CN201869440U - Heat dissipation bonding pad - Google Patents
Heat dissipation bonding pad Download PDFInfo
- Publication number
- CN201869440U CN201869440U CN2010206233233U CN201020623323U CN201869440U CN 201869440 U CN201869440 U CN 201869440U CN 2010206233233 U CN2010206233233 U CN 2010206233233U CN 201020623323 U CN201020623323 U CN 201020623323U CN 201869440 U CN201869440 U CN 201869440U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- small holes
- heat radiation
- green oil
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a heat dissipation bonding pad which is mainly applied to a printed circuit board. The heat dissipation bonding pad mainly comprises a copper foil, a plurality of small holes uniformly distributed on the copper foil, and green oil rings arranged at the periphery of the individual small holes of the copper foil to encircle the small holes, wherein the green oil rings are round or square rings encircling the small holes. Compared with the prior art, by arranging the green oil rings at the periphery of the individual small holes of the copper foil to encircle the small holes, not only the heat dissipation area is ensured but also the molten tin is not liable to flow into the small holes.
Description
Technical field
The utility model relates to a kind of heat radiation pad, relates in particular to a kind of heat radiation pad that is applicable on the printed circuit board (PCB).
Background technology
As shown in Figure 1, heat radiation pad 10 on the printed circuit board (PCB) is several apertures 1011 of design distribution on whole piece Copper Foil 101 generally, in order to heat radiation, in the Reflow Soldering processing procedure, molten tin flows in the aperture 1011 easily, causes the other one side of printed circuit board (PCB) tin sweat(ing) to occur.Existing a kind of method is to utilize green oil to block in order to the aperture of heat radiation on the Copper Foil, and this method is residual chemical medicinal liquid in aperture easily, can cause a large amount of bubbles to occur.With reference to shown in Figure 2, be another heat radiation pad 20 again, this heat radiation pad 20 utilizes green oil to separate heat radiation pad 201, and green oil is surrounded aperture 2011, and this method has reduced the contact area of Copper Foil, has reduced radiating effect.
Summary of the invention
In view of the above problems, the utility model provides a kind of heat radiation pad that mainly is applicable on the printed circuit board (PCB).
In order to achieve the above object, the utility model has adopted following technical scheme: a kind of heat radiation pad, it mainly is applicable on the printed circuit board (PCB), this heat radiation pad mainly comprises a Copper Foil and is uniformly distributed in several apertures on this Copper Foil, one circle green oil is set to surround aperture in the periphery of the aperture of this Copper Foil.
Preferable, the utility model provides a kind of heat radiation pad, and wherein, this circle green oil is for surrounding the circular or square of aperture.
Compared to prior art, heat radiation pad described in the utility model is provided with a circle green oil to surround aperture by the periphery at the aperture of this Copper Foil, not only guaranteed area of dissipation, and molten tin is not easy also to flow in the aperture.
Description of drawings
Fig. 1 is the schematic diagram of the heat radiation pad of one type of prior art
Fig. 2 is prior art is separated the heat radiation pad with green oil a schematic diagram
Fig. 3 is a schematic diagram of the present utility model
Embodiment
Please refer to shown in Figure 3ly, be schematic diagram of the present utility model.The utility model mainly is applicable on the printed circuit board (PCB).
Wherein, described heat radiation pad 30, it mainly is applicable on the printed circuit board (PCB), this heat radiation pad 30 mainly comprises a Copper Foil 301 and is uniformly distributed in several apertures 3011 on this Copper Foil 301, periphery in the aperture 3011 of this Copper Foil 301 is provided with a circle green oil 3012 to surround aperture 3011, wherein, this circle green oil 3012 is for surrounding the circular or square of aperture 3011.
Compared to prior art, heat radiation pad 301 described in the utility model is provided with a circle green oil 3012 to surround aperture 3011 by the periphery at the aperture 3011 of this Copper Foil 301, not only guaranteed area of dissipation, and molten tin is not easy also to flow in the aperture 3011.
Claims (2)
1. heat radiation pad, it mainly is applicable on the printed circuit board (PCB), this heat radiation pad mainly comprises a Copper Foil and is uniformly distributed in several apertures on this Copper Foil, it is characterized in that, one circle green oil is set with the encirclement aperture in the periphery of the aperture of this Copper Foil.
2. heat radiation pad according to claim 1 is characterized in that, this circle green oil is for surrounding the circular or square of aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206233233U CN201869440U (en) | 2010-11-25 | 2010-11-25 | Heat dissipation bonding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206233233U CN201869440U (en) | 2010-11-25 | 2010-11-25 | Heat dissipation bonding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201869440U true CN201869440U (en) | 2011-06-15 |
Family
ID=44140580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206233233U Expired - Fee Related CN201869440U (en) | 2010-11-25 | 2010-11-25 | Heat dissipation bonding pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201869440U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104393160A (en) * | 2014-10-24 | 2015-03-04 | 苏州德鲁森自动化***有限公司 | Six-pin 5050 LED lamp welding pad |
| WO2015176456A1 (en) * | 2014-05-19 | 2015-11-26 | 京东方科技集团股份有限公司 | Heat dissipating bonding pad and printed circuit board |
| CN111278216A (en) * | 2018-12-04 | 2020-06-12 | 湖南中车时代电动汽车股份有限公司 | Heat dissipation and welding deviation prevention packaging structure of PCB and design method thereof |
-
2010
- 2010-11-25 CN CN2010206233233U patent/CN201869440U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015176456A1 (en) * | 2014-05-19 | 2015-11-26 | 京东方科技集团股份有限公司 | Heat dissipating bonding pad and printed circuit board |
| US9313924B2 (en) | 2014-05-19 | 2016-04-12 | Boe Technology Group Co., Ltd. | Heat sinking pad and printed circuit board |
| CN104393160A (en) * | 2014-10-24 | 2015-03-04 | 苏州德鲁森自动化***有限公司 | Six-pin 5050 LED lamp welding pad |
| CN104393160B (en) * | 2014-10-24 | 2017-01-11 | 重庆市鸣浩电子科技有限公司 | Six-pin 5050 LED lamp welding pad |
| CN111278216A (en) * | 2018-12-04 | 2020-06-12 | 湖南中车时代电动汽车股份有限公司 | Heat dissipation and welding deviation prevention packaging structure of PCB and design method thereof |
| CN111278216B (en) * | 2018-12-04 | 2023-06-20 | 湖南中车时代电动汽车股份有限公司 | PCB heat dissipation and welding offset prevention packaging structure and design method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110615 Termination date: 20131125 |