CN105376938A - Communication device and circuit board module thereof - Google Patents
Communication device and circuit board module thereof Download PDFInfo
- Publication number
- CN105376938A CN105376938A CN201510780543.4A CN201510780543A CN105376938A CN 105376938 A CN105376938 A CN 105376938A CN 201510780543 A CN201510780543 A CN 201510780543A CN 105376938 A CN105376938 A CN 105376938A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic component
- shielding cover
- electro
- magnetic shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a circuit board module. The circuit board module comprises a circuit board, and a first electronic component, a second electronic component and a third electronic component that are arranged on the circuit board, and an electromagnetic shielding cover; the first electronic component is covered by the electromagnetic shielding cover; the second electronic component and the third electronic component are positioned on the two sides of the first electronic component respectively and are electrically connected through wires. The invention also discloses a communication device. According to the circuit board module, the printed circuit wiring on the circuit board is reduced, the wiring area on the circuit board is reduced, the existing wiring space is fully utilized, and the cost of the circuit board is reduced without influencing the PCB appearance and the electromagnetic shielding property of electromagnetic sensitive electronic components.
Description
Technical field
The present invention relates to the design field of circuit board and cabling thereof, particularly relate to a kind of communication apparatus and circuit board assemblies thereof.
Background technology
For pursuing the compact design of electronic product, in board design, because the components and parts on circuit board are more, and the area of circuit board is less, makes the space of circuit trace very little.As circuit trace insufficient space then needs the approach being added layer by circuit board to solve, this kind of design is unfavorable for reducing product cost and manufacture difficulty.
At present, some need to arrange shield shell to prevent electromagnetic interference to electromagnetic susceptibility electronic component, for reducing the impact on this electronic component as much as possible, other electronic components and circuit trace must get around this electronic component, or are distributed in separately on the circuit board of other one deck.This just causes length of arrangement wire on circuit board to increase and the increase of circuit board fabrication cost, the neighboring area that a large amount of metal routings is printed on circuit board surface, covers through whole radome, occupy a large amount of PCB inner spaces, cabling is complicated, space availability ratio is little, and aesthetics is also had a greatly reduced quality.
Summary of the invention
In view of the deficiency that prior art exists, the invention provides a kind of wiring space few, reduce circuit board cost and do not affect communication apparatus and the circuit board assemblies thereof of PCB aesthetic property and electromagnetic susceptibility electronic component capability of electromagnetic shielding.
In order to realize above-mentioned object, present invention employs following technical scheme:
A kind of circuit board assemblies, comprise circuit board, the first electronic component be located on described circuit board, the second electronic component, the 3rd electronic component and electro-magnetic shielding cover, described first electronic component covers at wherein by described electro-magnetic shielding cover, and described second electronic component and described 3rd electronic component are laid respectively at the both sides of described first electronic component and be electrically connected by wire.
Wherein, described wire is FPC.
Wherein, described wire is formed at the side, face that described circuit board does not arrange electronic component, and two ends are each passed through described circuit board is connected with described second electronic component and described 3rd electronic component.
Or described conductor part is located in described electro-magnetic shielding cover.
Wherein, two sidewall bottom of described electro-magnetic shielding cover are respectively equipped with pad, and described second electronic component and described 3rd electronic component are electrically connected with pad described in one of them respectively.
Wherein, described pad is located at the sidewall bottom near described second electronic component and described 3rd electronic component on described electro-magnetic shielding cover respectively.
Wherein, described wire is pasted on the inwall of described electro-magnetic shielding cover.
Wherein, described circuit board assemblies comprises circuit board described in polylith, and the face that at least two pieces of adjacent described circuit boards do not arrange electronic component is close together.
Wherein, described wire is arranged with magnet ring.
Another object of the present invention is to provide a kind of communication apparatus, comprise above-mentioned circuit board assemblies.
The present invention, by arranging two electronic components in the electro-magnetic shielding cover both sides of circuit board assemblies, utilizes wire to make this two electronic component electrical connections, decreases the printed wire wiring on circuit board.And by wire is arranged to FPC (FlexiblePrintedCircuitboard, flexible print wiring board), this FPC is arranged in electro-magnetic shielding cover, its two ends are utilized to connect two electronic components of electro-magnetic shielding cover both sides respectively, decrease the wiring area on circuit board, make full use of existing wiring space, do not affect PCB aesthetic property and electromagnetic susceptibility electronic component capability of electromagnetic shielding, reduce circuit board cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the circuit board assemblies of the embodiment of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is described in more detail.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Consult Fig. 1, the circuit board assemblies of the embodiment of the present invention comprises circuit board 10, the first electronic component 11, second electronic component 12, the 3rd electronic component 13 and the electro-magnetic shielding cover 14 be located on circuit board 10, first electronic component 11 covers at wherein by electro-magnetic shielding cover 14, and the second electronic component 12 and the 3rd electronic component 13 are laid respectively at the both sides of the first electronic component 11 and be electrically connected by wire 15.Preferably, wire 15 is that surface has the FPC of electro-magnetic screen layer, can avoid producing to the interference of the first electronic component 11 and avoid the interference of the first electronic component 11.
Wire 15 part of the present embodiment is located in electro-magnetic shielding cover 14, its two ends are electrically connected with the second electronic component 12 and the 3rd electronic component 13 by pad 16, particularly, be respectively equipped with pad 16 at two sidewall bottom of electro-magnetic shielding cover 14, the second electronic component 12 and the 3rd electronic component 13 are electrically connected with one of them pad 16 respectively.Preferably, two pads 16 are located at the bottom of sidewall relative with a pair of the 3rd electronic component 13 near the second electronic component 12 on electro-magnetic shielding cover 14 respectively.Change pad 16 surface and can scribble insulating material, to insulate with the electro-magnetic shielding cover 14 of metal.
For improving the fixing reliability of FPC, wire 15 is glued to the inwall of electro-magnetic shielding cover 14, basically identical with the shape of electro-magnetic shielding cover 14, its two ends by pad 16 respectively with the second electronic component 12 and the 3rd electronic component 13 conducting of both sides.
For reducing the antijamming capability of wire 15 further and reducing its electromagnetic radiation, wire 15 can be arranged with magnet ring further.
In other embodiments, wire 15 also can be formed at the side, face that circuit board 10 does not arrange electronic component, and its two ends are rear with the second electronic component 12 and the 3rd electronic component 13 are connected respectively through circuit board 10.
In addition, circuit board assemblies also can have polylith circuit board 10 and electro-magnetic shielding cover 14, the face that at least two pieces of adjacent circuit boards 10 do not arrange electronic component is close together, be conducive to the compactedness improving circuit board assemblies, meanwhile, adjacent two the first electronic components 11 can also be enclosed within wherein by two adjacent electro-magnetic shielding covers 14.
Circuit board assemblies of the present invention can be widely used in variously to be had in the communication apparatus of electro-magnetic screen function, structure is simple, and it is practical, decrease the wiring area on circuit board, make full use of existing wiring space, do not affect PCB aesthetic property and electromagnetic susceptibility electronic component capability of electromagnetic shielding, reduce circuit board cost.
The above is only the embodiment of the application; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the protection range of the application.
Claims (10)
1. a circuit board assemblies, it is characterized in that, comprise circuit board (10), the first electronic component (11) be located on described circuit board (10), the second electronic component (12), the 3rd electronic component (13) and electro-magnetic shielding cover (14), described first electronic component (11) covers at wherein by described electro-magnetic shielding cover (14), and described second electronic component (12) and described 3rd electronic component (13) are laid respectively at the both sides of described first electronic component (11) and be electrically connected by wire (15).
2. circuit board assemblies according to claim 1, is characterized in that, described wire (15) is FPC.
3. circuit board assemblies according to claim 1, it is characterized in that, described wire (15) is formed at the side, face that described circuit board (10) does not arrange electronic component, and two ends are each passed through described circuit board (10) is connected with described second electronic component (12) and described 3rd electronic component (13).
4. circuit board assemblies according to claim 2, is characterized in that, described wire (15) part is located in described electro-magnetic shielding cover (14).
5. circuit board assemblies according to claim 4, it is characterized in that, two sidewall bottom of described electro-magnetic shielding cover (14) are respectively equipped with pad (16), and described second electronic component (12) and described 3rd electronic component (13) are electrically connected with pad described in one of them (16) respectively.
6. circuit board assemblies according to claim 5, it is characterized in that, described pad (16) is located at the sidewall bottom of upper close described second electronic component (12) of described electro-magnetic shielding cover (14) and described 3rd electronic component (13) respectively.
7. circuit board assemblies according to claim 4, is characterized in that, described wire (15) is pasted on the inwall of described electro-magnetic shielding cover (14).
8. circuit board assemblies according to claim 1, is characterized in that, comprises circuit board described in polylith (10), and the face that at least two pieces of adjacent described circuit boards (10) do not arrange electronic component is close together.
9., according to the arbitrary described circuit board assemblies of claim 1-8, it is characterized in that, (15) are arranged with magnet ring with described wire.
10. a communication apparatus, is characterized in that, comprises the arbitrary described circuit board assemblies of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510780543.4A CN105376938B (en) | 2015-11-12 | 2015-11-12 | A kind of communication apparatus and its circuit board assemblies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510780543.4A CN105376938B (en) | 2015-11-12 | 2015-11-12 | A kind of communication apparatus and its circuit board assemblies |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105376938A true CN105376938A (en) | 2016-03-02 |
| CN105376938B CN105376938B (en) | 2018-12-04 |
Family
ID=55378616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510780543.4A Active CN105376938B (en) | 2015-11-12 | 2015-11-12 | A kind of communication apparatus and its circuit board assemblies |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105376938B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484405A (en) * | 2017-09-27 | 2017-12-15 | 广东欧珀移动通信有限公司 | Mobile terminal and its circuit board assemblies |
| CN109121296A (en) * | 2018-08-20 | 2019-01-01 | 维沃移动通信有限公司 | A kind of circuit board, mobile terminal and circuit board trace method |
| CN109195325A (en) * | 2018-09-29 | 2019-01-11 | 维沃移动通信有限公司 | A kind of board structure of circuit and electronic equipment |
| WO2020135729A1 (en) * | 2018-12-29 | 2020-07-02 | 比亚迪股份有限公司 | Vehicle-mounted power supply structure and circuit board layout structure thereof |
| CN111586970A (en) * | 2020-05-08 | 2020-08-25 | 维沃移动通信有限公司 | Signal transmission module and electronic equipment |
| CN111742624A (en) * | 2018-02-21 | 2020-10-02 | 三星电子株式会社 | Electronic device including shielding member for shielding at least part of magnetic force generated by magnetic substance and connection portion including property of non-magnetic substance connected to shielding member |
| CN113258228A (en) * | 2021-06-29 | 2021-08-13 | 成都市克莱微波科技有限公司 | Multichannel amplitude-phase consistent microwave assembly |
| CN115003022A (en) * | 2021-10-09 | 2022-09-02 | 荣耀终端有限公司 | Printed Circuit Board (PCB) assembly, electronic equipment and power supply wiring method |
| US11622481B2 (en) | 2018-02-21 | 2023-04-04 | Samsung Electronics Co., Ltd. | Electronic device including shield member for shielding at least part of magnetic force generated by magnetic substance and connection portion including property of nonmagnetic substance connected to shield member |
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| JP2002258067A (en) * | 2001-02-28 | 2002-09-11 | Mitsubishi Cable Ind Ltd | Optical fiber wiring board |
| US6958445B1 (en) * | 2004-12-16 | 2005-10-25 | Hewlett-Packard Development Company, L.P. | Electromagnetic interference shield for electronic devices on a circuit board |
| CN101065005A (en) * | 2006-04-28 | 2007-10-31 | 佛山市顺德区顺达电脑厂有限公司 | Electronic equipment having wiring mode for suppressing electromagnetic interference |
| CN201947598U (en) * | 2009-12-24 | 2011-08-24 | 三星电子株式会社 | Shielding cover of portable terminal |
| CN104347535A (en) * | 2013-07-31 | 2015-02-11 | 环旭电子股份有限公司 | Electronic packaging module and manufacturing method thereof |
-
2015
- 2015-11-12 CN CN201510780543.4A patent/CN105376938B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002258067A (en) * | 2001-02-28 | 2002-09-11 | Mitsubishi Cable Ind Ltd | Optical fiber wiring board |
| US6958445B1 (en) * | 2004-12-16 | 2005-10-25 | Hewlett-Packard Development Company, L.P. | Electromagnetic interference shield for electronic devices on a circuit board |
| CN101065005A (en) * | 2006-04-28 | 2007-10-31 | 佛山市顺德区顺达电脑厂有限公司 | Electronic equipment having wiring mode for suppressing electromagnetic interference |
| CN201947598U (en) * | 2009-12-24 | 2011-08-24 | 三星电子株式会社 | Shielding cover of portable terminal |
| CN104347535A (en) * | 2013-07-31 | 2015-02-11 | 环旭电子股份有限公司 | Electronic packaging module and manufacturing method thereof |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107484405A (en) * | 2017-09-27 | 2017-12-15 | 广东欧珀移动通信有限公司 | Mobile terminal and its circuit board assemblies |
| CN107484405B (en) * | 2017-09-27 | 2020-01-03 | Oppo广东移动通信有限公司 | Mobile terminal and circuit board assembly thereof |
| CN111742624A (en) * | 2018-02-21 | 2020-10-02 | 三星电子株式会社 | Electronic device including shielding member for shielding at least part of magnetic force generated by magnetic substance and connection portion including property of non-magnetic substance connected to shielding member |
| US11622481B2 (en) | 2018-02-21 | 2023-04-04 | Samsung Electronics Co., Ltd. | Electronic device including shield member for shielding at least part of magnetic force generated by magnetic substance and connection portion including property of nonmagnetic substance connected to shield member |
| US11877383B2 (en) | 2018-02-21 | 2024-01-16 | Samsung Electronics Co., Ltd. | Electronic device including shield member for shielding at least part of magnetic force generated by magnetic substance and connection portion including property of nonmagnetic substance connected to shield member |
| CN109121296A (en) * | 2018-08-20 | 2019-01-01 | 维沃移动通信有限公司 | A kind of circuit board, mobile terminal and circuit board trace method |
| CN109195325A (en) * | 2018-09-29 | 2019-01-11 | 维沃移动通信有限公司 | A kind of board structure of circuit and electronic equipment |
| WO2020135729A1 (en) * | 2018-12-29 | 2020-07-02 | 比亚迪股份有限公司 | Vehicle-mounted power supply structure and circuit board layout structure thereof |
| CN111586970A (en) * | 2020-05-08 | 2020-08-25 | 维沃移动通信有限公司 | Signal transmission module and electronic equipment |
| CN111586970B (en) * | 2020-05-08 | 2023-12-12 | 维沃移动通信有限公司 | Signal transmission module and electronic equipment |
| CN113258228A (en) * | 2021-06-29 | 2021-08-13 | 成都市克莱微波科技有限公司 | Multichannel amplitude-phase consistent microwave assembly |
| CN115003022A (en) * | 2021-10-09 | 2022-09-02 | 荣耀终端有限公司 | Printed Circuit Board (PCB) assembly, electronic equipment and power supply wiring method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105376938B (en) | 2018-12-04 |
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Effective date of registration: 20230627 Address after: Room B027, Block B, Building 1301-1, 13th Floor, Wanjiali International Mall Project, No. 99, Section 1, Wanjiali Middle Road, Dongtundu Street, Furong District, Changsha City, Hunan Province, 410000 Patentee after: Changsha Yingrui Intellectual Property Operation Co.,Ltd. Address before: 516003 No.86, hechangqi Road West, Zhongkai high tech Zone, Huizhou City, Guangdong Province Patentee before: HUIZHOU TCL MOBILE COMMUNICATION Co.,Ltd. |
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