限公司 | Apparatus for implanting tin ball |
| KR100697623B1 (en) * | 1999-08-18 | 2007-03-22 | 삼성전자주식회사 | Attachment tape strip and chip scale type semiconductor package using the same |
| CN201402800Y (en) * | 2009-03-31 | 2010-02-10 | 深圳市微高半导体科技有限公司 | Chip ball-planting fixture |
-
2010
- 2010-11-23 CN CN 201010555304 patent/CN102076178B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100697623B1 (en) * | 1999-08-18 | 2007-03-22 | 삼성전자주식회사 | Attachment tape strip and chip scale type semiconductor package using the same |
| CN1641850A (en) * | 2004-01-09 | 2005-07-20 | 威宇科技测试封装有限公司 | Method for replanting ball of integrated circuit packaged by ball grid array |
| CN2881949Y (en) * | 2005-12-28 | 2007-03-21 | 宏连国际科技股份有限公司 | Apparatus for implanting tin ball |
| CN201402800Y (en) * | 2009-03-31 | 2010-02-10 | 深圳市微高半导体科技有限公司 | Chip ball-planting fixture |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014139099A1 (en) * | 2013-03-13 | 2014-09-18 | China Sunergy (Nanjing) Co., Ltd. | Soldering system |
| US9837559B2 (en) | 2013-03-13 | 2017-12-05 | China Sunergy (Nanjing) Co. Ltd. | Soldering system |
| CN104722879A (en) * | 2015-03-06 | 2015-06-24 | 天津七一二通信广播有限公司 | Fixture for welding patch component to heat dissipation metal strip |
| CN104722879B (en) * | 2015-03-06 | 2016-10-12 | 天津七一二通信广播有限公司 | A kind of surface-mounted device and the welding jigs and fixtures of heat radiating metal bar |
| CN108262547A (en) * | 2018-03-22 | 2018-07-10 | 深圳捷创电子科技有限公司 | A kind of soldering appliance and welding method of Type-C connectors |
| CN108262547B (en) * | 2018-03-22 | 2024-02-20 | 深圳捷创电子科技有限公司 | Welding tool and welding method for Type-C connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102076178B (en) | 2013-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105252094B (en) | A kind of highly reliable assembling method of high pressure welding point | |
| CN106686905A (en) | Surface mount technology for sheet components | |
| CN102076178B (en) | Fixture for solder paste printing and method for repairing integrated circuit board by utilizing same | |
| CN101925292B (en) | Electronic component pin correcting device and method | |
| CN101961825A (en) | Method for maintaining mainboard | |
| CN107612509A (en) | The processing method of 120 watts of miniaturization high power amplifiers of L-band | |
| CN201985082U (en) | Tinning device for chips | |
| CN102291942A (en) | Method for making aluminum-based circuit board with conduction holes | |
| CN105127629B (en) | A kind of general gold wire bonding loading attachment | |
| CN103917050A (en) | PCB special device manual printing method | |
| CN205380359U (en) | Laser welding equipment of components and parts | |
| CN104576426A (en) | Mounting method of flip chip and wafer level chip and mounting jig set | |
| CN107708328A (en) | Improve the chip adequately grounded welding method with radiating | |
| CN105428257B (en) | One kind is directed to large scale RFID tag reverse packaging process | |
| CN206293416U (en) | A kind of BGA ball-planting devices | |
| CN207464546U (en) | A kind of turbine core circle and the fixing device of blade spot welding | |
| CN205519104U (en) | Copper bar bending device | |
| CN204673196U (en) | Ball grid array packaged chip erection welding fixture | |
| CN105448871B (en) | Power semiconductor and preparation method | |
| CN107933063A (en) | Workpiece patch automatic stripper | |
| CN207489816U (en) | A kind of IC chip manufacturing equipment | |
| CN207044085U (en) | A kind of provision for disengagement for the lower mould of rectangular connector crimping | |
| CN208467470U (en) | A kind of staggered earphone wire wicking jig | |
| CN207099456U (en) | A kind of backlight PCB and the elastic conjunction tool of PIN needle | |
| CN207077138U (en) | A kind of precision welding Special tooling clamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 523533 Deng Housing Industrial Zone, Qiaotou town, Guangdong, Dongguan Applicant after: Dongguan Shin Tech Engineering Co.,Ltd. Address before: 523533, Guangdong, Dongguan province Qiaotou town, Deng Housing Industrial Zone, Dongguan bridge technology research Yang Xin Electrical Appliance Factory Applicant before: Dongguan Qiaotou Shintech Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: DONGGUAN QIAOTOU SHINTECH CO., LTD. TO: DONGGUAN SHIN TECH ENGINEERING CO.,LTD. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130508 Termination date: 20131123 |