CN109445192B - Area light source and manufacturing method thereof, backlight module and display device - Google Patents
Area light source and manufacturing method thereof, backlight module and display device Download PDFInfo
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- CN109445192B CN109445192B CN201910005717.8A CN201910005717A CN109445192B CN 109445192 B CN109445192 B CN 109445192B CN 201910005717 A CN201910005717 A CN 201910005717A CN 109445192 B CN109445192 B CN 109445192B
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- circuit board
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention provides a surface light source and a manufacturing method thereof, a backlight module and a display device, and relates to the technical field of display. The invention forms a plurality of point light sources on the circuit board, coats the reflecting material on the circuit board formed with a plurality of point light sources, and leads the reflecting material to cover the area of the circuit board except the plurality of point light sources through the fluidity of the reflecting material. After a plurality of point light sources are formed on the circuit board, the circuit board is coated with a reflecting material, and the fluidity of the reflecting material is utilized to enable the reflecting material to cover the area of the circuit board except the point light sources, so that the substrate and the bonding pad exposed in the circuit board are completely covered, thereby avoiding the absorption of the substrate and the bonding pad on the light rays emitted by the point light sources and improving the utilization rate of light energy.
Description
Technical Field
The invention relates to the technical field of display, in particular to a surface light source, a manufacturing method thereof, a backlight module and a display device.
Background
With the continuous development of display technologies, HDR (High-Dynamic Range) technologies are applied to display devices, which can greatly improve the image quality of the display devices, and the realization of the HDR technologies needs to be matched with a direct-type backlight module having a surface light source.
As shown in fig. 1 and 2, in a conventional surface light source of a direct-type backlight module, a circuit board 11 is coated with a reflective material 12, the circuit board 11 includes a substrate 11 and pads 12 formed on the substrate 11, the reflective material 12 in a die bonding region (i.e., a region where a point light source is soldered) is removed by exposure, development, etc., to expose the pads 112 in the die bonding region, and a plurality of point light sources 13 are respectively soldered to the pads 112 in the die bonding region by solder 14.
However, when the reflective material in the die bonding area is removed, due to the requirement of the precision of the equipment and the precision of the subsequent soldering point light source 13, the size of the reflective material removal area M is actually larger than that of the point light source 13, so that the substrate 111 and the bonding pad 112 in the circuit board 11 are exposed, and further, part of light emitted by the point light source 13 is absorbed by the substrate 111 and the bonding pad 112, which reduces the utilization rate of light energy.
Disclosure of Invention
The invention provides a surface light source and a manufacturing method thereof, a backlight module and a display device, and aims to solve the problem that in the existing process of manufacturing the surface light source, partial light rays emitted by a point light source can be absorbed by an exposed substrate and an exposed bonding pad, so that the utilization rate of light energy is reduced.
In order to solve the above problems, the present invention discloses a method for manufacturing a surface light source, comprising:
forming a plurality of point light sources on the circuit board;
and coating a reflecting material on the circuit board on which the point light sources are formed, wherein the reflecting material covers the area of the circuit board except for the point light sources through the fluidity of the reflecting material.
Preferably, after the step of coating the reflective material on the wiring board on which the plurality of point light sources are formed, the method further includes:
and heating the circuit board to cure the reflecting material coated on the circuit board.
Preferably, the reflective material is coated on the wiring board using a dot coating process or a line coating process.
Preferably, the step of forming a plurality of point light sources on the wiring board includes:
coating soldering tin on a bonding pad of the circuit board;
attaching a point light source to the solder;
and heating the circuit board to melt the soldering tin so as to weld the point light source on the bonding pad of the circuit board.
In order to solve the above problems, the present invention also discloses a variety of surface light sources, including:
a circuit board;
a plurality of point light sources formed on the wiring board;
a reflective material covering an area of the wiring board other than the plurality of point light sources.
Preferably, the thickness of the reflective material is 20 μm to 100 μm.
Preferably, an arc surface is formed at a contact position of the reflecting material and the point light source, and a normal direction of the arc surface faces the point light source.
Preferably, the reflective material is white oil.
In order to solve the above problems, the present invention further discloses a backlight module including the above surface light source.
In order to solve the above problem, the present invention further discloses a display device, including the backlight module.
Compared with the prior art, the invention has the following advantages:
a plurality of point light sources are formed on a wiring board, a reflecting material is coated on the wiring board on which the plurality of point light sources are formed, and the reflecting material covers the area of the wiring board except for the plurality of point light sources by the fluidity of the reflecting material. After a plurality of point light sources are formed on the circuit board, the circuit board is coated with a reflecting material, and the fluidity of the reflecting material is utilized to enable the reflecting material to cover the area of the circuit board except the point light sources, so that the substrate and the bonding pad exposed in the circuit board are completely covered, thereby avoiding the absorption of the substrate and the bonding pad on the light rays emitted by the point light sources and improving the utilization rate of light energy.
Drawings
Fig. 1 is a schematic view illustrating a structure of a conventional surface light source;
fig. 2 illustrates a sectional view of a conventional surface light source;
fig. 3 is a flow chart illustrating a method of fabricating a surface light source according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating the formation of multiple point light sources on a wiring board according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating an embodiment of the present invention for applying solder on a pad of a circuit board;
FIG. 6 is a schematic view showing a circuit board formed with a plurality of point light sources coated with a reflective material according to an embodiment of the present invention;
fig. 7 is a schematic view showing a structure of a surface light source according to an embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Example one
Referring to fig. 3, a flowchart of a method for manufacturing a surface light source according to an embodiment of the present invention is shown, which may specifically include the following steps:
In the embodiment of the present invention, as shown in fig. 4, a plurality of point Light sources 42 are formed on a Circuit Board 41 by soldering, the Circuit Board 41 may be an FPC (Flexible Printed Circuit) or a PCB (Printed Circuit Board), and the point Light sources 42 may be LED (Light Emitting Diode) chips.
Specifically, coating soldering tin on the pad of circuit board, will the pointolite laminate on the soldering tin, it is right the circuit board heats, so that the soldering tin melts will the pointolite welding is in on the pad of circuit board.
As shown in fig. 5, the circuit board 41 includes a substrate 411 and a pad 412 disposed on the substrate 411, the substrate may be a PI (Polyimide) substrate, the material of the pad 412 may be copper or other conductive material, the screen 50 is placed on the pad 412 of the circuit board 41, and the solder 43 is printed onto the pad 412 from the hollow area of the screen by using the brush 51, so as to achieve the purpose of coating the solder 43 on the pad 412 of the circuit board 41.
Then, the point light sources 42 are bonded to the solder 43, the wiring board 41 is heated to melt the solder 43, and the point light sources 42 are soldered to the lands 412 of the wiring board 41 after the solder 43 is cooled and solidified.
Preferably, the point light sources 42 may be distributed on the wiring board 41 in an array, so that the light provided by each region of the surface light source is more uniform.
In the embodiment of the present invention, the reflective material 44 is coated on the circuit board 41 formed with the plurality of point light sources 42, specifically, on any area of the circuit board 41 except for the plurality of point light sources 42, so as to prevent the reflective material 44 from being coated at the point light sources 42 and affecting the normal light emission of the point light sources 42.
The reflective material 44 is a liquid insulating material and has a certain reflectivity, and the fluidity of the reflective material 44 is utilized to make the reflective material flow to the whole area of the circuit board 41 except the plurality of point light sources 42, so as to cover the area of the circuit board 41 except the plurality of point light sources 42, and the substrate 411 and the bonding pad 412 exposed in the circuit board 41 are completely covered, thereby avoiding the absorption of the substrate 411 and the bonding pad 412 to the light emitted by the point light sources 42, and improving the utilization rate of light energy.
Wherein the reflective material 44 is coated on the wiring board 41 using a dot coating process or a line coating process.
Referring to fig. 6, a schematic diagram of coating a reflective material on a wiring board formed with a plurality of point light sources according to an embodiment of the present invention is shown.
The reflective material 44 is placed in the coating apparatus, the reflective material 44 is coated on the wiring board 41 by the dripping head D of the coating apparatus, and the reflective material 44 is caused to flow to the entire wiring board 41 except for the plurality of point light sources 42 by utilizing the fluidity of the reflective material 44.
Preferably, before the reflection material 44 is coated on the wiring board 41 where the plurality of point light sources 42 are formed, the wiring board 41 where the plurality of point light sources 42 are formed may be placed on a rotating device, and the rotating device controls the rotation of the wiring board 41 while the reflection material 44 is coated on the wiring board 41, so that the coating of the reflection material 44 is more uniform.
In the embodiment of the present invention, the coating thickness of the reflective material 44 on the wiring board 41 can be effectively controlled by controlling the coating amount of the reflective material 44. Regarding the reflection characteristics of the reflective material 44, the reflectance of the reflective material 44 is higher as the thickness of the reflective material 44 is larger, and the reflectance of the reflective material 44 is lower as the thickness of the reflective material 44 is smaller, for example, the reflective material 44 is white oil, and the reflectance of the white oil is higher as the coating thickness of the white oil is larger, and therefore, the reflectance of the reflective material 44 is effectively improved by appropriately increasing the thickness of the reflective material 44.
At present, in the existing surface light source manufacturing process, because a reflective material is coated on a circuit board firstly, then the reflective material in a die bonding area is removed, a pad in the die bonding area is exposed, then a screen is placed on the circuit board, soldering tin is printed on the pad from a hollow area of the screen by using a brush, when the thickness of the reflective material is too large, the distance between the screen and the pad is large, the soldering tin cannot well fall onto the pad, so that the condition of insufficient soldering or no soldering tin on the pad occurs, and the subsequent welding and fixing of a point light source are influenced, therefore, in the existing surface light source manufacturing process, the thickness of the reflective material is greatly limited, the thickness of a general reflective material is 20 μm at most, and the reflectivity of the reflective material can reach 80% at most.
In the manufacturing process of the surface light source according to the embodiment of the present invention, the reflective material 44 is coated on the circuit board 41 on which the plurality of point light sources 42 are formed, and the fluidity of the reflective material 44 is utilized to enable the reflective material 44 to flow to the whole area of the circuit board 41 except for the plurality of point light sources 42, without considering the influence of screen printing on the thickness of the reflective material 44, the thickness of the reflective material 44 is controlled by controlling the coating amount of the reflective material 44, and the larger the coating amount of the reflective material 44 is, the larger the thickness of the reflective material 44 is, so long as the thickness of the reflective material 44 is ensured not to exceed the thickness of the point light sources 42.
Generally, the point light source 42 has a thickness of 100 μm, and in order to ensure that the point light source 42 is not covered by the reflective material 44 while increasing the reflectivity of the reflective material 44, the reflective material 44 has a thickness of 20 μm to 100 μm, for example, when the thickness of the reflective material 44 is increased to 40 μm, the reflectivity of the reflective material 44 may reach 90% or more.
Referring to fig. 7, a schematic structural diagram of a surface light source according to an embodiment of the present invention is shown.
In the embodiment of the present invention, when the reflective material 44 flows around the point light source 42, an arc surface is formed at the contact position of the reflective material 44 and the point light source 42 by using the surface tension of the reflective material 44, and the normal direction of the arc surface faces the point light source 42.
It can be seen that when the side of the point light source 42 emits the light L, the arc surface can reflect the light L to the light-emitting surface of the surface light source, thereby further improving the utilization rate of the light.
Since the reflective material 44 is a liquid insulating material, it is necessary to coat the reflective material 44 on the wiring board 41 on which the plurality of point light sources 42 are formed, and to cure the reflective material 44 after the reflective material 44 covers the area of the wiring board 41 except for the plurality of point light sources 42 by the fluidity of the reflective material 44.
In a preferred embodiment of the present invention, after the step of coating the reflective material on the wiring board on which the plurality of point light sources are formed, the method further includes: and heating the circuit board to cure the reflecting material coated on the circuit board.
The wiring board 41 coated with the reflective material 44 may be placed in a heating device, and the wiring board 41 coated with the reflective material 44 may be heated by the heating device, so that the reflective material 44 coated on the wiring board 41 may be cured quickly, and the manufacturing time of the surface light source may be reduced. Wherein the heating temperature of the heating equipment is 80-120 ℃, and the heating time is 1-2 hours.
Of course, the wiring board 41 coated with the reflective material 44 may also be left to be naturally cured at normal temperature.
In the embodiment of the invention, a plurality of point light sources are formed on the circuit board, the reflecting material is coated on the circuit board on which the plurality of point light sources are formed, and the reflecting material covers the area of the circuit board except the plurality of point light sources through the fluidity of the reflecting material. After a plurality of point light sources are formed on the circuit board, the circuit board is coated with a reflecting material, and the fluidity of the reflecting material is utilized to enable the reflecting material to cover the area of the circuit board except the point light sources, so that the substrate and the bonding pad exposed in the circuit board are completely covered, thereby avoiding the absorption of the substrate and the bonding pad on the light rays emitted by the point light sources and improving the utilization rate of light energy.
Example two
An embodiment of the present invention provides a surface light source, as shown in fig. 7, including: a wiring board 41, a plurality of point light sources 42 formed on the wiring board 41; a reflective material 44, the reflective material 44 covering the area of the wiring board 41 except for the plurality of point light sources 42.
By covering the area of the circuit board 41 except the plurality of point light sources 42 with the reflective material 44, the substrate 411 and the bonding pads 412 in the circuit board 41 are completely covered, thereby avoiding the absorption of the light emitted by the point light sources 42 by the substrate 411 and the bonding pads 412 and improving the utilization rate of light energy.
The reflective material 44 may be white oil, and the reflective material 44 has a higher reflectivity when the reflective material 44 has a larger thickness, so that the reflective material 44 has a thickness of 20 μm to 100 μm in order to ensure that the point light source 42 is not covered by the reflective material 44 while the reflectivity of the reflective material 44 is increased.
As shown in fig. 7, the contact portion of the reflective material 44 and the point light source 42 is formed with an arc surface, and a normal direction of the arc surface is directed toward the point light source 42.
When the side of the point light source 42 emits light, the arc surface can reflect the light L to the light emitting surface of the surface light source, thereby further improving the utilization rate of the light.
In the embodiment of the invention, a plurality of point light sources are arranged on the circuit board, and the reflecting material covers the area of the circuit board except the area of the plurality of point light sources. The reflecting material covers the area of the circuit board except the plurality of point light sources, so that the substrate and the bonding pad in the circuit board are completely covered, the absorption of the substrate and the bonding pad on the light emitted by the point light sources is avoided, and the utilization rate of light energy is improved.
EXAMPLE III
The embodiment of the invention provides a backlight module, which comprises the surface light source in the second embodiment.
The backlight module may be a direct type backlight module, and the backlight module may further include an optical film, such as a diffusion sheet.
In addition, for specific description of the surface light source, reference may be made to the description of the first embodiment and the second embodiment, which is not repeated herein.
The embodiment of the invention also provides a display device which comprises the backlight module.
In addition, the Display device further comprises an LCD (Liquid Crystal Display) Display panel arranged on the light-emitting side of the backlight module.
In practical applications, the display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a navigator and the like.
In the embodiment of the invention, the backlight module comprises the surface light source, the plurality of point light sources are arranged on the circuit board, the reflecting material covers the areas except the plurality of point light sources on the circuit board, and the substrate and the bonding pad in the circuit board are completely covered by the reflecting material, so that the absorption of the substrate and the bonding pad on the light rays emitted by the point light sources is avoided, and the utilization rate of light energy is improved.
For simplicity of explanation, the foregoing method embodiments are described as a series of acts or combinations, but it should be understood by those skilled in the art that the present invention is not limited by the order of acts or acts described, as some steps may occur in other orders or concurrently with other steps in accordance with the invention. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and modules referred to are not necessarily required by the invention.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above is a detailed description of the surface light source and the manufacturing method thereof, the backlight module and the display device provided by the present invention, and a specific example is applied in the present document to explain the principle and the implementation of the present invention, and the description of the above embodiment is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A method for manufacturing a surface light source, comprising:
forming a plurality of point light sources on the circuit board;
and coating a reflecting material on the circuit board on which the point light sources are formed, wherein the reflecting material covers the area of the circuit board except for the point light sources through the fluidity of the reflecting material.
2. The method of claim 1, wherein after the step of coating a reflective material on the wiring board on which the plurality of point light sources are formed, further comprising:
and heating the circuit board to cure the reflecting material coated on the circuit board.
3. The method of claim 1, wherein the reflective material is coated on the wiring board using a dot coating process or a line coating process.
4. The method of claim 1, wherein the step of forming a plurality of point light sources on the wiring board comprises:
coating soldering tin on a bonding pad of the circuit board;
attaching a point light source to the solder;
and heating the circuit board to melt the soldering tin so as to weld the point light source on the bonding pad of the circuit board.
5. A surface light source, comprising:
a circuit board;
a plurality of point light sources formed on the wiring board;
and the reflecting material has fluidity, and the reflecting material covers the area of the circuit board except the plurality of point light sources through the fluidity of the reflecting material.
6. The surface light source of claim 5, wherein the thickness of the reflecting material is 20 μm to 100 μm.
7. The surface light source of claim 5, wherein an arc surface is formed at a contact of the reflecting material with the point light source, and a normal direction of the arc surface is directed toward the point light source.
8. An area light source as defined in claim 5, wherein the reflecting material is white oil.
9. A backlight module comprising the surface light source claimed in any one of claims 5 to 8.
10. A display device comprising the backlight module according to claim 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910005717.8A CN109445192B (en) | 2019-01-03 | 2019-01-03 | Area light source and manufacturing method thereof, backlight module and display device |
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| CN201910005717.8A CN109445192B (en) | 2019-01-03 | 2019-01-03 | Area light source and manufacturing method thereof, backlight module and display device |
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| US11852917B2 (en) | 2021-08-18 | 2023-12-26 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backlight module and preparation method therefor, and display panel |
| CN113703223B (en) * | 2021-08-18 | 2022-07-26 | Tcl华星光电技术有限公司 | Backlight module, preparation method thereof and display panel |
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