CN109195419B - Air conditioner electrical box and heat radiating device thereof - Google Patents
Air conditioner electrical box and heat radiating device thereof Download PDFInfo
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- CN109195419B CN109195419B CN201811265139.3A CN201811265139A CN109195419B CN 109195419 B CN109195419 B CN 109195419B CN 201811265139 A CN201811265139 A CN 201811265139A CN 109195419 B CN109195419 B CN 109195419B
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- 239000004065 semiconductor Substances 0.000 claims abstract description 128
- 238000005057 refrigeration Methods 0.000 claims abstract description 72
- 230000017525 heat dissipation Effects 0.000 claims abstract description 58
- 238000001816 cooling Methods 0.000 claims description 33
- 238000009413 insulation Methods 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 230000006698 induction Effects 0.000 claims 3
- 238000010030 laminating Methods 0.000 abstract description 5
- 239000012528 membrane Substances 0.000 abstract description 4
- 238000004364 calculation method Methods 0.000 description 12
- 238000001514 detection method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20945—Thermal management, e.g. inverter temperature control
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application relates to an air conditioner electrical apparatus box and heat abstractor thereof, the device semiconductor refrigeration piece, thermal-insulated membrane and fin, the semiconductor refrigeration piece inlays and locates the fin, and the refrigeration end of semiconductor refrigeration piece is used for setting up with the mainboard laminating of air conditioner electrical apparatus box, and the heat dissipation end and the fin laminating of semiconductor refrigeration piece set up, and the thermal-insulated membrane sets up between the refrigeration end and the heat dissipation end of semiconductor refrigeration piece. When the semiconductor refrigerating piece of the heat dissipating device is electrified, a cold source is generated at the refrigerating end of the semiconductor refrigerating piece to dissipate heat of the main board, the heat dissipating end of the semiconductor refrigerating piece is attached to the heat dissipating piece to dissipate heat, and a user can control the cold quantity of the semiconductor refrigerating piece by adjusting the flowing current of the semiconductor refrigerating piece, so that the main board is controlled to work within a reasonable temperature range. The heat dissipation of the main board at normal temperature and under working conditions can be realized by utilizing the semiconductor refrigeration principle, the problem that the air conditioner main board fails due to high temperature under high temperature and high load can be solved, and the heat dissipation reliability is improved.
Description
Technical Field
The application relates to the technical field of air conditioning equipment, in particular to an air conditioning electrical box and a heat dissipation device thereof.
Background
With the development of technology and the continuous progress of society, from household products to commercial products in the air conditioning industry, direct current frequency conversion has become the mainstream of unit capacity adjustment, and the rotation speed of the compressor can be changed by changing the frequency of a power supply entering the compressor, so that the discharge capacity of the compressor is adjusted, and the capacity of the compressor is changed accordingly. The direct-current variable-frequency compressor can fundamentally achieve the purposes of regulating the circulation quantity of the refrigerant and reducing the energy consumption.
The operation process of the direct current variable frequency compressor is actually realized by an alternating current-to-direct current circuit, a rectifying and filtering circuit and a direct current-to-alternating current circuit of the current. The IPM (Intelligent Power Module ) bears the most important cycle of direct current to alternating current to supply to the three-phase compressor, the running state of the IPM determines the frequency state of the compressor, the working temperature of the IPM is limited, so that the highest frequency of the compressor can be operated is limited, the problem of limited heat dissipation of the IPM during the high-frequency operation of the air conditioner is not solved effectively, and the problem is solved.
The traditional air conditioner main board radiating mode is air-cooled radiating, and is realized by adopting an air-cooled radiator, and by taking the IPM radiating on the main board as an example, the radiator is arranged at the lower side part of the external machine electric appliance box and driven by the operation of an external machine fan to strengthen the radiating capacity, but the IPM radiating capacity is limited during high-temperature high-load refrigerating operation, and the traditional air conditioner main board radiating mode has the defect of low radiating reliability.
Disclosure of Invention
Based on this, it is necessary to provide an air conditioner electrical box and a heat dissipating device thereof capable of improving the heat dissipating reliability, aiming at the problem of low heat dissipating reliability of the traditional heat dissipating mode of the air conditioner main board.
The utility model provides a heat abstractor of air conditioner electrical apparatus box, includes semiconductor refrigeration piece, thermal-insulated membrane and fin, the semiconductor refrigeration piece inlay locate the fin, just the refrigeration end of semiconductor refrigeration piece is used for laminating the setting with the mainboard of air conditioner electrical apparatus box, the radiating end of semiconductor refrigeration piece with the fin laminating sets up, the thermal-insulated membrane set up in between the refrigeration end of semiconductor refrigeration piece and the radiating end.
The utility model provides an air conditioner electrical apparatus box, includes mainboard and above-mentioned heat abstractor, the refrigeration end of semiconductor refrigeration piece sets up with the mainboard laminating of air conditioner electrical apparatus box.
According to the air conditioner electrical box and the heat dissipating device thereof, the heat dissipating device is arranged on the main board of the air conditioner electrical box, when the semiconductor refrigerating piece of the heat dissipating device is electrified, a cold source is generated at the refrigerating end of the semiconductor refrigerating piece to dissipate heat for the main board, the heat dissipating end of the semiconductor refrigerating piece is attached to the heat dissipating piece to dissipate heat, and the user can control the cold quantity of the semiconductor refrigerating piece by adjusting the flowing current of the semiconductor refrigerating piece, so that the main board can work in a reasonable temperature range. The heat dissipation of the main board at normal temperature and under working conditions can be realized by utilizing the semiconductor refrigeration principle, the problem that the air conditioner main board fails due to high temperature under high temperature and high load can be solved, and the heat dissipation reliability is improved.
Drawings
FIG. 1 is a block diagram of a heat sink of a hollow electrical box according to an embodiment;
FIG. 2 is a front view of a heat dissipating device of a hollow electrical box according to an embodiment;
FIG. 3 is a top view of a heat dissipating device of a hollow electrical box according to an embodiment;
FIG. 4 is a side view of a heat sink of a hollow electrical box according to one embodiment;
fig. 5 is a schematic structural diagram of a hollow electrical box according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
In one embodiment, a heat dissipating device of an air conditioner electrical box is provided, which is suitable for dissipating heat of an IPM module of a variable frequency air conditioner. As shown in fig. 1, the device includes a semiconductor refrigeration sheet 110, a heat insulation film 120 and a heat dissipation sheet 130, wherein the semiconductor refrigeration sheet 110 is embedded in the heat dissipation sheet 130, and the refrigeration end of the semiconductor refrigeration sheet 110 is used for being attached to a main board of an air conditioner box, the heat dissipation end of the semiconductor refrigeration sheet 110 is attached to the heat dissipation sheet 130, and the heat insulation film 120 is arranged between the refrigeration end and the heat dissipation end of the semiconductor refrigeration sheet 110.
Specifically, the semiconductor refrigeration sheet 110 is provided with a P-N junction, and when a current load is applied to the inside, one end of the semiconductor refrigeration sheet is used for refrigerating and absorbing heat, and the other end is used for heating and releasing heat, and the semiconductor refrigeration sheet 110 is a sheet formed by pressing various P-N lines. The refrigeration end of the semiconductor refrigeration piece 110 may be an IPM module directly attached to the motherboard, and the refrigeration effect is generated at the refrigeration end of the semiconductor refrigeration piece 110 by utilizing the semiconductor refrigeration principle to dissipate heat of the IPM module. The cooling end of the semiconductor cooling fin 110 may be bonded to a heat dissipation integrated board of the motherboard, the heat dissipation integrated board concentrates the heat of all the heating devices on the motherboard, and then the heat dissipation is performed by bonding with the cooling end of the semiconductor cooling fin 110, and finally the heat is transmitted through the heat dissipation fin 130 of the heat dissipation end of the semiconductor cooling fin 110. The heat insulation film 120 is arranged between the cooling end and the heat radiation end of the semiconductor refrigeration sheet 110 to insulate heat, and the semiconductor refrigeration principle of the semiconductor refrigeration sheet 110 is utilized to radiate heat, so that the heat radiation of the main board at normal temperature and under working conditions can be simultaneously considered, and the problem that the air conditioner main board fails due to high temperature under high temperature and high load is solved.
In one embodiment, the cooling side of semiconductor cooling fin 110 is attached to an IPM module on the motherboard. The IPM module integrates the power switching device and the driving circuit, integrates fault detection circuits such as overvoltage, overcurrent and overheat therein, and can send detection signals to the controller. Specifically, the cooling end of the semiconductor cooling fin 110 may be attached to the IPM module through a heat dissipating paste, so as to improve the heat dissipation effect. Under the working condition of high temperature and high load, the semiconductor refrigerating sheet 110 is connected with current, the refrigerating capacity of the refrigerating end of the semiconductor refrigerating sheet 110 can be controlled by controlling the current, so that the IPM module can be controlled to work in a reasonable temperature range, the adopted semiconductor refrigerating sheet 110 is simple to manufacture and low in cost, the IPM temperature is controlled accurately, and the action delay is greatly reduced. When the heat dissipating device works in the whole machine, the refrigerating end of the semiconductor refrigerating sheet 110 generates a cold source to dissipate heat for the IPM module, the heat dissipating end of the semiconductor refrigerating sheet 110 is tightly attached to the heat dissipating sheet 130 to dissipate heat, the structural design is reasonable, the assembly production time is short, the heat dissipation of the IPM module is good, and the effective temperature control of the IPM module is realized.
In another embodiment, the cooling end of the semiconductor refrigeration sheet 110 is attached to a heat dissipating integrated board on the motherboard. Specifically, various electric control components are mounted on the motherboard, besides the IPM module as a main heating component, other components such as various diodes, integrated circuits and the like also generate heat, and the heat dissipation integrated board on the motherboard is a set of heat dissipation of all the heating components on the motherboard, so that heat is concentrated firstly, then is adhered to a cooling end of the semiconductor cooling fin 110 for heat dissipation, and finally is transmitted out through the heat dissipation fin 130 adhered to the cooling end of the semiconductor cooling fin 110. Further, in one embodiment, the cooling end of the semiconductor cooling fin 110 is adhered to the heat dissipation integrated board on the motherboard through the heat dissipation paste, so that the fixing is reliable, and the heat dissipation effect can be improved.
Correspondingly, in one embodiment, the heat dissipation end of the semiconductor refrigeration sheet 110 is adhered to the heat dissipation sheet 130 by a heat dissipation paste. The heat dissipation ends of the semiconductor cooling fins 110 and the heat dissipation fins 130 are bonded by the heat dissipation paste, so that the fixing reliability and the heat dissipation effect can be improved.
In one embodiment, as shown in fig. 1 and 2, the heat sink 130 is further provided with a channel 132 for leading out positive and negative terminals of the semiconductor refrigeration sheet 110. Specifically, the positive and negative terminals of the semiconductor refrigeration sheet 110 may be connected by a wire disposed in the channel 132, so as to perform refrigeration control by supplying current to the semiconductor refrigeration sheet 110 through the wire. Taking the IPM module heat dissipation of an air conditioner as an example, under the normal temperature working condition, the heat productivity of the IPM module is not particularly large, and the heat dissipation requirement of the IPM module can be met by naturally dissipating heat through the semiconductor cooling fin 110 and the part where the IPM module is in direct contact with the heat dissipation fin 130. Under the working condition of high temperature and high load, the semiconductor refrigerating sheet 110 is connected with current, and the refrigerating capacity of the refrigerating end of the semiconductor refrigerating sheet 110 is controlled by controlling the current, so that the IPM is controlled to work in a reasonable temperature range.
The specific type of the heat sink 130 is not unique, and in this embodiment, the heat sink 130 is an aluminum heat sink, so that the heat dissipation effect is good and the cost is low. The specific structure of the heat sink 130 is not unique, in one embodiment, as shown in fig. 3 and 4, the heat sink 130 includes a body portion and a heat sink portion, the semiconductor refrigeration fin 110 is embedded on one surface of the body portion, a plurality of heat sinks spaced from each other are disposed on the other surface of the body portion opposite to the semiconductor refrigeration fin 110, the heat sinks may be in a sheet structure, and the areas of the heat sinks may be the same or different.
In one embodiment, the heat dissipating device further includes a controller, the controller is connected to the positive and negative terminals of the semiconductor refrigeration sheet 110 through a wire disposed in the channel 132, and the controller is configured to output a current to the semiconductor refrigeration sheet 110 to control the semiconductor refrigeration sheet 110 to perform refrigeration and heat dissipation. Specifically, the controller may be connected to an external power supply and output current to the positive and negative terminals connected to the semiconductor refrigeration sheet 110, so that the semiconductor refrigeration sheet 110 is electrified to perform refrigeration and heat dissipation.
Further, the heat dissipating device further includes a temperature sensor disposed on the motherboard, the temperature sensor is connected to the controller, and the controller is further configured to adjust the current output to the semiconductor refrigeration sheet 110 according to the sensed temperature data transmitted by the temperature sensor. Specifically, the temperature sensor may be disposed on the IPM module on the motherboard, and by detecting the current temperature of the IPM module and adjusting the current of the semiconductor refrigeration sheet 110, the cooling capacity of the semiconductor refrigeration sheet 110 is controlled, so as to control the temperature of the IPM module to be always at a lower temperature, so that the IPM module can work normally and efficiently.
The specific manner in which the controller adjusts the current output to the semiconductor refrigeration sheet 110 according to the sensed temperature data transmitted by the temperature sensor is not unique, and specifically, taking the detection of the temperature of the IPM module and the adjustment of the current to the semiconductor refrigeration sheet 110 as an example, in one embodiment, the controller maintains the output voltage unchanged when the detected temperature of the IPM module is greater than or equal to a preset lower limit temperature and less than or equal to a preset upper limit temperature within a preset period of time; and stopping outputting the voltage to the semiconductor cooling fin 110 when the temperature of the IPM module detected within the preset time period is less than the lower limit temperature. The specific value of the preset duration is not unique, and may be 0-30S, in this embodiment, the preset duration is 5S.
In one embodiment, if the temperature of the IPM module detected by the controller during the preset time period is greater than the upper limit temperature and less than the preset frequency limit temperature, the output voltage is increased according to the first preset amplitude, thereby increasing the cooling capacity of the semiconductor cooling fin 110. The value of the first preset amplitude is also not unique, and in this embodiment, is 0.2v.
Further, when the temperature of the IPM module detected by the controller within the preset time period is greater than or equal to the frequency limiting temperature and less than or equal to the preset frequency reducing temperature, the output voltage is increased according to a second preset amplitude, and the second preset amplitude is greater than the first preset amplitude. In this embodiment, the second preset amplitude is 0.5v. When the temperature of the IPM module is greater than the frequency limit temperature, the output voltage is rapidly increased, and the refrigerating capacity of the semiconductor refrigerating sheet 110 is increased to improve the heat dissipation effect.
In one embodiment, the controller increases the output voltage according to a third preset magnitude when the temperature of the IPM module detected during the preset time period is greater than the down-conversion temperature and less than the preset protection shutdown temperature, the third preset magnitude being greater than the second preset magnitude. In this embodiment, the third preset amplitude is 2v. When the temperature of the IPM module is greater than the frequency-reducing temperature, the amplitude of the output end is rapidly increased by adopting a larger amplitude, so that the refrigerating capacity of the semiconductor refrigerating sheet 110 is increased. In addition, if the temperature of the IPM module detected by the controller within the preset time period is greater than or equal to the protection shutdown temperature, the protection shutdown operation is executed, fault prompt information is output, and a user is reminded to overhaul.
In order to facilitate understanding, the following will explain in detail the adjustment of the current output to the semiconductor cooling fin 110 according to the sensed temperature data transmitted from the temperature sensor, taking the heat dissipation of the IPM module as an example. The specific control method is described as follows:
parameter description:
【I semiconductor device Describe the total current through both poles of the refrigeration sheet;
【U semiconductor calculation target voltage Describing the supply voltage of a control board to two ends of a refrigerating sheet;
【T semiconductor device Describing the current real-time working temperature of the IPM;
【T IPM frequency limiting Describe IPM frequency limiting temperature;
【T IPM frequency reduction Describe IPM down-conversion temperature;
【T IPM protection Describe IPM protection shutdown temperature;
【T min describing the lower limit temperature at which IPM can operate normally and efficiently;
【T max describe the upper temperature at which IPM can operate normally and efficiently;
note that: constant in value [ T ] min 】＜【T max 】＜【T IPM frequency limiting 】＜【T IPM protection 】。
1. If the detection is continued for 5 seconds [ T ] min 】≤【T Semiconductor device 】≤【T max Control parameters [ U ] Semiconductor calculation target voltage Stabilize at the current value.
2. If the detection is continued for 5 seconds [ T ] Semiconductor device 】＜【T min Control [ U ] Semiconductor calculation target voltage 0v, i.e. the semiconductor refrigeration operation is turned off.
3. If the detection is continued for 5 seconds [ T ] max 】＜【T Semiconductor device 】＜【T IPM frequency limiting Lifting [ U ] Semiconductor calculation target voltage The refrigerating capacity of the refrigerating sheet is increased [ U ] by the value Semiconductor calculation target voltage 】＝【U Semiconductor calculation target voltage 】+0.2v。
4. If the detection is continued for 5 seconds [ T ] IPM frequency limiting 】≤【T Semiconductor device 】≤【T IPM frequency reduction The U value is quickly increased, the refrigerating capacity of the refrigerating sheet is increased, [ U ] Semiconductor calculation target voltage 】＝【U Semiconductor calculation target voltage 】+0.5v。
5. If the detection is continued for 5 seconds [ T ] IPM frequency reduction 】＜【T Semiconductor device 】＜【T IPM protection The U value is quickly increased, the refrigerating capacity of the refrigerating sheet is increased, [ U ] Semiconductor calculation target voltage 】＝【U Semiconductor calculation target voltage 】+2v。
6. If the detection is continued for 5 seconds [ T ] IPM protection 】≤【T Semiconductor device And executing protection shutdown to prompt the current fault.
All detection parameters of the logic are real-time detection, the unit is s, the logic is executed to judge the action period is 5s, and the target voltage [ U ] Semiconductor calculation target voltage Computing update period [ T ] Semiconductor calculation target voltage The range of the product is 0-30s, and the default value of the manufacturer is 5s.
According to the heat dissipation device of the air conditioner electrical box, the heat dissipation device is arranged on the main board of the air conditioner electrical box, when the semiconductor refrigerating piece of the heat dissipation device is electrified, a cold source is generated at the refrigerating end of the semiconductor refrigerating piece to dissipate heat for the main board, the heat dissipation end of the semiconductor refrigerating piece is attached to the heat dissipation piece to dissipate heat, and a user can control the cold quantity of the semiconductor refrigerating piece by adjusting the flowing current of the semiconductor refrigerating piece, so that the main board can work in a reasonable temperature range. The heat dissipation of the main board at normal temperature and under working conditions can be realized by utilizing the semiconductor refrigeration principle, the problem that the air conditioner main board fails due to high temperature under high temperature and high load can be solved, and the heat dissipation reliability is improved.
In an embodiment, an air conditioner electrical box is provided, including a main board and the above heat dissipating device, where the cooling end of the semiconductor refrigeration piece is attached to the main board of the air conditioner electrical box, as shown in fig. 2, which is a schematic structural diagram of the heat dissipating device 100 disposed on the main board of the air conditioner electrical box. In addition, the air conditioner electrical box can further comprise a shell, and the main board and the heat dissipation device are arranged in the shell.
According to the air conditioner electrical box, the heat radiating device is arranged on the main board, when the semiconductor refrigerating piece of the heat radiating device is electrified, the refrigerating end of the semiconductor refrigerating piece can be utilized to generate a cold source to radiate heat for the main board, the heat radiating end of the semiconductor refrigerating piece is attached to the heat radiating piece to radiate heat, and a user can also control the cold quantity of the semiconductor refrigerating piece by adjusting the flowing current of the semiconductor refrigerating piece, so that the main board can be controlled to work in a reasonable temperature range. The heat dissipation of the main board at normal temperature and under working conditions can be realized by utilizing the semiconductor refrigeration principle, the problem that the air conditioner main board fails due to high temperature under high temperature and high load can be solved, and the heat dissipation reliability is improved.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (10)
1. The heat dissipation device of the air conditioner electrical box is characterized by comprising a semiconductor refrigeration piece, a heat insulation film, a heat dissipation piece, a controller and a temperature sensor arranged on an IPM module of a main board of the air conditioner electrical box, wherein the semiconductor refrigeration piece is embedded in the heat dissipation piece, the refrigeration end of the semiconductor refrigeration piece is used for being attached to the main board of the air conditioner electrical box, the heat dissipation end of the semiconductor refrigeration piece is attached to the heat dissipation piece, and the heat insulation film is arranged between the refrigeration end and the heat dissipation end of the semiconductor refrigeration piece;
the radiating fin is also provided with a channel for leading out positive and negative wiring terminals of the semiconductor refrigerating fin; the controller is connected with positive and negative electrode wiring terminals of the semiconductor refrigeration piece through wires arranged on the channel; the temperature sensor is connected with the controller;
the controller is used for acquiring the sensing temperature data transmitted by the temperature sensor within a preset duration, and keeping the voltage output to the semiconductor refrigerating sheet unchanged under the condition that the sensing temperature data is not less than a preset lower limit temperature and not more than a preset upper limit temperature; stopping outputting voltage to the semiconductor refrigeration piece under the condition that the sensed temperature data is smaller than the preset lower limit temperature; under the condition that the induction temperature data is larger than the preset upper limit temperature and smaller than the preset frequency limit temperature, increasing the voltage output to the semiconductor refrigerating sheet according to a first preset amplitude; under the condition that the induction temperature data is not smaller than the preset frequency limiting temperature and not larger than the preset frequency reducing temperature, increasing the voltage output to the semiconductor refrigeration sheet according to a second preset amplitude, wherein the second preset amplitude is larger than the first preset amplitude; under the condition that the induction temperature data is larger than the preset frequency-reducing temperature and smaller than the preset protection shutdown temperature, increasing the voltage output to the semiconductor refrigerating sheet according to a third preset amplitude, wherein the third preset amplitude is larger than the second preset amplitude; under the condition that the sensed temperature data is not smaller than the preset protection shutdown temperature, executing protection shutdown operation and outputting fault prompt information; the preset frequency limiting temperature is smaller than the preset protection shutdown temperature.
2. The heat dissipating apparatus of claim 1, wherein the cooling side of the semiconductor cooling fin is attached to the IPM module on the motherboard.
3. The heat dissipating device of claim 1, wherein the cooling side of the semiconductor cooling fin is attached to a heat dissipating integrated board on the motherboard.
4. The heat dissipating device of claim 3 wherein the cooling end of the semiconductor cooling fin is bonded to the heat dissipating integrated board on the motherboard by a heat dissipating paste.
5. The heat sink of claim 1, wherein the heat sink is an aluminum heat sink.
6. The heat dissipating device of claim 1, wherein the heat dissipating end of the semiconductor cooling fin is bonded to the heat dissipating fin by a heat dissipating paste.
7. The heat sink of claim 1, wherein the predetermined time period is 0 to 30 seconds.
8. The heat sink of claim 1, wherein the first predetermined magnitude is 0.2V; the second preset amplitude is 0.5V; the third preset amplitude is 2V.
9. The heat sink of claim 1 wherein the controller is further configured to increase the magnitude of the voltage output to the semiconductor cooling fin if the sensed temperature data is greater than the preset down-conversion temperature.
10. An air conditioner electrical box, which is characterized by comprising a main board and the heat dissipating device as set forth in any one of claims 1-9, wherein the refrigerating end of the semiconductor refrigerating sheet is attached to the main board of the air conditioner electrical box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811265139.3A CN109195419B (en) | 2018-10-29 | 2018-10-29 | Air conditioner electrical box and heat radiating device thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811265139.3A CN109195419B (en) | 2018-10-29 | 2018-10-29 | Air conditioner electrical box and heat radiating device thereof |
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| CN109195419A CN109195419A (en) | 2019-01-11 |
| CN109195419B true CN109195419B (en) | 2024-03-19 |
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| CN110364938A (en) * | 2019-07-24 | 2019-10-22 | 扬州利家科技有限公司 | A kind of explosion-proof power distribution cabinet convenient for safeguarding |
| CN111902017A (en) * | 2020-07-10 | 2020-11-06 | 青岛海日高科模型有限公司 | Control board assembly and electrical equipment |
| CN112594895B (en) * | 2020-11-19 | 2022-08-09 | 珠海格力电器股份有限公司 | Intelligent regulation and control method and system for temperature of outdoor unit |
| CN112333992B (en) * | 2020-11-23 | 2023-07-14 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN113513821B (en) * | 2021-05-11 | 2022-11-04 | 宁波奥克斯电气股份有限公司 | Air conditioner heat dissipation control method and device and air conditioner |
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