CN109445192A - A kind of area source and preparation method thereof, backlight module and display device - Google Patents
A kind of area source and preparation method thereof, backlight module and display device Download PDFInfo
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- CN109445192A CN109445192A CN201910005717.8A CN201910005717A CN109445192A CN 109445192 A CN109445192 A CN 109445192A CN 201910005717 A CN201910005717 A CN 201910005717A CN 109445192 A CN109445192 A CN 109445192A
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- reflecting material
- point light
- wiring board
- light source
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Abstract
The present invention provides a kind of area source and preparation method thereof, backlight module and display devices, are related to field of display technology.The present invention is coated with reflecting material on the wiring board for being formed with multiple point light sources, by the mobility of reflecting material, makes the region on reflecting material covering wiring board in addition to multiple point light sources by forming multiple point light sources in the circuit board.By being formed after multiple point light sources in the circuit board, it is coated with reflecting material in the circuit board, utilize the mobility of reflecting material, so that the region on reflecting material covering wiring board in addition to multiple point light sources, the substrate and pad then exposed in wiring board is completely covered, so as to avoid the absorption for the light that substrate and pad issue point light source, the utilization rate of luminous energy is improved.
Description
Technical field
The present invention relates to field of display technology, more particularly to a kind of area source and preparation method thereof, backlight module and show
Showing device.
Background technique
With the continuous development of display technology, HDR (High-Dynamic Range, high dynamic range) technology is applied to
In display device, it is greatly improved the image quality of display device, and the realization of HDR technology needs cooperation to have the straight of area source
Type backlight mould group.
As depicted in figs. 1 and 2, currently, the area source in down straight aphototropism mode set is anti-by being coated in assist side 11
Material 12 is penetrated, which includes substrate 11 and form pad 12 on the substrate 11, then will by the modes such as expose, develop
The reflecting material 12 in die bond region (i.e. the region of point light source welding) removes, and exposes the pad 112 in die bond region, finally will be multiple
Point light source 13 is respectively welded on the pad 112 in die bond region by scolding tin 14.
But when removing the reflecting material in die bond region, due to the precision of equipment precision and subsequent welding point light source 13
It is required that the size of actually reflecting material removal region M can be greater than the size of point light source 13, so that the substrate in wiring board 11
111 and pad 112 expose, and then cause point light source 13 issue some light can be absorbed by substrate 111 and pad 112, reduce
The utilization rate of luminous energy.
Summary of the invention
The present invention provides a kind of area source and preparation method thereof, backlight module and display device, to solve existing making
During making area source, the substrate and pad that some light that point light source issues can be exposed absorb, and lead to the utilization of luminous energy
The problem of rate reduces.
To solve the above-mentioned problems, the invention discloses a kind of production methods of area source, comprising:
Multiple point light sources are formed in the circuit board；
It is coated with reflecting material on the wiring board for being formed with the multiple point light source, passes through the flowing of the reflecting material
Property, so that the reflecting material is covered the region on the wiring board in addition to the multiple point light source.
Preferably, described after the step of being coated with reflecting material on the wiring board for being formed with the multiple point light source,
Further include:
The wiring board is heated, so that the reflecting material solidification being coated on the wiring board.
Preferably, reflecting material is coated on the wiring board using coating process or line coating process.
Preferably, described the step of forming multiple point light sources in the circuit board, comprising:
Scolding tin is coated on the pad of assist side；
Point light source is fitted on the scolding tin；
The wiring board is heated, so that the scolding tin melts the weldering that the point light source is welded on to the wiring board
On disk.
To solve the above-mentioned problems, the invention also discloses a kind area sources, comprising:
Wiring board；
The multiple point light sources being formed on the wiring board；
Reflecting material, the reflecting material cover the region on the wiring board in addition to the multiple point light source.
Preferably, the reflecting material with a thickness of 20 μm to 100 μm.
Preferably, the contact position of the reflecting material and the point light source is formed with curved surfaces, the curved surfaces
Normal direction is towards the point light source.
Preferably, the reflecting material is white oil.
To solve the above-mentioned problems, the invention also discloses a kind of backlight modules, including above-mentioned area source.
To solve the above-mentioned problems, in addition the present invention discloses a kind of display device, including above-mentioned backlight module.
Compared with prior art, the present invention includes the following advantages:
By forming multiple point light sources in the circuit board, reflecting material is coated on the wiring board for being formed with multiple point light sources
Material makes the region on reflecting material covering wiring board in addition to multiple point light sources by the mobility of reflecting material.By in route
It is formed on plate after multiple point light sources, is coated with reflecting material in the circuit board, using the mobility of reflecting material, so that reflecting material
Region on material covering wiring board in addition to multiple point light sources, the then substrate and pad exposed in wiring board are completely covered, thus
The absorption for avoiding the light that substrate and pad issue point light source improves the utilization rate of luminous energy.
Detailed description of the invention
Fig. 1 shows the structural schematic diagram of existing area source；
Fig. 2 shows the cross-sectional views of existing area source；
Fig. 3 shows a kind of flow chart of the production method of area source of the embodiment of the present invention；
Fig. 4 shows the schematic diagram that the embodiment of the present invention forms multiple point light sources in the circuit board；
Fig. 5 shows the schematic diagram that scolding tin is coated on the pad of assist side of the embodiment of the present invention；
Fig. 6 shows the signal that the embodiment of the present invention is coated with reflecting material on the wiring board for being formed with multiple point light sources
Figure；
Fig. 7 shows the structural schematic diagram of the area source of the embodiment of the present invention.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
Embodiment one
Referring to Fig. 3, a kind of flow chart of the production method of area source of the embodiment of the present invention is shown, can specifically include
Following steps:
Step 301, multiple point light sources are formed in the circuit board.
In embodiments of the present invention, multiple point light sources 42, wiring board 41 are formed as shown in figure 4, welding in assist side 41
It can be FPC (Flexible Printed Circuit, flexible circuit board) or PCB (Printed Circuit Board, print
Brush wiring board), point light source 42 can be LED (Light Emitting Diode, light emitting diode) chip.
Specifically, being coated with scolding tin on the pad of assist side, point light source is fitted on the scolding tin, to the wiring board
It is heated, so that the point light source is welded on the pad of the wiring board by scolding tin thawing.
As shown in figure 5, wiring board 41 includes substrate 411 and the pad 412 being arranged on substrate 411, substrate can be PI
The material of (Polyimide, polyimides) substrate, pad 412 can be copper or other conductive materials, and silk screen 50 is placed online
On the pad 412 of road plate 41, scolding tin 43 is printed from the hollowed out area of silk screen to pad 412 using brush 51, to realize
Scolding tin 43 is coated on the pad 412 of assist side 41.
Then, point light source 42 is fitted on scolding tin 43, wiring board 41 is heated, so that scolding tin 43 melts, work as weldering
After tin 43 cools and solidifies, point light source 42 is just welded on the pad 412 of wiring board 41.
Preferably, point light source 42 can be in array distribution assist side 41, so that the light that each region of area source provides
More evenly.
Step 302, it is coated with reflecting material on the wiring board for being formed with the multiple point light source, passes through the reflecting material
Mobility, so that the reflecting material is covered the region on the wiring board in addition to the multiple point light source.
In embodiments of the present invention, reflecting material 44 is coated on the wiring board 41 for being formed with multiple point light sources 42, specifically
Be to be coated with arbitrary region in addition to multiple point light sources 42 in assist side 41, avoid reflecting material 44 from being applied to point light source 42
Place, influences the normal luminous of point light source 42.
The reflecting material 44 is liquid insulating material, and has certain reflectivity, using the mobility of reflecting material 44,
So that reflecting material flows to the region on entire wiring board 41 in addition to multiple point light sources 42, to cover on wiring board 41 except more
Region outside a point light source 42, then the substrate 411 and pad 412 exposed in wiring board 41 is completely covered, so as to avoid base
The absorption for the light that plate 411 and pad 412 issue point light source 42, improves the utilization rate of luminous energy.
Wherein, using coating reflecting material 44 on coating process or line coating process assist side 41.
Referring to Fig. 6, shows the embodiment of the present invention and be coated with reflecting material on the wiring board for being formed with multiple point light sources
Schematic diagram.
Reflecting material 44 is placed in coating apparatus, and reflecting material 44 is applied to by route by the water dropper D of coating apparatus
On plate 41, using the mobility of reflecting material 44, so that reflecting material 44 flows on entire wiring board 41 except multiple point light sources
Region outside 42.
Preferably, it is coated with before reflecting material 44, can will be formed on the wiring board 41 for being formed with multiple point light sources 42
The wiring board 41 of multiple point light sources 42 is placed on the spinning device, while reflecting material 44 are coated in assist side 41, rotation
Device control circuit board 41 rotates, so that the coating of reflecting material 44 is more uniform.
It in embodiments of the present invention, can be anti-on effective control circuit board 41 by controlling the coating weight of reflecting material 44
Penetrate the coating thickness of material 44.For the reflection characteristic of reflecting material 44, when the thickness of reflecting material 44 is bigger, reflecting material
44 reflectivity is higher, and when the thickness of reflecting material 44 is smaller, the reflectivity of reflecting material 44 is lower, for example, the reflecting material
Material 44 is white oil, and when the coating thickness of white oil is bigger, the reflectivity of white oil is higher, therefore, by properly increasing reflecting material
44 thickness effectively improves the reflectivity of reflecting material 44.
Current existing area source manufacturing process is first coated with reflecting material due to being in the circuit board, then by die bond region
Reflecting material removal, expose die bond region pad, then, by silk screen place in the circuit board, using brush by scolding tin from
The hollowed out area of silk screen is printed to pad, when the thickness of reflecting material is too big, when using silk-screen printing scolding tin, silk screen with
The distance between pad is larger, then scolding tin can not be fallen on pad well, leads to the feelings of non-soldering tin on rosin joint or pad
Condition occurs, and influences being welded and fixed for subsequent point light source, therefore, in current area source manufacturing process, the thickness of reflecting material by
Great limitation is arrived, the thickness of general reflecting material is up to 20 μm, and the reflectivity highest of reflecting material can achieve 80%.
And the area source manufacturing process of the embodiment of the present invention, it is to be coated on the wiring board 41 for being formed with multiple point light sources 42
Reflecting material 44, using the mobility of reflecting material 44, so that reflecting material 44 flows on entire wiring board 41 except multiple points
Region outside light source 42, without considering that silk-screen printing, only need to be by controlling reflecting material 44 to the thickness effect of reflecting material 44
Coating weight control the thickness of reflecting material 44, when the coating weight of reflecting material 44 is more, the thickness of reflecting material 44 is bigger,
As long as guaranteeing that the thickness of reflecting material 44 is no more than the thickness of point light source 42.
In general, point light source 42 with a thickness of 100 μm, it is anti-in order to guarantee while improving the reflectivity of reflecting material 44
Penetrate material 44 and do not cover point light source 42, therefore, reflecting material 44 with a thickness of 20 μm to 100 μm, for example, when reflecting material 44
When thickness increases to 40 μm, the reflectivity of reflecting material 44 can achieve 90% or more.
Referring to Fig. 7, the structural schematic diagram of the area source of the embodiment of the present invention is shown.
In embodiments of the present invention, when reflecting material 44 flows to around point light source 42, reflecting material 44 is utilized
The effect of surface tension, so that the contact position of reflecting material 44 and point light source 42 is formed with curved surfaces, the normal of curved surfaces
Direction is towards point light source 42.
As can be seen that light L can be reflexed to face light by the curved surfaces when the side of point light source 42 emits beam L
The light-emitting surface in source, to further increase the utilization rate of light.
Since reflecting material 44 is liquid insulating material, it is applied on the wiring board 41 for being formed with multiple point light sources 42
Cloth reflecting material 44 covers reflecting material 44 on wiring board 41 except the multiple light by the mobility of reflecting material 44
After region outside source 42, it is also necessary to carry out curing process to reflecting material 44.
In a preferred embodiment of the invention, it is coated on the wiring board for being formed with the multiple point light source described
After the step of reflecting material, further includes: heated to the wiring board, so that the reflecting material being coated on the wiring board
Solidification.
The wiring board 41 that can be coated with reflecting material 44 is placed in heating equipment, by heating equipment to being coated with
The wiring board 41 of reflecting material 44 is heated, so that the reflecting material 44 being coated on wiring board 41 can be reduced with rapid curing
The production duration of area source.Wherein, the heating temperature of heating equipment is 80 ° to 120 °, and heating time is 1 hour to 2 hours.
It is, of course, also possible to which the placement of wiring board 41 for being coated with reflecting material 44 carries out spontaneous curing at normal temperature.
In embodiments of the present invention, by forming multiple point light sources in the circuit board, in the line for being formed with multiple point light sources
It is coated with reflecting material on the plate of road, by the mobility of reflecting material, is made on reflecting material covering wiring board in addition to multiple point light sources
Region.After forming multiple point light sources in the circuit board, it is coated with reflecting material in the circuit board, utilizes reflecting material
Mobility, so that the region on reflecting material covering wiring board in addition to multiple point light sources, the then substrate exposed in wiring board and weldering
Disk is completely covered, and so as to avoid the absorption for the light that substrate and pad issue point light source, improves the utilization rate of luminous energy.
Embodiment two
The embodiment of the invention provides a kind of area sources, as shown in fig. 7, comprises: wiring board 41 is formed in assist side 41
Multiple point light sources 42；Reflecting material 44, reflecting material 44 cover the region on wiring board 41 in addition to multiple point light sources 42.
By the way that reflecting material 44 to be covered to the region on wiring board 41 in addition to multiple point light sources 42, so that in wiring board 41
Substrate 411 and pad 412 are completely covered, so as to avoid the suction for the light that substrate 411 and pad 412 issue point light source 42
It receives, improves the utilization rate of luminous energy.
Wherein, reflecting material 44 can be white oil, when the thickness of reflecting material 44 is bigger, the reflectivity of reflecting material 44
It is higher, therefore, while improving the reflectivity of reflecting material 44, in order to guarantee that reflecting material 44 does not cover point light source 42, instead
Penetrate material 44 with a thickness of 20 μm to 100 μm.
As shown in fig. 7, the contact position of reflecting material 44 and point light source 42 is formed with curved surfaces, the normal side of curved surfaces
To towards point light source 42.
When the side of point light source 42 emits beam, which can reflex to light L the light-emitting surface of area source,
To further increase the utilization rate of light.
In embodiments of the present invention, by being arranged on multiple point light sources, and covering wiring board in the circuit board except multiple
The reflecting material in the region outside point light source.The region on wiring board in addition to multiple point light sources is covered by reflecting material, then route
Substrate and pad in plate are completely covered, and so as to avoid the absorption for the light that substrate and pad issue point light source, are improved
The utilization rate of luminous energy.
Embodiment three
The embodiment of the invention provides a kind of backlight modules, including the area source in above-described embodiment two.
Wherein, backlight module can be down straight aphototropism mode set, which can also include optical diaphragm, such as spread
Piece etc..
In addition, being referred to the description of embodiment one and embodiment two about the specific descriptions of area source, the present invention is implemented
Example repeats no more this.
The embodiment of the invention also provides a kind of display devices, including above-mentioned backlight module.
In addition, the display device further includes LCD (the Liquid Crystal that backlight module light emission side is arranged in
Display, liquid crystal display) display panel.
In practical applications, display device can be with are as follows: mobile phone, television set, display, laptop, is led at tablet computer
Any products or components having a display function such as boat instrument.
In embodiments of the present invention, backlight module includes area source, by the way that multiple point light sources are arranged in the circuit board, and
The reflecting material for covering the region on wiring board in addition to multiple point light sources is covered by reflecting material and removes multiple light on wiring board
Region outside source, then the substrate in wiring board and pad are completely covered, and are issued so as to avoid substrate and pad to point light source
Light absorption, improve the utilization rate of luminous energy.
For the aforementioned method embodiment, for simple description, therefore, it is stated as a series of action combinations, still
Those skilled in the art should understand that the present invention is not limited by the sequence of acts described, because according to the present invention, it is certain
Step can be performed in other orders or simultaneously.Secondly, those skilled in the art should also know that, it is described in the specification
Embodiment belong to preferred embodiment, it is related that actions and modules are not necessarily necessary for the present invention.
All the embodiments in this specification are described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiments, the same or similar parts between the embodiments can be referred to each other.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, commodity or the equipment that include a series of elements not only include that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, commodity or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in process, method, commodity or the equipment for including the element.
Above to a kind of area source provided by the present invention and preparation method thereof, backlight module and display device, carry out
It is discussed in detail, used herein a specific example illustrates the principle and implementation of the invention, above embodiments
Illustrate to be merely used to help understand method and its core concept of the invention；At the same time, for those skilled in the art, according to
According to thought of the invention, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification
It should not be construed as limiting the invention.
Claims (10)
1. a kind of production method of area source characterized by comprising
Multiple point light sources are formed in the circuit board；
It is coated with reflecting material on the wiring board for being formed with the multiple point light source, by the mobility of the reflecting material, is made
The reflecting material covers the region on the wiring board in addition to the multiple point light source.
2. the method according to claim 1, wherein described in the wiring board for being formed with the multiple point light source
After the step of upper coating reflecting material, further includes:
The wiring board is heated, so that the reflecting material solidification being coated on the wiring board.
3. the method according to claim 1, wherein using coating process or line coating process in the route
Reflecting material is coated on plate.
4. the method according to claim 1, wherein described the step of forming multiple point light sources in the circuit board,
Include:
Scolding tin is coated on the pad of assist side；
Point light source is fitted on the scolding tin；
The wiring board is heated, so that the scolding tin melts the pad that the point light source is welded on to the wiring board
On.
5. a kind of area source characterized by comprising
Wiring board；
The multiple point light sources being formed on the wiring board；
Reflecting material, the reflecting material cover the region on the wiring board in addition to the multiple point light source.
6. area source according to claim 5, which is characterized in that the reflecting material with a thickness of 20 μm to 100 μm.
7. area source according to claim 5, which is characterized in that the contact position shape of the reflecting material and the point light source
At there is a curved surfaces, the normal directions of the curved surfaces is towards the point light source.
8. area source according to claim 5, which is characterized in that the reflecting material is white oil.
9. a kind of backlight module, which is characterized in that including the area source as described in any one of claim 5-8.
10. a kind of display device, which is characterized in that including backlight module as claimed in claim 9.
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|---|---|---|---|
| CN201910005717.8A CN109445192B (en) | 2019-01-03 | 2019-01-03 | Area light source and manufacturing method thereof, backlight module and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910005717.8A CN109445192B (en) | 2019-01-03 | 2019-01-03 | Area light source and manufacturing method thereof, backlight module and display device |
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| CN109445192B CN109445192B (en) | 2022-04-22 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113703223A (en) * | 2021-08-18 | 2021-11-26 | Tcl华星光电技术有限公司 | Backlight module, preparation method thereof and display panel |
| US11852917B2 (en) | 2021-08-18 | 2023-12-26 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backlight module and preparation method therefor, and display panel |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102171508A (en) * | 2008-10-24 | 2011-08-31 | 夏普株式会社 | Illuminating device and display device |
| CN103474564A (en) * | 2013-09-11 | 2013-12-25 | 深圳市通普科技有限公司 | COB packaging structure and COB packaging method |
| CN105895785A (en) * | 2016-04-25 | 2016-08-24 | 湘能华磊光电股份有限公司 | Optical source assembly structure of flip LED chip integrated package and manufacturing method thereof |
| KR20160143088A (en) * | 2015-06-04 | 2016-12-14 | 엘지디스플레이 주식회사 | Backlight Unit |
| CN207676905U (en) * | 2016-09-30 | 2018-07-31 | 深圳市玲涛光电科技有限公司 | Display device and electronic equipment |
| CN108732816A (en) * | 2018-05-22 | 2018-11-02 | 武汉华星光电技术有限公司 | Area source backlight module and liquid crystal display panel |
| CN109065529A (en) * | 2018-09-27 | 2018-12-21 | 武汉华星光电技术有限公司 | Area source, preparation method and the display device using the area source |
-
2019
- 2019-01-03 CN CN201910005717.8A patent/CN109445192B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102171508A (en) * | 2008-10-24 | 2011-08-31 | 夏普株式会社 | Illuminating device and display device |
| CN103474564A (en) * | 2013-09-11 | 2013-12-25 | 深圳市通普科技有限公司 | COB packaging structure and COB packaging method |
| KR20160143088A (en) * | 2015-06-04 | 2016-12-14 | 엘지디스플레이 주식회사 | Backlight Unit |
| CN105895785A (en) * | 2016-04-25 | 2016-08-24 | 湘能华磊光电股份有限公司 | Optical source assembly structure of flip LED chip integrated package and manufacturing method thereof |
| CN207676905U (en) * | 2016-09-30 | 2018-07-31 | 深圳市玲涛光电科技有限公司 | Display device and electronic equipment |
| CN108732816A (en) * | 2018-05-22 | 2018-11-02 | 武汉华星光电技术有限公司 | Area source backlight module and liquid crystal display panel |
| CN109065529A (en) * | 2018-09-27 | 2018-12-21 | 武汉华星光电技术有限公司 | Area source, preparation method and the display device using the area source |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113703223A (en) * | 2021-08-18 | 2021-11-26 | Tcl华星光电技术有限公司 | Backlight module, preparation method thereof and display panel |
| US11852917B2 (en) | 2021-08-18 | 2023-12-26 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backlight module and preparation method therefor, and display panel |
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