JP2008016197A - Light-emitting diode mounting board, backlight equipped with light-emitting diode mounting board and light-emitting diode mounting method - Google Patents

Light-emitting diode mounting board, backlight equipped with light-emitting diode mounting board and light-emitting diode mounting method Download PDF

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JP2008016197A
JP2008016197A JP2006182846A JP2006182846A JP2008016197A JP 2008016197 A JP2008016197 A JP 2008016197A JP 2006182846 A JP2006182846 A JP 2006182846A JP 2006182846 A JP2006182846 A JP 2006182846A JP 2008016197 A JP2008016197 A JP 2008016197A
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led
substrate
light
mounting
leds
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Kinya Kawanobu
欽哉 川延
Tadaharu Murai
忠晴 村井
Katsutoshi Kurihara
克利 栗原
Ken Takano
建 高野
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Aoki Electric Industrial Co Ltd
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Aoki Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting technology enabling continuously arranged LEDs and a long lens body fitted in opposition to be surely in contact with or uniformly put in vicinity of each other, and a heat radiation technology radiating exothermic heat of the LEDs in an edge-light type backlight structure with the LEDs as a light source. <P>SOLUTION: A plurality of LEDs 2 is mounted on an LED-mounting substrate 4, as they are fixed to an LED-fixing plate 3 having a heat-sink function. Then, the LEDs 2 are made in contact with a lens body 1. Here, the LEDs 2 are pinched by a bored hole part 13 formed at the LED-mounting substrate 4 in a thickness direction, and LED terminal parts 10 of the LEDs 2 and substrate terminal parts 11 of the LED-mounting substrate 4 are soldered to be mounted. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、発光ダイオード（ＬＥＤ）の実装技術に関するものである。   The present invention relates to a technology for mounting a light emitting diode (LED).

これまでＬＥＤを光源とするエッジライト型バックライトのＬＥＤ実装技術には、次のようなものがあった。
（１）特許文献１は、複数のＬＥＤがガラスエポキシ製基板に一定間隔のピッチで実装され、基板の表面には可視域の光を反射するように白色塗料が印刷されているとともに、基板は導光板の一側面に近接するようにホルダーに着脱可能に取り付けられており、ＬＥＤの側方に出射された光を導光板に反射させるための反射板が基板の両側に配設されているものである（同明細書［００３０］）。
（２）特許文献２は、光源（ＬＥＤ）３２と導光体２７の入射面２９との間に設けられた屈折集光板（レンズ体）３３により、ＬＥＤ３２ａ、３２ｂから平面放射状に出た光を屈折集光させて平行光とし、この平行光を導光体２７の入射面２９に入射させているので、点光源であるＬＥＤ３２ａ、３２ｂを用いても、導光体２７の出射面２８から出射される光の輝度分布を均一にすることができ、この技術を備えた液晶表示装置では、液晶表示パネル２１の表面から出射される光の輝度分布を均一にすることができ、表示品質を向上することができるものである（同明細書［００１３］）。
（３）特許文献３は、光源である複数のＬＥＤと、該ＬＥＤを実装するＬＥＤ基板と、側面の入射面から入射した光源の光を前面の照射面から面光源とし照射する導光板と、ＬＥＤ、ＬＥＤ基板及び導光板を収容する表示板ケースとを備えた面光源装置であって、ＬＥＤ基板の少なくとも一部が表示板ケースの内面と密着し、また、ＬＥＤが導光板の側面の入射面に対向するように、ＬＥＤ基板を配設したものであり、ＬＥＤの発生熱が、ＬＥＤ基板と表示板ケースを密着させることにより表示板ケースから外部に効率良く放熱されるので、ＬＥＤが高温となるのが防止でき、性能が損なわれることがなく、明るい表示の表示装置を得ることができるものである（同明細書［０００５］及び［０００６］）。 Until now, the LED mounting technology of the edge light type backlight using LED as a light source has been as follows.
(1) In Patent Document 1, a plurality of LEDs are mounted on a glass epoxy substrate at a constant pitch, and a white paint is printed on the surface of the substrate so as to reflect light in the visible range. It is detachably attached to the holder so as to be close to one side of the light guide plate, and reflectors for reflecting the light emitted to the side of the LED to the light guide plate are arranged on both sides of the substrate (The same specification [0030]).
(2) In Patent Document 2, light emitted from the LEDs 32a and 32b in a planar radial pattern is radiated by a refractive condensing plate (lens body) 33 provided between the light source (LED) 32 and the incident surface 29 of the light guide 27. Since the light is refracted and condensed into parallel light, and this parallel light is incident on the incident surface 29 of the light guide 27, the light is emitted from the output surface 28 of the light guide 27 even if the LEDs 32 a and 32 b that are point light sources are used. The brightness distribution of the emitted light can be made uniform, and in the liquid crystal display device equipped with this technology, the brightness distribution of the light emitted from the surface of the liquid crystal display panel 21 can be made uniform, improving the display quality. It is possible to do this (the same specification [0013]).
(3) Patent Document 3 discloses a plurality of LEDs that are light sources, an LED substrate on which the LEDs are mounted, a light guide plate that irradiates light from a light source incident from an incident surface on a side surface as a surface light source from an irradiation surface on the front surface, A surface light source device including an LED, a LED board, and a display plate case that houses a light guide plate, wherein at least a part of the LED substrate is in close contact with the inner surface of the display plate case, and the LED is incident on a side surface of the light guide plate The LED board is arranged so as to face the surface, and the heat generated by the LED is efficiently radiated from the display board case to the outside by bringing the LED board and the display board case into close contact with each other. Thus, a display device with bright display can be obtained without impairing performance (the same specification [0005] and [0006]).

特開平９−１７９５１２号公報JP-A-9-179512 特開２００２−２８９０２３号公報JP 2002-289023 A 特開２００５−３８７７１号公報JP 2005-38771 A

上記特許文献１ないし３のようなＬＥＤを光源とするエッジライト型バックライトのＬＥＤ実装技術には、次のような課題があった。
（１）複数のＬＥＤを基板に実装して光源とした場合、光源と被光源体（導光板またはレンズ体など）との距離をどのように調整するのか？例えば、従来、連続して配置されるＬＥＤとそれに対向して設けられる長尺なレンズ体とを確実に当接又は均一近接可能とするシステマチックな実装技術は存在していなかった。
（２）複数のＬＥＤを基板に実装して光源とした場合、ＬＥＤの発生熱をどのように放熱するのか？すなわち、ＬＥＤは発生熱によりその寿命を著しく低下させるとともに故障の原因ともなるので、これを防止する放熱技術（低温での使用技術）はこれまで実用化になっていなかった。 The LED mounting technology of the edge light type backlight using the LED as the light source as in Patent Documents 1 to 3 has the following problems.
(1) When a plurality of LEDs are mounted on a substrate as a light source, how is the distance between the light source and the light source body (light guide plate or lens body) adjusted? For example, conventionally, there has not been a systematic mounting technique that can reliably contact or uniformly approach a continuously disposed LED and a long lens body provided facing the LED.
(2) When a plurality of LEDs are mounted on a substrate and used as a light source, how is the heat generated by the LEDs radiated? That is, since the life of the LED is remarkably reduced due to the generated heat and also causes a failure, a heat dissipation technique (a technique used at a low temperature) for preventing this has not been put into practical use.

上記課題を解決するため、本願発明者らは鋭意試験・研究を行い、これまでにない新規な技術を開発し、本願発明を完成させたものである。   In order to solve the above-mentioned problems, the inventors of the present application have conducted intensive studies and research, developed a novel technique that has not been made so far, and completed the present invention.

本願発明の第１の発明は、ＬＥＤを光源とするエッジライト型バックライト構造のＬＥＤと導光板の間に介在させるレンズ体へＬＥＤ（チップＬＥＤ用パッケージ）を当接又は均一近接可能に実装することを特徴とするＬＥＤ実装基板である。
第２の発明は、ＬＥＤ（チップＬＥＤ用パッケージ）の底面部を基板裏面に表出させつつＬＥＤを実装させたことを特徴とするＬＥＤ実装基板である。
第３の発明は、ＬＥＤ実装基板の長手方向側面に形成された凹部にＬＥＤ（チップＬＥＤ用パッケージ）を実装させたことを特徴とするＬＥＤ実装基板である。
第４の発明は、ＬＥＤ実装基板の厚さ方向に形成された穿孔部にＬＥＤ（チップＬＥＤ用パッケージ）を実装させたことを特徴とするＬＥＤ実装基板である。
第５の発明は、基板に折曲自在な材質を用いたことを特徴とするＬＥＤ実装基板である。
第６の発明は、折曲自在な材質としてポリイミドを用いたことを特徴とするＬＥＤ実装基板である。
第７の発明は、基板に鏡面を備えたことを特徴とするＬＥＤ実装基板である。
第８の発明は、基板に金属材料を用いたことを特徴とするＬＥＤ実装基板である。
第９の発明は、金属材質としてアルミニウムを用いたことを特徴とするＬＥＤ実装基板である。
第１０の発明は 以上のようなＬＥＤ実装基板を備えたバックライトである。
第１１の発明は、ＬＥＤを光源とするエッジライト型バックライト構造のＬＥＤと導光板の間に介在させるレンズ体へＬＥＤ（チップＬＥＤ用パッケージ）を当接又は均一近接可能に実装するために、ＬＥＤ（チップＬＥＤ用パッケージ）の底面部を基板裏面に表出させて、基板裏面側からの実装作業を可能としたことを特徴とするＬＥＤ実装方法である。
第１２の発明は、ＬＥＤを光源とするエッジライト型バックライト構造のＬＥＤと導光板の間に介在させるレンズ体へＬＥＤ（チップＬＥＤ用パッケージ）を当接又は均一近接可能に実装するために、ヒートシンク機能を有するＬＥＤ固定板のＬＥＤ固定部にＬＥＤ（チップＬＥＤ用パッケージ）を組み込む第１工程と、ＬＥＤ（チップＬＥＤ用パッケージ）の組み込まれたＬＥＤ固定板とＬＥＤ実装基板をセットし、ＬＥＤ端子部と基板端子部をハンダ付けしてＬＥＤユニットを構成する第２工程と、ＬＥＤユニット体とレンズ体とを当接又は均一近接させた第３工程とからなることを特徴とするＬＥＤ実装方法である。 According to a first aspect of the present invention, an LED (chip LED package) is mounted on a lens body interposed between a light guide plate and an LED having an edge light type backlight structure using the LED as a light source so that the LED can be contacted or uniformly approached. It is the LED mounting board | substrate characterized by these.
The second invention is an LED mounting board in which the LED is mounted while the bottom surface of the LED (chip LED package) is exposed on the back surface of the board.
A third invention is an LED mounting board in which an LED (chip LED package) is mounted in a recess formed on a side surface in the longitudinal direction of the LED mounting board.
A fourth invention is an LED mounting board in which an LED (chip LED package) is mounted in a perforated portion formed in the thickness direction of the LED mounting board.
According to a fifth aspect of the present invention, there is provided an LED mounting board characterized in that a flexible material is used for the board.
6th invention is the LED mounting board | substrate characterized by using a polyimide as a foldable material.
7th invention is the LED mounting board | substrate characterized by providing the board | substrate with the mirror surface.
An eighth invention is an LED mounting board characterized in that a metal material is used for the board.
A ninth invention is an LED mounting board characterized by using aluminum as a metal material.
A tenth aspect of the invention is a backlight including the LED mounting substrate as described above.
In an eleventh aspect of the present invention, an LED (chip LED package) is mounted on a lens body interposed between an LED having an edge light type backlight structure having an LED as a light source and a light guide plate so that the LED can be contacted or uniformly approached. The LED mounting method is characterized in that the bottom surface portion of the (chip LED package) is exposed on the back surface of the substrate to enable mounting work from the back surface side of the substrate.
A twelfth aspect of the present invention is a heat sink for mounting an LED (chip LED package) on a lens body interposed between an LED having an edge light type backlight structure using an LED as a light source and a light guide plate so that the LED can be contacted or uniformly approached. First step of incorporating LED (chip LED package) into LED fixing portion of LED fixing plate having function, LED fixing plate and LED mounting board incorporating LED (chip LED package) are set, LED terminal portion And a second step of soldering the board terminal portion to form the LED unit, and a third step of bringing the LED unit body and the lens body into contact or uniform proximity to each other. .

上記発明によれば、以下のような効果を有する。
（１）ＬＥＤをレンズ体に当接又は均一近接可能に実装できるＬＥＤ実装基板を有することで、バックライトの性能・生産効率が極めて向上する。また、レンズ体を介在させることで、ＬＥＤから導光板への集光及び／又は拡散効果が得られ、バックライトの性能を向上させる。
（２）ＬＥＤ（チップＬＥＤ用パッケージ）の底面部が基板裏面に表出していることで、基板裏面側からの実装作業（ハンダ付け等）が可能となり、ＬＥＤ（チップＬＥＤ用パッケージ）をレンズ体へ確実（誤差の減少）に当接又は均一近接させることができる。また、ＬＥＤ（チップＬＥＤ用パッケージ）の底面部が基板裏面に表出していることで、基板の裏面側に熱を逃がす放熱効果を有する。
（３）ＬＥＤ実装基板に形成された凹部及び穿孔部によって、ＬＥＤ（チップＬＥＤ用パッケージ）の底面部を基板裏面に表出させつつＬＥＤ（チップＬＥＤ用パッケージ）を確実に実装できる。
（４）基板に折曲自在な材質を用いたことで、基板側が柔軟に折曲し、ＬＥＤ（チップＬＥＤ用パッケージ）をレンズ体へ確実に当接又は均一近接させることができる。
（５）ＬＥＤ（チップＬＥＤ用パッケージ）にリフレクター（反射面）を構成しない場合でも、基板に鏡面を備えることで、高輝度が得られる。
（６）基板の短手方向の長さを液晶画面（導光板）の厚さに合わせる為、寸法的には極端に短くなる場合がある。基板は熱を加えると「反り」が発生するものだが、放熱板を実装することにより「反りにくい」構造とすることができる。すなわち、一般的に基板は長手方向が長く短手方向が短いほど反りやすくなる。そのため、製造工程で基板が反ってしまった場合、その反りを強制的に戻そうとすると、半田クラックや部品破損の危険性がある。基板にＬＥＤを先に半田を行うと「反り」が生じ、それから放熱板へセットすると「反りから平ら」に戻そうとすることになるが、本件発明の場合、先に放熱板とＬＥＤをセットしてから基板に半田付けするため放熱板（金属でＬ字型等の物）で基板が反らないようにできる。
（７）ＬＥＤ固定板のＬＥＤ固定部にＬＥＤ２を組み込む又は嵌め込む場合、ＬＥＤを熱伝導性接着剤（硬化性、非硬化性）、熱伝導性シート、熱伝導ゴム、熱伝導ゲル等を使用し接着固定することで、熱伝導効率を上げることができる。 According to the said invention, it has the following effects.
(1) By having the LED mounting substrate on which the LED can be mounted on the lens body so as to be in contact with or uniformly approachable, the performance and production efficiency of the backlight are greatly improved. Further, by interposing the lens body, a condensing and / or diffusing effect from the LED to the light guide plate is obtained, and the performance of the backlight is improved.
(2) Since the bottom surface portion of the LED (chip LED package) is exposed on the back surface of the substrate, mounting work (soldering etc.) from the back surface side of the substrate becomes possible, and the LED (chip LED package) is a lens body. It is possible to make contact (uniform reduction) with certainty (decrease in error). Moreover, since the bottom surface portion of the LED (package for chip LED) is exposed on the back surface of the substrate, it has a heat radiation effect to release heat to the back surface side of the substrate.
(3) The LED (chip LED package) can be reliably mounted while the bottom surface of the LED (chip LED package) is exposed on the back of the substrate by the recesses and the perforated portions formed on the LED mounting substrate.
(4) By using a foldable material for the substrate, the substrate side can be flexibly bent, and the LED (chip LED package) can be reliably brought into contact with or evenly close to the lens body.
(5) Even when a reflector (reflecting surface) is not formed in an LED (chip LED package), high brightness can be obtained by providing a mirror surface on the substrate.
(6) Since the length of the substrate in the short direction is matched with the thickness of the liquid crystal screen (light guide plate), the dimension may be extremely shortened. The substrate is “warped” when heat is applied, but it can be made “hard to warp” by mounting a heat sink. That is, generally, the substrate is more likely to warp as the longer direction is longer and the shorter direction is shorter. For this reason, if the substrate is warped during the manufacturing process, there is a risk of solder cracks or component damage if the warp is forced to return. If the LED is soldered to the board first, "warping" will occur, and if it is set to the heat sink, it will try to return to "flat from warpage", but in the case of the present invention, the heat sink and LED are set first. Then, since it is soldered to the substrate, the substrate can be prevented from warping with a heat radiating plate (a metal L-shaped object).
(7) When LED2 is incorporated or fitted into the LED fixing part of the LED fixing plate, the heat conductive adhesive (curable, non-curable), heat conductive sheet, heat conductive rubber, heat conductive gel, etc. are used for the LED. Then, the heat conduction efficiency can be increased by bonding and fixing.

本発明の実施形態を図面に基づいて説明する。
図１は、本願発明に係るＬＥＤ実装構造を示す説明図である。図１に示すように、複数のＬＥＤ（本実施形態では、ＬＥＤとして「チップＬＥＤ用パッケージ」を使用する。以下同じ）２，２，…がヒートシンク（放熱板）機能を有するＬＥＤ固定板３に固定されながら、ＬＥＤ実装基板４に実装されている。そして、ＬＥＤ２，２，…はレンズ体１に当接されている。なお、符号５は抵抗である。 Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an explanatory view showing an LED mounting structure according to the present invention. As shown in FIG. 1, a plurality of LEDs (in this embodiment, a “chip LED package” is used as an LED. The same applies hereinafter) 2, 2,... Are formed on an LED fixing plate 3 having a heat sink (heat sink) function. It is mounted on the LED mounting substrate 4 while being fixed. .. Are in contact with the lens body 1. Reference numeral 5 denotes a resistor.

また、図１に示すＬＥＤ実装構造を外装する外装部材（図示省略）をヒートシンクとして利用する場合、上記ＬＥＤ固定板３はその外装部材との接合性を高め、それによって放熱効果を向上させることになる。   In addition, when the exterior member (not shown) for packaging the LED mounting structure shown in FIG. 1 is used as a heat sink, the LED fixing plate 3 enhances the bondability with the exterior member, thereby improving the heat dissipation effect. Become.

次に、上記ＬＥＤ実装構造の実装工程を説明する。
図２は、ＬＥＤ実装工程の第１工程を示す。（ａ）に示すように、断面略コ字形のＬＥＤ固定板３は穿孔された複数のＬＥＤ固定部６，６，…を長手方向に備え、そのＬＥＤ固定部６にＬＥＤ２を組み込む又は嵌め込む。この時ＬＥＤ２は、熱伝導効率を上げる為、熱伝導性接着剤（硬化性、非硬化性）、熱伝導性シート、熱伝導ゴム、熱伝導ゲル等を使用し接着固定してもよい。但し、接着剤を使用する場合、基板実装後に作業する場合もあり得る。また、この時、（ｂ）及び（ｃ）に示すように、ＬＥＤ固定板３の平滑面７とＬＥＤ２の発光面８を一致させる。全てのＬＥＤ発光面とレンズとの隙間を極力無くし、レンズへの入光率を高める為である。 Next, the mounting process of the LED mounting structure will be described.
FIG. 2 shows a first step of the LED mounting step. As shown in (a), the LED fixing plate 3 having a substantially U-shaped cross section is provided with a plurality of perforated LED fixing portions 6, 6... In the longitudinal direction, and the LED 2 is incorporated or fitted into the LED fixing portion 6. At this time, in order to increase the heat conduction efficiency, the LED 2 may be bonded and fixed using a heat conductive adhesive (curable or non-curable), a heat conductive sheet, a heat conductive rubber, a heat conductive gel, or the like. However, when an adhesive is used, the work may be performed after mounting on the board. At this time, as shown in (b) and (c), the smooth surface 7 of the LED fixing plate 3 and the light emitting surface 8 of the LED 2 are matched. This is because the gap between all the LED light emitting surfaces and the lens is eliminated as much as possible to increase the light incident rate to the lens.

図３は、ＬＥＤ実装工程の第２工程を示す。（ａ）及び（ｂ）に示すように、ＬＥＤ２の組み込まれたＬＥＤ固定板３とＬＥＤ実装基板４をセットする。そして、（ｃ）に示すようにＬＥＤ２のＬＥＤ端子部１０とＬＥＤ実装基板４の基板端子部１１をハンダ付け（リフロー，手半田など）する。これでＬＥＤユニット９を構成する。   FIG. 3 shows a second step of the LED mounting step. As shown in (a) and (b), the LED fixing plate 3 in which the LED 2 is incorporated and the LED mounting substrate 4 are set. Then, as shown in (c), the LED terminal portion 10 of the LED 2 and the substrate terminal portion 11 of the LED mounting substrate 4 are soldered (reflow, manual soldering, etc.). Thus, the LED unit 9 is configured.

図４は、ＬＥＤ実装工程の第３工程を示す。（ａ）及び（ｂ）に示すように、ＬＥＤユニット９とレンズ体１とを当接させて、ＬＥＤの実装を完了する。ＬＥＤ固定板３とレンズ体の当接固定は、例えば、接着剤、又は、樹脂固定（リブ等）、ネジ固定、ＬＥＤ固定板での挟み込みなどがあげられる。この時、ＬＥＤユニット９は、ＬＥＤ固定板３の平滑面７側をレンズ体１に当接する。   FIG. 4 shows a third step of the LED mounting step. As shown in (a) and (b), the LED unit 9 and the lens body 1 are brought into contact with each other to complete the LED mounting. Examples of the contact fixing between the LED fixing plate 3 and the lens body include an adhesive or resin fixing (ribs or the like), screw fixing, and pinching with the LED fixing plate. At this time, the LED unit 9 contacts the lens body 1 with the smooth surface 7 side of the LED fixing plate 3.

図５は、レンズ体１の形状を示す説明図である。レンズ体１は、ＬＥＤと導光板の間に介在されることで、ＬＥＤから導光板への集光及び／または拡散効果を得られ、バックライトの性能を向上させるものである。従って、バックライトの光度や実装されるＬＥＤの数量などその仕様に応じて、適宜適切なレンズ体１を選択すればよい。レンズ体は、図３に示すものに限らず、例えば、非球面レンズ、フレーネルレンズ、レンチキュラレンズなどであってもよい。なお、レンズ体を使用しない方法もある。   FIG. 5 is an explanatory diagram showing the shape of the lens body 1. The lens body 1 is interposed between the LED and the light guide plate, thereby obtaining a light condensing and / or diffusing effect from the LED to the light guide plate, and improving the performance of the backlight. Therefore, an appropriate lens body 1 may be appropriately selected according to the specifications such as the brightness of the backlight and the number of LEDs to be mounted. The lens body is not limited to that shown in FIG. 3, and may be, for example, an aspheric lens, a Fresnel lens, a lenticular lens, or the like. There is also a method that does not use a lens body.

図６は、ＬＥＤ実装基板４の形状を示す説明図である。
（ａ）は、従来からの平基板タイプのＬＥＤ実装基板４である。ＬＥＤ２のＬＥＤ端子部１０とＬＥＤ実装基板４の基板端子部１１をハンダ付けして実装される。なお、抵抗５は、基本的に裏面側に設けられる（表面側も可能）。
（ｂ）は、本発明に係るギザギザ（凹部）基板タイプのＬＥＤ実装基板４である。ＬＥＤ実装基板４の長手方向側面に連続して形成された凹部１２にＬＥＤ２を挟持して、ＬＥＤ２のＬＥＤ端子部１０とＬＥＤ実装基板４の基板端子部１１をハンダ付けして実装される。ＬＥＤ２の側面一部と底面部が表出（開放）されているので、放熱効果を生じる。また、ＬＥＤ２の底面部が基板裏面に表出していることで、基板裏面側からの実装作業（ハンダ付け等）が可能となり、ＬＥＤをレンズ体へ確実（誤差の減少）に当接又は均一近接させることができる。さらに、ＬＥＤをＬＥＤ実装基板４内に埋め込みことになるので、従来よりもＬＥＤを実装した基板を薄くできる。このため、装置の小型化・薄型化を可能にする。
（ｃ）は、本発明に係る穴あき基板タイプのＬＥＤ実装基板４である。ＬＥＤ実装基板４の厚さ方向に形成された穿孔部１３にＬＥＤ２を挟持して、ＬＥＤ２のＬＥＤ端子部１０とＬＥＤ実装基板４の基板端子部１１をハンダ付けして実装される。ＬＥＤ２の底面部が表出（開放）されているので、放熱効果を生じる。また、ＬＥＤ２の底面部が基板裏面に表出していることで、基板裏面側からの実装作業（ハンダ付け等）が可能となり、ＬＥＤをレンズ体へ確実（誤差の減少）に当接又は均一近接させることができる。さらに、ＬＥＤをＬＥＤ実装基板４内に埋め込みことになるので、従来よりもＬＥＤを実装した基板を薄くできる。このため、装置の小型化・薄型化を可能にする。 FIG. 6 is an explanatory view showing the shape of the LED mounting substrate 4.
(A) is a conventional flat substrate type LED mounting substrate 4. The LED terminal portion 10 of the LED 2 and the substrate terminal portion 11 of the LED mounting substrate 4 are mounted by soldering. The resistor 5 is basically provided on the back side (the front side is also possible).
(B) is a jagged (concave) substrate type LED mounting substrate 4 according to the present invention. The LED 2 is sandwiched between recesses 12 formed continuously on the side surface in the longitudinal direction of the LED mounting substrate 4, and the LED terminal portion 10 of the LED 2 and the substrate terminal portion 11 of the LED mounting substrate 4 are soldered and mounted. Since part of the side surface and the bottom surface of the LED 2 are exposed (opened), a heat dissipation effect is produced. In addition, the bottom surface of the LED 2 is exposed on the back side of the substrate, so that mounting work (soldering, etc.) from the back side of the substrate is possible, and the LED is in contact with the lens body reliably (decrease in error) or uniformly close. Can be made. Furthermore, since the LED is embedded in the LED mounting substrate 4, the substrate on which the LED is mounted can be made thinner than the conventional one. For this reason, the apparatus can be reduced in size and thickness.
(C) is a perforated board type LED mounting board 4 according to the present invention. The LED 2 is sandwiched between perforations 13 formed in the thickness direction of the LED mounting substrate 4, and the LED terminal portion 10 of the LED 2 and the substrate terminal portion 11 of the LED mounting substrate 4 are soldered and mounted. Since the bottom surface portion of the LED 2 is exposed (opened), a heat dissipation effect is produced. In addition, the bottom surface of the LED 2 is exposed on the back side of the substrate, so that mounting work (soldering, etc.) from the back side of the substrate is possible, and the LED is in contact with the lens body reliably (decrease in error) or uniformly close. Can be made. Furthermore, since the LED is embedded in the LED mounting substrate 4, the substrate on which the LED is mounted can be made thinner than the conventional one. For this reason, the apparatus can be reduced in size and thickness.

図７は、ＬＥＤ実装構造の本発明（穴あき基板タイプ）と従来例との比較を示す説明図である。
（ａ）は本発明の断面図、（ｂ）は従来例の断面図である。
図示するように、本発明と従来例では、次のような差異がある。
（１）ＬＥＤとＬＥＤ実装基板との接触面
本発明（側面４面） ＜ 従来例（底面のみ）
（２）ＬＥＤと外装部材１５との接触面
本発明（放熱板１４＋ＬＥＤ固定板３）＜ 従来例（放熱板１４のみ） FIG. 7 is an explanatory view showing a comparison between the present invention (perforated substrate type) of LED mounting structure and a conventional example.
(A) is sectional drawing of this invention, (b) is sectional drawing of a prior art example.
As shown in the figure, the present invention and the conventional example have the following differences.
(1) Contact surface between LED and LED mounting substrate The present invention (four side surfaces) <Conventional example (bottom surface only)
(2) Contact surface between LED and exterior member 15 The present invention (heat sink 14 + LED fixing plate 3) <conventional example (only heat sink 14)

以上のように、本発明は従来例と比較して、ＬＥＤとＬＥＤ実装基板との接触面が極めて多く、また、外装部材との接触面も極めて大きい。従って、本発明の放熱性能は、従来例よりも飛躍的に高いものと言える。   As described above, in the present invention, the contact surface between the LED and the LED mounting substrate is extremely large and the contact surface with the exterior member is extremely large as compared with the conventional example. Therefore, it can be said that the heat dissipation performance of the present invention is significantly higher than that of the conventional example.

本願発明に係るＬＥＤ実装構造を示す説明図。Explanatory drawing which shows the LED mounting structure which concerns on this invention. ＬＥＤ実装工程（第１工程）を示す説明図。Explanatory drawing which shows a LED mounting process (1st process). ＬＥＤ実装工程（第２工程）を示す説明図。Explanatory drawing which shows a LED mounting process (2nd process). ＬＥＤ実装工程（第３工程）を示す説明図。Explanatory drawing which shows a LED mounting process (3rd process). レンズ体の形状を示す説明図。Explanatory drawing which shows the shape of a lens body. ＬＥＤ実装基板の形状を示す説明図。Explanatory drawing which shows the shape of a LED mounting board. ＬＥＤ実装構造の本発明と従来例の比較を示す説明図。Explanatory drawing which shows the comparison of this invention of LED mounting structure, and a prior art example.

符号の説明Explanation of symbols

１ レンズ体
２ ＬＥＤ（チップＬＥＤ用パッケージ）
３ ＬＥＤ固定板
４ ＬＥＤ実装基板
５ 抵抗
６ ＬＥＤ固定部
７ ＬＥＤ固定板３の平滑面
８ ＬＥＤ２の発光面
９ ＬＥＤユニット
１０ ＬＥＤ端子部
１１ 基板端子
１２ 凹部
１３ 穿孔部
１４ 放熱板（アルミブロック）
１５ 外装部材 1 Lens body 2 LED (chip LED package)
3 LED fixing plate 4 LED mounting substrate 5 Resistance 6 LED fixing portion 7 Smooth surface 8 of LED fixing plate 3 Light emitting surface 9 of LED 2 LED unit 10 LED terminal portion 11 Substrate terminal 12 Recessed portion 13 Perforated portion 14 Heat sink (aluminum block)
15 Exterior member

Claims (12)

ＬＥＤを光源とするエッジライト型バックライト構造のＬＥＤと導光板の間に介在させるレンズ体へＬＥＤを当接又は均一近接可能に実装することを特徴とするＬＥＤ実装基板。   An LED mounting substrate, wherein an LED is mounted so as to be in contact with or uniformly close to a lens body interposed between an LED having an edge light type backlight structure using the LED as a light source and a light guide plate. ＬＥＤの底面部を基板裏面に表出させつつＬＥＤを実装させたことを特徴とする請求項１記載のＬＥＤ実装基板。   The LED mounting board according to claim 1, wherein the LED is mounted while the bottom surface of the LED is exposed on the back surface of the board. ＬＥＤ実装基板の長手方向側面に形成された凹部にＬＥＤを実装させたことを特徴とする請求項２記載のＬＥＤ実装基板。   3. The LED mounting board according to claim 2, wherein the LED is mounted in a recess formed on a side surface in the longitudinal direction of the LED mounting board. ＬＥＤ実装基板の厚さ方向に形成された穿孔部にＬＥＤを実装させたことを特徴とする請求項２記載のＬＥＤ実装基板。   The LED mounting substrate according to claim 2, wherein the LED is mounted in a perforated portion formed in the thickness direction of the LED mounting substrate. 基板に折曲自在な材質を用いたことを特徴とする請求項１記載のＬＥＤ実装基板。   The LED mounting substrate according to claim 1, wherein a material that can be bent is used for the substrate. 折曲自在な材質としてポリイミドを用いたことを特徴とする請求項５記載のＬＥＤ実装基板。   6. The LED mounting substrate according to claim 5, wherein polyimide is used as a material that can be bent. 基板に鏡面を備えたことを特徴とする請求項１から６のいずれかに記載のＬＥＤ実装基板。   The LED mounting substrate according to claim 1, wherein the substrate is provided with a mirror surface. 基板に金属材料を用いたことを特徴とする請求項１から４のいずれかに記載のＬＥＤ実装基板。   The LED mounting substrate according to claim 1, wherein a metal material is used for the substrate. 金属材質としてアルミニウムを用いたことを特徴とする請求項８記載のＬＥＤ実装基板。   9. The LED mounting board according to claim 8, wherein aluminum is used as a metal material. 請求項１〜９のいずれかに記載のＬＥＤ実装基板を備えたバックライト。   The backlight provided with the LED mounting board in any one of Claims 1-9. ＬＥＤを光源とするエッジライト型バックライト構造のＬＥＤと導光板の間に介在させるレンズ体へＬＥＤを当接又は均一近接可能に実装するために、ＬＥＤの底面部を基板裏面に表出させて、基板裏面側からの実装作業を可能としたことを特徴とするＬＥＤ実装方法。   In order to mount the LED in a contact or uniform proximity to the lens body interposed between the LED of the edge light type backlight structure using the LED as a light source and the light guide plate, the bottom surface of the LED is exposed on the back surface of the substrate, An LED mounting method characterized in that mounting work from the back side of a substrate is possible. ＬＥＤを光源とするエッジライト型バックライト構造のＬＥＤと導光板の間に介在させるレンズ体へＬＥＤを当接又は均一近接可能に実装するために、ヒートシンク機能を有するＬＥＤ固定板のＬＥＤ固定部にＬＥＤを組み込む第１工程と、ＬＥＤの組み込まれたＬＥＤ固定板とＬＥＤ実装基板をセットし、ＬＥＤ端子部と基板端子部をハンダ付けしてＬＥＤユニットを構成する第２工程と、ＬＥＤユニット体とレンズ体とを当接又は均一近接させた第３工程とからなることを特徴とするＬＥＤ実装方法。   An LED is mounted on an LED fixing portion of an LED fixing plate having a heat sink function in order to mount the LED so as to be in contact with or uniformly approach a lens body interposed between the LED of the edge light type backlight structure using the LED as a light source and the light guide plate. A first step of incorporating the LED, a second step of setting the LED fixing plate and the LED mounting substrate in which the LED is incorporated, and soldering the LED terminal portion and the substrate terminal portion to constitute the LED unit, and the LED unit body and the lens An LED mounting method comprising: a third step in which the body is brought into contact with or uniformly brought into contact with the body.
JP2006182846A 2006-06-30 2006-06-30 Light-emitting diode mounting board, backlight equipped with light-emitting diode mounting board and light-emitting diode mounting method Pending JP2008016197A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009218342A (en) * 2008-03-10 2009-09-24 Seiko Epson Corp Light source and method of mounting the same
JP2010232211A (en) * 2009-03-25 2010-10-14 Denso Corp Led light source unit
KR100993252B1 (en) 2008-08-25 2010-11-10 전자부품연구원 Light emitting diode module
JP2011238901A (en) * 2010-05-11 2011-11-24 Samsung Electronics Co Ltd Light emitting diode chip and supporting member, light emitting diode package including the light emitting diode chip and the supporting member, and light emitting device including the light emitting diode package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009218342A (en) * 2008-03-10 2009-09-24 Seiko Epson Corp Light source and method of mounting the same
JP4544316B2 (en) * 2008-03-10 2010-09-15 セイコーエプソン株式会社 Light source and light source mounting method
US7942552B2 (en) 2008-03-10 2011-05-17 Seiko Epson Corporation Light source device and light source packaging method
KR100993252B1 (en) 2008-08-25 2010-11-10 전자부품연구원 Light emitting diode module
JP2010232211A (en) * 2009-03-25 2010-10-14 Denso Corp Led light source unit
JP2011238901A (en) * 2010-05-11 2011-11-24 Samsung Electronics Co Ltd Light emitting diode chip and supporting member, light emitting diode package including the light emitting diode chip and the supporting member, and light emitting device including the light emitting diode package

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