CN201194446Y - PCB circuit board - Google Patents
PCB circuit board Download PDFInfo
- Publication number
- CN201194446Y CN201194446Y CNU2008200929520U CN200820092952U CN201194446Y CN 201194446 Y CN201194446 Y CN 201194446Y CN U2008200929520 U CNU2008200929520 U CN U2008200929520U CN 200820092952 U CN200820092952 U CN 200820092952U CN 201194446 Y CN201194446 Y CN 201194446Y
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- CN
- China
- Prior art keywords
- pcb
- mainboard
- circuit board
- daughter board
- pcb circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a PCB circuit board comprising a main board. A PCB sub board for guiding stream and eliminating heat is arranged on the main board. The PCB circuit board guides stream and eliminates heat for the high temperature area on the main board through the PCB sub board; on the one hand, well distributing and eliminating heat effects can be achieved, on the other hand, the problem of safe insulating distance with the peripheral devices is not considered, and meanwhile, the cost is low, the volume is small, the arrange space of the main board is not occupied, and the arrangement density of the main board is reduced; in addition, the implementing technique is simple, better coherence and reliably are included in the utility model.
Description
Technical field
The utility model relates to circuit board, more particularly, relates to a kind of PCB circuit board that mainboard is carried out flow-guiding radiation by the PCB daughter board.
Background technology
Along with improving constantly of power designs density, zone, veneer top often needs logical big electric current, and this just causes this regional temperature higher, so heat dissipation problem has become the focus of paying close attention to.At present, comparatively common solution: 1, adopt the busbar flow-guiding radiation; 2, adopt the radiator flow-guiding radiation; 3, adopt the manual mode flow-guiding radiation of warding off tin.The defective of prior art: a, adopt the mode of busbar flow-guiding radiation, 1), the material of busbar is generally copper, so cost is higher; 2), the busbar volume is not little, and this is as electric conductor, therefore also need to consider and peripheral devices between the safety insulation distance, this arrangement space that just causes this scheme to take is bigger, with product high density designs contradiction; 3), consider the EMC problem of veneer, busbar need be consistent with the shop copper direction of PCB internal layer, this often just causes many bendings designs of busbar, brings certain degree of difficulty for the processing and fabricating of busbar itself; B, adopt the mode of radiator to carry out flow-guiding radiation then to need radiator directly is bonded on the PCB, at first difficultly on the technology realize that the volume of radiator own is not little in addition, be not inconsistent with the high density designs of product; C, the manual mode of warding off tin of employing at first realize cumbersome on technology, need expend a large amount of man-hours, and in addition, consistency of product is difficult to be guaranteed.
The utility model content
The technical problems to be solved in the utility model is, at the above-mentioned defective of prior art, provides a kind of PCB circuit board that mainboard is carried out flow-guiding radiation by the PCB daughter board.
The technical scheme that its technical problem that solves the utility model adopts is: construct a kind of PCB circuit board, comprise mainboard, described mainboard is provided with the PCB daughter board that is used for flow-guiding radiation.
In PCB circuit board described in the utility model, described PCB daughter board is arranged on the position of staggering mutually with the paster device area on the mainboard.
In PCB circuit board described in the utility model, described mainboard is provided with pad, and described PCB daughter board correspondence is provided with welding hole, and described PCB daughter board is weldingly fixed on the described mainboard.
Preferably, described PCB daughter board is welded on the described mainboard by Reflow Soldering.
Preferably, the profile of described pad is square, and the profile of described welding hole is oval.
Implement in the PCB circuit board of the present utility model, has following beneficial effect: by flow-guiding radiation being carried out in the higher zone of mainboard temperature with the PCB daughter board, on the one hand owing in the PCB daughter board Copper Foil is arranged, can realize well shunting radiating effect, PCB daughter board skin has dielectric on the other hand, need not consider safety insulation distance problem with peripheral devices, cost is low simultaneously, volume is little, and because the PCB daughter board is to be placed on the zone in the plug set on the mainboard, stagger mutually with the paster device area, can not take the arrangement space of mainboard, reduced the layout density of mainboard; In addition, the mode by reflow soldering connects, and realizes that technology is simple, has better consistency and reliability.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation of the utility model PCB circuit board one embodiment;
Fig. 2 is the vertical view of PCB circuit board shown in Figure 1;
Fig. 3 is the structural representation of mainboard shown in Figure 2;
Fig. 4 is the structural representation of PCB daughter board shown in Figure 2.
Embodiment
The technical solution of the utility model mainly is to consider that Copper Foil can realize flow-guiding radiation, has Copper Foil in the PCB in addition, therefore can adopt PCB to replace busbar/radiator and come flow-guiding radiation.In addition, the PCB skin has dielectric, and this just need not consider the safety insulation distance problem with peripheral devices.
As shown in Figure 1, 2, in an embodiment of PCB circuit board of the present utility model, comprise mainboard 1, mainboard 1 is provided with the PCB daughter board 2 that is used for flow-guiding radiation.In force, mainly be that PCB daughter board 2 is fixed on the higher zone of temperature on the mainboard 1, to realize the fixedly electrical connection between two PCB.So, the big electric current of the part on the mainboard 1 just can be diverted on the PCB daughter board 2, thereby finally realizes the flow-guiding radiation function of 2 pairs of mainboards 1 of PCB daughter board.
In addition, consider the arrangement space of mainboard 1 and the problem of layout density, therefore PCB daughter board 2 is placed on the zone in the plug set on the mainboard 1, thereby stagger mutually with the paster device area, so can on PCB daughter board 2, carry out the opening processing by plug-in unit pin correspondence position, so just can not take the arrangement space of mainboard 1, reduce the layout density of mainboard 1.
Shown in Fig. 2,3 and 4, in the enforcement, for PCB daughter board 2 and connected mode at mainboard 1, by pad 12 is set on mainboard 1, PCB daughter board 2 correspondences are provided with welding hole 21, therefore just PCB daughter board 2 can be weldingly fixed on the mainboard 1.Wherein the quantity for pad 12 and welding hole 21 settings can change according to actual needs, if the higher region area of temperature is big on the mainboard 1, cause the area of PCB daughter board 2 of needs bigger, therefore just several pads 12 can be set on mainboard 1 more, and the welding hole 21 that same quantity correspondingly is set on PCB daughter board 21.Shown in Fig. 3,4, in concrete enforcement, the profile of pad 12 is square, and the profile of welding hole 21 is oval.But the contour shape of pad 12 and welding hole 21 also can carry out different changes according to the actual needs, just can implement as long as can reach good effect fixing and flow-guiding radiation.
In addition, consider that Reflow Soldering has better consistency and reliability than wave-soldering, so the mode of this programme employing Reflow Soldering realizes the interconnection welding between PCB daughter board 2 and the mainboard 1.Confirm that through actual test this PCB daughter board can replace busbar or radiator fully, zone corresponding on the mainboard 1 is realized the function of effective flow-guiding radiation.
For using 2 pairs of mainboards of PCB daughter board 1 to carry out the mode of flow-guiding radiation in the technical program, the one application-specific is in single face paster circuit board, and paster IC is arranged on the reverse side of mainboard 1, and the reverse side that can be arranged on mainboard 1 as PCB daughter board 2 also can be arranged on its front.
The utility model describes by several specific embodiments, it will be appreciated by those skilled in the art that, without departing from the present invention, can also carry out various conversion and be equal to alternative the utility model.In addition, at particular condition or concrete condition, can make various modifications to the utility model, and not break away from scope of the present utility model.Therefore, the utility model is not limited to disclosed specific embodiment, and should comprise the whole execution modes that fall in the utility model claim scope.
Claims (5)
1. a PCB circuit board comprises mainboard, it is characterized in that, described mainboard is provided with the PCB daughter board that is used for flow-guiding radiation.
2. PCB circuit board according to claim 1 is characterized in that, described PCB daughter board is arranged on the position of staggering mutually with the paster device area on the mainboard.
3. PCB circuit board according to claim 1 and 2 is characterized in that described mainboard is provided with pad, and described PCB daughter board correspondence is provided with welding hole, and described PCB daughter board is weldingly fixed on the described mainboard.
4. PCB circuit board according to claim 3 is characterized in that, described PCB daughter board is welded on the described mainboard by Reflow Soldering.
5. PCB circuit board according to claim 4 is characterized in that, the profile of described pad is square, and the profile of described welding hole is oval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200929520U CN201194446Y (en) | 2008-03-28 | 2008-03-28 | PCB circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200929520U CN201194446Y (en) | 2008-03-28 | 2008-03-28 | PCB circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201194446Y true CN201194446Y (en) | 2009-02-11 |
Family
ID=40393978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200929520U Expired - Lifetime CN201194446Y (en) | 2008-03-28 | 2008-03-28 | PCB circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201194446Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102867624A (en) * | 2012-09-27 | 2013-01-09 | 广东易事特电源股份有限公司 | Inductor packaging structure |
| CN104022414A (en) * | 2014-05-22 | 2014-09-03 | 苏州西典机电有限公司 | Novel laminated busbar |
| CN108811321A (en) * | 2018-06-20 | 2018-11-13 | 厦门科华恒盛股份有限公司 | A kind of abnormity expands stream printed board and preparation method thereof, system and a kind of storage medium |
| CN110504554A (en) * | 2018-05-17 | 2019-11-26 | 通用汽车环球科技运作有限责任公司 | For eliminating the component in the position gap between the antenna being located on printed circuit board |
-
2008
- 2008-03-28 CN CNU2008200929520U patent/CN201194446Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102867624A (en) * | 2012-09-27 | 2013-01-09 | 广东易事特电源股份有限公司 | Inductor packaging structure |
| CN102867624B (en) * | 2012-09-27 | 2015-12-02 | 广东易事特电源股份有限公司 | A kind of encapsulating structure of inductance |
| CN104022414A (en) * | 2014-05-22 | 2014-09-03 | 苏州西典机电有限公司 | Novel laminated busbar |
| CN104022414B (en) * | 2014-05-22 | 2016-08-31 | 苏州西典机电有限公司 | A kind of stack bus bar |
| CN110504554A (en) * | 2018-05-17 | 2019-11-26 | 通用汽车环球科技运作有限责任公司 | For eliminating the component in the position gap between the antenna being located on printed circuit board |
| CN110504554B (en) * | 2018-05-17 | 2021-07-20 | 通用汽车环球科技运作有限责任公司 | Assembly for eliminating positional gaps between antennas on a printed circuit board |
| CN108811321A (en) * | 2018-06-20 | 2018-11-13 | 厦门科华恒盛股份有限公司 | A kind of abnormity expands stream printed board and preparation method thereof, system and a kind of storage medium |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Nanshan District Xueyuan Road in Shenzhen city of Guangdong province 518055 No. 1001 Nanshan Chi Park B2 building 1-4 floor, building 6-10 Patentee after: Vitamin Technology Co., Ltd. Address before: 518057 Nanshan District science and Technology Industrial Park, Guangdong, Shenzhen Branch Road, No. Patentee before: Aimosheng Network Energy Source Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090211 |
|
| CX01 | Expiry of patent term |