CN109375471A - 具有嵌入式清洗模块的光刻*** - Google Patents
具有嵌入式清洗模块的光刻*** Download PDFInfo
- Publication number
- CN109375471A CN109375471A CN201811222288.1A CN201811222288A CN109375471A CN 109375471 A CN109375471 A CN 109375471A CN 201811222288 A CN201811222288 A CN 201811222288A CN 109375471 A CN109375471 A CN 109375471A
- Authority
- CN
- China
- Prior art keywords
- mask
- cleaning
- lithography system
- designed
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 280
- 238000001459 lithography Methods 0.000 title claims abstract description 90
- 230000007246 mechanism Effects 0.000 claims abstract description 52
- 238000007687 exposure technique Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims description 86
- 239000000758 substrate Substances 0.000 claims description 42
- 239000002245 particle Substances 0.000 claims description 39
- 238000010521 absorption reaction Methods 0.000 claims description 26
- 230000008569 process Effects 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 24
- 238000001259 photo etching Methods 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 11
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 11
- 239000002390 adhesive tape Substances 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 6
- 239000000839 emulsion Substances 0.000 claims description 6
- 150000004676 glycans Chemical class 0.000 claims description 6
- 229920001282 polysaccharide Polymers 0.000 claims description 6
- 239000005017 polysaccharide Substances 0.000 claims description 6
- 239000004094 surface-active agent Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 230000004044 response Effects 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 241000406668 Loxodonta cyclotis Species 0.000 claims 2
- 239000011538 cleaning material Substances 0.000 description 25
- 238000010586 diagram Methods 0.000 description 18
- 235000012431 wafers Nutrition 0.000 description 16
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 10
- 238000012546 transfer Methods 0.000 description 9
- 230000005855 radiation Effects 0.000 description 8
- 238000007689 inspection Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- XTDAIYZKROTZLD-UHFFFAOYSA-N boranylidynetantalum Chemical compound [Ta]#B XTDAIYZKROTZLD-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- GALOTNBSUVEISR-UHFFFAOYSA-N molybdenum;silicon Chemical compound [Mo]#[Si] GALOTNBSUVEISR-UHFFFAOYSA-N 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
Landscapes
- Epidemiology (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Cleaning In General (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361793838P | 2013-03-15 | 2013-03-15 | |
| US61/793,838 | 2013-03-15 | ||
| US14/168,114 US10459353B2 (en) | 2013-03-15 | 2014-01-30 | Lithography system with an embedded cleaning module |
| US14/168,114 | 2014-01-30 | ||
| CN201410084248.0A CN104049469A (zh) | 2013-03-15 | 2014-03-07 | 具有嵌入式清洗模块的光刻*** |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410084248.0A Division CN104049469A (zh) | 2013-03-15 | 2014-03-07 | 具有嵌入式清洗模块的光刻*** |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109375471A true CN109375471A (zh) | 2019-02-22 |
Family
ID=51419015
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811222288.1A Pending CN109375471A (zh) | 2013-03-15 | 2014-03-07 | 具有嵌入式清洗模块的光刻*** |
| CN201410084248.0A Pending CN104049469A (zh) | 2013-03-15 | 2014-03-07 | 具有嵌入式清洗模块的光刻*** |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410084248.0A Pending CN104049469A (zh) | 2013-03-15 | 2014-03-07 | 具有嵌入式清洗模块的光刻*** |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN109375471A (de) |
| DE (2) | DE102014020027B3 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015204521A1 (de) * | 2015-03-12 | 2016-10-27 | Carl Zeiss Smt Gmbh | Reinigungsvorrichtung für ein EUV-Lithographiesystem, EUV-Lithographiesystem damit und Reinigungsverfahren |
| CN109426085A (zh) * | 2017-08-25 | 2019-03-05 | 台湾积体电路制造股份有限公司 | 用于清洁光刻设备的集光镜的装置及方法 |
| TWI639886B (zh) * | 2017-10-23 | 2018-11-01 | Powerchip Technology Corporation | 光罩承載平台的維護方法 |
| US10684559B2 (en) | 2017-11-20 | 2020-06-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for cleaning reticle stage |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110061981A (ko) * | 2009-12-02 | 2011-06-10 | 주식회사 하이닉스반도체 | 포토마스크의 세정방법 |
| TW201140672A (en) * | 2010-03-12 | 2011-11-16 | Sony Chemical & Inf Device | Dust removing material and dust removal method using same |
| US20120024318A1 (en) * | 2010-07-28 | 2012-02-02 | Masamitsu Itoh | Reticle chuck cleaner |
| CN202649668U (zh) * | 2012-06-19 | 2013-01-02 | 京东方科技集团股份有限公司 | 一种掩膜板自动清洁***及曝光设备 |
| WO2013035415A1 (ja) * | 2011-09-05 | 2013-03-14 | 株式会社 東芝 | レチクルチャッククリーナー及びレチクルチャッククリーニング方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4744833A (en) | 1987-06-11 | 1988-05-17 | International Business Machines Corporation | Electrostatic removal of contaminants |
| TW285721B (de) | 1994-12-27 | 1996-09-11 | Siemens Ag | |
| JP2002028596A (ja) * | 2000-07-12 | 2002-01-29 | Nitto Denko Corp | 除塵装置 |
| JP2002139825A (ja) | 2000-11-02 | 2002-05-17 | Ibiden Co Ltd | 露光用マスクの清掃方法および露光用マスクの清掃装置 |
| EP1329770A1 (de) | 2002-01-18 | 2003-07-23 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung eines Artikels |
| JP4418325B2 (ja) * | 2004-08-02 | 2010-02-17 | 富士通マイクロエレクトロニクス株式会社 | Ｘｙステージと半導体装置の製造装置 |
| JP2007212765A (ja) | 2006-02-09 | 2007-08-23 | Nsk Ltd | 近接露光装置の手動式クリーナ及びクリーナ装置 |
| US20070227565A1 (en) * | 2006-03-29 | 2007-10-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Workstation and cleaning apparatus thereof |
| EP2113616A4 (de) * | 2007-02-15 | 2015-01-14 | Xiaoyue Ding | Cpad-system für gebäude mit vorgefertigtem rahmen mit vollfunktion und verfahren dafür |
| JP2008216433A (ja) * | 2007-03-01 | 2008-09-18 | Adtec Engineeng Co Ltd | 露光装置 |
| US20090183322A1 (en) | 2008-01-17 | 2009-07-23 | Banqiu Wu | Electrostatic surface cleaning |
| JP5329387B2 (ja) | 2009-12-25 | 2013-10-30 | 株式会社東芝 | 洗浄用レチクル、レチクルステージの洗浄方法及び半導体装置の製造方法 |
| TWI450324B (zh) * | 2010-01-25 | 2014-08-21 | Gudeng Prec Ind Co Ltd | 微影設備之光罩清潔方法及微影設備之光罩清潔系統 |
| CN102338987A (zh) * | 2010-07-16 | 2012-02-01 | 中芯国际集成电路制造(上海)有限公司 | 光刻设备 |
| JP5678671B2 (ja) * | 2011-01-07 | 2015-03-04 | 富士通セミコンダクター株式会社 | クリーニング方法およびクリーニング装置 |
-
2014
- 2014-02-28 DE DE102014020027.2A patent/DE102014020027B3/de active Active
- 2014-02-28 DE DE102014102651.9A patent/DE102014102651B4/de active Active
- 2014-03-07 CN CN201811222288.1A patent/CN109375471A/zh active Pending
- 2014-03-07 CN CN201410084248.0A patent/CN104049469A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110061981A (ko) * | 2009-12-02 | 2011-06-10 | 주식회사 하이닉스반도체 | 포토마스크의 세정방법 |
| TW201140672A (en) * | 2010-03-12 | 2011-11-16 | Sony Chemical & Inf Device | Dust removing material and dust removal method using same |
| US20120024318A1 (en) * | 2010-07-28 | 2012-02-02 | Masamitsu Itoh | Reticle chuck cleaner |
| WO2013035415A1 (ja) * | 2011-09-05 | 2013-03-14 | 株式会社 東芝 | レチクルチャッククリーナー及びレチクルチャッククリーニング方法 |
| CN202649668U (zh) * | 2012-06-19 | 2013-01-02 | 京东方科技集团股份有限公司 | 一种掩膜板自动清洁***及曝光设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102014020027B3 (de) | 2023-03-09 |
| DE102014102651B4 (de) | 2020-12-17 |
| CN104049469A (zh) | 2014-09-17 |
| DE102014102651A1 (de) | 2014-09-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190222 |
|
| RJ01 | Rejection of invention patent application after publication |