CN109166467A - A kind of LED display and LED display mould group - Google Patents
A kind of LED display and LED display mould group Download PDFInfo
- Publication number
- CN109166467A CN109166467A CN201810976806.2A CN201810976806A CN109166467A CN 109166467 A CN109166467 A CN 109166467A CN 201810976806 A CN201810976806 A CN 201810976806A CN 109166467 A CN109166467 A CN 109166467A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- pad
- led display
- mould group
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention relates to field of LED display, in particular to a kind of LED display and LED display mould group.A kind of LED display mould group, including pcb board, the pcb board are equipped with copper foil, and pad is equipped on the top end face of the copper foil, and the area of the top end face of the copper foil is greater than the contact area that the pad is contacted with the copper foil.Pad is equipped on the top end face of copper foil, the area of the top end face of copper foil is greater than the contact area that pad is contacted with copper foil, increase the area of copper foil, to increase the anticollision power of pad, so that pad is not easy to fall off from pcb board, aim to solve the problem that existing LED display mould group, pad is easy the problem of falling off from pcb board.
Description
Technical field
The present invention relates to field of LED display, in particular to a kind of LED display and LED display mould group.
Background technique
In the prior art, LED display mould group has to some extent under by outer collision by the pad on pcb board
Damage, and pad is easy to fall off from pcb board, causes LED display mould group to fail and scraps, cannot repair.
Summary of the invention
In view of the shortcomings of the prior art, the present invention proposes a kind of LED display and LED display mould group, it is intended to solve existing
LED display mould group, pad is easy the problem of falling off from pcb board.
Technical solution proposed by the present invention is:
A kind of LED display mould group, including pcb board, the pcb board is equipped with copper foil, on the top end face of the copper foil
Equipped with pad, the area of the top end face of the copper foil is greater than the contact area that the pad is contacted with the copper foil.
Further, the area of the top end face of the copper foil is the contact area that the pad is contacted with the copper foil
2.6 again.
Further, the copper foil is in rectangle, and the pad is set to one end of the copper foil, and the width of the pad is less than institute
State the width of copper foil.
Further, the copper foil be in rectangle, the pad be set to the copper foil one end, the pad width with it is described
The width of copper foil is equal.
Further, the copper thickness of the copper foil is 1 ounce.
Further, the lead of the pad is placed under the bottom side of the copper foil.
Further, the pcb board is equipped with cable hole, and the cable hole is placed under the bottom side of the copper foil, the weldering
The lead of disk is placed in the bottom side of the pcb board by the cable hole.
Further, the quantity of the copper foil is multiple, and the pad is equipped on the top end face on each copper foil, more
A copper foil on the pcb board, is respectively arranged and is stitched between having between the copper foil by column distribution.
The present invention also provides a kind of LED displays, including a kind of above-mentioned LED display mould group.
According to above-mentioned technical solution, the invention has the advantages that: pad, the top of copper foil are equipped on the top end face of copper foil
The area in face is greater than the contact area that pad is contacted with copper foil, increases the area of copper foil, thus increase the anticollision power of pad, so that
Pad is not easy to fall off from pcb board, it is intended to solve existing LED display mould group, what pad was easy to fall off from pcb board asks
Topic.
Detailed description of the invention
Fig. 1 is the schematic diagram using LED display mould group provided in an embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
As shown in Figure 1, the embodiment of the present invention proposes that a kind of LED display mould group 1, LED display mould group 1 include pcb board
2, pcb board 2 is equipped with copper foil 3, is equipped with pad 4 on the top end face of copper foil 3, the area of the top end face of copper foil 3 be greater than pad 4 with
The contact area that copper foil 3 contacts.
In the present embodiment, pad 4 is on the top end face of copper foil 3, and the area of copper foil 3 is greater than the area of pad 4, specifically
Ground, the area of the top end face of copper foil 3 are greater than the contact area that pad 4 is contacted with copper foil 3, increase the area of copper foil 3, to increase
The anticollision power of pad 4, so that pad 4 is not easy to fall off from pcb board 2, it is intended to solve existing LED display mould group 1, pad
4 are easy the problem of falling off from pcb board 2.
In the present embodiment, the area of the top end face of copper foil 3 is 2.6 times of the contact area that pad 4 is contacted with copper foil 3.
Increase the area of copper foil 3, not only increases the anticollision power of pad 4, also enhance the heat dissipation effect of pad 4.
In the present embodiment, copper foil 3 is in rectangle, and pad 4 is set to one end of copper foil 3, the wide width less than copper foil 3 of pad 4.
In the present embodiment, copper foil 3 is rectangle, and in order to be printed on pad 4 preferably on copper foil 3, the wide of pad 4 is less than copper foil 3
Width.
In some embodiments, copper foil 3 is in rectangle, and pad 4 is set to one end of copper foil 3, the width of the wide and copper foil 3 of pad 4
It is equal.Specifically, copper foil 3 is rectangle, in order to be printed on pad 4 preferably on copper foil 3, the width of the wide and copper foil 3 of pad 4
It is equal, further increase the anticollision power of pad 4.
In the present embodiment, the copper thickness of copper foil 3 is 1 ounce.It is, the copper thickness of copper foil 3 is 35um.
In the present embodiment, the lead of pad 4 is placed under the bottom side of copper foil 3.In order to make the preferably cabling of pcb board 2, weld
The lead of disk 4 is placed under the bottom side of copper foil 3.
Further for the preferably cabling of pcb board 2 is made, pcb board 2 is equipped with cable hole, and cable hole is placed in the bottom side of copper foil 3
Under, the lead of pad 4 is placed in the bottom side of pcb board 2 by cable hole.
In the present embodiment, the quantity of copper foil 3 is multiple, is equipped with pad 4, Duo Getong on the top end face on each copper foil 3
Foil 3 on pcb board 2, is stitched by column distribution between having between each column copper foil 3.It is more in order to make 3 reasonable layout of copper foil on pcb board 2
A copper foil 3 on pcb board 2, is stitched by column distribution between having between each column copper foil 3.
The embodiment of the present invention proposes a kind of LED display, including a kind of above-mentioned LED display mould group 1.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (9)
1. a kind of LED display mould group, which is characterized in that including pcb board, the pcb board is equipped with copper foil, in the copper foil
Top end face is equipped with pad, and the area of the top end face of the copper foil is greater than the contact area that the pad is contacted with the copper foil.
2. a kind of LED display mould group according to claim 1, which is characterized in that the area of the top end face of the copper foil
It is 2.6 times of the contact area that the pad is contacted with the copper foil.
3. a kind of LED display mould group according to claim 1, which is characterized in that the copper foil is in rectangle, the pad
Set on one end of the copper foil, the width of the pad is less than the width of the copper foil.
4. a kind of LED display mould group according to claim 1, which is characterized in that the copper foil is in rectangle, the pad
Set on one end of the copper foil, the width of the pad is equal with the width of the copper foil.
5. a kind of LED display mould group according to claim 1, which is characterized in that the copper thickness of the copper foil is 1 ounce.
6. a kind of LED display mould group according to claim 1, which is characterized in that the lead of the pad is placed in described
Under the bottom side of copper foil.
7. a kind of LED display mould group according to claim 6, which is characterized in that the pcb board is equipped with cable hole, institute
It states cable hole to be placed under the bottom side of the copper foil, the lead of the pad is placed in the bottom of the pcb board by the cable hole
Side.
8. a kind of LED display mould group according to claim 1, which is characterized in that the quantity of the copper foil be it is multiple, respectively
The pad is equipped on top end face on the copper foil, multiple copper foils press column distribution on the pcb board, described in each column
It is stitched between having between copper foil.
9. a kind of LED display, which is characterized in that including a kind of LED display mould group a method as claimed in any one of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810976806.2A CN109166467A (en) | 2018-08-25 | 2018-08-25 | A kind of LED display and LED display mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810976806.2A CN109166467A (en) | 2018-08-25 | 2018-08-25 | A kind of LED display and LED display mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109166467A true CN109166467A (en) | 2019-01-08 |
Family
ID=64896875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810976806.2A Pending CN109166467A (en) | 2018-08-25 | 2018-08-25 | A kind of LED display and LED display mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109166467A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102654250A (en) * | 2011-03-04 | 2012-09-05 | 黄甜仔 | Heat-radiating structure of lamp panel of LED daylight lamp |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
| CN104411088A (en) * | 2014-12-02 | 2015-03-11 | 青岛歌尔声学科技有限公司 | Anti-dropping bonding pad, circuit board, and circuit board printing method |
| CN105636348A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN205648195U (en) * | 2016-05-20 | 2016-10-12 | 柳梦洁 | Circuit board and penetrating LED display screen |
-
2018
- 2018-08-25 CN CN201810976806.2A patent/CN109166467A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102654250A (en) * | 2011-03-04 | 2012-09-05 | 黄甜仔 | Heat-radiating structure of lamp panel of LED daylight lamp |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
| CN104411088A (en) * | 2014-12-02 | 2015-03-11 | 青岛歌尔声学科技有限公司 | Anti-dropping bonding pad, circuit board, and circuit board printing method |
| CN105636348A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN205648195U (en) * | 2016-05-20 | 2016-10-12 | 柳梦洁 | Circuit board and penetrating LED display screen |
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