CN104411088A - Anti-dropping bonding pad, circuit board, and circuit board printing method - Google Patents
Anti-dropping bonding pad, circuit board, and circuit board printing method Download PDFInfo
- Publication number
- CN104411088A CN104411088A CN201410717101.0A CN201410717101A CN104411088A CN 104411088 A CN104411088 A CN 104411088A CN 201410717101 A CN201410717101 A CN 201410717101A CN 104411088 A CN104411088 A CN 104411088A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- circuit board
- oil reservoir
- pad
- solder mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses an anti-dropping bonding pad, a circuit board, and a circuit board printing method, wherein the anti-dropping bonding pad comprises copper foil adhered to a base material of the circuit board, the copper foil is electrically connected with a wire route on the base material of the circuit board, the copper foil comprises a central solder mask layer in the central area and an oil coating layer in the peripheral area, and the upper surface of the oil coating layer is coated with a green oil layer. The anti-dropping bonding pad divides the whole copper foil into the central solder mask layer in the central area and the oil coating layer in the peripheral area, and the upper surface of the oil coating layer is coated with the green oil layer, so that on the one hand, the fixing area of the bonding pad and the base material of the circuit board is increased, when an upward-pulling external force is applied to the bonding pad, the force in a unit area is dispersed, the bonding pad is not easily pulled up, on the other hand, the green oil layer has a pressing force on the copper foil, so that the difficulty of pulling up the bonding pad is further increased, and the bonding pad does not fall off easily in the operation process.
Description
Technical field
The invention belongs to circuit board technology field, specifically, relate to a kind of slip-off preventing pad, circuit board and circuit board printing method.
Background technology
PCB (printed circuit board (PCB)) often can use test point when scheduling and planning; often need out to be debugged by pads wire in test point when such as software burning debugging etc. are resolved; if use accidentally; often can run into the whole copper sheet of pad by the situation of pulling out; if pad draws whole circuit board substantially by chip source will be scrapped; higher and the waste resource of risk, increases scheduling and planning difficulty, is unfavorable for reducing costs.
Summary of the invention
The present invention, in order to solve existing pad easily from the problem that circuit board comes off, proposes a kind of slip-off preventing pad, and attachment is more firm, is not easy to come off.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions:
A kind of slip-off preventing pad, comprise the Copper Foil be mounted on board substrate, described Copper Foil is electrically connected with the circuit trace on described board substrate, and what described Copper Foil comprised the center solder mask that is positioned at central area and was positioned at outer edge area covers oil reservoir, described in cover oil reservoir upper surface and be coated with green oil layer.
Further, described Copper Foil is formed in one structure.
Preferably, described Copper Foil is circular Copper Foil, and described center solder mask is circular, described in cover oil reservoir be annular.
Based on above-mentioned a kind of slip-off preventing pad, the present invention proposes a kind of circuit board simultaneously, the pad comprising board substrate, circuit trace and be electrically connected with described circuit trace, described pad comprises the Copper Foil be mounted on described board substrate, what described Copper Foil comprised the center solder mask that is positioned at central area and was positioned at outer edge area covers oil reservoir, described in cover oil reservoir upper surface and be coated with green oil layer.
Preferably, in order to prevent center solder mask just in case come off from circuit board, whole circuit board is unlikely to scrap, and described circuit trace and the described oil reservoir that covers are electrically connected.Therefore, by scraping the green oil covering oil reservoir surface off, the Copper Foil exposed can use as test point.
Further, described Copper Foil is formed in one structure.
Further again, described Copper Foil is circular Copper Foil, and described center solder mask be circle, described in cover oil reservoir be annular.
Based on above-mentioned a kind of circuit board, the invention allows for a kind of circuit board printing method, comprise the step of attachment pad, described pad comprises Copper Foil, and the step of described attachment pad comprises:
(1), by Copper Foil be mounted on board substrate, and described Copper Foil is electrically connected with circuit trace;
(2), described Copper Foil comprise the center solder mask that is positioned at central area and be positioned at outer edge area cover oil reservoir, the described surface covering oil reservoir is applied green oil layer together with the headroom district around described Copper Foil.
Preferably, in order to prevent center solder mask just in case come off from circuit board, whole circuit board is unlikely to scrap, and in described step (1), described circuit trace and the described oil reservoir that covers are electrically connected.Therefore, by scraping the green oil covering oil reservoir surface off, the Copper Foil exposed can use as test point.
Further again, described Copper Foil is circular integrated formed structure, and described center solder mask be circle, described in cover oil reservoir be annular.
Compared with prior art, advantage of the present invention and good effect are: slip-off preventing pad of the present invention, oil reservoir is covered by what whole Copper Foil is divided into the center solder mask that is positioned at central area and is positioned at outer edge area, and be coated with green oil layer at the described oil reservoir upper surface that covers, on the one hand, in order to meet the function of pad, ensure that the Copper Foil (Ye Ji center solder mask) of exposed part can use as test point welding, the pad Copper Foil diameter not covering oil reservoir region certainly will be greater than by the diameter of pad Copper Foil in the present embodiment, therefore, the fixed-area of large bonding pad and board substrate can be added, when the external force that pad is upwards pulled out, discrete units area stressed, can not be pulled out easily, in addition on the one hand, green oil is covered by the oil reservoir that covers in outer edge area, integrally green oil is covered with the headroom district be positioned at around Copper Foil, form the green oil layer of whole, green oil layer has thrust to Copper Foil, pad can be further increased by the difficulty of pulling out, difficult drop-off more in operation.
After reading the detailed description of embodiment of the present invention by reference to the accompanying drawings, the other features and advantages of the invention will become clearly.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of example structure schematic diagram of slip-off preventing pad proposed by the invention;
Fig. 2 is a kind of example structure schematic diagram of circuit board proposed by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment one, the present embodiment proposes a kind of slip-off preventing pad, as shown in Figure 1, comprise the Copper Foil 11 be mounted on board substrate, described Copper Foil 11 is electrically connected with the circuit trace be arranged on board substrate, what described Copper Foil 11 comprised the center solder mask 110 that is positioned at central area and was positioned at outer edge area covers oil reservoir 111, described in cover oil reservoir 111 upper surface and be coated with green oil layer.The slip-off preventing pad of the present embodiment, oil reservoir 111 is covered by what whole Copper Foil 11 is divided into the center solder mask 110 that is positioned at central area and is positioned at outer edge area, and be coated with green oil layer (angle reason at described oil reservoir 111 upper surface that covers, not shown), on the one hand, in order to meet the function of pad, ensure that the Copper Foil (Ye Ji center solder mask 110) of exposed part can use as test point welding, because in current technology, pad entirety is exposed, the diameter of the center solder mask 110 of minimum guarantee the present embodiment pad is suitable with the diameter of existing pad, the present embodiment pad also comprises in addition and covers oil reservoir 111, therefore, in the present embodiment the diameter of pad Copper Foil 11 be greater than do not cover oil reservoir region in prior art pad Copper Foil diameter (such as, in circuit board, the Copper Foil diameter of existing pad is 1.0mm, the diameter arranging center solder mask 110 that needs of the present embodiment is 1.0mm, and the width covering oil reservoir 111 is not less than 0.5mm, therefore the diameter being equivalent to the present embodiment pad is 1.5mm, be greater than the diameter 1.0mm of existing pad), increase the fixed-area of pad and board substrate, when the external force that pad is upwards pulled out, the stressed of unit are can be reduced, can not be pulled out easily, in addition on the one hand, green oil is covered by the oil reservoir that covers in outer edge area, it integrally can cover green oil with the headroom district be positioned at around Copper Foil, form the green oil layer of whole, green oil layer has thrust to Copper Foil, pad can be further increased by the difficulty of pulling out, difficult drop-off more in operation.
As a preferred embodiment, in the present embodiment, described Copper Foil 11 is formed in one structure, also be, the center solder mask 110 being positioned at central area and the oil reservoir 111 that covers being positioned at outer edge area are one, and both materials are identical, therefore both are electrical connections, can increase pad like this by the difficulty of pulling out.
In order to improve the versatility of the present embodiment pad, it is made more to be applicable to the PCB of various model, described Copper Foil 11 preferably adopts circular Copper Foil as shown in Figure 1, and conveniently pad solder electronic device or welding test wires, described center solder mask 110 also should be circular mutually, therefore, described in cover oil reservoir 111 for annular, be looped around described center solder mask 110 1 weeks.
Embodiment two, based on a kind of slip-off preventing pad in embodiment one, the present embodiment proposes a kind of circuit board, as shown in Figure 2, the pad comprising board substrate 13, circuit trace 14 and be electrically connected with described circuit trace 14, described pad comprises the Copper Foil 11 be mounted on described board substrate, and what described Copper Foil 11 comprised the center solder mask 110 that is positioned at central area and was positioned at outer edge area covers oil reservoir 111, described in cover oil reservoir 111 upper surface and be coated with green oil layer.As shown in Figure 2, pad is one block of independently Copper Foil 11 in board substrate 13, the surrounding of this Copper Foil 11 is headroom district 15, for Copper Foil 11 is isolated with other copper sheet regions on circuit board, headroom district 15 upper surface is coated with green oil layer equally, therefore, the green oil layer of the green oil layer and headroom district 15 upper surface of preferably covering oil reservoir 111 upper surface is structure as a whole, form the green oil layer of whole, green oil layer has thrust to Copper Foil 11, pad can be further increased by the difficulty of pulling out, in operation difficult drop-off more.
As a preferred embodiment, in the present embodiment, in order to prevent center solder mask 110 just in case come off from circuit board, whole circuit board is unlikely to scrap, and described circuit trace 14 is electrically connected with the described oil reservoir 111 that covers.When pad be subject to external force be unplugged time, generally that exposed copper foil portion divides (Ye Ji center solder mask 110) to be unplugged, covering oil reservoir 111 is still attached on board substrate 13, due to circuit trace 14 with cover oil reservoir 111 and be electrically connected, therefore, this pad also does not directly come off completely, by scraping the green oil covering oil reservoir 111 surface off, the Copper Foil exposed replaces the effect of former center solder mask 110, can continue to use as test point, and then whole circuit board is unlikely to scrap, can also continue to use.
Preferably in the present embodiment, described Copper Foil 11 is formed in one structure, is also, the center solder mask 110 being positioned at central area and the oil reservoir 111 that covers being positioned at outer edge area are one, and both materials are identical, therefore both are electrical connections, can increase pad like this by the difficulty of pulling out.
As a same reason, in order to improve the versatility of circuit board, its solder joint is made to go for the welding of polytype electronic device or test pin, in the present embodiment, described Copper Foil 11 is circular Copper Foil, described center solder mask 110 is circular, and therefore covering oil reservoir 111 part described in remainder is annular.
Embodiment three, based on a kind of circuit board in embodiment two, the present embodiment proposes a kind of circuit board printing method, this circuit board printing method comprises the step of attachment pad, as shown in Figure 2, described pad comprises Copper Foil 11 to the structural representation of circuit board, and the step of described attachment pad comprises:
S1, Copper Foil 11 to be mounted on board substrate 13, and described Copper Foil 11 is electrically connected with circuit trace 14;
What S2, described Copper Foil 11 comprised the center solder mask 110 that is positioned at central area and be positioned at outer edge area covers oil reservoir 111, and the described surface covering oil reservoir 111 is applied green oil layer together with the headroom district 15 around described Copper Foil 11.
By the described surface covering oil reservoir 111 is applied green oil layer together with the headroom district 15 around described Copper Foil 11 in the present embodiment, the green oil layer formed is structure as a whole, also the green oil layer of oil reservoir 111 surface and whole of surface, headroom district 15 formation is namely covered, green oil layer has thrust to covering oil reservoir 111, also firmly grasp by Copper Foil 11 and surrounding headroom district, pad can be further increased by the difficulty of pulling out, in operation difficult drop-off more.In addition, in order to meet the function of pad, ensure that the Copper Foil (Ye Ji center solder mask 110) of exposed part can use as test point welding, because in current technology, pad entirety is exposed, need the diameter of the diameter of the center solder mask 110 of minimum guarantee the present embodiment pad and existing pad suitable, oil reservoir 111 is covered because the present embodiment pad also comprises in addition, therefore, in the present embodiment, the actual diameter of pad Copper Foil 11 is greater than the pad Copper Foil diameter not covering oil reservoir region in prior art, and then increase the fixed-area of pad and board substrate, when the external force that pad is upwards pulled out, the stressed of unit are can be reduced, can not be pulled out easily.
As a preferred embodiment, in order to prevent center solder mask just in case come off from circuit board, whole circuit board is unlikely to scrap, and in described step S1, described circuit trace and the described oil reservoir that covers is electrically connected.When pad be subject to external force be unplugged time, generally that exposed copper foil portion divides (Ye Ji center solder mask 110) to be unplugged, covering oil reservoir 111 is still attached on board substrate 13, due to circuit trace 14 with cover oil reservoir 111 and be electrically connected, therefore, this pad also does not directly come off completely, by scraping the green oil covering oil reservoir 111 surface off, the Copper Foil exposed replaces the effect of former center solder mask 110, can continue to use as test point, and then whole circuit board is unlikely to scrap, can also continue to use.
As a same reason, in order to improve the versatility of the circuit board printed by this method, make its solder joint go for the welding of polytype electronic device or test pin, described Copper Foil is circular integrated formed structure, described center solder mask is circular, described in cover oil reservoir be annular.
Certainly; above-mentioned explanation is not limitation of the present invention; the present invention is also not limited in above-mentioned citing, the change that those skilled in the art make in essential scope of the present invention, remodeling, interpolation or replacement, also should belong to protection scope of the present invention.
Claims (10)
1. a slip-off preventing pad, comprise the Copper Foil be mounted on board substrate, described Copper Foil is electrically connected with the circuit trace on described board substrate, it is characterized in that, what described Copper Foil comprised the center solder mask that is positioned at central area and was positioned at outer edge area covers oil reservoir, described in cover oil reservoir upper surface and be coated with green oil layer.
2. slip-off preventing pad according to claim 1, is characterized in that, described Copper Foil is formed in one structure.
3. slip-off preventing pad according to claim 1 and 2, is characterized in that, described Copper Foil is circular Copper Foil, and described center solder mask is circular, described in cover oil reservoir be annular.
4. a circuit board, the pad comprising board substrate, circuit trace and be electrically connected with described circuit trace, described pad comprises the Copper Foil be mounted on described board substrate, it is characterized in that, what described Copper Foil comprised the center solder mask that is positioned at central area and was positioned at outer edge area covers oil reservoir, described in cover oil reservoir upper surface and be coated with green oil layer.
5. circuit board according to claim 4, is characterized in that, described circuit trace and the described oil reservoir that covers are electrically connected.
6. circuit board according to claim 5, is characterized in that, described Copper Foil is formed in one structure.
7. the circuit board according to any one of claim 4-6, is characterized in that, described Copper Foil is circular Copper Foil, and described center solder mask is circular, described in cover oil reservoir be annular.
8. a circuit board printing method, comprise the step of attachment pad, described pad comprises Copper Foil, it is characterized in that, the step of described attachment pad comprises:
(1), by Copper Foil be mounted on board substrate, and described Copper Foil is electrically connected with circuit trace;
(2), described Copper Foil comprise the center solder mask that is positioned at central area and be positioned at outer edge area cover oil reservoir, the described surface covering oil reservoir is applied green oil layer together with the headroom district around described Copper Foil.
9. circuit board printing method according to claim 8, is characterized in that, described Copper Foil is formed in one structure.
10. circuit board printing method according to claim 8 or claim 9, is characterized in that, described Copper Foil is circular integrated formed structure, and described center solder mask be circle, described in cover oil reservoir be annular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410717101.0A CN104411088A (en) | 2014-12-02 | 2014-12-02 | Anti-dropping bonding pad, circuit board, and circuit board printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410717101.0A CN104411088A (en) | 2014-12-02 | 2014-12-02 | Anti-dropping bonding pad, circuit board, and circuit board printing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104411088A true CN104411088A (en) | 2015-03-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410717101.0A Pending CN104411088A (en) | 2014-12-02 | 2014-12-02 | Anti-dropping bonding pad, circuit board, and circuit board printing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104411088A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109166467A (en) * | 2018-08-25 | 2019-01-08 | 深圳市雷凌显示技术有限公司 | A kind of LED display and LED display mould group |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10313167A (en) * | 1997-05-12 | 1998-11-24 | Canon Inc | Wiring board |
| WO2002058443A1 (en) * | 2001-01-16 | 2002-07-25 | Delaware Capital Formation, Inc. | Contact pads and circuit boards incorporating same |
| CN201298961Y (en) * | 2008-12-15 | 2009-08-26 | 浙江哈勃电子科技有限公司 | PCB circuit board |
| CN201533447U (en) * | 2009-07-30 | 2010-07-21 | 北京星网锐捷网络技术有限公司 | Surface mounting device and printed circuit board |
| CN201601891U (en) * | 2010-02-08 | 2010-10-06 | 华为终端有限公司 | Printed circuit board |
| CN202364474U (en) * | 2011-11-24 | 2012-08-01 | 惠州Tcl移动通信有限公司 | PCB structure for handset |
-
2014
- 2014-12-02 CN CN201410717101.0A patent/CN104411088A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10313167A (en) * | 1997-05-12 | 1998-11-24 | Canon Inc | Wiring board |
| WO2002058443A1 (en) * | 2001-01-16 | 2002-07-25 | Delaware Capital Formation, Inc. | Contact pads and circuit boards incorporating same |
| CN201298961Y (en) * | 2008-12-15 | 2009-08-26 | 浙江哈勃电子科技有限公司 | PCB circuit board |
| CN201533447U (en) * | 2009-07-30 | 2010-07-21 | 北京星网锐捷网络技术有限公司 | Surface mounting device and printed circuit board |
| CN201601891U (en) * | 2010-02-08 | 2010-10-06 | 华为终端有限公司 | Printed circuit board |
| CN202364474U (en) * | 2011-11-24 | 2012-08-01 | 惠州Tcl移动通信有限公司 | PCB structure for handset |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109166467A (en) * | 2018-08-25 | 2019-01-08 | 深圳市雷凌显示技术有限公司 | A kind of LED display and LED display mould group |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150311 |