CN109468677A - A kind of vertical continuous electro-plating method - Google Patents
A kind of vertical continuous electro-plating method Download PDFInfo
- Publication number
- CN109468677A CN109468677A CN201811480421.3A CN201811480421A CN109468677A CN 109468677 A CN109468677 A CN 109468677A CN 201811480421 A CN201811480421 A CN 201811480421A CN 109468677 A CN109468677 A CN 109468677A
- Authority
- CN
- China
- Prior art keywords
- plate
- electroplating bath
- electric current
- rectifier
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Abstract
A kind of vertical continuous electro-plating method, be included in production plate be continuously transferred to electroplating bath during, when it is described production plate first plate do not enter the electroplating bath when, the electric current of rectifier is zero；When the first plate of the production plate enters the electroplating bath, for one compensation electric current of rectifier setting；During the production plate continues into the electroplating bath, the current value of the rectifier is gradually increased from the compensation electric current, until reaching tankful current value；During the tailgate of the production plate removes the electroplating bath, the current value of the rectifier is gradually decreased from tankful current value, until reaching the compensation current.The present invention ensure that the plating copper thickness of first plate and tailgate by setting compensation electric current.
Description
Technical field
The present invention relates to electroplating technologies, more particularly to a kind of vertical continuous electro-plating method.
Background technique
Have electroplating velocity fast currently used for the copper-plated continuous electroplating line of pcb board, occupied area is small, electroplating evenness is good,
The advantages of manpower is saved.But 3 meters of first tail-board length or so of discovery continuous electroplating are inclined in the presence of plating copper thickness in use
Thin problem.
In plating, to front transfer, this just makes LINEAR CONTINUOUS production plate vertical continuous plating lines in fixed plating cylinder
What it is at plate is dynamic change in plating cylinder by plating area, especially initial phase.In the industry generally in vertical continuous copper facing
Initial phase, electric current can be adjusted using step-by-step movement, when plating starts, production plate has just enter into plating section moment, start from scratch by
Step increase electric current, when produce plate be advanced to plating section it is full up when, electric current to highest.
Production plate continuously forwards on conveyer chain, and plate is not also into coating bath, rectifier current 0, as plate is opened into slot
Begin, rectifier stepping since initial current 0 increases electric current.Assuming that electroplating current production plate tankful electric current is i (it is assumed that i
=180A), rectifier current stepping substep is n step (it is assumed that n=6), then electroplating current is per further, value added t=i ÷
N=180A ÷ 6=30A electric current, each step electric current I=t × n, if step 6 is tankful, electric current I=t × n=30A × 6=
180A.Tailgate ejecting plate is then the reverse of this process.
In fact in process of production, due to generating plate when into and out of coating bath, have the sky for clamping production plate and be clipped in
In coating bath, to avoid empty folder plated with copper (sky folder copper facing will lead to the quality problems such as plating copper ashes), some corporate policies add one
Very narrow matches plating lath.And the electric current of thin production plate can be divided with plating lath, therefore lead to the head of the copper-plated production plate of vertical continuous
Plate and tailgate copper facing are partially thin, and depending on the edge strip width used, first plate and tailgate plating copper thickness even can be partially thin by 20% or more, lead to product
Matter defect.The reason of leading to quality defect is: the first plate and tailgate that produce plate are located at the part of coating bath, and coating bath is interior without the vacant of plate
Position exists with plating lath, can divide thin production plate electric current, and causes first plate and tailgate copper facing partially thin, and due to plating distribution
Problem, small by plating area with plating lath, it is big that duty plates slot space, and causes electric current to be easier to flow to plating lath, and then cause
First plate and tailgate copper facing are partially thin.Therefore, it is necessary to a kind of better electro-plating method be designed, to solve the above problems.
Summary of the invention
In view of the problems of the existing technology, the present invention provides a kind of by preset compensation electric current, the head of compensation production plate
The electric current of plate and tailgate loss, to guarantee the vertical continuous electro-plating method that first plate and tailgate copper thickness will not be partially thin.
To achieve the goals above, the present invention adopts the following technical scheme:
A kind of vertical continuous electro-plating method, be included in production plate be continuously transferred to electroplating bath during, when the life
When the first plate of production plate does not enter the electroplating bath, the electric current of rectifier is zero；
When the first plate of the production plate enters the electroplating bath, for one compensation electric current of rectifier setting；
During the production plate continues into the electroplating bath, the current value of the rectifier is electric from the compensation
Stream gradually increases, until reaching tankful current value；
During the tailgate of the production plate removes the electroplating bath, the current value of the rectifier is from tankful electric current
Value gradually decreases, until reaching the compensation current.
Further, during the production plate continues into the electroplating bath, the current value of the rectifier is from institute
It states compensation electric current and starts stepping increase.
Further, during the tailgate of the production plate removes the electroplating bath, the current value of the rectifier from
Tankful current value stepping reduces.
Further, the compensation electric current is set as a, and the tankful electric current of the electroplating bath is i, the step of the rectifier stepping
Number is n, then the electric current reduced value of the every further current increase of the rectifier or one step of every drop: t=(i-a) ÷ n.
Further, the calculation method of the compensation electric current a are as follows: the width with plating lath for producing edges of boards edge, which is arranged, is
B, the length of electroplating bath are l, and the current density of the production plate is c, then compensation current a=b × l × c.
Beneficial effects of the present invention:
When the first plate for producing plate enters electroplating bath, for one compensation electric current of rectifier setting, then first plate enter electroplating bath and
During tailgate removes electroplating bath, the current value of rectifier increases to tankful current value or by tankful current value from compensation electric current
It is reduced to compensation electric current, therefore the electroplating current minimum value of first plate and tailgate in electroplating bath is compensation current, ensure that head
The plating copper thickness of plate and tailgate avoids plating copper thickness partially thin.
Detailed description of the invention
Fig. 1 does not enter rectifier current when electroplating bath for the first plate of production plate in vertical continuous electro-plating method of the present invention
Value, arrow indicate the production plate direction of motion；
Fig. 2 enters rectifier current value when electroplating bath for the first plate of production plate in vertical continuous electro-plating method of the present invention,
Arrow indicates the production plate direction of motion；
Fig. 3 enters rectifier current when electroplating bath for a part of production plate in vertical continuous electro-plating method of the present invention
Value, arrow indicate the production plate direction of motion；
In figure, 1-production plate, 2-first plates, 3-electroplating baths, 4-rectifiers, 5-are with plating lath.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
Such as Fig. 1 to Fig. 3, the present invention provides a kind of vertical continuous electro-plating method, and production plate 1 is continuously transmitted on conveyer chain
To electroplating bath 3.When the first plate 2 for producing plate 1 does not enter electroplating bath 3, the electric current of rectifier 4 is zero；When the first plate of production plate 1
When 2 entrance electroplating bath 3, for one compensation electric current of the setting of rectifier 4；During production plate 1 continues into electroplating bath 3, rectification
The current value of device 4 is gradually increased from compensation electric current, until reaching tankful current value；Electroplating bath 3 is removed in the tailgate of production plate 1
In the process, the current value of rectifier 4 is gradually decreased from tankful current value, until reaching compensation current.
In the present embodiment, during production plate 1 continues into electroplating bath 3, the current value of rectifier 4 is electric from compensation
Stream starts stepping and increases, and during the tailgate for producing plate 1 removes electroplating bath 3, the current value of rectifier 4 is from tankful current value
Stepping reduces.Compensation electric current is set as a, the tankful electric current of electroplating bath 3 is i, and the step number of 4 stepping of rectifier is n, then rectifier 4
The electric current reduced value of one step of every further current increase or every drop: t=(i-a) ÷ n.
The calculation method of above-mentioned compensation electric current a are as follows: the width with plating lath 5 at setting production 1 edge of plate is b, electroplating bath 3
Length be l, the current density of 1 plate of production is c, then compensation current a=b × l × c.One is designed in the program of plating
Input data with plating 5 width of lath, program is automatically according to width b, the length l of electroplating bath 3 with plating lath 5, and production
The current density c of plate 1 calculates compensation electric current a=b × l × c.Width b with plating lath 5 can be by producers according to practical need
Be arranged, may be configured as it is wider or narrow with plating lath 5 than actual use, to carry out adequate compensation.Then produce 1 the n-th step of stepping of plate
Current value are as follows: I=a+t × n.
As shown in Figure 1 to Figure 3, it is assumed that the compensation calculated according to the current density with plating lath 5, electroplating bath 3 and production plate 1
Current value a=18A, the tankful current value i=180A of electroplating bath 3, the step number n=6 of 4 stepping of rectifier, then 4 electric current of rectifier is every
It is further or every by the current increase of a step or reduced value t=(i-a) ÷ n=(180-18) ÷ 6=27A, it is first from production plate 1
Since plate 2, which enter electroplating bath 3 and start the stepping compensate electric current 18A, increases, up to tankful current value 180A, the electricity of each step at this time
Flow valuve I=a+t × n, such as the electric current of third step are as follows: I=a+t × n=18A+27A*3=99A.Similarly, tailgate ejecting plate is then this
Process it is reverse.
The present invention produces the first plate 2 of plate 1 and the compensation electric current of tailgate by presetting continuously plating product line, ensure that first plate
2 and tailgate plating copper thickness, while compensation current is calculated by the above method, can avoid predesigned compensation electric current influences
Subsequent production plate.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although referring to preferred embodiment to this hair
It is bright to be described in detail, it will be appreciated by those skilled in the art that technical solution of the present invention can be modified or be waited
With replacement, without departing from the objective and range of the technical program, should all cover in scope of the presently claimed invention.
Claims (5)
1. a kind of vertical continuous electro-plating method characterized by comprising be continuously transferred in production plate to the process of electroplating bath
In, when the first plate of the production plate does not enter the electroplating bath, the electric current of rectifier is zero；
When the first plate of the production plate enters the electroplating bath, for one compensation electric current of rectifier setting；
During the production plate continues into the electroplating bath, the current value of the rectifier from the compensation electric current by
It is cumulative to add, until reaching tankful current value；
During the tailgate of the production plate removes the electroplating bath, the current value of the rectifier from tankful current value by
It gradually reduces, until reaching the compensation current.
2. vertical continuous electro-plating method according to claim 1, which is characterized in that continued into the production plate described
During electroplating bath, the stepping since the compensation electric current of the current value of the rectifier increases.
3. vertical continuous electro-plating method according to claim 1, which is characterized in that remove institute in the tailgate of the production plate
During stating electroplating bath, the current value of the rectifier is reduced from tankful current value stepping.
4. vertical continuous electro-plating method according to claim 2 or 3, which is characterized in that set the compensation electric current as a,
The tankful electric current of the electroplating bath is i, and the step number of the rectifier stepping is n, then the rectifier increases per further electric current
Value added or one step of every drop electric current reduced value: t=(i-a) ÷ n.
5. vertical continuous electro-plating method according to claim 4, which is characterized in that the calculation method of the compensation electric current a
Are as follows: the width with plating lath of the setting production edges of boards edge is b, and the length of electroplating bath is l, the current density of the production plate
For c, then compensation current a=b × l × c.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811480421.3A CN109468677A (en) | 2018-12-05 | 2018-12-05 | A kind of vertical continuous electro-plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811480421.3A CN109468677A (en) | 2018-12-05 | 2018-12-05 | A kind of vertical continuous electro-plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109468677A true CN109468677A (en) | 2019-03-15 |
Family
ID=65675626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811480421.3A Pending CN109468677A (en) | 2018-12-05 | 2018-12-05 | A kind of vertical continuous electro-plating method |
Country Status (1)
| Country | Link |
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| CN (1) | CN109468677A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112981515A (en) * | 2021-05-06 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Current regulation and control method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59215496A (en) * | 1983-05-19 | 1984-12-05 | Sumitomo Metal Ind Ltd | Manufacture of electroplated steel sheet having fixed amount of deposited metal |
| EP0308636A3 (en) * | 1987-09-24 | 1989-12-06 | Schering Aktiengesellschaft Berlin Und Bergkamen | Method for matching the component currents in an electrolytic bath |
| JPH06212500A (en) * | 1993-01-19 | 1994-08-02 | Fuji Electric Co Ltd | Plating current compensating control circuit |
| CN1578853A (en) * | 2001-10-27 | 2005-02-09 | 埃托特克德国有限公司 | Method and conveyorized system for electorlytically processing work pieces |
| CN101423969A (en) * | 2007-11-01 | 2009-05-06 | Almexpe株式会社 | Continuous plating apparatus |
| CN102383169A (en) * | 2011-10-31 | 2012-03-21 | 东莞生益电子有限公司 | Assistant plate bar of vertical plating line and method for vertical electroplating of PCB plate |
-
2018
- 2018-12-05 CN CN201811480421.3A patent/CN109468677A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59215496A (en) * | 1983-05-19 | 1984-12-05 | Sumitomo Metal Ind Ltd | Manufacture of electroplated steel sheet having fixed amount of deposited metal |
| EP0308636A3 (en) * | 1987-09-24 | 1989-12-06 | Schering Aktiengesellschaft Berlin Und Bergkamen | Method for matching the component currents in an electrolytic bath |
| JPH06212500A (en) * | 1993-01-19 | 1994-08-02 | Fuji Electric Co Ltd | Plating current compensating control circuit |
| CN1578853A (en) * | 2001-10-27 | 2005-02-09 | 埃托特克德国有限公司 | Method and conveyorized system for electorlytically processing work pieces |
| CN101423969A (en) * | 2007-11-01 | 2009-05-06 | Almexpe株式会社 | Continuous plating apparatus |
| CN102383169A (en) * | 2011-10-31 | 2012-03-21 | 东莞生益电子有限公司 | Assistant plate bar of vertical plating line and method for vertical electroplating of PCB plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112981515A (en) * | 2021-05-06 | 2021-06-18 | 四川英创力电子科技股份有限公司 | Current regulation and control method |
| CN112981515B (en) * | 2021-05-06 | 2021-09-14 | 四川英创力电子科技股份有限公司 | Current regulation and control method |
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Application publication date: 20190315 |
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| RJ01 | Rejection of invention patent application after publication |