CN113865054B - Heat dissipation control method and device of air conditioner and air conditioner - Google Patents
Heat dissipation control method and device of air conditioner and air conditioner Download PDFInfo
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- CN113865054B CN113865054B CN202111178139.1A CN202111178139A CN113865054B CN 113865054 B CN113865054 B CN 113865054B CN 202111178139 A CN202111178139 A CN 202111178139A CN 113865054 B CN113865054 B CN 113865054B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 111
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000006243 chemical reaction Methods 0.000 claims abstract description 195
- 238000005057 refrigeration Methods 0.000 claims abstract description 128
- 239000004065 semiconductor Substances 0.000 claims abstract description 101
- 230000005494 condensation Effects 0.000 claims abstract description 65
- 238000009833 condensation Methods 0.000 claims abstract description 65
- 238000012546 transfer Methods 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims description 22
- 238000004590 computer program Methods 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 238000013021 overheating Methods 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 5
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/64—Electronic processing using pre-stored data
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/65—Electronic processing for selecting an operating mode
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
- F24F2110/10—Temperature
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Abstract
The invention discloses a heat dissipation control method and a heat dissipation control device of an air conditioner and the air conditioner, wherein the air conditioner comprises a frequency conversion module and a heat dissipation device, the heat dissipation device comprises a semiconductor refrigeration module, the semiconductor refrigeration module comprises a cold end and a hot end, and the cold end is adjacent to the frequency conversion module so as to transfer heat of the frequency conversion module to the hot end; the method comprises the steps of obtaining a first temperature parameter of the frequency conversion module; when the first temperature parameter is larger than a preset starting temperature threshold value of the frequency conversion module, controlling the frequency conversion module to be in a closed state, and controlling the semiconductor refrigeration module to be in a working state; acquiring a second temperature parameter of the frequency conversion module, and acquiring a current condensation temperature parameter; and when the second temperature parameter is less than or equal to the condensation temperature parameter, controlling the semiconductor refrigeration module to be closed. The invention can realize the quick heat dissipation of the frequency conversion module and simultaneously can prevent the frequency conversion module from condensation caused by over-low temperature.
Description
Technical Field
The invention relates to the technical field of air conditioners, in particular to a heat dissipation control method and a heat dissipation control device of an air conditioner and the air conditioner.
Background
Due to the characteristics of high energy efficiency, comfort and the like, the variable frequency air conditioner is increasingly becoming the mainstream of the market. The frequency conversion module is a core device in the outdoor unit of the frequency conversion air conditioner, and the heat dissipation quality of the frequency conversion module is directly related to the working performance and reliability of the frequency conversion air conditioner. For example, in high temperature weather in summer, the outdoor unit is often exposed to the sun, so that the overall temperature of the outdoor unit is very high (up to 80 ℃), and if a user starts the cooling mode of the air conditioner at this time, the inverter module is easily burned out due to overheating when the air conditioner is turned on. In order to solve the heat dissipation problem of the frequency conversion module, an aluminum fin radiator is often installed on the frequency conversion module in the related art, but the heat dissipation efficiency of the aluminum fin radiator is low, and the heat dissipation is not ideal under the high-temperature condition.
Disclosure of Invention
The invention mainly aims to provide a heat dissipation control method and a heat dissipation control device of an air conditioner and the air conditioner, so as to improve the heat dissipation efficiency and the heat dissipation reliability of a frequency conversion module.
In a first aspect, an embodiment of the present invention provides a heat dissipation control method for an air conditioner, which is applied to an air conditioner, where the air conditioner 100 includes an inverter module and a heat dissipation device, the heat dissipation device includes a semiconductor refrigeration module, the semiconductor refrigeration module includes a cold end and a hot end, and the cold end is adjacent to the inverter module to transfer heat of the inverter module to the hot end;
the heat dissipation control method comprises the following steps:
responding to a received refrigeration operation instruction of a user, and acquiring a first temperature parameter of the frequency conversion module;
when the first temperature parameter is larger than a preset starting temperature threshold value of the frequency conversion module, controlling the frequency conversion module to be in a closed state, and controlling the semiconductor refrigeration module to be in a working state;
acquiring a second temperature parameter of the frequency conversion module;
acquiring a current condensation temperature parameter;
and when the second temperature parameter is less than or equal to the condensation temperature parameter, controlling the semiconductor refrigeration module to be closed.
The heat dissipation control method of the air conditioner provided by the embodiment of the invention at least has the following beneficial technical effects:
when a refrigeration operation instruction of a user is received, the current temperature of a frequency conversion module is detected to obtain a first temperature parameter; then compare first temperature parameter and predetermined frequency conversion module start temperature threshold value, if first temperature parameter is greater than predetermined frequency conversion module start temperature threshold value, then control frequency conversion module is in the off-state in order to avoid frequency conversion module to burn out because of overheated, starts the semiconductor refrigeration module among the heat abstractor simultaneously, compares traditional aluminium fin radiator, utilizes semiconductor refrigeration module to dispel the heat and can obtain higher radiating efficiency for when the air conditioner starts the refrigeration mode under the high temperature condition, realize frequency conversion module's quick heat dissipation, avoid influencing air conditioner performance and reliability of operation because of frequency conversion module temperature is too high. After the semiconductor refrigeration module is started, the current temperature of the frequency conversion module is continuously detected to obtain a second temperature parameter, and if the second temperature parameter is less than or equal to the current condensation temperature parameter, the semiconductor refrigeration module is controlled to be closed, so that the frequency conversion module is prevented from generating too large temperature difference with the ambient temperature due to too low temperature, a large amount of condensation water is generated on the frequency conversion module, and further accidents such as short circuit and open circuit of a circuit board in an outdoor unit due to the condensation water are prevented.
According to the heat dissipation control method of the air conditioner according to some embodiments of the present invention, the obtaining the current condensation temperature parameter includes:
acquiring a current environment temperature parameter and an environment humidity parameter;
and acquiring a current condensation temperature parameter according to the environment temperature parameter and the environment humidity parameter.
Because different temperatures and humidities correspond to different condensation temperatures, the embodiment of the invention obtains the current condensation temperature parameter based on the currently acquired environmental temperature parameter and environmental humidity parameter.
According to some embodiments of the present invention, a heat dissipation control method of an air conditioner further includes:
and when the second temperature parameter is less than or equal to a preset frequency conversion module starting temperature threshold value, controlling the frequency conversion module to be in a working state so as to enable the air conditioner to operate in a refrigeration mode.
Along with the starting of the semiconductor refrigeration module and the temperature reduction of the frequency conversion module, if the second temperature parameter of the frequency conversion module is less than or equal to the preset starting temperature threshold value of the frequency conversion module, the frequency conversion module can be controlled to be started, so that the air conditioner enters a refrigeration working state, and if not, the closing state of the frequency conversion module is kept so as to prevent the frequency conversion module from being burnt out due to overheating.
According to the heat dissipation control method of the air conditioner in some embodiments of the present invention, the heat dissipation device further comprises a heat dissipation fan, the heat dissipation fan being adjacent to the hot end of the semiconductor refrigeration module;
the heat dissipation control method further includes one of:
when the semiconductor refrigeration module is controlled to be in a working state, the cooling fan is also controlled to be in a working state;
and when the semiconductor refrigeration module is controlled to be closed, the cooling fan is also controlled to be closed.
Therefore, the heat radiating fan is arranged at the hot end of the semiconductor refrigeration module, so that heat concentrated at the hot end can be quickly diffused to the outside air, the heat conducting performance of the semiconductor refrigeration module is enhanced, and the heat radiating efficiency is further accelerated. And when the semiconductor refrigeration module is closed, the cooling fan is controlled to be closed at the same time.
In a second aspect, an embodiment of the present invention provides an air conditioner, where the air conditioner includes an inverter module, a heat dissipation device, and a control device, where the heat dissipation device includes a semiconductor refrigeration module, the semiconductor refrigeration module includes a cold end and a hot end, and the cold end is adjacent to the inverter module to transfer heat of the inverter module to the hot end;
the control device is used for:
responding to a received refrigeration operation instruction of a user, and acquiring a first temperature parameter of the frequency conversion module;
when the first temperature parameter is larger than a preset starting temperature threshold value of the frequency conversion module, controlling the frequency conversion module to be in a closed state, and controlling the semiconductor refrigeration module to be in a working state;
acquiring a second temperature parameter of the frequency conversion module;
acquiring a current condensation temperature parameter;
and when the second temperature parameter is less than or equal to the condensation temperature parameter, controlling the semiconductor refrigeration module to be closed.
The air conditioner provided by the embodiment of the invention at least has the following beneficial technical effects:
when a refrigeration operation instruction of a user is received, the current temperature of a frequency conversion module is detected to obtain a first temperature parameter; then compare first temperature parameter and predetermined frequency conversion module start temperature threshold value, if first temperature parameter is greater than predetermined frequency conversion module start temperature threshold value, then control frequency conversion module is in the off-state in order to avoid frequency conversion module to burn out because of overheated, starts the semiconductor refrigeration module among the heat abstractor simultaneously, compares traditional aluminium fin radiator, utilizes semiconductor refrigeration module to dispel the heat and can obtain higher heat dissipation efficiency for when the air conditioner starts the refrigeration mode under the high temperature condition, realize frequency conversion module's quick heat dissipation, avoid influencing air conditioner performance and reliability because of frequency conversion module temperature is too high. After the semiconductor refrigeration module is started, the current temperature of the frequency conversion module is continuously detected to obtain a second temperature parameter, and if the second temperature parameter is less than or equal to the current condensation temperature parameter, the semiconductor refrigeration module is controlled to be closed, so that the frequency conversion module is prevented from generating too large temperature difference with the ambient temperature due to too low temperature, a large amount of condensation water is generated on the frequency conversion module, and further accidents such as short circuit and open circuit of a circuit board in an outdoor unit due to the condensation water are prevented.
According to the air conditioner of some embodiments of the present invention, the control device is further configured to:
acquiring a current environment temperature parameter and an environment humidity parameter;
and acquiring a current condensation temperature parameter according to the environment temperature parameter and the environment humidity parameter.
Because different temperatures and humidities correspond to different condensation temperatures, the embodiment of the invention obtains the current condensation temperature parameter based on the currently acquired environmental temperature parameter and environmental humidity parameter.
According to the air conditioner of some embodiments of the present invention, the control device is further configured to:
and when the second temperature parameter is less than or equal to a preset frequency conversion module starting temperature threshold value, controlling the frequency conversion module to be in a working state so as to enable the air conditioner to operate in a refrigeration mode.
Along with the starting of the semiconductor refrigeration module and the temperature reduction of the frequency conversion module, if the second temperature parameter of the frequency conversion module is less than or equal to the preset starting temperature threshold value of the frequency conversion module, the frequency conversion module can be controlled to be started, so that the air conditioner enters a refrigeration working state, and if not, the closing state of the frequency conversion module is kept so as to prevent the frequency conversion module from being burnt out due to overheating.
According to the air conditioner of some embodiments of the present invention, the heat dissipation device further comprises a heat dissipation fan, the heat dissipation fan is adjacent to the hot end of the semiconductor refrigeration module;
the air conditioner is further configured to:
when the semiconductor refrigeration module is controlled to be in a working state, the heat radiation fan is also controlled to be in a working state; or,
and when the semiconductor refrigeration module is controlled to be closed, the cooling fan is also controlled to be closed.
Therefore, the heat radiating fan is arranged at the hot end of the semiconductor refrigeration module, and the air blown out by the heat radiating fan is utilized to accelerate the diffusion of the heat on the surface of the hot end, so that the heat conducting performance of the semiconductor refrigeration module is enhanced, and the heat radiating efficiency is further accelerated. And when the semiconductor refrigeration module is closed, the cooling fan is controlled to be closed at the same time.
According to the air conditioner provided by some embodiments of the invention, the heat dissipation device further comprises a fin radiator, and the fin radiator is arranged between the cold end of the semiconductor refrigeration module and the frequency conversion module.
On one hand, the heat generated by the frequency conversion module is quickly transferred to the cold end of the semiconductor refrigeration module by utilizing the high-efficiency heat conductivity of the finned radiator, so that the cold end absorbs the heat of the frequency conversion module; on the other hand, the finned radiator can assist in quickly diffusing heat generated by the frequency conversion module to the outside air, so that the heat dissipation efficiency of the heat dissipation device is improved.
In a third aspect, an embodiment of the present invention provides a control apparatus, including: memory, a processor and a computer program stored on the memory and executable on the processor, the computer program when executed being adapted to perform a method as described in any one of the embodiments of the first aspect.
The control device provided by the embodiment of the invention at least has the following beneficial technical effects: when a refrigeration operation instruction of a user is received, the current temperature of a frequency conversion module is detected to obtain a first temperature parameter; then compare first temperature parameter and predetermined frequency conversion module start temperature threshold value, if first temperature parameter is greater than predetermined frequency conversion module start temperature threshold value, then control frequency conversion module is in the off-state in order to avoid frequency conversion module to burn out because of overheated, starts the semiconductor refrigeration module among the heat abstractor simultaneously, compares traditional aluminium fin radiator, utilizes semiconductor refrigeration module to dispel the heat and can obtain higher heat dissipation efficiency for when the air conditioner starts the refrigeration mode under the high temperature condition, realize frequency conversion module's quick heat dissipation, avoid influencing air conditioner performance and reliability because of frequency conversion module temperature is too high. After the semiconductor refrigeration module is started, the current temperature of the frequency conversion module is continuously detected to obtain a second temperature parameter, and if the second temperature parameter is smaller than or equal to the current condensation temperature parameter, the semiconductor refrigeration module is controlled to be closed, so that the frequency conversion module is prevented from generating too large temperature difference with the ambient temperature due to too low temperature, a large amount of condensation water is generated on the frequency conversion module, and accidents such as short circuit and open circuit of a circuit board in an outdoor unit due to the condensation water are further prevented.
In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, where computer-executable instructions are stored, and when executed by a processor, implement the heat dissipation control method described in any one of the embodiments of the first aspect.
When a refrigerating operation instruction of a user is received, the current temperature of a frequency conversion module is detected to obtain a first temperature parameter; then compare first temperature parameter and predetermined frequency conversion module start temperature threshold value, if first temperature parameter is greater than predetermined frequency conversion module start temperature threshold value, then control frequency conversion module is in the off-state in order to avoid frequency conversion module to burn out because of overheated, starts the semiconductor refrigeration module among the heat abstractor simultaneously, compares traditional aluminium fin radiator, utilizes semiconductor refrigeration module to dispel the heat and can obtain higher heat dissipation efficiency for when the air conditioner starts the refrigeration mode under the high temperature condition, realize frequency conversion module's quick heat dissipation, avoid influencing air conditioner performance and reliability because of frequency conversion module temperature is too high. After the semiconductor refrigeration module is started, the current temperature of the frequency conversion module is continuously detected to obtain a second temperature parameter, and if the second temperature parameter is less than or equal to the current condensation temperature parameter, the semiconductor refrigeration module is controlled to be closed, so that the frequency conversion module is prevented from generating too large temperature difference with the ambient temperature due to too low temperature, a large amount of condensation water is generated on the frequency conversion module, and further accidents such as short circuit and open circuit of a circuit board in an outdoor unit due to the condensation water are prevented.
In a fifth aspect, an embodiment of the present invention provides an air conditioner, including the control device as described in the third aspect.
The air conditioner provided by the embodiment of the invention at least has the following beneficial technical effects: when a refrigeration operation instruction of a user is received, the current temperature of a frequency conversion module is detected to obtain a first temperature parameter; then compare first temperature parameter and predetermined frequency conversion module start temperature threshold value, if first temperature parameter is greater than predetermined frequency conversion module start temperature threshold value, then control frequency conversion module is in the off-state in order to avoid frequency conversion module to burn out because of overheated, starts the semiconductor refrigeration module among the heat abstractor simultaneously, compares traditional aluminium fin radiator, utilizes semiconductor refrigeration module to dispel the heat and can obtain higher heat dissipation efficiency for when the air conditioner starts the refrigeration mode under the high temperature condition, realize frequency conversion module's quick heat dissipation, avoid influencing air conditioner performance and reliability because of frequency conversion module temperature is too high. After the semiconductor refrigeration module is started, the current temperature of the frequency conversion module is continuously detected to obtain a second temperature parameter, and if the second temperature parameter is smaller than or equal to the current condensation temperature parameter, the semiconductor refrigeration module is controlled to be closed, so that the frequency conversion module is prevented from generating too large temperature difference with the ambient temperature due to too low temperature, a large amount of condensation water is generated on the frequency conversion module, and accidents such as short circuit and open circuit of a circuit board in an outdoor unit due to the condensation water are further prevented.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
Fig. 1 is a block diagram illustrating an air conditioner according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;
fig. 3 is a flowchart illustrating a heat dissipation control method of an air conditioner according to an embodiment of the present invention;
FIG. 4 is a flow chart illustrating the sub-steps of step S140 in FIG. 3;
fig. 5 is a flowchart illustrating a heat dissipation control method of an air conditioner according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a control device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be understood that in the description of the embodiments of the present invention, if there is any description of "first", "second", etc., it is only for the purpose of distinguishing technical features, and it is not to be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the precedence of the indicated technical features. "at least one" means one or more, "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, and indicates that three relationships may exist, for example, a and/or B, and may indicate that a exists alone, a and B exist simultaneously, and B exists alone. Wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" and similar expressions refer to any combination of these items, including any combination of singular or plural items. For example, at least one of a, b, and c may represent: a, b, c, a and b, a and c, b and c or a and b and c, wherein a, b and c can be single or multiple.
Those of ordinary skill in the art will appreciate that the connections described in connection with the embodiments of the present invention include direct connections and indirect connections through intermediate components.
It should be noted that the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Due to the characteristics of high energy efficiency, comfort and the like, the inverter air conditioner is increasingly becoming the mainstream of the market. The frequency conversion module is a core device in the outdoor unit of the frequency conversion air conditioner, and the heat dissipation quality of the frequency conversion module directly relates to the working performance and reliability of the frequency conversion air conditioner. For example, in high temperature weather in summer, the outdoor unit is often exposed to the sun, so that the overall temperature of the outdoor unit is very high (up to 80 ℃), and if a user starts the cooling mode of the air conditioner at this time, the inverter module is easily burned out due to overheating when the air conditioner is turned on. For another example, when the inverter air conditioner operates in a cooling mode under a high temperature condition, the load of the unit is large, and the compressor operates at a high frequency, so that the temperature of the inverter module is rapidly increased. If the frequency conversion module has poor heat dissipation, hardware faults can be caused, and the reliability of the air conditioner is affected. Under the normal condition, in order to ensure the reliability of the frequency conversion module and avoid the frequency conversion module from being burnt out due to overheating, a frequency reduction operation mode is usually adopted for the compressor, but the refrigerating capacity of the air conditioner is greatly reduced in a high-temperature environment.
Based on the above problems, embodiments of the present invention provide a heat dissipation control method and a control device for an air conditioner, and the air conditioner, so as to improve heat dissipation efficiency and heat dissipation reliability of a frequency conversion module.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an air conditioner according to an embodiment of the present invention. As shown in fig. 1, an air conditioner 100 according to an embodiment of the present invention includes an inverter module 110, a heat dissipation device 120, and a control device 130, wherein the control device 130 is connected to the inverter module 110 and the heat dissipation device 120, respectively.
It is understood that the air conditioner 100 described in the embodiment of the present invention is an inverter air conditioner. The air conditioner 100 includes an outdoor unit and an indoor unit, wherein the outdoor unit includes a compressor, a four-way valve, an outdoor heat exchanger, and a frequency conversion module, and the indoor unit includes an indoor heat exchanger. In the embodiment of the present invention, the frequency conversion module 110 is provided with the heat dissipation device 120, and the heat dissipation device 120 in the embodiment of the present invention is an electrically controlled heat dissipation device, and the embodiment of the present invention dissipates heat of the frequency conversion module through the electrically controlled heat dissipation device.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention. The heat dissipation device 120 can be applied to an outdoor unit of an inverter air conditioner to dissipate heat of the inverter module 110 in the outdoor unit.
As shown in fig. 2, the heat dissipation device 120 of the embodiment of the present invention includes a semiconductor refrigeration module 121, where the semiconductor refrigeration module 121 includes a cold end 121a and a hot end 121b, where the cold end 121a is located at a side adjacent to the frequency conversion module 110, and the hot end 121b is located at a side far from the frequency conversion module 110. The cold end 121a of the semiconductor refrigeration module 121 is used for absorbing heat generated by the inverter module 110 and transferring the absorbed heat to the hot end 121b, and the heat is diffused to the outside air through the hot end 121b of the semiconductor refrigeration module 121, thereby achieving the effect of heat dissipation.
Compared with the traditional aluminum rib radiator, the embodiment of the invention utilizes the semiconductor refrigeration module 121 to radiate the frequency conversion module 110, so that higher radiating efficiency can be obtained, when the air conditioner starts a refrigeration mode under a high temperature condition, the quick and reliable radiating of the frequency conversion module 110 is realized, and the influence on the running performance and reliability of the air conditioner due to too high temperature of the frequency conversion module 110 is avoided.
It can be understood that the heat dissipation device 120 of the embodiment of the present invention further includes a heat dissipation fan 123, and the heat dissipation fan 123 is disposed at a side adjacent to the hot end 121b of the semiconductor refrigeration module 121. In this way, by providing the heat dissipation fan at the hot end 121b of the semiconductor refrigeration module 121, the air blown by the heat dissipation fan 123 accelerates the diffusion of the heat on the surface of the hot end 121b, thereby enhancing the heat conduction performance of the semiconductor refrigeration module 121 and further accelerating the heat dissipation efficiency.
It is understood that the heat sink 120 of the embodiment of the present invention further includes a fin radiator 122, and the fin radiator 122 is disposed between the cold end 121a of the semiconductor refrigeration module 121 and the inverter module 110. By adding the fin radiator 122 between the cold end 121a of the semiconductor refrigeration module 121 and the frequency conversion module 110, on one hand, the heat generated by the frequency conversion module 110 is quickly transferred to the cold end 121a of the semiconductor refrigeration module 121 by utilizing the high-efficiency heat conductivity of the fin radiator 122, so that the cold end 121a absorbs the heat of the frequency conversion module 110; on the other hand, the fin radiator 122 can assist in quickly diffusing the heat generated by the inverter module 110 to the outside air, and even if the semiconductor refrigeration module 121 stops operating, a certain heat dissipation efficiency can be maintained by the fin radiator 122.
In a specific implementation, fin radiator 122 may be designed into a shape as shown in fig. 2, and fin radiator 122 includes a transverse end surface, and a portion of the transverse end surface is in contact with cold ends 121a of frequency conversion module 110 and semiconductor refrigeration module 121 respectively, so as to quickly transfer heat generated by frequency conversion module 110 to cold end 121a of semiconductor refrigeration module 121; the remaining portion of the transverse end surface is provided with a plurality of heat dissipation fins, which can help to quickly diffuse the heat generated by the frequency conversion module 110 to the outside air, thereby improving the heat dissipation efficiency of the heat dissipation device 120.
The embodiment of the present invention further provides a heat dissipation control method for an air conditioner based on the heat dissipation device 120 described in the above embodiment.
Referring to fig. 3, fig. 3 shows a heat dissipation control method of an air conditioner according to an embodiment of the present invention. It should be understood that the heat dissipation control method is applied to the air conditioner as described in any one of the above embodiments, and may be executed by a control device of the air conditioner.
As shown in fig. 3, the heat dissipation control method of an air conditioner provided in the embodiment of the present invention includes the following steps:
and S110, responding to a received refrigerating operation instruction of a user, and acquiring a first temperature parameter of the frequency conversion module.
According to the embodiment of the invention, when a user inputs a refrigeration operation instruction to the air conditioner, the air conditioner responds to the refrigeration operation instruction of the user, and detects the current temperature of the frequency conversion module through the first temperature sensor to obtain the first temperature parameter.
During specific implementation, a first temperature sensor used for detecting the temperature of the frequency conversion module can be arranged on the frequency conversion module and connected with the control device, so that the first temperature sensor sends the temperature parameter to the control device after detecting the temperature parameter of the frequency conversion module, and the control device analyzes and processes the temperature parameter.
And S120, when the first temperature parameter is greater than a preset starting temperature threshold value of the frequency conversion module, controlling the frequency conversion module to be in a closed state, and controlling the semiconductor refrigeration module to be in a working state.
It can be understood that after the first temperature parameter of the frequency conversion module is obtained, the first temperature parameter may be compared with a preset starting temperature threshold of the frequency conversion module, so as to determine whether the air conditioner meets a normal starting condition based on a comparison result.
It can be understood that, if the first temperature parameter is greater than the preset starting temperature threshold of the frequency conversion module, it indicates that the current temperature of the frequency conversion module is too high, and the air conditioner cannot be normally started, otherwise, the frequency conversion module is easily burned out due to overheating. In order to avoid the above situation, in the embodiment of the present invention, when the first temperature parameter is greater than the preset starting temperature threshold of the frequency conversion module, the frequency conversion module is controlled to be in the off state, and the semiconductor refrigeration module is controlled to be started, so that the semiconductor refrigeration module is in the working state, and the frequency conversion module is cooled through the semiconductor refrigeration module.
And step S130, acquiring a second temperature parameter of the frequency conversion module.
It can be understood that after the semiconductor refrigeration module is started, the temperature of the frequency conversion module is gradually reduced, and in the embodiment of the invention, the temperature of the frequency conversion module is continuously detected after the semiconductor refrigeration module is started, so that the second temperature parameter is obtained.
Step S140, obtaining a current condensation temperature parameter.
It can be understood that, along with frequency conversion module's temperature reduces gradually, frequency conversion module temperature and ambient temperature's the difference in temperature will crescent, when the difference in temperature was too big, can make frequency conversion module go up a large amount of condensation water that appear, condensation water gathers on the circuit board surface of off-premises station, causes circuit board short circuit, accident such as opening a way easily, causes the electrical components of circuit board to burn out even when serious. In order to prevent the above situation, in the embodiment of the present invention, after the semiconductor refrigeration module is started, the condensation temperature parameter of the outdoor unit is monitored, so as to timely turn off the semiconductor refrigeration module based on the condensation temperature parameter, thereby preventing the temperature of the frequency conversion module from being further reduced, and overcoming the condensation problem caused by the excessively low temperature of the frequency conversion module.
Referring to fig. 4, it can be understood that, in step S140, the specific implementation process of acquiring the current condensation temperature parameter may include the following steps:
step S141, acquiring a current environment temperature parameter and an environment humidity parameter;
it should be appreciated that the dew temperature parameter may also be referred to as a dew point temperature parameter. Generally, the condensation temperature parameter is related to an ambient temperature parameter and an ambient humidity parameter, and different temperatures and humidities correspond to different condensation temperatures, so that the ambient temperature and the ambient humidity can be acquired in real time to determine the condensation temperature. The ambient temperature parameter and the ambient humidity herein may be understood as an ambient temperature and an ambient humidity of the outdoor unit.
For obtaining the ambient temperature and the ambient humidity of the outdoor unit, in particular, a second temperature sensor and a humidity sensor may be disposed in the outdoor unit, wherein the second temperature sensor is configured to collect the ambient temperature of the outdoor unit, the humidity sensor is configured to collect the ambient humidity of the outdoor unit, the second temperature sensor and the humidity sensor are respectively connected to the control device, the second temperature sensor transmits the collected ambient temperature parameter to the control device, the humidity sensor transmits the collected ambient humidity parameter to the control device, and the control device determines the condensation temperature parameter based on the ambient temperature parameter and the ambient humidity parameter.
And S142, acquiring a current condensation temperature parameter according to the environment temperature parameter and the environment humidity parameter.
During specific implementation, a corresponding relation table of the condensation temperature parameter, the environment temperature parameter and the environment humidity parameter can be configured in advance, and after the environment temperature parameter and the environment humidity parameter are obtained, the corresponding condensation temperature parameter is obtained in a table look-up mode. Of course, the condensation temperature parameter may also be determined by a calculation formula in practice, and the method for obtaining the condensation temperature parameter in the embodiment of the present invention is not particularly limited.
It should also be appreciated that the actual value of the dew temperature parameter is generally less than the above-described variable frequency module start-up temperature threshold.
And S150, controlling the semiconductor refrigeration module to be closed when the second temperature parameter is less than or equal to the condensation temperature parameter.
It can be understood that, after the second temperature parameter and the condensation temperature parameter are obtained, the control device compares the second temperature parameter and the condensation temperature parameter, and if the comparison result is that the second temperature parameter is less than or equal to the condensation temperature parameter, it indicates that the current temperature of the frequency conversion module is too low, and there is a risk of condensation, the semiconductor refrigeration module should be turned off, so as to prevent the temperature of the frequency conversion module from being continuously reduced, which causes the outdoor unit to generate a large amount of condensation and to break down. Therefore, in the embodiment of the present invention, when it is determined that the second temperature parameter is less than or equal to the condensation temperature parameter, the semiconductor refrigeration module is controlled to be turned off so as to avoid a fault.
In the embodiment, when the air conditioner receives a refrigerating operation instruction of a user, the current temperature of the frequency conversion module is detected to obtain a first temperature parameter; and then comparing the first temperature parameter with a preset starting temperature threshold value of the frequency conversion module, if the first temperature parameter is greater than the preset starting temperature threshold value of the frequency conversion module, controlling the frequency conversion module to be in a closed state to prevent the frequency conversion module from being burnt out due to overheating, and simultaneously starting a semiconductor refrigeration module in the heat dissipation device. After the semiconductor refrigeration module is started, the air conditioner continues to detect the current temperature of the frequency conversion module to obtain a second temperature parameter, and meanwhile, the current condensation temperature parameter of the outdoor unit is obtained.
Referring to fig. 5, in a specific implementation, after the step S130 of acquiring the second temperature parameter, the following step S160 may be further included:
and step S160, when the second temperature parameter is less than or equal to a preset starting temperature threshold value of the frequency conversion module, controlling the frequency conversion module to be in a working state so as to enable the air conditioner to operate in a refrigeration mode.
It can be understood that, as the semiconductor refrigeration module is started, the inverter module can effectively dissipate heat, and the temperature of the inverter module generally decreases, i.e., the second temperature parameter obtained in step S130 is generally smaller than the first temperature parameter obtained in step S110.
After the second temperature parameter is obtained in step S130, the second temperature parameter is compared with the preset starting temperature threshold of the frequency conversion module, and if the second temperature parameter of the frequency conversion module is less than or equal to the preset starting temperature threshold of the frequency conversion module, it indicates that the temperature of the frequency conversion module has been reduced to a normal level, and at this time, the frequency conversion module can be controlled to start, so that the air conditioner is normally started to operate, and enters a refrigeration working state. If the second temperature parameter of the frequency conversion module is still larger than the preset frequency conversion module starting temperature threshold value, the current temperature of the frequency conversion module is still too high, and the frequency conversion module needs to be kept in a closed state, so that the frequency conversion module is prevented from being burnt out due to overheating after being started.
It can be understood that, after the frequency conversion module is started, the air conditioner is normally started to operate, and enters a refrigeration working mode, because the whole load of the air conditioner unit is larger under a high-temperature condition, the compressor operates at a high frequency, so that the temperature of the frequency conversion module is easy to sharply rise, the reliability of the air conditioner is not influenced by poor heat dissipation of the frequency conversion module, or the frequency reduction operation of the compressor is not required to ensure the reliability of the frequency conversion module, after the step S150 is executed, namely after the frequency conversion module is started, the semiconductor refrigeration module can be controlled to still keep a working state, so as to continue to efficiently dissipate heat of the frequency conversion module, and the working performance and the reliability of the air conditioner in the refrigeration mode under the high-temperature condition are ensured.
It can be understood that, in the case that the heat dissipation device includes a heat dissipation fan, the heat dissipation control method according to the embodiment of the present invention further includes the following step S170:
and step S170, when the semiconductor refrigeration module is controlled to be in a working state, the cooling fan is also controlled to be in a working state.
Therefore, during the working period of the semiconductor refrigeration module, the cooling fan close to the hot end of the semiconductor refrigeration module is controlled to be opened, so that the air blown by the cooling fan is utilized to promote the air flow in the outdoor unit, and the heat concentrated at the hot end is quickly dissipated, thereby enhancing the heat conduction performance of the semiconductor refrigeration module and further accelerating the heat dissipation efficiency.
It is to be understood that, in the case that the heat dissipation device includes a heat dissipation fan, the heat dissipation control method according to the embodiment of the present invention further includes the following step S180:
and step S180, when the semiconductor refrigeration module is controlled to be closed, the cooling fan is also controlled to be closed.
Thus, the heat radiation fan stops operating during the period when the semiconductor cooling module stops operating. For example, after the step S150 is executed, the operation of controlling the cooling fan to be turned off is executed at the same time, so that the temperature of the inverter module is prevented from being continuously lowered, and the outdoor unit generates a large amount of condensation and fails.
The following describes in detail a heat dissipation control method of an air conditioner according to an embodiment of the present invention with reference to specific embodiments.
Step S201, an air conditioner receives a refrigeration operation instruction of a user, detects the temperature of a frequency conversion module, and obtains a first temperature parameter of the frequency conversion module, wherein the obtained first temperature parameter is assumed to be 82 ℃;
step S202, comparing the first temperature parameter with a preset starting temperature threshold of the frequency conversion module to obtain a first comparison result, wherein the starting temperature threshold of the frequency conversion module is assumed to be 80 ℃;
step S203, according to the first comparison result, determining that a first temperature parameter (82 ℃) is greater than a preset frequency conversion module starting temperature threshold value (80 ℃), controlling the frequency conversion module to be in a closed state, and controlling a semiconductor refrigeration module and a cooling fan in the cooling device to be started, so that the semiconductor refrigeration module and the cooling fan are both in working states;
step S204, after a preset time interval (for example, 5 min), detecting the temperature of the frequency conversion module to obtain a second temperature parameter of the frequency conversion module, wherein the obtained second temperature parameter is assumed to be 78 ℃;
step S205, comparing the second temperature parameter with a preset starting temperature threshold of the frequency conversion module to obtain a second comparison result;
step S206, according to the second comparison result, determining that the second temperature parameter (78 ℃) is smaller than a preset variable frequency module starting temperature threshold value (80 ℃), namely controlling the variable frequency module to start, and enabling the air conditioner to normally run in a refrigeration mode;
step S207, continuously detecting the temperature of the frequency conversion module according to a preset time interval, and continuously updating a second temperature parameter of the frequency conversion module, wherein the updated second temperature parameter is assumed to be 28 ℃;
step S208, acquiring an environment temperature parameter and an environment humidity parameter of the outdoor unit according to a preset time interval, and determining a current condensation temperature parameter according to the environment temperature parameter and the environment humidity parameter, wherein the current condensation temperature parameter is assumed to be 30 ℃;
step S209, comparing the updated second temperature parameter (28 ℃) with the condensation temperature parameter (30 ℃) to obtain a third comparison result;
and step S210, determining that the current second temperature parameter is smaller than the current condensation temperature parameter according to the third comparison result, and controlling a semiconductor refrigeration module and a cooling fan in the cooling device to be closed so as to avoid the situation that the temperature of the frequency conversion module is continuously reduced to generate a large amount of condensation.
It is to be understood that, in the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the relevant descriptions of other embodiments for parts that are not described or recited in a certain embodiment.
It is further to be understood that while operations are depicted in the drawings in a particular order, this is not to be understood as requiring that such operations be performed in the particular order shown or in serial order, or that all illustrated operations be performed, to achieve desirable results. In certain environments, multitasking and parallel processing may be advantageous.
Fig. 6 shows a control device 130 according to an embodiment of the present invention, where the control device 130 includes: the controller includes a memory 131, a processor 132, and a computer program stored in the memory 131 and executable on the processor 132, wherein the computer program is used to execute the heat dissipation control method of the air conditioner.
The processor 132 and the memory 131 may be connected by a bus or other means.
The memory 131, which is a non-transitory computer readable storage medium, may be used to store non-transitory software programs and non-transitory computer executable programs, such as the heat dissipation control method of the air conditioner described in the embodiments of the present invention. The processor 132 implements the heat dissipation control method of the air conditioner described above by running a non-transitory software program and instructions stored in the memory 131.
The memory 131 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area can store and execute the heat dissipation control method of the air conditioner. It is further noted that the memory 131 may include a high speed random access memory 131, and may also include a non-transitory memory 131, such as at least one disk memory 131, flash memory device, or other non-transitory solid state memory 131. In some embodiments, the memory 131 optionally includes memory 131 located remotely from the processor 132, and the remote memory 131 may be connected to the control device 130 via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
Non-transitory software programs and instructions required to implement the heat dissipation control method of the air conditioner described above are stored in the memory 131, and when executed by the one or more processors 132, perform the heat dissipation control method of the air conditioner described above, for example, perform method steps S110 to S150 described in fig. 4, perform method steps S141 to S142 described in fig. 4, and perform method steps S130 to S160 described in fig. 5.
The above-described embodiments of the apparatus are merely illustrative, wherein the units illustrated as separate components may or may not be physically separate, i.e. may be located in one place, or may also be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
It should be understood that any of the air conditioners described in the embodiments of the present invention may include the above-described control device.
An embodiment of the present invention further provides a computer-readable storage medium, which stores computer-executable instructions, which are executed by a processor or a control device, for example, by a processor in the above-mentioned control device embodiment, and can enable the processor to execute the heat dissipation control method of the air conditioner in the above-mentioned embodiment, for example, execute the method steps S110 to S150 described in fig. 4, execute the method steps S141 to S142 described in fig. 4, and execute the method steps S130 to S160 described in fig. 5.
One of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as is well known to those skilled in the art.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.
Claims (10)
1. The heat dissipation control method of the air conditioner is characterized by being applied to the air conditioner, wherein the air conditioner comprises a frequency conversion module and a heat dissipation device, the heat dissipation device comprises a semiconductor refrigeration module, the semiconductor refrigeration module comprises a cold end and a hot end, and the cold end is adjacent to the frequency conversion module so as to transfer heat of the frequency conversion module to the hot end;
the heat dissipation control method comprises the following steps:
responding to a received refrigeration operation instruction of a user, and acquiring a first temperature parameter of the frequency conversion module;
when the first temperature parameter is larger than a preset starting temperature threshold value of the frequency conversion module, controlling the frequency conversion module to be in a closed state, and controlling the semiconductor refrigeration module to be in a working state;
acquiring a second temperature parameter of the frequency conversion module;
acquiring a current condensation temperature parameter;
when the second temperature parameter is less than or equal to the condensation temperature parameter, controlling the semiconductor refrigeration module to be closed;
and when the second temperature parameter is less than or equal to a preset frequency conversion module starting temperature threshold value, controlling the frequency conversion module to be in a working state so as to enable the air conditioner to operate in a refrigeration mode.
2. The heat dissipation control method according to claim 1, wherein the obtaining the current dew temperature parameter includes:
acquiring a current environment temperature parameter and an environment humidity parameter;
and acquiring a current condensation temperature parameter according to the environment temperature parameter and the environment humidity parameter.
3. The heat dissipation control method of claim 1, wherein the heat dissipation device further comprises a heat dissipation fan, the heat dissipation fan being adjacent to the hot end of the semiconductor refrigeration module;
the heat dissipation control method further includes one of:
when the semiconductor refrigeration module is controlled to be in a working state, the heat radiation fan is also controlled to be in a working state;
and when the semiconductor refrigeration module is controlled to be closed, the cooling fan is also controlled to be closed.
4. An air conditioner is characterized by comprising a frequency conversion module, a heat dissipation device and a control device, wherein the heat dissipation device comprises a semiconductor refrigeration module, the semiconductor refrigeration module comprises a cold end and a hot end, and the cold end is adjacent to the frequency conversion module so as to transfer heat of the frequency conversion module to the hot end;
the control device is used for:
responding to a received refrigeration operation instruction of a user, and acquiring a first temperature parameter of the frequency conversion module;
when the first temperature parameter is larger than a preset starting temperature threshold value of the frequency conversion module, controlling the frequency conversion module to be in a closed state, and controlling the semiconductor refrigeration module to be in a working state;
acquiring a second temperature parameter of the frequency conversion module;
acquiring a current condensation temperature parameter;
when the second temperature parameter is less than or equal to the condensation temperature parameter, controlling the semiconductor refrigeration module to be closed;
and when the second temperature parameter is less than or equal to a preset frequency conversion module starting temperature threshold value, controlling the frequency conversion module to be in a working state so as to enable the air conditioner to operate in a refrigeration mode.
5. The air conditioner according to claim 4, wherein said control means is further configured to:
acquiring a current environment temperature parameter and an environment humidity parameter;
and acquiring a current condensation temperature parameter according to the environment temperature parameter and the environment humidity parameter.
6. The air conditioner of claim 4, wherein the heat sink further comprises a heat sink fan adjacent the hot end of the semiconductor refrigeration module;
the control device is further configured to:
when the semiconductor refrigeration module is controlled to be in a working state, the cooling fan is also controlled to be in a working state;
or when the semiconductor refrigeration module is controlled to be closed, the cooling fan is also controlled to be closed.
7. The air conditioner of claim 4, wherein the heat sink further comprises a finned heat sink disposed between the cold end of the semiconductor refrigeration module and the inverter module.
8. A control device, comprising: a memory, a processor and a computer program stored on the memory and executable on the processor, the computer program when executed being adapted to perform the heat dissipation control method of any of claims 1 to 3.
9. A computer-readable storage medium storing computer-executable instructions that, when executed by a processor, implement the heat dissipation control method of any one of claims 1 to 3.
10. An air conditioner characterized by comprising the control device according to claim 8.
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| CN108775721B (en) * | 2018-07-27 | 2019-10-29 | 珠海格力电器股份有限公司 | cooling system and control method thereof |
| CN110848818A (en) * | 2018-08-21 | 2020-02-28 | 广东美的制冷设备有限公司 | Radiator, electric control assembly with same and air conditioner |
| CN109195419B (en) * | 2018-10-29 | 2024-03-19 | 珠海格力电器股份有限公司 | Air conditioner electrical box and heat radiating device thereof |
| CN110650613A (en) * | 2019-09-09 | 2020-01-03 | 珠海格力电器股份有限公司 | Heat dissipation regulation and control method and device for electric cabinet and air conditioning unit |
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