WO2015144078A1 - Control system for semiconductor refrigerator - Google Patents

Control system for semiconductor refrigerator Download PDF

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Publication number
WO2015144078A1
WO2015144078A1 PCT/CN2015/075167 CN2015075167W WO2015144078A1 WO 2015144078 A1 WO2015144078 A1 WO 2015144078A1 CN 2015075167 W CN2015075167 W CN 2015075167W WO 2015144078 A1 WO2015144078 A1 WO 2015144078A1
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Prior art keywords
module
semiconductor
temperature
signal
voltage
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PCT/CN2015/075167
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French (fr)
Chinese (zh)
Inventor
李春阳
刘来平
陈伟
李鹏
张奎
王铭
Original Assignee
海尔集团公司
青岛海尔股份有限公司
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Publication of WO2015144078A1 publication Critical patent/WO2015144078A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00—Arrangement or mounting of control or safety devices
    • F25D29/003—Arrangement or mounting of control or safety devices for movable devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2107—Temperatures of a Peltier element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2700/00—Means for sensing or measuring; Sensors therefor
    • F25D2700/12—Sensors measuring the inside temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00—Arrangement or mounting of control or safety devices

Definitions

  • the supply voltage of the semiconductor refrigerating sheet is generally determined by directly comparing the average temperature of the refrigerator compartment and the set temperature.
  • the present invention provides a control system for a semiconductor refrigerator, comprising: a hot end temperature sensor configured to detect a hot end temperature of a semiconductor refrigerating sheet of the semiconductor refrigerator, to issue the characterization a hot end temperature signal having a hot end temperature; a compartment temperature sensor configured to detect an average temperature of the refrigerator compartment of the semiconductor refrigerator, to generate a compartment temperature signal indicative of the average temperature; and a temperature setting module configured to Setting a target temperature to be reached in the refrigerator compartment, and generating a target temperature signal indicating the target temperature; the main control module is configured to receive the hot end temperature signal, the compartment temperature signal, and the target temperature a signal, a semiconductor refrigeration chip voltage adjustment signal is issued according to a preset PID adjustment rule; and a semiconductor voltage adjustment module configured to receive the semiconductor refrigeration chip voltage adjustment signal, and adjust to the semiconductor cooling chip voltage adjustment signal according to the semiconductor The supply voltage for the semiconductor cooling chip to supply power.
  • a hot end temperature sensor configured to detect a hot end temperature of a semiconductor refrigerating sheet of the semiconductor refrigerator, to
  • control system further includes a door switch detecting module and an LED lighting module, wherein the door switch detecting module is configured to: detect whether the refrigerator door of the semiconductor refrigerator is opened, and issue a door when the refrigerator door is opened a switching signal; the main control module is further configured to: after receiving the door switch signal, issue an LED light on signal; the LED lighting module is configured to: after receiving the LED light on signal, turn on the LED lights in the refrigerator room.
  • the door switch detecting module is configured to: detect whether the refrigerator door of the semiconductor refrigerator is opened, and issue a door when the refrigerator door is opened a switching signal
  • the main control module is further configured to: after receiving the door switch signal, issue an LED light on signal
  • the LED lighting module is configured to: after receiving the LED light on signal, turn on the LED lights in the refrigerator room.
  • the voltage module can convert it to DC power (which can be DC power compensated or DC power without power factor compensation) and output.
  • a part of the output DC power is directly supplied to the semiconductor voltage regulation module 105, and the voltage at this time is generally 310V; the other part is used by the step-down module 110 for step-down, and is stepped down to obtain a constant voltage with a reduced voltage, and
  • the output to the above-mentioned main control module 101, fan drive module 106 and LED illumination module 108, the voltage after the step-down is generally 12V.
  • the first hot end prohibiting temperature determining step 202 determines whether the hot end temperature T hot reaches or exceeds the preset prohibition temperature; if the hot end temperature T hot reaches or exceeds the prohibition temperature, performing the first stop power supply step 203: to the semiconductor
  • the supply voltage U of the cooling fin is set to zero to stop supplying power to the semiconductor cooling sheet, and U is a supply voltage for supplying power to the semiconductor cooling sheet.
  • the control method of the present invention may loop back to the first data acquisition step 201 to continue execution.
  • FIG. 3 is a schematic diagram of a control system quickly obtaining a maximum cooling capacity with a higher cooling efficiency and accurately controlling an average temperature of a refrigerator compartment of a semiconductor refrigerator to a set target temperature according to a preset control method according to an embodiment of the present invention.
  • Sexual graph As shown in FIG.
  • the hot end protection temperature upper limit determining step 204 determines that the hot end protection temperature upper limit is reached or exceeded, as shown in FIG. 4, the first down to maintain voltage step 206 is performed such that the supply voltage U is lowered to the sustain voltage U keep . Since the supply voltage U drops, the hot end temperature T hot also decreases.
  • the second data acquisition step 207 and the second hot end prohibition temperature determination step 208 are sequentially performed. As shown in FIG. 4, the hot end temperature T hot does not exceed the prohibition temperature, so the determination of the second hot end prohibition temperature determination step 208 is always negative, and according to the aforementioned method, the hot end protection temperature lower limit determination step 210 is performed.
  • Fig. 5 is a schematic graph showing the relationship between the supply voltage of the semiconductor refrigerating sheet and the cooling efficiency and the cooling capacity according to an embodiment of the present invention.
  • the supply voltage U can be divided into four regions: the first non-economic zone 501 (ie, the region where the supply voltage U is between 0 and U min ), and efficient.
  • a region 502 ie, a region where the supply voltage U is between U min and U n
  • a high cooling capacity region 503 ie, a region where the supply voltage U is between U n and U max
  • a second non-economic region 504 ie, a power supply
  • the voltage U is larger than the area of U max ).
  • the maximum supply voltage U max can be experimentally selected as the maximum cooling capacity voltage U max-cold , that is, the PID adjustment rule in the present invention can be set such that it makes the supply voltage U in the above formula.
  • the maximum value is determined as the maximum cooling capacity voltage U max-cold , that is, U PID ( ⁇ T) is assigned to the maximum cooling capacity voltage U max-cold minus the highest efficiency voltage when ⁇ T is greater than the temperature difference threshold ⁇ T thd U best .
  • the highest efficiency voltage U best can be experimentally obtained, the value of which is apparently between the maximum cooling capacity voltage U max-cold and the minimum cooling capacity voltage U min-cold .
  • the sustain voltage U keep can generally take a value between the minimum supply voltage U min and the highest efficiency voltage U best .
  • the selection principle of the maintenance voltage U keep is to consider the temperature in the refrigerator when the refrigerator is in an extreme situation such as excessive ambient temperature, poor air flow, excessive humidity, and large temperature difference. It can be quickly reduced to the set temperature.
  • the value of the selected sustain voltage U keep is that, in these extreme cases, it is found by simulation that the difference between this value and U max-cold is not very large.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)

Abstract

A control system for a semiconductor refrigerator, comprising: a hot end temperature sensor (102) configured to detect the hot end temperature of a semiconductor cooling piece of the semiconductor refrigerator and send a hot end temperature signal representing a hot end temperature level; a compartment temperature sensor (103) configured to detect the average temperature of the compartment of the semiconductor refrigerator and send a compartment temperature signal representing the average temperature level; a temperature setting module (104) configured to set a target temperature required by the compartment of the refrigerator and send a target temperature signal representing the target temperature level; a main control module (101) configured to receive the hot end temperature signal, the compartment temperature signal and the target temperature signal, and send a voltage regulating signal of the semiconductor cooling piece according to a preset PID regulating rule; a semiconductor voltage regulating module (105) configured to receive the voltage regulating signal of the semiconductor cooling piece, and regulating a supply voltage supplying power for the semiconductor cooling piece according to the voltage regulating signal of the semiconductor cooling piece.

Description

一种用于半导体冰箱的控制***Control system for semiconductor refrigerator 技术领域Technical field
本发明涉及制冷设备，特别是涉及一种用于半导体冰箱的控制***。The present invention relates to refrigeration equipment, and more particularly to a control system for a semiconductor refrigerator.
背景技术Background technique
在现有的半导体冰箱的控制***中，一般是通过直接比较冰箱间室的平均温度和设定温度来确定半导体制冷片的供电电压。In the control system of the existing semiconductor refrigerator, the supply voltage of the semiconductor refrigerating sheet is generally determined by directly comparing the average temperature of the refrigerator compartment and the set temperature.
然而，现有的这种半导体冰箱的控制***并未考虑到半导体制冷片的制冷特性，其并未把半导体制冷片的热端的温度列入确定半导体制冷片的供电电压的考虑因素。这往往导致其难以保证半导体冰箱在正常工作维持其内的制冷空间温度时，半导体制冷片能够以实现较高制冷效率的方式工作，或者难以保证在需要半导体冰箱快速制冷时，半导体制冷片能够以快速获得最大制冷量的方式工作。However, the conventional control system of such a semiconductor refrigerator does not take into consideration the refrigeration characteristics of the semiconductor refrigerating sheet, and does not include the temperature of the hot end of the semiconductor refrigerating sheet in consideration of the supply voltage for determining the semiconductor refrigerating sheet. This often makes it difficult to ensure that the semiconductor refrigerator can operate in a manner that achieves higher cooling efficiency when the semiconductor refrigerator maintains the temperature of the refrigerating space therein, or it is difficult to ensure that the semiconductor refrigerating sheet can be used when the semiconductor refrigerator is required to be rapidly cooled. Work quickly by getting the maximum amount of cooling.
此外，在现有的半导体冰箱中，在半导体冰箱的半导体制冷片两端的电压过高、半导体制冷片的热端的散热不良等情况下，半导体制冷片的热端温度往往会快速上升，最终导致半导体制冷片损坏。若半导体冰箱的控制***仅仅采取停止对半导体制冷片的供电的方法来应对此问题，固然可以使得半导体制冷片的热端温度迅速下降，但会影响半导体制冷片的正常制冷，往往会使得半导体冰箱的冰箱间室的温度过度升高，从而对制冷效果带来过大负面影响。Further, in the conventional semiconductor refrigerator, in the case where the voltage across the semiconductor refrigerating sheet of the semiconductor refrigerator is too high, and the heat dissipation at the hot end of the semiconductor refrigerating sheet is poor, the hot end temperature of the semiconductor refrigerating sheet tends to rise rapidly, eventually leading to the semiconductor. The cooling plate is damaged. If the control system of the semiconductor refrigerator only takes the method of stopping the power supply to the semiconductor refrigerating sheet to cope with this problem, the temperature of the hot end of the semiconductor refrigerating sheet can be rapidly decreased, but the normal cooling of the semiconductor refrigerating sheet is affected, and the semiconductor refrigerator is often caused. The temperature in the refrigerator compartment is excessively increased, which has an excessively negative effect on the cooling effect.
发明内容Summary of the invention
本发明的一个目的旨在克服现有技术的制冷设备的至少一个缺陷，提供一种可结合半导体制冷片的热端温度、冰箱间室的平均温度及所要达到的目标温度，合理调节半导体制冷片的供电电压的用于半导体冰箱的控制***。An object of the present invention is to overcome at least one of the drawbacks of the prior art refrigeration apparatus, and to provide a semiconductor cooling fin that can be adjusted in combination with the hot end temperature of the semiconductor refrigerating sheet, the average temperature of the refrigerator compartment, and the target temperature to be achieved. The supply voltage is used in the control system of the semiconductor refrigerator.
本发明的一个进一步的目的是提供一种可使半导体制冷片以较高制冷效率快速获得最大制冷量而且可精确控制间室的平均温度的用于半导体冰箱的控制***。It is a further object of the present invention to provide a control system for a semiconductor refrigerator which allows a semiconductor refrigerating sheet to quickly obtain a maximum cooling capacity with a high cooling efficiency and which can accurately control the average temperature of the compartment.
本发明的一个进一步的目的是提供一种能够兼顾对半导体制冷片的保护和制冷效果的半导体冰箱及其半导体制冷片的供电电压控制方法，避免在 对半导体制冷片进行保护时对半导体冰箱的制冷效果带来过大负面影响。A further object of the present invention is to provide a method for controlling a power supply voltage of a semiconductor refrigerator and a semiconductor refrigerating sheet thereof capable of achieving both protection and cooling effects on a semiconductor refrigerating sheet, and avoiding The protection of the semiconductor refrigerating sheet has an excessively negative effect on the cooling effect of the semiconductor refrigerator.
为了实现上述一个或多个目的，本发明提供了一种用于半导体冰箱的控制***，包括：热端温度传感器，配置成检测所述半导体冰箱的半导体制冷片的热端温度，发出表征所述热端温度高低的热端温度信号；间室温度传感器，配置成检测所述半导体冰箱的冰箱间室的平均温度，发出表征所述平均温度高低的间室温度信号；温度设定模块，配置成设定所述冰箱间室内所要达到的目标温度，发出表征所述目标温度高低的目标温度信号；主控模块，配置成接收所述热端温度信号、所述间室温度信号以及所述目标温度信号，根据预设的PID调节规则发出半导体制冷片电压调节信号；以及半导体电压调节模块，配置成接收所述半导体制冷片电压调节信号，并根据所述半导体制冷片电压调节信号，调节向所述半导体制冷片进行供电的供电电压。In order to achieve one or more of the above objects, the present invention provides a control system for a semiconductor refrigerator, comprising: a hot end temperature sensor configured to detect a hot end temperature of a semiconductor refrigerating sheet of the semiconductor refrigerator, to issue the characterization a hot end temperature signal having a hot end temperature; a compartment temperature sensor configured to detect an average temperature of the refrigerator compartment of the semiconductor refrigerator, to generate a compartment temperature signal indicative of the average temperature; and a temperature setting module configured to Setting a target temperature to be reached in the refrigerator compartment, and generating a target temperature signal indicating the target temperature; the main control module is configured to receive the hot end temperature signal, the compartment temperature signal, and the target temperature a signal, a semiconductor refrigeration chip voltage adjustment signal is issued according to a preset PID adjustment rule; and a semiconductor voltage adjustment module configured to receive the semiconductor refrigeration chip voltage adjustment signal, and adjust to the semiconductor cooling chip voltage adjustment signal according to the semiconductor The supply voltage for the semiconductor cooling chip to supply power.
可选地，所述主控模块还配置成：根据预设的风机调节条件发出风机调节信号；所述控制***还包括：风机驱动模块，配置成接收所述风机调节信号，并根据所述风机调节信号，控制所述半导体冰箱的风机的叶轮转速；所述风机配置成：将所述半导体制冷片的冷端所产生的冷量散布到所述冰箱间室中，和/或为所述半导体制冷片的热端进行散热。Optionally, the main control module is further configured to: issue a fan adjustment signal according to a preset fan adjustment condition; the control system further includes: a fan drive module configured to receive the fan adjustment signal, and according to the fan Adjusting a signal to control an impeller rotation speed of a fan of the semiconductor refrigerator; the fan configured to: distribute a cooling amount generated by a cold end of the semiconductor refrigeration sheet into the refrigerator compartment, and/or to be the semiconductor The hot end of the cooling fins dissipates heat.
可选地，所述控制***还包括门开关检测模块和LED照明模块，其中所述门开关检测模块配置成：检测所述半导体冰箱的冰箱门是否打开，在所述冰箱门打开时，发出门开关信号；所述主控模块还配置成：在接收到所述门开关信号后，发出LED灯开启信号；所述LED照明模块配制成：在接收到所述LED灯开启信号后，开启所述冰箱间室内的LED灯。Optionally, the control system further includes a door switch detecting module and an LED lighting module, wherein the door switch detecting module is configured to: detect whether the refrigerator door of the semiconductor refrigerator is opened, and issue a door when the refrigerator door is opened a switching signal; the main control module is further configured to: after receiving the door switch signal, issue an LED light on signal; the LED lighting module is configured to: after receiving the LED light on signal, turn on the LED lights in the refrigerator room.
可选地，所述控制***还包括电源模块和降压模块，其中所述电源模块配置成：接收外部电源提供的交流电，将其转换为直流电后输出到所述降压模块和所述半导体电压调节模块；所述降压模块配置成：接收所述电源模块输出的直流电并对其降压后输出到所述主控模块、所述风机驱动模块以及所述LED照明模块。Optionally, the control system further includes a power module and a buck module, wherein the power module is configured to: receive an alternating current provided by an external power source, convert it into a direct current, and output the same to the buck module and the semiconductor voltage The buck module is configured to: receive the DC power output by the power module and step down the output to the main control module, the fan drive module, and the LED illumination module.
可选地，所述电源模块包括电源输入模块、整流模块、PFC模块，其中所述电源输入模块配置成：接收所述外部电源提供的所述交流电，输出到所述整流模块；所述整流模块配置成：接收所述电源输入模块输出的交流电，将其进行滤波后整流为直流电，并输出到所述PFC模块；PFC模块配置成：接收所述整流模块输出的直流电，对其进行所述功率因数补偿后输出到所述 降压模块和所述半导体电压调节模块。Optionally, the power module includes a power input module, a rectifier module, and a PFC module, wherein the power input module is configured to: receive the alternating current provided by the external power source, and output the same to the rectifier module; The device is configured to: receive the alternating current output by the power input module, filter it, and then rectify it into direct current, and output it to the PFC module; the PFC module is configured to: receive the direct current output by the rectifier module, and perform the power Factor compensation and output to the A buck module and the semiconductor voltage regulation module.
可选地，所述主控模块还配置成：根据预设半导体电压调节模块关闭条件，发出关闭半导体电压调节模块信号；所述控制***还包括：待机管理模块，配置成接收所述关闭半导体电压调节模块信号，并根据所述关闭半导体电压调节模块信号，关闭所述半导体电压调节模块。Optionally, the main control module is further configured to: issue a semiconductor voltage regulation module signal according to a preset semiconductor voltage regulation module shutdown condition; the control system further includes: a standby management module configured to receive the shutdown semiconductor voltage The module signal is adjusted, and the semiconductor voltage regulation module is turned off according to the closing the semiconductor voltage regulation module signal.
可选地，所述主控模块还配置成：根据预设的PFC模块关闭条件，发出关闭PFC模块信号；所述待机管理模块还配置成：接收所述关闭PFC模块信号，并根据所述关闭PFC模块信号，关闭所述PFC模块，使得经所述整流模块整流后的直流电不经功率因数补偿，而直接从电源模块输出。Optionally, the main control module is further configured to: issue a shutdown PFC module signal according to a preset PFC module shutdown condition; the standby management module is further configured to: receive the shutdown PFC module signal, and close according to the The PFC module signal turns off the PFC module, so that the DC power rectified by the rectifier module is directly output from the power module without power factor compensation.
可选地，所述PID调节规则包括：按公式U＝UPID(△T)+Ubest确定所述供电电压，其中，U为向所述半导体制冷片供电的供电电压，Ubest为使得所述半导体制冷片的制冷效率最高的最高效率电压，△T为所述冰箱间室的平均温度与设定的目标温度的温差，UPID(△T)为根据所述PID调节规则对所述温差进行运算得出的数值。Optionally, the PID adjustment rule includes: determining the power supply voltage according to a formula U=U PID (ΔT)+U best , where U is a power supply voltage for supplying power to the semiconductor cooling sheet, and U best is The highest efficiency voltage of the semiconductor refrigeration sheet having the highest cooling efficiency, ΔT is the temperature difference between the average temperature of the refrigerator compartment and the set target temperature, and U PID (ΔT) is the temperature difference according to the PID adjustment rule. The value obtained by the operation.
可选地，所述PID调节规则还包括：当所述平均温度与所述目标温度的温差大于等于预设的温差阈值时，使得所述供电电压等于使所述半导体制冷片产生最大制冷量的最大制冷量电压；当所述温差降低到所述温差阈值时，使得所述供电电压开始从所述最大制冷量电压下降。Optionally, the PID adjustment rule further includes: when the temperature difference between the average temperature and the target temperature is greater than or equal to a preset temperature difference threshold, so that the supply voltage is equal to causing the semiconductor refrigeration sheet to generate a maximum cooling capacity. a maximum cooling capacity voltage; when the temperature difference decreases to the temperature difference threshold, causing the supply voltage to begin to decrease from the maximum cooling capacity voltage.
可选地，所述PID调节规则还包括：当所述热端温度达到或超出预设的热端保护温度上限时，将所述供电电压设置为预设的维持电压。Optionally, the PID adjustment rule further includes: setting the supply voltage to a preset maintenance voltage when the hot end temperature reaches or exceeds a preset upper limit of the hot end protection temperature.
本发明的用于半导体冰箱的控制***由于结合半导体制冷片的热端温度、冰箱间室的平均温度及所要达到的目标温度，根据PID规则调节半导体制冷片的供电电压，从而将半导体制冷片的热端的温度列入确定半导体制冷片的供电电压的考虑因素，因此能够根据半导体制冷片的制冷特性合理调节半导体制冷片的供电电压。The control system for a semiconductor refrigerator of the present invention adjusts the supply voltage of the semiconductor refrigerating sheet according to the PID rule by combining the hot end temperature of the semiconductor refrigerating sheet, the average temperature of the inter-refrigerator compartment, and the target temperature to be achieved, thereby the semiconductor refrigerating sheet The temperature of the hot end is included in the consideration of determining the supply voltage of the semiconductor refrigerating sheet, so that the supply voltage of the semiconductor refrigerating sheet can be appropriately adjusted according to the cooling characteristics of the semiconductor refrigerating sheet.
进一步地，在本发明的控制***中，当温差大于等于预设的温差阈值时，主控模块使得供电电压等于最大制冷量电压；当温差降低到温差阈值时，主控模块使得供电电压开始从最大制冷量电压下降。因此，能够在温差较大时以较高制冷效率迅速降低温度，使得温差迅速趋于一个较小值，而且能够避免降温过快，以免降低到远低于目标温度，造成不良制冷效果。Further, in the control system of the present invention, when the temperature difference is greater than or equal to the preset temperature difference threshold, the main control module makes the supply voltage equal to the maximum cooling capacity voltage; when the temperature difference decreases to the temperature difference threshold, the main control module causes the supply voltage to start from The maximum cooling capacity voltage drops. Therefore, it is possible to rapidly lower the temperature with a higher cooling efficiency when the temperature difference is large, so that the temperature difference rapidly approaches a small value, and it is possible to avoid the temperature drop too fast, so as not to fall far below the target temperature, resulting in a poor cooling effect.
进一步地，在本发明的控制***中，在热端温度达到或超出热端保护温 度上限时，主控模块降低或保持向半导体制冷片供电的供电电压为预设的维持电压，因此能够兼顾对半导体制冷片的保护和制冷效果，即在对半导体制冷片进行保护时可继续对半导体冰箱供电，避免了对半导体冰箱的制冷效果带来过大负面影响。Further, in the control system of the present invention, the hot end temperature reaches or exceeds the hot end protection temperature. When the upper limit is reached, the main control module reduces or maintains the supply voltage for supplying power to the semiconductor cooling fin to a preset maintenance voltage, so that the protection and cooling effect of the semiconductor refrigerating sheet can be achieved, that is, the protection of the semiconductor refrigerating sheet can continue The power supply of the semiconductor refrigerator avoids the excessive negative impact on the cooling effect of the semiconductor refrigerator.
根据下文结合附图对本发明具体实施例的详细描述，本领域技术人员将会更加明了本发明的上述以及其他目的、优点和特征。The above as well as other objects, advantages and features of the present invention will become apparent to those skilled in the <
附图说明DRAWINGS
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的。附图中：Some specific embodiments of the present invention are described in detail below by way of example, and not limitation. The same reference numbers in the drawings identify the same or similar parts. Those skilled in the art should understand that the drawings are not necessarily drawn to scale. In the figure:
图1是根据本发明一个实施例的用于半导体冰箱的控制***的结构框图；1 is a block diagram showing the structure of a control system for a semiconductor refrigerator according to an embodiment of the present invention;
图2是根据本发明一个实施例的控制***的预设的控制方法的流程图；2 is a flow chart of a preset control method of a control system according to an embodiment of the present invention;
图3是根据本发明一个实施例的控制***的按照预设的控制方法以较高制冷效率快速获得最大制冷量且将半导体冰箱的冰箱间室的平均温度精确控制到设定的目标温度的示意性曲线图；3 is a schematic diagram of a control system quickly obtaining a maximum cooling capacity with a higher cooling efficiency and accurately controlling an average temperature of a refrigerator compartment of a semiconductor refrigerator to a set target temperature according to a preset control method according to an embodiment of the present invention. Sexual graph
图4是根据本发明一个实施例的控制***的按照预设的控制方法在半导体制冷片热端温度较高时对其供电电压进行控制的示意性曲线图；4 is a schematic graph showing control of a supply voltage of a control system in accordance with a preset control method when the temperature of the hot end of the semiconductor refrigerating sheet is high, according to an embodiment of the present invention;
图5是根据本发明一个实施例的半导体制冷片的供电电压与制冷效率及制冷量关系的示意性曲线图；5 is a schematic graph showing a relationship between a supply voltage of a semiconductor refrigerating sheet and a cooling efficiency and a cooling capacity according to an embodiment of the present invention;
附图中使用的附图标记如下：The reference numerals used in the drawings are as follows:
101   主控模块，101 main control module,
102   热端温度传感器，102 hot end temperature sensor,
103   间室温度传感器，103 compartment temperature sensor,
104   温度设定模块，104 temperature setting module,
105   半导体电压调节模块，105 semiconductor voltage regulation module,
106   风机驱动模块，106 fan drive module,
107   门开关检测模块，107 door switch detection module,
108   LED照明模块，108 LED lighting module,
109   电源模块， 109 power module,
110   降压模块，110 step-down module,
111   电源输入模块，111 power input module,
112   整流模块，112 rectifier module,
113   PFC模块，113 PFC module,
114   待机管理模块，114 standby management module,
201至211为所述控制方法的各个步骤，201 to 211 are the respective steps of the control method,
501   第一非经济区，501 the first non-economic zone,
502   高效区，502 high efficiency zone,
503   高制冷量区，503 high cooling capacity area,
504   第二非经济区。504 Second non-economic zone.
具体实施方式detailed description
图1是根据本发明一个实施例的用于半导体冰箱的控制***的结构框图。根据图1，该用于半导体冰箱的控制***至少可包括：主控模块101，及分别与主控模块101信号连接的热端温度传感器102、间室温度传感器103、温度设定模块104以及半导体电压调节模块105。其中，热端温度传感器102可以紧贴着半导体制冷片的热端，其可配置成检测半导体制冷片的热端温度，发出表征热端温度高低的热端温度信号。间室温度传感器103可位于半导体冰箱的冰箱间室的内部，其可配置成检测冰箱间室的平均温度，发出表征平均温度高低的间室温度信号。温度设定模块104可配置成设定冰箱间室内所要达到的目标温度，发出表征目标温度高低的目标温度信号。1 is a block diagram showing the structure of a control system for a semiconductor refrigerator in accordance with one embodiment of the present invention. According to FIG. 1, the control system for a semiconductor refrigerator may include at least: a main control module 101, and a hot end temperature sensor 102, a compartment temperature sensor 103, a temperature setting module 104, and a semiconductor respectively connected to the main control module 101. Voltage regulation module 105. The hot end temperature sensor 102 can be in close contact with the hot end of the semiconductor refrigerating sheet, and can be configured to detect the hot end temperature of the semiconductor refrigerating sheet and emit a hot end temperature signal indicative of the hot end temperature. The inter-chamber temperature sensor 103 can be located inside the refrigerator compartment of the semiconductor refrigerator, and can be configured to detect an average temperature of the inter-fridge compartment, signaling a compartment temperature that characterizes the average temperature. The temperature setting module 104 can be configured to set a target temperature to be reached in the refrigerator compartment and issue a target temperature signal indicative of the target temperature.
在图1所示的实施例中，主控模块101可配置成接收热端温度信号、间室温度信号以及目标温度信号，根据预设的PID调节规则发出半导体制冷片电压调节信号。半导体制冷片电压调节信号通过位于主控模块101和半导体电压调节模块105间的调压信号控制线传递到半导体电压调节模块105。半导体电压调节模块105可配置成接收半导体制冷片电压调节信号，并根据半导体制冷片电压调节信号，调节向半导体制冷片进行供电的供电电压。In the embodiment shown in FIG. 1, the main control module 101 can be configured to receive a hot end temperature signal, a compartment temperature signal, and a target temperature signal, and issue a semiconductor refrigerating chip voltage adjustment signal according to a preset PID adjustment rule. The semiconductor refrigerating chip voltage adjustment signal is transmitted to the semiconductor voltage regulating module 105 through a voltage regulating signal control line between the main control module 101 and the semiconductor voltage regulating module 105. The semiconductor voltage regulation module 105 is configurable to receive the semiconductor refrigeration chip voltage adjustment signal and adjust the supply voltage to supply power to the semiconductor refrigeration chip according to the semiconductor refrigeration chip voltage adjustment signal.
在本发明的一个实施例中，该用于半导体冰箱的控制***还可包括与主控模块101信号连接的风机驱动模块106。当预设的风机调节条件达成时，主控模块101发出风机调节信号，该风机调节信号传递到风机驱动模块106。风机驱动模块106接收风机调节信号后，并根据风机调节信号，控制半导体 冰箱的风机的叶轮转速。这里的控制叶轮转速可以包括使叶轮的转速为0(或者说，使风机停止工作)，也可以包括使叶轮的转速大于0(即使风机开始工作)，也可以包括降低或提升叶轮转速或者使叶轮转速为其他具体值。此处的风机可为半导体冰箱的任意风机，例如，其可以为用于将半导体制冷片的冷端所产生的冷量散布到冰箱间室中的风机，其也可以为用于为半导体制冷片的热端进行散热的风机。In one embodiment of the invention, the control system for the semiconductor refrigerator may further include a fan drive module 106 that is signally coupled to the main control module 101. When the preset fan adjustment condition is reached, the main control module 101 issues a fan adjustment signal, and the fan adjustment signal is transmitted to the fan drive module 106. After the fan drive module 106 receives the fan adjustment signal, and controls the semiconductor according to the fan adjustment signal The impeller speed of the fan of the refrigerator. The control of the impeller speed here may include making the impeller rotation speed 0 (or stopping the fan), and may also include making the impeller rotation speed greater than 0 (even if the fan starts to work), and may also include reducing or increasing the impeller rotation speed or making the impeller The speed is other specific values. The fan here may be any fan of the semiconductor refrigerator, for example, it may be a fan for spreading the cold amount generated by the cold end of the semiconductor refrigeration sheet into the refrigerator compartment, which may also be used for the semiconductor refrigeration sheet. The hot end of the fan that dissipates heat.
在本发明的另一个实施例中，该用于半导体冰箱的控制***还可包括分别与主控模块101信号连接的门开关检测模块107和LED照明模块108。门开关检测模块107检测半导体冰箱的冰箱门是否打开，在冰箱门打开时，门开关检测模块107发出门开关信号。主控模块101在接收到门开关信号后，发出LED灯开启信号。LED照明模块108接收到LED灯开启信号后，开启冰箱间室内的LED灯。In another embodiment of the present invention, the control system for the semiconductor refrigerator may further include a door switch detecting module 107 and an LED lighting module 108 that are separately coupled to the main control module 101. The door switch detecting module 107 detects whether the refrigerator door of the semiconductor refrigerator is opened, and when the refrigerator door is opened, the door switch detecting module 107 issues a door switch signal. The main control module 101 sends an LED light on signal after receiving the door switch signal. After receiving the LED light on signal, the LED lighting module 108 turns on the LED light in the refrigerator compartment.
在上述实施例中，该用于半导体冰箱的控制***可由电源模块109供电。该电源模块109可包括电源输入模块111、整流模块112、PFC模块113(或者说，功率因数补偿模块)。电源输入模块111接收外部电源提供的交流电，输出到整流模块112；整流模块112接收电源输入模块111输出的交流电，将其进行滤波后通过整流桥整流为直流电，并输出到PFC模块113；PFC模块113接收整流模块112输出的直流电，对其进行功率因数补偿后输出到降压模块110和半导体电压调节模块105。需要理解的是，PFC模块113是可关闭的，当其关闭时，输入到PFC模块113的直流电不经功率因数补偿而直接从其输出。In the above embodiment, the control system for the semiconductor refrigerator can be powered by the power module 109. The power module 109 can include a power input module 111, a rectifier module 112, and a PFC module 113 (or a power factor compensation module). The power input module 111 receives the AC power provided by the external power source, and outputs the AC power to the rectifier module 112. The rectifier module 112 receives the AC power output by the power input module 111, filters it, rectifies it into DC power through the rectifier bridge, and outputs it to the PFC module 113. The PFC module The DC output from the rectifier module 112 is received, and is subjected to power factor compensation and output to the buck module 110 and the semiconductor voltage regulation module 105. It should be understood that the PFC module 113 is closable, and when it is turned off, the direct current input to the PFC module 113 is directly outputted therefrom without power factor compensation.
因此，电压模块接收外部电源提供的交流电后，可以将其转换为直流电(可以为经功率因数补偿的直流电或未经功率因数补偿的直流电)后输出。其输出的直流电一部分直接供给到半导体电压调节模块105，此时的电压一般为310V；另一部分被用于降压的降压模块110接收后，对其降压，得到电压降低的恒定电压，并输出到上述的主控模块101、风机驱动模块106以及LED照明模块108，降压后的电压一般为12V。Therefore, after receiving the AC power provided by the external power supply, the voltage module can convert it to DC power (which can be DC power compensated or DC power without power factor compensation) and output. A part of the output DC power is directly supplied to the semiconductor voltage regulation module 105, and the voltage at this time is generally 310V; the other part is used by the step-down module 110 for step-down, and is stepped down to obtain a constant voltage with a reduced voltage, and The output to the above-mentioned main control module 101, fan drive module 106 and LED illumination module 108, the voltage after the step-down is generally 12V.
在本发明的一些实施例中，该用于半导体冰箱的控制***还可包括与主控模块101信号连接的待机管理模块114，其可以用于关闭PFC模块113。该待机管理模块114可以与恒压模块连接，由恒压模块降压后的电流可以输出到该待机管理模块114。当预设PFC模块113关闭条件成立时，主控模 块101发出关闭PFC模块信号。待机管理模块114接收关闭PFC模块信号，并可根据关闭PFC模块信号，关闭PFC模块113，使得经整流模块112整流后的直流电不经功率因数补偿，而直接从电源模块109输出。In some embodiments of the invention, the control system for the semiconductor refrigerator may further include a standby management module 114 that is signally coupled to the main control module 101, which may be used to turn off the PFC module 113. The standby management module 114 can be connected to the constant voltage module, and the current after being stepped down by the constant voltage module can be output to the standby management module 114. When the preset PFC module 113 closing condition is established, the master mode Block 101 issues a signal to turn off the PFC module. The standby management module 114 receives the signal of the PFC module, and can turn off the PFC module 113 according to the signal of the PFC module, so that the DC power rectified by the rectifier module 112 is directly output from the power module 109 without power factor compensation.
在本发明的另一些实施例中，该待机管理模块114还可以用于关闭半导体电压调节模块105。当预设半导体电压调节模块105关闭条件成立时，主控模块101发出关闭半导体电压调节模块信号。待机管理模块114接收关闭半导体电压调节模块信号，并可根据关闭半导体电压调节模块信号，关闭半导体电压调节模块105。这样，在例如热端温度传感器102检测到的热端温度高于禁止温度等不需要半导体制冷片工作的情况下，主控模块101发出关闭PFC模块信号及关闭半导体电压调节模块信号，待机管理模块114接收到这两个信号后，关闭半导体电压调节模块105和PFC模块113，以达到节能或保护半导体制冷片的效果。In other embodiments of the present invention, the standby management module 114 can also be used to turn off the semiconductor voltage regulation module 105. When the preset semiconductor voltage regulation module 105 is turned off, the main control module 101 issues a signal to turn off the semiconductor voltage regulation module. The standby management module 114 receives the signal for turning off the semiconductor voltage regulation module, and turns off the semiconductor voltage adjustment module 105 according to the signal of the semiconductor voltage adjustment module being turned off. Thus, in the case where, for example, the hot end temperature detected by the hot end temperature sensor 102 is higher than the prohibition temperature, etc., the semiconductor module is not required to operate, the main control module 101 issues a signal to turn off the PFC module and turn off the signal of the semiconductor voltage regulation module, and the standby management module After receiving the two signals, the semiconductor voltage regulation module 105 and the PFC module 113 are turned off to achieve the effect of saving energy or protecting the semiconductor refrigeration chip.
在上述实施例中，PID调节规则可以包括：按公式U＝UPID(△T)+Ubest确定供电电压，其中，U为向半导体制冷片供电的供电电压，Ubest为使得半导体制冷片的制冷效率最高的最高效率电压，△T为冰箱间室的平均温度与设定的目标温度的温差，UPID(△T)为根据PID调节规则对温差进行运算得出的数值。In the above embodiment, the PID adjustment rule may include: determining the power supply voltage according to the formula U=U PID (ΔT)+U best , where U is a power supply voltage for supplying power to the semiconductor cooling sheet, and U best is a semiconductor cooling sheet. The highest efficiency voltage with the highest cooling efficiency, ΔT is the temperature difference between the average temperature of the refrigerator compartment and the set target temperature, and U PID (ΔT) is the value obtained by calculating the temperature difference according to the PID adjustment rule.
在本发明的一个实施例中，PID调节规则还可包括：当平均温度与目标温度的温差△T大于等于预设的温差阈值时，使得供电电压等于使半导体制冷片产生最大制冷量的最大制冷量电压；当温差△T降低到温差阈值时，使得供电电压开始从最大制冷量电压下降。In an embodiment of the present invention, the PID adjustment rule may further include: when the temperature difference ΔT between the average temperature and the target temperature is greater than or equal to a preset temperature difference threshold, so that the supply voltage is equal to the maximum cooling that causes the semiconductor refrigeration sheet to generate the maximum cooling capacity. The voltage; when the temperature difference ΔT decreases to the temperature difference threshold, the supply voltage begins to decrease from the maximum cooling capacity voltage.
在本发明的另一个实施例中，PID调节规则还可包括：当热端温度达到或超出预设的热端保护温度上限时，将供电电压设置为预设的维持电压。In another embodiment of the present invention, the PID adjustment rule may further include setting the supply voltage to a preset sustain voltage when the hot end temperature reaches or exceeds a preset upper limit of the hot end protection temperature.
本发明还公开了一种用于半导体冰箱的控制方法，该控制方法可以通过对主控模块的预先设置来运用到本发明的控制***，以下将对此控制方法进行详细说明。The present invention also discloses a control method for a semiconductor refrigerator, which can be applied to the control system of the present invention by presetting the main control module, which will be described in detail below.
图2是根据本发明一个实施例的控制***的预设的控制方法的流程图。在图2所示的实施例中，该控制方法可包括：2 is a flow chart of a preset control method of a control system in accordance with one embodiment of the present invention. In the embodiment shown in FIG. 2, the control method may include:
第一数据获取步骤201，获取冰箱间室的平均温度Tr与预设的目标温度TS的温差△T，采集半导体制冷片的热端温度Thot。The first data acquisition step 201 acquires a temperature difference ΔT between the average temperature T r of the refrigerator compartment and the preset target temperature T S , and collects the hot end temperature T hot of the semiconductor refrigeration chip.
第一热端禁止温度判断步骤202，判断热端温度Thot是否达到或超出预 设的禁止温度；若热端温度Thot达到或超出禁止温度，则执行第一停止供电步骤203：将向半导体制冷片的供电电压U设置为零，停止对半导体制冷片供电，U为向半导体制冷片供电的供电电压。The first hot end prohibiting temperature determining step 202 determines whether the hot end temperature T hot reaches or exceeds the preset prohibition temperature; if the hot end temperature T hot reaches or exceeds the prohibition temperature, performing the first stop power supply step 203: to the semiconductor The supply voltage U of the cooling fin is set to zero to stop supplying power to the semiconductor cooling sheet, and U is a supply voltage for supplying power to the semiconductor cooling sheet.
热端保护温度上限判断步骤204，在热端温度Thot小于禁止温度时执行，判断热端温度Thot是否达到或超出预设的热端保护温度上限，其中热端保护温度上限小于禁止温度；若热端温度Thot小于热端保护温度上限，则执行制冷供电步骤205；The hot end protection temperature upper limit determining step 204 is performed when the hot end temperature T hot is less than the prohibition temperature, and determines whether the hot end temperature T hot reaches or exceeds a preset hot end protection temperature upper limit, wherein the hot end protection temperature upper limit is less than the prohibited temperature; If the hot end temperature T hot is less than the hot end protection temperature upper limit, the cooling power supply step 205 is performed;
制冷供电步骤205，根据预设的PID调节规则，按公式U＝UPID(△T)+Ubest确定的供电电压U向冰箱的半导体制冷片供电。The cooling power supply step 205 supplies power to the semiconductor cooling sheet of the refrigerator according to the preset PID adjustment rule according to the power supply voltage U determined by the formula U=U PID (ΔT)+U best .
第一数据获取步骤201可以具体包括：获取预设的目标温度TS，并采集冰箱间室的平均温度Tr；计算平均温度Tr与目标温度TS之间的温差△T。The first data obtaining step 201 may specifically include: acquiring a preset target temperature T S , and collecting an average temperature T r of the refrigerator compartment; and calculating a temperature difference ΔT between the average temperature T r and the target temperature T S .
在制冷供电步骤205中，Ubest为使得半导体制冷片的制冷效率最高的最高效率电压，UPID(△T)为根据PID调节规则对温差△T进行运算得出的数值。在本发明的一些实施例中，在执行制冷供电步骤205后，本发明的控制方法可以循环回第一数据获取步骤201继续执行。In the cooling power supply step 205, U best is the highest efficiency voltage that maximizes the cooling efficiency of the semiconductor refrigerating sheet, and U PID (ΔT) is a value obtained by calculating the temperature difference ΔT according to the PID adjustment rule. In some embodiments of the present invention, after performing the cooling power supply step 205, the control method of the present invention may loop back to the first data acquisition step 201 to continue execution.
需要说明的是，在本发明控制方法的其他一些实施例中，第一热端禁止温度判断步骤202至热端保护温度上限判断步骤204并不是必须的。在这样的实施例中，在第一数据获取步骤201中可以仅仅采集温差△T，而无需采集热端温度Thot；在第一数据获取步骤201执行完毕后，直接执行制冷供电步骤205。It should be noted that, in other embodiments of the control method of the present invention, the first hot end prohibition temperature determining step 202 to the hot end protection temperature upper limit determining step 204 are not necessary. In such an embodiment, only the temperature difference ΔT may be acquired in the first data acquisition step 201 without collecting the hot end temperature T hot ; after the first data acquisition step 201 is performed, the cooling power supply step 205 is directly performed.
图3是根据本发明一个实施例的控制***的按照预设的控制方法以较高制冷效率快速获得最大制冷量且将半导体冰箱的冰箱间室的平均温度精确控制到设定的目标温度的示意性曲线图。如图3所示，PID调节规则可以被设置成：当温差△T大于等于预设的温差阈值△Tthd时，使得供电电压U等于最大制冷量电压Umax-cold，这样能对热端进行迅速降温；当温差△T降低到温差阈值△Tthd时，使得供电电压U开始从最大制冷量电压Umax-cold下降，这样不再以较大的供电电压对半导体制冷片进行供电，能够避免冰箱内的温度降低到远低于预设定值的温度而造成不良制冷效果。在制冷供电步骤205中，可以按此规则对半导体制冷片进行供电。3 is a schematic diagram of a control system quickly obtaining a maximum cooling capacity with a higher cooling efficiency and accurately controlling an average temperature of a refrigerator compartment of a semiconductor refrigerator to a set target temperature according to a preset control method according to an embodiment of the present invention. Sexual graph. As shown in FIG. 3, the PID adjustment rule may be set such that when the temperature difference ΔT is greater than or equal to the preset temperature difference threshold ΔT thd , the supply voltage U is equal to the maximum cooling capacity voltage U max-cold , so that the hot end can be performed Rapid cooling; when the temperature difference ΔT decreases to the temperature difference threshold ΔT thd , the supply voltage U starts to decrease from the maximum cooling capacity voltage U max-cold , so that the semiconductor cooling chip is no longer supplied with a larger supply voltage, which can avoid The temperature inside the refrigerator is lowered to a temperature far below the preset value, resulting in poor cooling. In the refrigerating power supply step 205, the semiconductor refrigerating sheet can be powered according to this rule.
在本发明的一个实施例中，如图3所示，PID调节规则还可被设置成：当温差△T首次降低到零值后，使得供电电压U经历波动变化，以使温差△T 等于或趋于零值的供电电压U向半导体制冷片供电。在制冷供电步骤205中，可按此规则对半导体制冷片进行供电。这样能够使得供电电压U最终稳定在最高效率电压Ubest附近。In an embodiment of the present invention, as shown in FIG. 3, the PID adjustment rule may be further configured to cause the power supply voltage U to undergo a fluctuation change after the temperature difference ΔT is first reduced to a value of zero, so that the temperature difference ΔT is equal to or The supply voltage U, which tends to zero, supplies power to the semiconductor cooling fins. In the refrigerating power supply step 205, the semiconductor refrigerating sheet can be powered according to this rule. This enables the supply voltage U to finally stabilize near the highest efficiency voltage U best .
在本发明的另一个实施例中，若热端温度Thot达到或超出热端保护温度上限，则执行第一降至维持电压步骤206：降低供电电压U至预设的维持电压Ukeep。维持电压Ukeep为在环境温度过高、空气流通性差、湿度过大、温差较大等极端情况下能维持冰箱间室的平均温度Tr缓慢上升或者下降的电压，其一个目的在于尽量保证热端的温度不大于预设的热端保护温度下限。In another embodiment of the present invention, if the hot end temperature T hot reaches or exceeds the hot end protection temperature upper limit, the first down to maintain voltage step 206 is performed: lowering the supply voltage U to the preset sustain voltage U keep . The maintenance voltage U keep is a voltage that can gradually increase or decrease the average temperature T r of the refrigerator compartment in an extreme situation such as excessive ambient temperature, poor air flow, excessive humidity, and large temperature difference. One purpose is to ensure heat as much as possible. The temperature at the end is not greater than the preset lower limit of the hot end protection temperature.
在本发明的一个实施例中，在第一降至维持电压步骤206之后，依次执行第二数据获取步骤207、第二热端禁止温度判断步骤208。第二数据获取步骤207为：获取平均温度Tr与目标温度TS的温差△T，并采集热端温度Thot，第二数据获取步骤207可以具体包括：获取目标温度TS，并采集平均温度Tr；计算平均温度Tr与目标温度TS之间的温差△T。第二热端禁止温度判断步骤208为：判断热端温度Thot是否达到或超出禁止温度。In one embodiment of the invention, after the first drop to sustain voltage step 206, the second data acquisition step 207 and the second hot end disable temperature determination step 208 are performed in sequence. The second data acquisition step 207 is: acquiring the temperature difference ΔT between the average temperature T r and the target temperature T S and collecting the hot end temperature T hot . The second data obtaining step 207 may specifically include: acquiring the target temperature T S and collecting the average Temperature T r ; The temperature difference ΔT between the average temperature T r and the target temperature T S is calculated. The second hot end prohibition temperature determining step 208 is to: determine whether the hot end temperature T hot reaches or exceeds the prohibition temperature.
在第二热端禁止温度判断步骤208执行完毕后，若热端温度Thot达到或超出禁止温度，则执行第二停止供电步骤209：将向半导体制冷片的供电电压U设置为零，停止对半导体制冷片供电；若热端温度Thot小于禁止温度，则执行热端保护温度下限判断步骤210：判断热端温度Thot是否达到或低于预设的热端保护温度下限，其中热端保护温度下限小于热端保护温度上限。在执行第二停止供电步骤209后，本发明的控制方法可以循环回第二数据获取步骤207继续执行。After the second hot end prohibition temperature determination step 208 is completed, if the hot end temperature T hot reaches or exceeds the prohibition temperature, the second stop power supply step 209 is performed: the supply voltage U to the semiconductor refrigeration chip is set to zero, and the pair is stopped. If the hot end temperature T hot is less than the prohibition temperature, the hot end protection temperature lower limit determination step 210 is performed: determining whether the hot end temperature T hot is lower than or lower than a preset hot end protection temperature lower limit, wherein the hot end protection The lower temperature limit is less than the upper limit of the hot end protection temperature. After performing the second power-off step 209, the control method of the present invention can loop back to the second data acquisition step 207 to continue execution.
在热端保护温度下限判断步骤210执行完毕后，若热端温度Thot达到或低于热端保护温度下限，则执行制冷供电步骤205；若热端温度Thot大于热端保护温度下限，则执行第二降至维持电压步骤211：降低或保持供电电压U至维持电压Ukeep。这样在热端温度较高，但尚未足以达到停止对半导体制冷片供电的条件时，以较低的供电电压U满足冰箱的制冷量，也使得半导体制冷片的热端温度下降，从而在不停止制冷的情况下保护半导体制冷片。在执行第二降至维持电压步骤211后，本发明的控制方法可循环回第二数据获取步骤207继续执行。After the hot end protection temperature lower limit determining step 210 is completed, if the hot end temperature T hot reaches or falls below the hot end protection temperature lower limit, the cooling power supply step 205 is performed; if the hot end temperature T hot is greater than the hot end protection temperature lower limit, then Performing a second drop to the sustain voltage step 211: lowering or maintaining the supply voltage U to the sustain voltage U keep . Thus, when the temperature at the hot end is high, but it is not enough to stop the supply of the semiconductor refrigerating sheet, the lower supply voltage U satisfies the cooling capacity of the refrigerator, and the temperature of the hot end of the semiconductor refrigerating sheet is lowered, thereby not stopping. The semiconductor refrigerating sheet is protected in the case of cooling. After performing the second down to maintain voltage step 211, the control method of the present invention may loop back to the second data acquisition step 207 to continue execution.
图4是根据本发明一个实施例的控制***的按照预设的控制方法在半导体制冷片热端温度较高时对其供电电压进行控制的示意性曲线图。在图4 所示实施例中，在例如环境温度过高、空气流通性差、湿度过大、温差△T大于等于预设的温差阈值△Tthd等冰箱需要大的制冷量的情况下，以最大制冷量电压Umax-cold为供电电压，使得半导体制冷片的冷端较快制冷，热端温度Thot由一个低值逐渐升高到热端保护温度上限。在此过程中，不断进行热端保护温度上限判断步骤204。在热端保护温度上限判断步骤204的判定为达到或超出热端保护温度上限时，如图4所示，执行第一降至维持电压步骤206，使得供电电压U降低至维持电压Ukeep。由于供电电压U下降了，热端温度Thot也下降，在此过程中，依次执行第二数据获取步骤207、第二热端禁止温度判断步骤208。如图4所示，热端温度Thot并没有超过禁止温度，因此第二热端禁止温度判断步骤208的判定始终为否，根据前述方法，执行热端保护温度下限判断步骤210。当热端温度Thot达到热端保护温度下限，则执行制冷供电步骤205。由图4可以看出，若此时温差△T大于温差阈值△Tthd，则根据PID调节规则得到的供电电压U可为最大制冷量电压Umax-cold。重复上述过程，直至冰箱间室的平均温度△T小于温差阈值△Tthd后开始按PID调节规则降低电压。如前文，当这两个温度之间的温差△T降低到预设的温差阈值△Tthd内时，供电电压可为低于最大制冷量电压Umax-cold的某个值；然后，当温差△T首次降低到零值后，使得供电电压经历波动变化，以使温差△T等于或趋于零值的供电电压向半导体制冷片供电。4 is a schematic graph showing control of a supply voltage of a semiconductor refrigeration chip at a high temperature in accordance with a preset control method according to an embodiment of the present invention. In the embodiment shown in FIG. 4, for example, if the ambient temperature is too high, the air flow is poor, the humidity is too large, and the temperature difference ΔT is greater than or equal to the preset temperature difference threshold ΔT thd, etc., the refrigerator needs a large cooling capacity to maximize The cooling capacity voltage U max-cold is the supply voltage, so that the cold end of the semiconductor refrigeration chip is cooled faster, and the hot end temperature T hot is gradually increased from a low value to an upper limit of the hot end protection temperature. During this process, the hot end protection temperature upper limit determination step 204 is continuously performed. When the hot end protection temperature upper limit determining step 204 determines that the hot end protection temperature upper limit is reached or exceeded, as shown in FIG. 4, the first down to maintain voltage step 206 is performed such that the supply voltage U is lowered to the sustain voltage U keep . Since the supply voltage U drops, the hot end temperature T hot also decreases. In the process, the second data acquisition step 207 and the second hot end prohibition temperature determination step 208 are sequentially performed. As shown in FIG. 4, the hot end temperature T hot does not exceed the prohibition temperature, so the determination of the second hot end prohibition temperature determination step 208 is always negative, and according to the aforementioned method, the hot end protection temperature lower limit determination step 210 is performed. When the hot end temperature T hot reaches the lower limit of the hot end protection temperature, the cooling power supply step 205 is performed. As can be seen from FIG. 4, if the temperature difference ΔT is greater than the temperature difference threshold ΔT thd at this time, the power supply voltage U obtained according to the PID adjustment rule may be the maximum cooling capacity voltage U max-cold . The above process is repeated until the average temperature ΔT of the inter-refrigerator compartment is less than the temperature difference threshold ΔT thd and the voltage is lowered according to the PID adjustment rule. As before, when the temperature difference ΔT between the two temperatures is lowered to the preset temperature difference threshold ΔT thd , the supply voltage may be a value lower than the maximum cooling capacity voltage U max-cold ; then, when the temperature difference is After ΔT is first lowered to a value of zero, the supply voltage is subjected to a fluctuating change so that the supply voltage of the temperature difference ΔT equal to or tending to zero value supplies power to the semiconductor refrigerating sheet.
图5是根据本发明一个实施例的半导体制冷片的供电电压与制冷效率及制冷量关系的示意性曲线图。如图5所示，根据供电电压U与制冷效率的关系，可将供电电压U划分为4个区域：第一非经济区501(即供电电压U在0至Umin之间的区域)、高效区502(即供电电压U在Umin至Un之间的区域)、高制冷量区503(即供电电压U在Un至Umax之间的区域)、第二非经济区504(即供电电压U大于Umax的区域)。第一非经济区501的制冷量非常小，基本上不能满足冰箱的最低制冷需求；第二非经济区504中虽然半导体的制冷量本身可能满足冰箱的最低制冷需求，但是由于此区域所需的供电电压U高，功耗要比高效区502和高制冷量区503高很多；因此在本发明的实施例中，不使用第一非经济区501和第二非经济区504的供电电压U为半导体制冷片供电，而是使半导体制冷片的供电电压U位于高效区502和高制冷量区503。也就是说，在本发明的实施例中，将根据对半导体制冷冰箱制冷效率的要求，根据实验确定所用半导体制冷片供电电压U 的最大值(即最大供电电压Umax)和最小值(即最小供电电压Umin)，使半导体制冷片的工作电压位于这两个值所限定的高效区502和高制冷量区503内。Fig. 5 is a schematic graph showing the relationship between the supply voltage of the semiconductor refrigerating sheet and the cooling efficiency and the cooling capacity according to an embodiment of the present invention. As shown in FIG. 5, according to the relationship between the supply voltage U and the cooling efficiency, the supply voltage U can be divided into four regions: the first non-economic zone 501 (ie, the region where the supply voltage U is between 0 and U min ), and efficient. a region 502 (ie, a region where the supply voltage U is between U min and U n ), a high cooling capacity region 503 (ie, a region where the supply voltage U is between U n and U max ), and a second non-economic region 504 (ie, a power supply) The voltage U is larger than the area of U max ). The cooling capacity of the first non-economic zone 501 is very small, and basically cannot meet the minimum cooling demand of the refrigerator; although the cooling capacity of the semiconductor itself in the second non-economic zone 504 may satisfy the minimum cooling demand of the refrigerator, The power supply voltage U is high, and the power consumption is much higher than the high efficiency area 502 and the high cooling capacity area 503; therefore, in the embodiment of the present invention, the power supply voltage U of the first non-economy area 501 and the second non-economy area 504 is not used. The semiconductor refrigerating sheet supplies power, and the supply voltage U of the semiconductor refrigerating sheet is placed in the high efficiency region 502 and the high cooling capacity region 503. That is, in the embodiment of the present invention, the maximum value (ie, the maximum supply voltage U max ) and the minimum value (ie, the minimum) of the supply voltage U of the semiconductor refrigerating chip used will be determined experimentally according to the requirements for the cooling efficiency of the semiconductor refrigerating refrigerator. The supply voltage U min ) causes the operating voltage of the semiconductor cooling fin to be located in the high efficiency region 502 and the high cooling capacity region 503 defined by the two values.
如图5所示，最大供电电压Umax可通过实验选取为最大制冷量电压Umax-cold，即：可将本发明中的PID调节规则设置成使其在前文的公式中使得供电电压U的最大值被确定为最大制冷量电压Umax-cold，也就是说，UPID(△T)在△T大于温差阈值△Tthd时被赋值限定为最大制冷量电压Umax-cold减最高效率电压Ubest。As shown in FIG. 5, the maximum supply voltage U max can be experimentally selected as the maximum cooling capacity voltage U max-cold , that is, the PID adjustment rule in the present invention can be set such that it makes the supply voltage U in the above formula. The maximum value is determined as the maximum cooling capacity voltage U max-cold , that is, U PID (ΔT) is assigned to the maximum cooling capacity voltage U max-cold minus the highest efficiency voltage when ΔT is greater than the temperature difference threshold ΔT thd U best .
也如图5所示，最小供电电压Umin可通过实验选取为第一非经济区501与高效区502划界的供电电压U，即最小制冷量电压Umin-cold。类似地，可将本发明实施例中的PID调节规则设置成使其在前文的公式中使得供电电压U的最小值被确定为最小制冷量电压Umin-cold。也就是说，UPID(△T)在△T小于一定阈值时可被赋值限定为最小制冷量电压Umin-cold减最高效率电压Ubest(此时计算出的电压数值为一负值)。在本发明的一些替代性实施例中，最小供电电压Umin也可略低于满足冰箱最小制冷量电压Umin-cold。As also shown in FIG. 5, the minimum supply voltage Umin can be experimentally selected as the supply voltage U bounded by the first non-economic zone 501 and the high efficiency zone 502, that is, the minimum cooling capacity voltage Umin-cold . Similarly, the PID adjustment rule in the embodiment of the present invention can be set such that the minimum value of the supply voltage U is determined as the minimum cooling capacity voltage U min-cold in the above formula. That is to say, U PID (ΔT) can be assigned to the minimum cooling capacity voltage U min-cold minus the highest efficiency voltage U best when ΔT is less than a certain threshold (the calculated voltage value is a negative value at this time). In some alternative embodiments of the invention, the minimum supply voltage Umin may also be slightly lower than the minimum cooling capacity voltage Umin-cold of the refrigerator.
此外，如本领域技术人员根据图5可认识到的，最高效率电压Ubest可经实验得到，其值显然处于最大制冷量电压Umax-cold和最小制冷量电压Umin-cold之间。Furthermore, as can be appreciated by those skilled in the art in accordance with FIG. 5, the highest efficiency voltage U best can be experimentally obtained, the value of which is apparently between the maximum cooling capacity voltage U max-cold and the minimum cooling capacity voltage U min-cold .
需要理解的是，维持电压Ukeep通常可在最小供电电压Umin与最高效率电压Ubest间取值。在本发明的一些实施例中，维持电压Ukeep的选取原则是考虑在冰箱处在环境温度过高、空气流通性差、湿度过大、温差较大等极端情况下时，使冰箱内的温度还能较快地降到最低到设定温度。被选取的维持电压Ukeep的值是在这些极端情况下，通过模拟实验得出，这个值与Umax-cold的差值不是很大。It should be understood that the sustain voltage U keep can generally take a value between the minimum supply voltage U min and the highest efficiency voltage U best . In some embodiments of the present invention, the selection principle of the maintenance voltage U keep is to consider the temperature in the refrigerator when the refrigerator is in an extreme situation such as excessive ambient temperature, poor air flow, excessive humidity, and large temperature difference. It can be quickly reduced to the set temperature. The value of the selected sustain voltage U keep is that, in these extreme cases, it is found by simulation that the difference between this value and U max-cold is not very large.
至此，本领域技术人员应认识到，虽然本文已详尽示出和描述了本发明的多个示例性实施例，但是，在不脱离本发明精神和范围的情况下，仍可根据本发明公开的内容直接确定或推导出符合本发明原理的许多其他变型或修改，例如适当改变微波检测装置的安装位置。因此，本发明的范围应被理解和认定为覆盖了所有这些其他变型或修改。 In this regard, it will be appreciated by those skilled in the <RTIgt;the</RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The content directly determines or derives many other variations or modifications consistent with the principles of the invention, such as appropriately changing the mounting location of the microwave detecting device. Therefore, the scope of the invention should be understood and construed as covering all such other modifications or modifications.

Claims (10)

  1. 一种用于半导体冰箱的控制***，包括：A control system for a semiconductor refrigerator, comprising:
    热端温度传感器，配置成检测所述半导体冰箱的半导体制冷片的热端温度，发出表征所述热端温度高低的热端温度信号；a hot end temperature sensor configured to detect a hot end temperature of the semiconductor refrigerating sheet of the semiconductor refrigerator, and emit a hot end temperature signal indicative of a temperature of the hot end;
    间室温度传感器，配置成检测所述半导体冰箱的冰箱间室的平均温度，发出表征所述平均温度高低的间室温度信号；a compartment temperature sensor configured to detect an average temperature of a refrigerator compartment of the semiconductor refrigerator, and emit a compartment temperature signal indicative of the average temperature;
    温度设定模块，配置成设定所述冰箱间室内所要达到的目标温度，发出表征所述目标温度高低的目标温度信号；a temperature setting module configured to set a target temperature to be reached in the refrigerator compartment, and to generate a target temperature signal indicative of the target temperature;
    主控模块，配置成接收所述热端温度信号、所述间室温度信号以及所述目标温度信号，根据预设的PID调节规则发出半导体制冷片电压调节信号；以及The main control module is configured to receive the hot end temperature signal, the inter-cell temperature signal, and the target temperature signal, and issue a semiconductor refrigerating chip voltage adjustment signal according to a preset PID adjustment rule;
    半导体电压调节模块，配置成接收所述半导体制冷片电压调节信号，并根据所述半导体制冷片电压调节信号，调节向所述半导体制冷片进行供电的供电电压。The semiconductor voltage regulation module is configured to receive the semiconductor refrigeration chip voltage adjustment signal, and adjust a supply voltage for supplying power to the semiconductor refrigeration chip according to the semiconductor refrigeration chip voltage adjustment signal.
  2. 根据权利要求1所述的控制***，其中The control system of claim 1 wherein
    所述主控模块还配置成：根据预设的风机调节条件发出风机调节信号；The main control module is further configured to: issue a fan adjustment signal according to a preset fan adjustment condition;
    所述控制***还包括：The control system further includes:
    风机驱动模块，配置成接收所述风机调节信号，并根据所述风机调节信号，控制所述半导体冰箱的风机的叶轮转速；a fan drive module configured to receive the fan adjustment signal and control an impeller rotation speed of a fan of the semiconductor refrigerator according to the fan adjustment signal;
    所述风机配置成：将所述半导体制冷片的冷端所产生的冷量散布到所述冰箱间室中，和/或为所述半导体制冷片的热端进行散热。The fan is configured to disperse a cooling amount generated by a cold end of the semiconductor refrigerating sheet into the refrigerator compartment, and/or to dissipate heat from a hot end of the semiconductor refrigerating sheet.
  3. 根据权利要求2所述的控制***，还包括门开关检测模块和LED照明模块，其中The control system of claim 2 further comprising a door switch detection module and an LED illumination module, wherein
    所述门开关检测模块配置成：检测所述半导体冰箱的冰箱门是否打开，在所述冰箱门打开时，发出门开关信号；The door switch detecting module is configured to: detect whether a refrigerator door of the semiconductor refrigerator is opened, and issue a door switch signal when the refrigerator door is opened;
    所述主控模块还配置成：在接收到所述门开关信号后，发出LED灯开启信号；The main control module is further configured to: after receiving the door switch signal, issue an LED light on signal;
    所述LED照明模块配制成：在接收到所述LED灯开启信号后，开启所述冰箱间室内的LED灯。 The LED lighting module is configured to: after receiving the LED light on signal, turn on the LED light in the refrigerator compartment.
  4. 根据权利要求3所述的控制***，还包括电源模块和降压模块，其中The control system of claim 3 further comprising a power module and a buck module, wherein
    所述电源模块配置成：接收外部电源提供的交流电，将其转换为直流电后输出到所述降压模块和所述半导体电压调节模块；The power module is configured to: receive an alternating current provided by an external power source, convert it into direct current power, and output the same to the buck module and the semiconductor voltage regulating module;
    所述降压模块配置成：接收所述电源模块输出的直流电并对其降压后输出到所述主控模块、所述风机驱动模块以及所述LED照明模块。The step-down module is configured to: receive the DC power output by the power module and step down the output to the main control module, the fan drive module, and the LED illumination module.
  5. 根据权利要求4所述的控制***，其中所述电源模块包括电源输入模块、整流模块、PFC模块，其中The control system according to claim 4, wherein said power module comprises a power input module, a rectifier module, and a PFC module, wherein
    所述电源输入模块配置成：接收所述外部电源提供的所述交流电，输出到所述整流模块；The power input module is configured to: receive the alternating current provided by the external power source, and output the same to the rectifier module;
    所述整流模块配置成：接收所述电源输入模块输出的交流电，将其进行滤波后整流为直流电，并输出到所述PFC模块；The rectifier module is configured to: receive the alternating current output by the power input module, filter it, rectify it into direct current, and output it to the PFC module;
    PFC模块配置成：接收所述整流模块输出的直流电，对其进行功率因数补偿后输出到所述降压模块和所述半导体电压调节模块。The PFC module is configured to receive the DC power output by the rectifier module, perform power factor compensation on the power module, and output the power to the buck module and the semiconductor voltage regulation module.
  6. 根据权利要求5所述的控制***，其中The control system according to claim 5, wherein
    所述主控模块还配置成：根据预设半导体电压调节模块关闭条件，发出关闭半导体电压调节模块信号；The main control module is further configured to: issue a signal for turning off the semiconductor voltage regulation module according to a preset semiconductor voltage regulation module off condition;
    所述控制***还包括：The control system further includes:
    待机管理模块，配置成接收所述关闭半导体电压调节模块信号，并根据所述关闭半导体电压调节模块信号，关闭所述半导体电压调节模块。The standby management module is configured to receive the shutdown semiconductor voltage regulation module signal, and turn off the semiconductor voltage adjustment module according to the closing the semiconductor voltage regulation module signal.
  7. 根据权利要求6所述的控制***，其中The control system of claim 6 wherein
    所述主控模块还配置成：根据预设的PFC模块关闭条件，发出关闭PFC模块信号；The main control module is further configured to: issue a signal for turning off the PFC module according to a preset PFC module shutdown condition;
    所述待机管理模块还配置成：接收所述关闭PFC模块信号，并根据所述关闭PFC模块信号，关闭所述PFC模块，使得经所述整流模块整流后的直流电不经功率因数补偿，而直接从电源模块输出。The standby management module is further configured to: receive the signal of the PFC module to be turned off, and close the PFC module according to the signal of the PFC module, so that the DC power rectified by the rectifier module is not compensated by power factor, but directly Output from the power module.
  8. 根据权利要求1-7中任一项所述的控制***，其中 A control system according to any one of claims 1-7, wherein
    所述PID调节规则包括：按公式U＝UPID(△T)+Ubest确定所述供电电压，其中，U为向所述半导体制冷片供电的供电电压，Ubest为使得所述半导体制冷片的制冷效率最高的最高效率电压，△T为所述冰箱间室的平均温度与设定的目标温度的温差，UPID(△T)为根据所述PID调节规则对所述温差进行运算得出的数值。The PID adjustment rule includes: determining the supply voltage according to a formula U=U PID (ΔT)+U best , where U is a supply voltage for supplying power to the semiconductor cooling sheet, and U best is to make the semiconductor refrigeration sheet The highest efficiency voltage with the highest cooling efficiency, ΔT is the temperature difference between the average temperature of the refrigerator compartment and the set target temperature, and U PID (ΔT) is calculated by calculating the temperature difference according to the PID adjustment rule. The value.
  9. 根据权利要求8所述的控制***，其中所述PID调节规则还包括：The control system of claim 8 wherein said PID adjustment rules further comprise:
    当所述平均温度与所述目标温度的温差大于等于预设的温差阈值时，使得所述供电电压等于使所述半导体制冷片产生最大制冷量的最大制冷量电压；When the temperature difference between the average temperature and the target temperature is greater than or equal to a preset temperature difference threshold, the power supply voltage is made equal to a maximum cooling capacity voltage that causes the semiconductor cooling fin to generate a maximum cooling capacity;
    当所述温差降低到所述温差阈值时，使得所述供电电压开始从所述最大制冷量电压下降。When the temperature difference decreases to the temperature difference threshold, the supply voltage begins to decrease from the maximum cooling capacity voltage.
  10. 根据权利要求8所述的控制***，其中所述PID调节规则还包括：The control system of claim 8 wherein said PID adjustment rules further comprise:
    当所述热端温度达到或超出预设的热端保护温度上限时，将所述供电电压设置为预设的维持电压。 When the hot end temperature reaches or exceeds a preset upper limit of the hot end protection temperature, the supply voltage is set to a preset sustain voltage.
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