CN109195325A - A kind of board structure of circuit and electronic equipment - Google Patents
A kind of board structure of circuit and electronic equipment Download PDFInfo
- Publication number
- CN109195325A CN109195325A CN201811148871.2A CN201811148871A CN109195325A CN 109195325 A CN109195325 A CN 109195325A CN 201811148871 A CN201811148871 A CN 201811148871A CN 109195325 A CN109195325 A CN 109195325A
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- China
- Prior art keywords
- circuit
- board
- pieces
- component
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention provides a kind of board structure of circuit and electronic equipment, and board structure of circuit includes two pieces of circuit boards and connection frame plate, and two pieces of circuit boards are opposite and interval setting, and settable component on two pieces of circuit boards；Connection frame plate is located between two pieces of circuit boards, and two pieces of circuit boards pass through connection frame plate electrical connection；The one side of at least one piece circuit board is provided with opening in two pieces of circuit boards, and the component on another piece of circuit board being oppositely arranged with side is by being open across side, board structure of circuit provided in an embodiment of the present invention, in the case where the finite volume of electronic equipment, the increase that can be realized loaded area in board structure of circuit increases the component number that can be carried in electronic equipment.
Description
Technical field
The present invention relates to circuit design field more particularly to a kind of board structure of circuit and electronic equipment.
Background technique
With the rapid development of electronic technology, the electronic equipments such as smart phone and tablet computer are more more and more universal, and have become
For tool indispensable in people's daily life.In order to meet the needs of people are for electronic equipment, electronic equipment passes through member
The improvement of device performance and newly-increased component realize more and more functions.
Wherein, printed circuit board (Printed Circuit Board, PCB) is used as the primary clustering in electronic equipment
In the connection of carrying component and realization circuit.And in electronic equipment component be continuously increased, it is first in electronic equipment
Device needs to occupy more and more loaded areas on PCB.But since the volume by electronic equipment is limited, including length and width
The limitation of size and the limitation of thickness, the loaded area for the PCB being set in electronic equipment is difficult to increase, so that electronics
The loaded area of PCB is limited in equipment, and it is less to further result in the component number that can be carried in the electronic device.
As it can be seen that presently, there are the loaded areas of PCB of the volumetric constraint because of electronic equipment, and cause to hold in electronic equipment
The less problem of the component number of load.
Summary of the invention
The embodiment of the present invention provides a kind of board structure of circuit and electronic equipment, and to solve, presently, there are the bodies because of electronic equipment
It accumulates and limits the loaded area of PCB, and the problem for causing the component number that can be carried in electronic equipment less.
In order to solve the above technical problems, the present invention is implemented as follows:
In a first aspect, the embodiment of the present invention provides a kind of board structure of circuit, including two pieces of circuit boards and connection frame plate, institute
It states two pieces of circuit boards relatively and interval is arranged, and settable component on two pieces of circuit boards；The connection frame plate is located in
Between two pieces of circuit boards, two pieces of circuit boards are electrically connected by the connection frame plate；In two pieces of circuit boards at least
The one side of one piece of circuit board is provided with opening, and the component on another piece of circuit board being oppositely arranged with the side is by institute
Opening is stated across the side.
Second aspect, the embodiment of the present invention also provide a kind of electronic equipment, including the hardened structure of foregoing circuit.
In the embodiment of the present invention, board structure of circuit includes two pieces of circuit boards and connection frame plate, two pieces of circuit board phases
Pair and interval setting, and settable component on two pieces of circuit boards；The connection frame plate is located in two pieces of circuit boards
Between, two pieces of circuit boards are electrically connected by the connection frame plate；The one of at least one piece circuit board in two pieces of circuit boards
Side is provided with opening, and the component on another piece of circuit board being oppositely arranged with the side is open by described across described
Side, to realize the increase of loaded area in board structure of circuit in the case where the finite volume of electronic equipment, set electronics
The component number that can be carried in standby increases.
Detailed description of the invention
Fig. 1 is one of the structural schematic diagram of board structure of circuit provided in an embodiment of the present invention；
Fig. 2 is the second structural representation of board structure of circuit provided in an embodiment of the present invention；
Fig. 3 is the third structural representation of board structure of circuit provided in an embodiment of the present invention；
Fig. 4 is the four of the structural schematic diagram of board structure of circuit provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
It is a kind of structural schematic diagram of board structure of circuit provided in an embodiment of the present invention referring to Fig. 1, Fig. 1, as shown in Figure 1,
Board structure of circuit includes two pieces of circuit boards 10 and connection frame plate 20, and two pieces of circuit boards 10 are opposite and interval is arranged, and two blocks of electricity
Settable component 30 on road plate 10；Connection frame plate 20 is located between two pieces of circuit boards 10, and two pieces of circuit boards 10 pass through connection
Frame plate 20 is electrically connected；The one side 101 of at least one piece circuit board 10 is provided with opening 102, and and side in two pieces of circuit boards 10
Component 30 on 10 another piece of circuit boards 10 being oppositely arranged passes through side 101 by opening 102.Wherein, side 101 refers to two pieces
The opposite surface of circuit board 10.
Here, due in board structure of circuit two pieces of circuit boards 10 be oppositely arranged, and the opposite flank of two pieces of circuit boards 10 can
Component 30 is set, thus board structure of circuit x-axis to y-axis on (direction of plane where perpendicular to x-axis and z-axis) ruler
It is very little by limited time, can increasing in board structure of circuit for carrying the loaded area of component, the member that carry board structure of circuit can
Number of devices is more；And in upward size-constrained of the z-axis of board structure of circuit, by the side of one piece of circuit board 10 101
Opening 102 is opened up, so that the component 30 on another piece of circuit board 10 is passed through side 101 by opening 102, so as to reduce circuit
The hardened structure thickness upward in z-axis realizes the opposite and interval setting of two pieces of circuit boards 101 in board structure of circuit, even may be used
So that in board structure of circuit with respect to and interval setting two pieces or more circuit board 101, further make the loading end of board structure of circuit
Product increases, to make that more multicomponent device can be carried in board structure of circuit.
Each circuit board 10, which can be, in the embodiment of the present invention, in above-mentioned two pieces of circuit boards 10 any can carry component
30 circuit board can be the circuit board of single layer board, double-layer circuit board or three layers or three layers or more, such as: it is above-mentioned
Two pieces of circuit boards 10 all can be one piece of circuit board 10 be single layer board and another in single layer board or two pieces of circuit boards 10
One piece of circuit board 10 is double-layer circuit board, etc., is not defined herein.
Wherein, the one side of at least one piece circuit board offers opening 102 in above-mentioned two pieces of circuit boards 10, can be one piece
Circuit board 10 offers opening 102 with another piece of opposite one side of circuit board 10, such as: it is optional, as shown in Fig. 2, two pieces
Circuit board 10 is first circuit board 11 and second circuit board 12, the first side 111 and second circuit board 12 of first circuit board 11
Second side 121 be oppositely arranged, first side 111 is provided with the first opening 112, and at least one in second side 121
First component 31 passes through first side 111 by the first opening 112, to make in two pieces of circuit boards 10 on one piece of circuit board 10
Component can pass through the side of another piece of circuit board 10, realize board structure of circuit in the reduction of the upward thickness of z-axis.
Certainly, the one side of at least one piece circuit board offers opening 102 in above-mentioned two pieces of circuit boards 10, is also possible to two
Opening 102 is provided on block circuit board 10, such as: it is optional, as shown in figure 3, above-mentioned two pieces of circuit boards 10 are the first circuit
Plate 11 and second circuit board 12, second side 121 are provided with the second opening 122, and in first side 111 at least one second
Component 32 passes through second side 121 by the second opening 122, thus allow component 30 on two pieces of circuit boards 10 pass through with
The side of its another piece of opposite circuit board 10 can further decrease the board structure of circuit thickness upward in z-axis.Wherein,
One side 111 and second side 121 are two opposite sides.
It should be noted that the size and shape etc. of above-mentioned opening 102 can be set according to the actual situation, and on
Stating, which can be in opening 102, is provided only with a component 30, is also possible to that two or more first device can be arranged
Part 30, i.e., as shown in Fig. 2, not being defined herein.
In addition, when the opening 102 on a circuit board 10 and two or more first device on another circuit board 10
When part 30 is opposite, can be in two or more component 30 some or all of 102 is extended through by opening
Above-mentioned side 101.
In the embodiment of the present invention, the component 30 on above-mentioned another piece of circuit board 10 being oppositely arranged with side 101 is by opening
Mouth 102 passes through side 101, can be the component 30 on above-mentioned another piece of circuit board 10 through the circuit board where side 101
10；It is also possible to the component 30 on above-mentioned another piece of circuit board 10 and partially protrudes into the circuit board 10 at 101 place of side, and does not pass through
Wear the circuit board 10 where side 101.
Wherein, above-mentioned opening 102 can be the opening for the sunk area being opened at least one piece of circuit board 10, such as:
As shown in figure 3, offering the first opening 112 of sunk area on first circuit board 11, recess is offered on second circuit board 12
The opening of region i.e. second 122, and the second component 32 on first circuit board 11 can partially protrude into second circuit board 12 i.e. not
The first component 31 on second circuit board 12 and second circuit board 12 can partially protrude into first circuit board 11 i.e. not
Through first circuit board 11, to realize board structure of circuit in the reduction of the upward thickness of z-axis.
Certainly, above-mentioned opening 102 or the opening for the hollowed out area being opened at least one piece of circuit board 10, example
Such as: as shown in figure 4, above-mentioned two pieces of circuit boards 10 are first circuit board 11 and second circuit board 12, being opened up on first circuit board 11
There is the first opening 112 of hollowed out area, the second opening 122 of hollowed out area, and first yuan of device are offered on second circuit board 12
Part 31, which can run through first circuit board 11 or partially protrude into first circuit board 11 and the second component 32, can run through second
Circuit board 12 partially protrudes into second circuit board 12, can further decrease the board structure of circuit thickness upward in z-axis, especially
It is when the component 30 between two pieces of circuit boards 10 is longer.
It should be noted that only shown in Fig. 3 and Fig. 4 on two pieces of circuit boards 10 while offering sunk area or hollow out
The case where opening 11 in region, accommodates the blind hole and through-hole of component, and in practical applications, in above-mentioned two pieces of circuit boards 10
The opening 11 of sunk area or hollowed out area can be offered with only one piece of circuit board 10；Alternatively, being also possible to one piece of circuit board
10 open up the opening 11 of sunk area, and another piece of circuit board 10 opens up the opening 11 of hollowed out area, does not show one by one herein.
In addition, the opening 11 opened up at least one piece of circuit board 10 in above-mentioned two pieces of circuit boards 10 can be one or more
A, particular number can be to be set according to actual needs, is not defined herein.
In the embodiment of the present invention, above-mentioned connection frame plate 20 can be it is any can support above-mentioned two pieces of circuit boards 10, and it is real
The structure of electrical connection between existing two pieces of circuit boards 10, such as: it can be all members between above-mentioned two pieces of circuit boards 10
At least one piece of circuit board of device setting, and at least one piece of circuit board and above-mentioned two pieces of circuit boards 10 weld；Alternatively, can also be with
It is at least two surface mount elements (such as patch capacitor) of all component settings between above-mentioned two pieces of circuit boards 10, and above-mentioned
Two pieces of circuit boards 10 are by a pin of each surface mount elements or two pin electrical connections, etc., herein and without limit
It is fixed.
Since there may be electromagnetic fields during the work time for the component that carries in board structure of circuit, to influence circuit
Other components or board structure of circuit on hardened structure are with a circuit in the normal work of exterior part, especially board structure of circuit
When component 30 on plate 10 partially protrudes into or runs through another circuit board 10.
In the embodiment of the present invention, for reduce because protruded into board structure of circuit or through a circuit board 10 component 30
The influence that electromagnetism generates, in the case where above-mentioned opening 102 is the opening for the sunk area being opened at least one piece of circuit board,
The inner wall of sunk area can be provided with metal layer (not shown), by metal layer to protrude into the component 30 of sunk area into
Row shielding.
Alternatively, in the case where above-mentioned opening 102 is the opening for the hollowed out area being opened at least one piece of circuit board, electricity
The hardened structure in road can also include shielding part, and shielding part is set to the other side that hollowed out area is located at above-mentioned at least one piece circuit board 10
The location of face, and shielding part covers above-mentioned component 30, wherein the another side and side of above-mentioned at least one piece circuit board 10
Face 101 is back to shield the component for passing through side 101 by shielding part.
Such as: as shown in figure 4, the third side 113 of first circuit board 11 is arranged at intervals with the first shielding part 41, the first screen
Shield 41 is located at the first opening 112 and masking is set on the first component 31 of first side 111, passes through the first shielding part
41 the first components of shielding；Similarly, secondary shielding part 42 can be set on second circuit board 12, secondary shielding part 42 can shield
It covers and is set on the second component 32 of second side 121.
In addition, above-mentioned shielding part can be the component that any component 30 covered to it plays electromagnetic shielding action,
Such as: it can be shielding part made of metal, and shielding part made of the metal is welded on circuit board 10；Or
Person is also possible to the structures such as shielding cloth, is not defined herein.
It should be noted that the component 30 that above-mentioned shielding part can be shielded with it abuts against, thus by shielding part, it can
It is transmitted to the heat that the component 30 for being shielded it generates on the circuit board 10 where the shielding part, passes through the circuit board 10
The heat that the component 30 that shielding part is shielded generates is distributed in time.
Certainly, spaced apart between the component 30 that above-mentioned shielding part can also be shielded with it, and be to guarantee shielding
The heat that the component 30 that part is shielded generates distributes in time, and optionally, board structure of circuit further includes insulating heat-conductive part, component
30 are connect by insulating heat-conductive part with shielding part, to can be conducted the heat of the component 30 to screen by insulating heat-conductive part
Shield, then as on the circuit board 10 where shielding part conducts heat to it.
Such as: as shown in Figure 4, the first insulating heat-conductive part is provided between the first component 31 and the first shielding part 41
51, the heat of first component 31 is conducted to the first shielding part 41 by the first insulating heat-conductive part 51；Similarly, second yuan of device
Also the second insulating heat-conductive part 52 can be set between part 32 and secondary shielding part 42, this will not be repeated here.
Wherein, the insulating heat-conductive part can be it is any have a structure made of insulating heat-conduction material, such as: can be and be set to
Thermally conductive congealed fat layer between component and shielding part, etc..
In the embodiment of the present invention, for the heat-sinking capability for further promoting board structure of circuit, optionally, board structure of circuit is also wrapped
It includes heat dissipating layer, the another side interval of heat dissipating layer and at least one piece circuit board 10 and is oppositely arranged, it can will be electric by heat dissipating layer
The heat that component generates in the hardened structure in road is conducted in time to external structure, is such as provided with the outer of the electronic equipment of board structure of circuit
Shell etc..
Wherein, the shape, size of above-mentioned heat dissipating layer and position etc. can be set according to actual needs, such as: it can
To be that projection of the heat dissipating layer on the another side of at least one piece circuit board 10 covers shielding part；Alternatively, as shown in figure 4, first
The third side 113 of circuit board 11 is arranged at intervals with the first heat dissipating layer 61, and the first heat dissipating layer 61 is where first circuit board 11
The projection of plane covers first circuit board 11；4th side 123 of second circuit board 12 is arranged at intervals with the second heat dissipating layer 62, and
Second heat dissipating layer 62 covers second circuit board 12, etc. in the projection of 12 place plane of second circuit board, herein and without limit
It is fixed.
It should be noted that above-mentioned heat dissipating layer can be any structure for having heat-sinking capability, and such as: above-mentioned heat dissipating layer can
To be graphite thermal conductive layer, to have good heat dissipation performance.
In the embodiment of the present invention, board structure of circuit includes two pieces of circuit boards and connection frame plate, two pieces of circuit boards it is opposite and
Interval setting, and settable component on two pieces of circuit boards；Connection frame plate is located between two pieces of circuit boards, and two pieces of circuit boards are logical
Cross the electrical connection of connection frame plate；The one side of at least one piece circuit board is provided with opening in two pieces of circuit boards, and opposite with side sets
The component on another piece of circuit board set is by being open across side, real thus in the case where the finite volume of electronic equipment
The increase of loaded area, increases the component number that can be carried in electronic equipment in existing board structure of circuit.
Based on the hardened structure of foregoing circuit, the embodiment of the present invention also provides a kind of electronic equipment, including the hardened structure of foregoing circuit.
Since the structure of electronic equipment ontology is the prior art, board structure of circuit has carried out specifically in the above-described embodiments
It is bright, therefore, the structure of specific electronic equipment is repeated no more in the present embodiment.
In the embodiment of the present invention, above-mentioned electronic equipment can be mobile terminal, such as: mobile phone, tablet computer (Tablet
Personal Computer), laptop computer (Laptop Computer), personal digital assistant (personal digital
Assistant, abbreviation PDA), mobile Internet access device (Mobile Internet Device, MID) or wearable device
(Wearable Device) etc. can also be other electronic equipments, such as digital camera, e-book, navigator.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within protection of the invention.
Claims (10)
1. a kind of board structure of circuit, which is characterized in that opposite including two pieces of circuit boards and connection frame plate, two pieces of circuit boards
And interval setting, and settable component on two pieces of circuit boards；The connection frame plate be located in two pieces of circuit boards it
Between, two pieces of circuit boards are electrically connected by the connection frame plate；The side of at least one piece circuit board in two pieces of circuit boards
Face is provided with opening, and the component on another piece of circuit board being oppositely arranged with the side is open by described across the side
Face.
2. board structure of circuit according to claim 1, which is characterized in that two pieces of circuit boards are first circuit board and the
Two circuit boards, the first side of the first circuit board and the second side of the second circuit board are oppositely arranged, and described first
Side is provided with the first opening, and at least one first component in the second side is open by described first across described
First side.
3. board structure of circuit according to claim 2, which is characterized in that the second side is provided with the second opening, and
At least one second component in the first side is by second opening across the second side.
4. board structure of circuit according to any one of claim 1 to 3, which is characterized in that the opening is is opened in
State the opening of the sunk area at least one piece of circuit board.
5. board structure of circuit according to any one of claim 1 to 3, which is characterized in that the opening is is opened in
State the opening of the hollowed out area at least one piece of circuit board.
6. board structure of circuit according to claim 5, which is characterized in that the component does not run through at least one block of electricity
Road plate or the component run through at least one piece of circuit board.
7. board structure of circuit according to claim 5, which is characterized in that the board structure of circuit further includes shielding part, institute
It states shielding part and is set to the location of the another side that the hollowed out area is located at at least one piece circuit board, and the screen
Shield covers the component, wherein the another side and the side of at least one piece circuit board back to.
8. board structure of circuit according to claim 7, which is characterized in that the board structure of circuit further includes insulating heat-conductive
Part, the component are connect by the insulating heat-conductive part with the shielding part.
9. board structure of circuit according to claim 7, which is characterized in that the board structure of circuit further includes heat dissipating layer, institute
It states the another side interval of heat dissipating layer and at least one piece circuit board and is oppositely arranged.
10. a kind of electronic equipment, which is characterized in that including board structure of circuit as claimed in any one of claims 1-9 wherein.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811148871.2A CN109195325A (en) | 2018-09-29 | 2018-09-29 | A kind of board structure of circuit and electronic equipment |
| PCT/CN2019/101511 WO2020063195A1 (en) | 2018-09-29 | 2019-08-20 | Circuit board structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811148871.2A CN109195325A (en) | 2018-09-29 | 2018-09-29 | A kind of board structure of circuit and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109195325A true CN109195325A (en) | 2019-01-11 |
Family
ID=64907764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811148871.2A Pending CN109195325A (en) | 2018-09-29 | 2018-09-29 | A kind of board structure of circuit and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109195325A (en) |
| WO (1) | WO2020063195A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020063195A1 (en) * | 2018-09-29 | 2020-04-02 | 维沃移动通信有限公司 | Circuit board structure and electronic device |
| CN111743211A (en) * | 2020-06-24 | 2020-10-09 | 深圳市吉迩科技有限公司 | Circuit board structure and aerosol generating device |
| CN112702871A (en) * | 2020-12-23 | 2021-04-23 | 松山湖材料实验室 | Heat radiation structure of laser radar |
| CN115580983A (en) * | 2022-09-30 | 2023-01-06 | 荣耀终端有限公司 | Circuit board assembly and electronic device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1734756A (en) * | 2004-08-11 | 2006-02-15 | 索尼株式会社 | Electronic circuit device |
| CN200956370Y (en) * | 2006-08-01 | 2007-10-03 | 环隆电气股份有限公司 | Package-on-package structure for communication module |
| CN101204125B (en) * | 2005-07-14 | 2011-04-06 | 松下电器产业株式会社 | Interconnecting board and three-dimensional wiring structure using it |
| CN103763852A (en) * | 2013-12-28 | 2014-04-30 | 华为技术有限公司 | Power panel and main board with power panel |
| CN103811444A (en) * | 2012-11-07 | 2014-05-21 | 环旭电子股份有限公司 | Electronic apparatus, system in package module and method for manufacturing system in package module |
| CN204316868U (en) * | 2014-09-30 | 2015-05-06 | 上海移远通信技术有限公司 | The integrated structure of circuit board |
| CN105376938A (en) * | 2015-11-12 | 2016-03-02 | 惠州Tcl移动通信有限公司 | Communication device and circuit board module thereof |
| CN205622671U (en) * | 2016-03-18 | 2016-10-05 | 上海与德通讯技术有限公司 | Mobile terminal |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011003377A1 (en) * | 2011-01-31 | 2012-08-02 | Zf Friedrichshafen Ag | Printed circuit board assembly |
| CN104853563A (en) * | 2014-02-19 | 2015-08-19 | 联想(北京)有限公司 | Electronic equipment |
| TWI562687B (en) * | 2014-09-24 | 2016-12-11 | Wistron Corp | Circuit board assembly |
| CN105828571A (en) * | 2015-10-21 | 2016-08-03 | 维沃移动通信有限公司 | Shielding and heat-dissipation structure of electronic device chip and electronic device |
| CN109195325A (en) * | 2018-09-29 | 2019-01-11 | 维沃移动通信有限公司 | A kind of board structure of circuit and electronic equipment |
-
2018
- 2018-09-29 CN CN201811148871.2A patent/CN109195325A/en active Pending
-
2019
- 2019-08-20 WO PCT/CN2019/101511 patent/WO2020063195A1/en active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1734756A (en) * | 2004-08-11 | 2006-02-15 | 索尼株式会社 | Electronic circuit device |
| CN101204125B (en) * | 2005-07-14 | 2011-04-06 | 松下电器产业株式会社 | Interconnecting board and three-dimensional wiring structure using it |
| CN200956370Y (en) * | 2006-08-01 | 2007-10-03 | 环隆电气股份有限公司 | Package-on-package structure for communication module |
| CN103811444A (en) * | 2012-11-07 | 2014-05-21 | 环旭电子股份有限公司 | Electronic apparatus, system in package module and method for manufacturing system in package module |
| CN103763852A (en) * | 2013-12-28 | 2014-04-30 | 华为技术有限公司 | Power panel and main board with power panel |
| CN204316868U (en) * | 2014-09-30 | 2015-05-06 | 上海移远通信技术有限公司 | The integrated structure of circuit board |
| CN105376938A (en) * | 2015-11-12 | 2016-03-02 | 惠州Tcl移动通信有限公司 | Communication device and circuit board module thereof |
| CN205622671U (en) * | 2016-03-18 | 2016-10-05 | 上海与德通讯技术有限公司 | Mobile terminal |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020063195A1 (en) * | 2018-09-29 | 2020-04-02 | 维沃移动通信有限公司 | Circuit board structure and electronic device |
| CN111743211A (en) * | 2020-06-24 | 2020-10-09 | 深圳市吉迩科技有限公司 | Circuit board structure and aerosol generating device |
| CN111743211B (en) * | 2020-06-24 | 2024-02-20 | 深圳市吉迩科技有限公司 | Circuit board structure and aerosol generating device |
| CN112702871A (en) * | 2020-12-23 | 2021-04-23 | 松山湖材料实验室 | Heat radiation structure of laser radar |
| CN115580983A (en) * | 2022-09-30 | 2023-01-06 | 荣耀终端有限公司 | Circuit board assembly and electronic device |
| CN115580983B (en) * | 2022-09-30 | 2023-08-29 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020063195A1 (en) | 2020-04-02 |
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Application publication date: 20190111 |
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| RJ01 | Rejection of invention patent application after publication |