CN105472873A - Resonant component and electronic equipment - Google Patents
Resonant component and electronic equipment Download PDFInfo
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- CN105472873A CN105472873A CN201511001557.8A CN201511001557A CN105472873A CN 105472873 A CN105472873 A CN 105472873A CN 201511001557 A CN201511001557 A CN 201511001557A CN 105472873 A CN105472873 A CN 105472873A
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- Prior art keywords
- radome
- screen
- circuit board
- oscillator
- thermal conductivity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10068—Non-printed resonator
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention discloses a resonant component and electronic equipment. The resonant component comprises a circuit board, a shielding layer, an oscillator and a shielding case, wherein the shielding layer is arranged on the circuit board; the oscillator is arranged on the shielding layer and is fixed on the circuit board; the shielding case is arranged on the circuit board; the oscillator is accommodated into a hollow cavity formed by the shielding case; and the thermal conductivity of the shielding layer and/or the shielding case is lower than preset thermal conductivity, so that heat which enters the hollow cavity and is generated by at least one electronic element arranged outside the shielding case is reduced. The resonant component and the electronic equipment are used for solving the technical problem that a crystal oscillator of the electronic equipment in the prior art generates a frequency drift due to the influence of nearby heat source and achieving the technical effect of reducing the probability of the frequency drift generated by the crystal oscillator.
Description
Technical field
The present invention relates to electronic technology field, particularly a kind of resonant component and electronic equipment.
Background technology
Along with the continuous progress of science and technology, electronic technology have also been obtained development at full speed, a lot of portable electric appts, as smart mobile phone, panel computer etc., become the necessity of people's daily life, and crystal oscillator is the important devices in electronic device circuitry system, provide reference signal for data processing equipment clocking with for particular system.In actual use, crystal oscillator is often subject to the impact of the factor such as temperature or other signal disturbing, thus cannot meet the stability of electronic equipment in working temperature.
In the prior art, for solving the problems of the technologies described above, have employed and use sealing shielding can crystal oscillator, and circuit board simultaneously below crystal oscillator is laid the mode of ground screen, other interference signals in screened circuit system, thus other interference signals decreased in electronic equipment are on the impact of the stability of crystal oscillator.
Although electronic equipment of the prior art adopts the mode increasing radome and screen, the interference of other signals to crystal oscillator can be reduced, but make because radome and ground screen are metallic conductor, when crystal oscillator is nearer apart from some thermal source devices, the heat of the generation of thermal source near radome and ground screen can import in a large number, causes the temperature of crystal oscillator higher thus produces frequency drift.
So there is the technical problem producing frequency drift because of the impact of neighbouring thermal source in the crystal oscillator of electronic equipment of the prior art.
Summary of the invention
The embodiment of the present application provides a kind of resonant component and electronic equipment, there is the technical problem producing frequency drift because of the impact of neighbouring thermal source in the crystal oscillator for solving electronic equipment of the prior art, realizes reducing the technique effect that crystal oscillator produces the probability of frequency drift.
The embodiment of the present application provides a kind of resonant component on the one hand, comprising:
Circuit board;
Screen, is arranged on described circuit board;
Oscillator, to be arranged on described screen and to be fixed on described circuit board;
Radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation;
Wherein, the thermal conductivity of described screen and/or described radome lower than default thermal conductivity, to reduce the heat produced by least one electronic component be arranged on outside described radome entering into described cavity.
Optionally, described screen and/or described radome offer at least one through hole.
Optionally, described radome is arranged on described screen, forms described cavity by described radome and described screen.
Optionally, described radome is arranged on the region of the described circuit board outside described screen edge.
Optionally, thermal conductivity corresponding when being 5ppm that described default thermal conductivity is less than or equal to the frequency drift of described oscillator.
Optionally, when described oscillator application is in gps system, thermal conductivity corresponding when the frequency drift that described default thermal conductivity is less than or equal to described oscillator is 3ppm.
Optionally, at least one thermal vias described, the aperture of each thermal vias is less than or equal to 1/4 of wavelength corresponding to the highest signal of described electronic equipment medium frequency.
Optionally, the area of described screen is identical with the projected area of described oscillator on described circuit board.
Optionally, described radome is made up of metal material.
Optionally, described screen is made up of metal material.
The embodiment of the present application provides a kind of electronic equipment on the other hand, comprising:
Housing;
At least one electronic component, is arranged in described housing, and wherein, at least one electronic component described, when in running order, can produce heat;
Resonant component, be arranged in described housing, described resonant component comprises: circuit board; Screen, is arranged on described circuit board; Oscillator, to be arranged on described screen and to be fixed on described circuit board; Radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation; Wherein, the thermal conductivity of described screen and/or described radome is lower than default thermal conductivity, and to reduce the first heat entering into described cavity, described first heat is a part of heat in described heat.
Above-mentioned one or more technical scheme in the embodiment of the present application, at least has one or more technique effects following:
One, due to the technical scheme in the embodiment of the present application, circuit board is adopted, screen, is arranged on described circuit board, oscillator, to be arranged on described screen and to be fixed on described circuit board, radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation, wherein, the thermal conductivity of described screen and/or described radome is lower than default thermal conductivity, to reduce the technological means entering into the heat produced by least one electronic component be arranged on outside described radome of described cavity, like this, when heater members near oscillator produces a large amount of heats, because the thermal conductivity of screen and radome is low, so, the heat produced by heater members that screen and radome absorb is also corresponding less, thus inhibit the intensification degree of screen and radome, reduce heater members to affect the temperature of oscillator, further reduce because temperature raises the frequency drift brought, so, there is the technical problem producing frequency drift because of the impact of neighbouring thermal source in the crystal oscillator efficiently solving electronic equipment of the prior art, realize reducing the technique effect that crystal oscillator produces the probability of frequency drift.
Two, due to the technical scheme in the embodiment of the present application, adopt the technological means described screen and/or described radome offering at least one through hole, like this, owing to decreasing the area of screen and radome, so, decrease the contact area of conductor and heat on the whole, the heat that the neighbouring thermal source that reduce further screen and radome importing produces, thus reduce the temperature rise at oscillator place, achieve and reduce the technique effect that crystal oscillator produces the probability of frequency drift further.
Three, due to the technical scheme in the embodiment of the present application, circuit board is adopted, screen, is arranged on described circuit board, oscillator, to be arranged on described screen and to be fixed on described circuit board, radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation, wherein, the thermal conductivity of described screen and/or described radome is lower than default thermal conductivity, to reduce the technological means entering into and the heat produced by least one electronic component be arranged on outside described radome of described cavity and described screen and/or described radome offer at least one through hole, like this, by decreasing the heat of thermal source near screen and radome importing, reduce the temperature rise at oscillator place, thus the probability making oscillator produce frequency drift reduces, the frequency error of oscillator self work reduces, further ensure the stability of the operating frequency of the electronic device that other are associated with oscillator, achieve the technique effect of the stability of the Circuits System improving whole electronic equipment.
Four, due to the technical scheme in the embodiment of the present application, the aperture of each thermal vias at least one thermal vias described is adopted to be less than or equal to the technological means of 1/4 of wavelength corresponding to the highest signal of described electronic equipment medium frequency, like this, as long as the aperture of thermal vias is less than 1/4 of wavelength, just can realize the effect reducing heat conduction and shielding interference simultaneously, ensure that radome and screen are under the prerequisite realizing its shielding interference signal, reduce the importing of the heat to neighbouring thermal source to greatest extent, achieve the function of shielding interference signal of balanced radome and screen and the technique effect of the function of heat radiation.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described by the accompanying drawing used required in describing embodiment below, apparently, the accompanying drawing in the following describes is only some embodiments of the present invention.
A kind of structural representation of resonant component of Fig. 1 for providing in the embodiment of the present application one;
Fig. 2 is the first set-up mode schematic diagram of screen 20 and radome 40 in the embodiment of the present application one;
Fig. 3 is the second set-up mode schematic diagram of screen 20 and radome 40 in the embodiment of the present application one;
Screen 20 is set to cancellated schematic diagram in the embodiment of the present application one by Fig. 4;
A kind of structural representation of electronic equipment of Fig. 5 for providing in the embodiment of the present application two.
Embodiment
The embodiment of the present application provides a kind of resonant component and electronic equipment, there is the technical problem producing frequency drift because of the impact of neighbouring thermal source in the crystal oscillator for solving electronic equipment of the prior art, realizes reducing the technique effect that crystal oscillator produces the probability of frequency drift.
Technical scheme in the embodiment of the present application is solve above-mentioned technical problem, and general thought is as follows:
A kind of resonant component, comprising:
Circuit board;
Screen, is arranged on described circuit board;
Oscillator, to be arranged on described screen and to be fixed on described circuit board;
Radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation;
Wherein, the thermal conductivity of described screen and/or described radome lower than default thermal conductivity, to reduce the heat produced by least one electronic component be arranged on outside described radome entering into described cavity.
In technique scheme, adopt circuit board, screen, is arranged on described circuit board, oscillator, to be arranged on described screen and to be fixed on described circuit board, radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation, wherein, the thermal conductivity of described screen and/or described radome is lower than default thermal conductivity, to reduce the technological means entering into the heat produced by least one electronic component be arranged on outside described radome of described cavity, like this, when heater members near oscillator produces a large amount of heats, because the thermal conductivity of screen and radome is low, so, the heat produced by heater members that screen and radome absorb is also corresponding less, thus inhibit the intensification degree of screen and radome, reduce heater members to affect the temperature of oscillator, further reduce because temperature raises the frequency drift brought, so, there is the technical problem producing frequency drift because of the impact of neighbouring thermal source in the crystal oscillator efficiently solving electronic equipment of the prior art, realize reducing the technique effect that crystal oscillator produces the probability of frequency drift.
In order to better understand technique scheme, below by accompanying drawing and specific embodiment, technical solution of the present invention is described in detail, the specific features being to be understood that in the embodiment of the present application and embodiment is the detailed description to technical solution of the present invention, instead of the restriction to technical solution of the present invention, when not conflicting, the technical characteristic in the embodiment of the present application and embodiment can be combined with each other.
Embodiment one
Please refer to Fig. 1, is a kind of structural representation of resonant component provided in the embodiment of the present application one.In actual applications, described resonant component specifically can be applied in the first electronic equipment, and described first electronic equipment can notebook computer, smart mobile phone, desktop computer etc., also can be that other needs to produce the electronic equipment of oscillator signal, at this, just differing one schematically illustrates.In the embodiment of the present application, will be applied in notebook computer for described resonant component, be described.
A kind of resonant component, comprising:
Circuit board 10;
Screen 20, is arranged on the circuit board 10;
Oscillator 30, is arranged on screen 20 and also fixes on the circuit board 10;
Radome 40, is arranged on the circuit board 10, and oscillator 30 is placed in the cavity of radome 40 formation;
Wherein, the thermal conductivity of screen 20 and/or radome 40 lower than default thermal conductivity, to reduce the heat produced by least one electronic component be arranged on outside radome 40 entering into described cavity.
In specific implementation process, when described resonant component is applied in notebook computer, described resonant component specifically can be arranged near processor, for providing clock signal etc. to processor, certainly, described resonant component also can be arranged on other positions in notebook computer by those skilled in the art, is not restricted in the embodiment of the present application.
In specific implementation process, the circuit board 10 of described resonant component can be can deformation circuit board, as: FlexiblePrintedCircuit (FPC, flexible printed circuit board), with polyester film or polyimides for base material, Copper Foil forms circuit and the one made has height reliability, the printed circuit of excellent flexibility by being etched in.It can meet the needs of original text density, miniaturization, lightweight, lightening, highly reliable future development, and can move arbitrarily at three dimensions and stretch, thus reaches element assembling and wire connecting integration; Circuit board 10 also can be can not deformation circuit board, as: PrintedCircuitBOARD (PCB, printed circuit board (PCB)), be commonly referred to hard printed circuit board, it is the supporter of electronic devices and components, the supplier that electronic devices and components electrical equipment connects, it can be divided into single sided board, double sided board, four laminates, six laminates and other multilayer circuit boards according to the wiring board number of plies.Those skilled in the art can select according to the material of actual user demand to circuit board, are not restricted in the embodiment of the present application.
In specific implementation process, near the processor being arranged on notebook computer for described resonant component, when processor is in running order, processor can generate electromagnetic waves, and this electromagnetic wave can have an impact to the job stability of oscillator, therefore, also need on the circuit board 10 to arrange screen 20 and radome 40, the interference electromagnetic wave produced with shielding processing device.
In the embodiment of the present application, screen 20 is made up of metal material and radome 40 is made up of metal material.
In specific implementation process, the metal material being used for making screen 20 and radome 40 has multiple.Such as, steel, aluminium etc., it is cheap and be easy to cutting, processing, bending and connection, and wherein, the conductivity of aluminium is higher, but easily chemical reaction occurs, and usually needs to carry out oxidation processes to its surface when using aluminum to make shield; The conductivity of mild steel is fine, and relative permeability is also comparatively large, better to the shield effectiveness of low frequency magnetic field, in order to improve the reflection characteristic of mild steel, also conductivity can be better than the zinc of steel or tin as coating, be plated to the surface of steel; Although stainless conductivity and magnetic permeability are all lower than mild steel, if the environment for use of electronic equipment is comparatively moist, stainless steel can be used as shielding material; The conductivity of red metal, brass, tin and metalloid is all higher, is easy to processing, directly can be used as shielding material, also can be plated and use on other metals, such as tin plate etc.Because the electric conductivity of metallic copper is better, usually can adopt and use copper as polymeric barrier layer materials.
When disturbing electromagnetic frequency higher, utilizing the eddy current produced in the metal material of low-resistivity, forming the negative function to external electromagnetic wave, thus reaching the effect of shielding; When disturbing electromagnetic frequency lower, the material of high permeability be adopted, thus make the magnetic line of force be limited in shield inside, preventing the space being diffused into shielding from going; In some cases, if when requiring, to high and low frequency electromagnetic field, all there is good shield effectiveness, often adopt different metal material composition shielding polylayer forests.Certainly, those skilled in the art also can select suitable metal material to make screen and radome according to actual service condition, are not restricted in the embodiment of the present application.
In specific implementation process, radome 40 is specifically made up of supporting leg and cover body, and supporting leg and cover body are for being flexibly connected, and cover body is crown.The thickness of cover body can be 0.2mm, certainly, can be also other thickness, not be restricted in the embodiment of the present application.According to the connected mode of radome 40 with circuit board 10, radome 40 specifically can be divided into two classes: fixed and removable.Wherein, fixed general employing surface mounting technology (SurfaceMountTechnology, SMT) is welded direct on circuit board 10; Removablely can adopt projection button snapping on radome 40 on the circuit board 10, not be restricted in the embodiment of the present application.
In the embodiment of the present application, screen 20 and radome 40 can have the concrete set-up mode of the following two kinds:
First kind of way, please refer to Fig. 2:
Radome 40 is arranged on screen 20, forms described cavity by radome 40 and screen 20.
In specific implementation process, the area of screen 20 is identical with oscillator 30 projected area on the circuit board 10, radome 40 projected area is on the circuit board 10 identical with the area of screen 20, by SMT mode, radome 40 and screen 20 are fixed connection, thus form an enclosed cavity by radome 40 and screen 20, wherein, the top of radome 40 and the distance of circuit board 10 are determined according to the thickness of oscillator 30, can be specifically be 0.1mm with the distance of oscillator 30, certainly, also can be other distance values, be not restricted in this application.
The second way, please refer to Fig. 3:
Radome 40 is arranged on the region of the circuit board 10 outside screen 20 edge.
In specific implementation process, the area of screen 20 is identical with oscillator 30 projected area on the circuit board 10, radome 40 projected area is on the circuit board 10 slightly larger than the area of screen 20, and be connected with circuit board 10 by the supporting leg of radome 40, concrete connected mode can be fixed and removable in any one, wherein, the supporting leg of radome 40 and border 0.1mm or 0.2mm of screen 20, be not restricted in this application.
In specific implementation process, oscillator 30 can be specifically crystal oscillator, RC oscillator or the ceramic resonance tank circuit etc., and those skilled in the art can select according to actual user demand, are not restricted in the embodiment of the present application.
In specific implementation process, because described resonant component is arranged near processor, when processor is in running order, also heat can be produced, and along with the increase of operating time, the heat of generation can get more and more.And screen 20 and radome 40 are made by metal material, therefore, can initiatively import the heat produced by processor, thus the temperature of oscillator 30 is raised.After the temperature of oscillator 30 raises, the frequency shifts of its oscillator signal produced can be made, thus affect the job stability of whole notebook computer.Therefore, in the embodiment of the present application, need to be restricted the thermal conductivity of screen 20 and radome 40, like this, because the thermal conductivity of screen 20 and radome 40 is low, so, the heat produced by heater members that screen 20 and radome 40 absorb is also corresponding less, thus inhibit the intensification degree of screen 20 and radome 40, reduce heater members to affect the temperature of oscillator 30, reduce because temperature raises the frequency drift brought, effectively reduce the probability that crystal oscillator produces frequency drift.
Specifically, in the embodiment of the present application, the thermal conductivity of screen 20 and/or radome 40 is lower than default thermal conductivity.Thermal conductivity corresponding when the frequency drift that described default thermal conductivity is less than or equal to oscillator 30 is 5ppm.That is, the frequency drift that the heat imported by screen 20 and radome 40 makes oscillator 30 produce should be less than or equal to 5ppm, to ensure the job stability of notebook computer.At some in particular cases, the requirement of the Circuits System in electronic equipment to frequency accuracy is higher, and now, described default thermal conductivity is lower.As, when described resonant component is applied in GPS Circuits System, thermal conductivity corresponding when the frequency drift that described default thermal conductivity is less than or equal to oscillator 30 is 3ppm.That is, the frequency drift that the heat imported by screen 20 and radome 40 makes oscillator 30 produce should be less than or equal to 3ppm.Certainly, those skilled in the art also can arrange described default thermal conductivity according to actual user demand.
The mode of the thermal conductivity of adjustment radome 40 and screen 20 can be by carrying out plated film on its surface, or adopts alloy mode to incorporate the lower other materials etc. of thermal conductivity, is not restricted in the embodiment of the present application.
In the embodiment of the present application, screen 20 and/or radome 40 offer at least one through hole, reduce the contact area of conductor and heat on the whole, the heat that the neighbouring thermal source that reduce further screen and radome importing produces, thus reduce the temperature rise at oscillator place.
In specific implementation process, at least one thermal vias described, the aperture of each thermal vias is less than or equal to 1/4 of wavelength corresponding to the highest signal of described electronic equipment medium frequency.Like this, ensure that thermal vias can not affect the function of the shielding interference signal of radome 40 and screen 20, also reduce the importing of the heat to neighbouring thermal source simultaneously, reach the function of shielding interference signal of balanced radome and screen and the effect of the function of heat radiation.
In specific implementation process, screen 20 and radome 40 all can be set to network structure, alveolate texture etc., please refer to Fig. 4, for screen 20 is set to cancellated schematic diagram.If the signal that the frequency in notebook computer is the highest is 3600MHz, the wavelength of this signal is: L=V/f=1/12m, then now the aperture of each thermal vias needs to be less than or equal to 1/4*12=1/48m ≈ 0.02m, as, the aperture of thermal vias can be set to 0.5cm, 0.1cm etc., those skilled in the art can be arranged according to actual user demand, are not restricted in the embodiment of the present application.
Embodiment two
Based on the inventive concept identical with embodiment one, the structural representation of a kind of electronic equipment provided in the embodiment of the present application two, please refer to Fig. 5.In actual applications, described electronic equipment can be notebook computer, smart mobile phone etc., also can be else need the electronic equipment of oscillator signal, and at this, just differing one schematically illustrates.In specific descriptions below, will be notebook computer for described electronic equipment, be described.
A kind of electronic equipment, comprising:
Housing 101;
At least one electronic component 201, is arranged in housing 101, and wherein, at least one electronic component 201, when in running order, can produce heat;
Resonant component 301, be arranged in housing 101, resonant component 301 comprises: circuit board; Screen, is arranged on described circuit board; Oscillator, to be arranged on described screen and to be fixed on described circuit board; Radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation; Wherein, the thermal conductivity of described screen and/or described radome is lower than default thermal conductivity, and to reduce the first heat entering into described cavity, described first heat is a part of heat in described heat.
In specific implementation process, notebook computer for described electronic equipment, at least one electronic component 201 described can be the processor of notebook computer, the video card etc. of notebook computer, certainly, the electronic device of heat can be produced when also can be other work, be not restricted in this application.
The described resonant component that the 26S Proteasome Structure and Function of resonant component 301 is a kind of with the embodiment of the present application is identical, is not just repeating at this.
In specific implementation process, continue to use above-mentioned example, when at least one electronic component 201 is the processor of notebook computer, the in running order meeting of processor generates electromagnetic waves, and this electromagnetic wave can have an impact to the job stability of resonant component 301, thus in resonant component 301, be provided with screen and radome, the interference electromagnetic wave produced with shielding processing device.
Processor, when in running order, also can produce amount of heat, and screen and radome is made by metal material, therefore, can initiatively import the heat produced by processor, thus the temperature of resonant component 301 is raised.After the temperature of resonant component 301 raises, the frequency shifts of its oscillator signal produced can be made, thus affect the job stability of whole notebook computer.Therefore, screen and/or radome offer at least one through hole, such as, screen and radome are set to network structure, reduce the contact area of conductor and heat on the whole, the heat that the neighbouring thermal source that reduce further screen and radome importing produces, thus reduce the temperature rise at oscillator place.
Thus, by arranging at least one thermal vias on the radome and screen of resonant component 301, make resonant component 301 not only can shield interference signal but also good radiating effect can be had, significantly reduce the frequency drift of resonant component 301, ensure that the job stability of whole electronic equipment.
By the one or more technical schemes in the embodiment of the present application, following one or more technique effect can be realized:
One, due to the technical scheme in the embodiment of the present application, circuit board is adopted, screen, is arranged on described circuit board, oscillator, to be arranged on described screen and to be fixed on described circuit board, radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation, wherein, the thermal conductivity of described screen and/or described radome is lower than default thermal conductivity, to reduce the technological means entering into the heat produced by least one electronic component be arranged on outside described radome of described cavity, like this, when heater members near oscillator produces a large amount of heats, because the thermal conductivity of screen and radome is low, so, the heat produced by heater members that screen and radome absorb is also corresponding less, thus inhibit the intensification degree of screen and radome, reduce heater members to affect the temperature of oscillator, further reduce because temperature raises the frequency drift brought, so, there is the technical problem producing frequency drift because of the impact of neighbouring thermal source in the crystal oscillator efficiently solving electronic equipment of the prior art, realize reducing the technique effect that crystal oscillator produces the probability of frequency drift.
Two, due to the technical scheme in the embodiment of the present application, adopt the technological means described screen and/or described radome offering at least one through hole, like this, owing to decreasing the area of screen and radome, so, decrease the contact area of conductor and heat on the whole, the heat that the neighbouring thermal source that reduce further screen and radome importing produces, thus reduce the temperature rise at oscillator place, achieve and reduce the technique effect that crystal oscillator produces the probability of frequency drift further.
Three, due to the technical scheme in the embodiment of the present application, circuit board is adopted, screen, is arranged on described circuit board, oscillator, to be arranged on described screen and to be fixed on described circuit board, radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation, wherein, the thermal conductivity of described screen and/or described radome is lower than default thermal conductivity, to reduce the technological means entering into and the heat produced by least one electronic component be arranged on outside described radome of described cavity and described screen and/or described radome offer at least one through hole, like this, by decreasing the heat of thermal source near screen and radome importing, reduce the temperature rise at oscillator place, thus the probability making oscillator produce frequency drift reduces, the frequency error of oscillator self work reduces, further ensure the stability of the operating frequency of the electronic device that other are associated with oscillator, achieve the technique effect of the stability of the Circuits System improving whole electronic equipment.
Four, due to the technical scheme in the embodiment of the present application, the aperture of each thermal vias at least one thermal vias described is adopted to be less than or equal to the technological means of 1/4 of wavelength corresponding to the highest signal of described electronic equipment medium frequency, like this, as long as the aperture of thermal vias is less than 1/4 of wavelength, just can realize the effect reducing heat conduction and shielding interference simultaneously, ensure that radome and screen are under the prerequisite realizing its shielding interference signal, reduce the importing of the heat to neighbouring thermal source to greatest extent, achieve the function of shielding interference signal of balanced radome and screen and the technique effect of the function of heat radiation.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. a resonant component, comprising:
Circuit board;
Screen, is arranged on described circuit board;
Oscillator, to be arranged on described screen and to be fixed on described circuit board;
Radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation;
Wherein, the thermal conductivity of described screen and/or described radome lower than default thermal conductivity, to reduce the heat produced by least one electronic component be arranged on outside described radome entering into described cavity.
2. resonant component as claimed in claim 1, is characterized in that, described screen and/or described radome offer at least one through hole.
3. resonant component as claimed in claim 2, it is characterized in that, described radome is arranged on described screen, forms described cavity by described radome and described screen.
4. resonant component as claimed in claim 2, it is characterized in that, described radome is arranged on the region of the described circuit board outside described screen edge.
5. the resonant component as described in claim arbitrary in claim 1-4, is characterized in that, thermal conductivity corresponding when the frequency drift that described default thermal conductivity is less than or equal to described oscillator is 5ppm.
6. the resonant component as described in claim arbitrary in claim 1-4, is characterized in that, when described oscillator application is in gps system, and thermal conductivity corresponding when the frequency drift that described default thermal conductivity is less than or equal to described oscillator is 3ppm.
7. resonant component as claimed in claim 2, it is characterized in that, at least one thermal vias described, the aperture of each thermal vias is less than or equal to 1/4 of wavelength corresponding to the highest signal of described electronic equipment medium frequency.
8. resonant component as claimed in claim 7, it is characterized in that, the area of described screen is identical with the projected area of described oscillator on described circuit board.
9. resonant component as claimed in claim 8, it is characterized in that, described radome and/or described screen are made up of metal material.
10. an electronic equipment, comprising:
Housing;
At least one electronic component, is arranged in described housing, and wherein, at least one electronic component described, when in running order, can produce heat;
Resonant component, be arranged in described housing, described resonant component comprises: circuit board; Screen, is arranged on described circuit board; Oscillator, to be arranged on described screen and to be fixed on described circuit board; Radome, is arranged on described circuit board, and described oscillator is placed in the cavity of described radome formation; Wherein, the thermal conductivity of described screen and/or described radome is lower than default thermal conductivity, and to reduce the first heat entering into described cavity, described first heat is a part of heat in described heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511001557.8A CN105472873A (en) | 2015-12-28 | 2015-12-28 | Resonant component and electronic equipment |
Applications Claiming Priority (1)
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Cited By (5)
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| CN107148142A (en) * | 2017-06-15 | 2017-09-08 | 广东欧珀移动通信有限公司 | Circuit board assemblies and electronic installation |
| CN107517540A (en) * | 2017-08-03 | 2017-12-26 | 晶晨半导体(上海)股份有限公司 | A kind of heat abstractor and a kind of multimedia terminal |
| CN108132682A (en) * | 2017-12-12 | 2018-06-08 | 北京自动化控制设备研究所 | A kind of circuit for reducing crystal oscillator operating temperature |
| WO2018220569A1 (en) * | 2017-06-02 | 2018-12-06 | International Business Machines Corporation | Resonant clock circuit with magnetic shield |
| CN112424732A (en) * | 2018-07-18 | 2021-02-26 | 希迪普公司 | Writing pen |
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| CN104168749A (en) * | 2013-05-17 | 2014-11-26 | 纬创资通股份有限公司 | Electronic device and electromagnetic interference shield structure |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018220569A1 (en) * | 2017-06-02 | 2018-12-06 | International Business Machines Corporation | Resonant clock circuit with magnetic shield |
| CN110679086A (en) * | 2017-06-02 | 2020-01-10 | 国际商业机器公司 | Resonant clock circuit with magnetic shielding |
| GB2577210A (en) * | 2017-06-02 | 2020-03-18 | Ibm | Resonant clock circuit with magnetic shield |
| US10797642B2 (en) | 2017-06-02 | 2020-10-06 | International Business Machines Corporation | Resonant clock circuit with magnetic shield |
| US10998854B2 (en) | 2017-06-02 | 2021-05-04 | International Business Machines Corporation | Resonant clock circuit with magnetic shield |
| GB2577210B (en) * | 2017-06-02 | 2022-05-11 | Ibm | Resonant clock circuit with magnetic shield |
| CN107148142A (en) * | 2017-06-15 | 2017-09-08 | 广东欧珀移动通信有限公司 | Circuit board assemblies and electronic installation |
| CN107517540A (en) * | 2017-08-03 | 2017-12-26 | 晶晨半导体(上海)股份有限公司 | A kind of heat abstractor and a kind of multimedia terminal |
| CN108132682A (en) * | 2017-12-12 | 2018-06-08 | 北京自动化控制设备研究所 | A kind of circuit for reducing crystal oscillator operating temperature |
| CN112424732A (en) * | 2018-07-18 | 2021-02-26 | 希迪普公司 | Writing pen |
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