WO2020134477A1 - 介质谐振器封装天线***及移动终端 - Google Patents

介质谐振器封装天线***及移动终端 Download PDF

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Publication number
WO2020134477A1
WO2020134477A1 PCT/CN2019/113381 CN2019113381W WO2020134477A1 WO 2020134477 A1 WO2020134477 A1 WO 2020134477A1 CN 2019113381 W CN2019113381 W CN 2019113381W WO 2020134477 A1 WO2020134477 A1 WO 2020134477A1
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WIPO (PCT)
Prior art keywords
dielectric resonator
antenna system
antenna
mobile terminal
substrate
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PCT/CN2019/113381
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English (en)
French (fr)
Inventor
邾志民
夏晓岳
雍征东
王超
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瑞声声学科技(深圳)有限公司
瑞声科技（南京）有限公司
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Publication of WO2020134477A1 publication Critical patent/WO2020134477A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0485—Dielectric resonator antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • the invention relates to the technical field of antennas, in particular to a dielectric resonator package antenna system and a mobile terminal.
  • the rich bandwidth resources of the millimeter wave band provide a guarantee for the high-speed transmission rate, but due to the severe space loss of electromagnetic waves in this band, the wireless communication system using the millimeter wave band needs to adopt a phased array architecture.
  • the phase shifter makes the phase of each array element distributed according to a certain rule, thereby forming a high-gain beam, and changes the phase shift to make the beam scan within a certain spatial range.
  • the antenna is an indispensable component in the RF front-end system. While the RF circuit is developing towards integration and miniaturization, it is an inevitable trend for the future development of the RF front-end to integrate and package the antenna and the RF front-end circuit.
  • the packaged antenna system (AiP) technology integrates the antenna into the package that carries the chip through the packaging material and process. It takes into account the antenna performance, cost and volume, and is favored by the majority of chip and package manufacturers. At present, Qualcomm, Intel, IBM and other companies have adopted packaged antenna system technology. Needless to say, AiP technology will also provide a good antenna solution for 5G millimeter wave mobile communication systems.
  • the metal antenna conductor has serious loss, which greatly reduces the antenna's radiation efficiency.
  • the dielectric resonator antenna has higher radiation efficiency due to the absence of conductor and surface wave losses, and can generally reach more than 90%.
  • the object of the present invention is to provide a dielectric resonator packaged antenna system, which can be applied in a housing with a high dielectric constant, with less gain reduction, and can meet the requirements of 3GPP millimeter wave space coverage.
  • a dielectric resonator packaged antenna system is applied to a mobile terminal.
  • the mobile terminal includes a main board.
  • the dielectric resonator packaged antenna system includes a substrate, a dielectric resonator antenna disposed on a side of the substrate away from the motherboard, and a device An integrated circuit chip on a side of the substrate close to the main board and a circuit provided in the substrate to connect the dielectric resonator antenna and the integrated circuit chip, the circuit is connected to the main board.
  • the dielectric resonator antenna is a one-dimensional linear array, which includes a plurality of dielectric resonator antenna units, and the plurality of dielectric resonator antenna units are sequentially arranged at intervals.
  • the dielectric resonator package antenna system is a millimeter wave phased array antenna system.
  • the dielectric resonator antenna is connected to the circuit through a feeding probe.
  • the dielectric resonator antenna may be any one of a circle, a square, a hexagon, and a cross.
  • the dielectric resonator antenna and the circuit are electrically connected by any one of microstrip feeding, slot coupling, and coplanar waveguide feeding.
  • the present invention also provides a mobile terminal, including the dielectric resonator package antenna system.
  • a dielectric resonator package antenna system and mobile terminal provided by the present invention have the following advantages:
  • dielectric resonator antennas can effectively suppress the loss of conductors and surface waves, so it has high radiation efficiency, which can generally reach more than 90%; at the same time, the broadband effect can be obtained by reasonable choice of dielectric constant;
  • the dielectric resonator antenna is a one-dimensional linear array, and the space occupied in the mobile terminal is narrowed, which simplifies the design difficulty, test difficulty, and beam management complexity;
  • the dielectric resonator antenna is symmetrical in structure and can easily meet the requirements of dual polarization
  • FIG. 1 is a schematic diagram of a stereo structure of a mobile terminal provided by the present invention.
  • FIG. 2 is a schematic diagram of the connection structure of the dielectric resonator package antenna system shown in FIG. 1 and the main board;
  • FIG. 3 is a schematic diagram of feeding a dielectric resonator antenna through a feeding probe
  • FIG. 5 is a diagram of the overall efficiency of the dielectric resonator package antenna system of the present invention.
  • 6 is a radiation pattern of the dielectric resonator package antenna system of the present invention when it is not scanning at 26.5 GHz;
  • 9 is a radiation pattern of the dielectric resonator package antenna system of the present invention when scanning to 55° at 29.5 GHz;
  • FIG. 10 is a graph of the gain CDF of the dielectric resonator package antenna system of the present invention.
  • the present invention provides a mobile terminal 100.
  • the mobile terminal 100 may be a mobile phone, an ipad, a POS machine, etc.
  • the present invention does not limit this.
  • the mobile terminal 100 includes a screen 1 and a cover The screen 1 and the rear cover 2 that cooperates with the screen 1 to form a receiving space, a main board 3 interposed between the screen 1 and the rear cover 2, and a dielectric resonator packaged antenna system connected to the main board 3 4. Both the main board 3 and the dielectric resonator package antenna system 4 are accommodated in the accommodation space.
  • the back cover 2 is a 3D glass back cover, which can provide better protection, aesthetics, thermal diffusion, color and user experience.
  • the rear cover 2 includes a bottom wall 21 spaced apart from the screen 1 and a side wall 22 bent and extending from the outer periphery of the bottom wall 21 toward the screen 1.
  • the side wall 22 is connected to the screen 1, and the bottom wall 21 and the side wall 22 are integrally formed.
  • the dielectric resonator packaged antenna system 4 is disposed adjacent to the side wall 22 and parallel to the bottom wall 21, and the dielectric resonator packaged antenna system 4 is used to receive and transmit electromagnetic wave signals, thereby implementing the mobile terminal 100 Communication function.
  • the dielectric resonator packaged antenna system 4 can be connected to the main board 3 through ball grid array (BGA) technology, that is, the antenna is integrated in the package carrying the chip through the packaging material and process, which is well considered
  • BGA ball grid array
  • the dielectric resonator package antenna system 4 includes a substrate 41 disposed between the screen 1 and the back cover 2, and an integrated circuit chip 42 disposed on a side of the substrate 41 near the main board 3 1.
  • a dielectric resonator antenna 43 provided on the side of the substrate 41 away from the main board 3, and a circuit 44 provided in the substrate 41 to connect the integrated circuit chip 42 and the dielectric resonator antenna 43.
  • the dielectric resonator antenna 43 is a one-dimensional linear array, which includes a plurality of dielectric resonator antenna units 431, and the plurality of dielectric resonator antenna units 431 are sequentially arranged at intervals.
  • the number of the dielectric resonator antenna units 431 is four, and the four dielectric resonator antenna units 431 are sequentially arranged at intervals in the same direction.
  • the dielectric resonator package antenna system 4 is a millimeter wave phased array system, which occupies a narrow space in the mobile phone; and only needs to scan one angle, which simplifies the design difficulty, test difficulty, and beam management complexity .
  • the dielectric resonator antenna 43 is connected to the circuit 44 through the feeding probe 20.
  • the dielectric resonator antenna 43 may be any one of a circle, a square, a hexagon, and a cross.
  • the dielectric resonator antenna 43 adopts a symmetrical structure, which easily meets the requirements of dual polarization, but the present invention does not specifically limit the shape of the dielectric resonator antenna 43, and any shape can be designed according to actual needs, which should belong to this Within the scope of protection of the invention.
  • the dielectric resonator antenna 43 and the circuit 44 may also be electrically connected by any one of microstrip feeding, slot coupling, and coplanar waveguide.
  • the dielectric resonator antenna 43 Due to the use of the dielectric resonator antenna 43, a wide selection range can be achieved, and the size and bandwidth of the dielectric resonator antenna 43 can be flexibly controlled. Since there is no conductor and surface wave loss, its own dielectric loss is small, so it has the medium The dielectric constant of the resonator antenna 43 has a high radiation efficiency, which can generally reach more than 90%.
  • the bandwidth of the dielectric resonator-encapsulated antenna system 4 can reach 7.5G and the relative bandwidth can reach 26%, which far meets the requirements of 5G communication and at the same time, the impedance bandwidth can be seen
  • the overall efficiency within is higher than -0.6dB.
  • the dielectric resonator packaged antenna system 4 can work well at 26.5 GHz and 29.5 GHz, and can effectively achieve effective work in the N257 frequency band.
  • the cumulative distribution function is used to describe the spatial coverage of the terminal using the dielectric resonator package antenna system 4 provided by the present invention.
  • a dielectric resonator package antenna system and mobile terminal provided by the present invention have the following advantages:
  • dielectric resonator antennas can effectively suppress the loss of conductors and surface waves, so it has high radiation efficiency, which can generally reach more than 90%; at the same time, the broadband effect can be obtained by reasonable choice of dielectric constant;
  • the dielectric resonator antenna is a one-dimensional linear array, and the space occupied in the mobile terminal is narrowed, which simplifies the design difficulty, test difficulty, and beam management complexity;
  • the dielectric resonator antenna is symmetrical in structure and can easily meet the requirements of dual polarization

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

本发明提供了一种介质谐振器封装天线***，应用于移动终端，移动终端包括主板，介质谐振器封装天线***包括基板、设于所述基板远离所述主板一侧的介质谐振器天线、设于所述基板靠近所述主板一侧的集成电路芯片和设于所述基板内连接所述介质谐振器天线和所述集成电路芯片的电路，所述电路与所述主板连接。与相关技术相比，本发明提供的一种介质谐振器封装天线***具有如下优点：简化了设计难度、测试难度以及波束管理复杂度；满足双极化要求；能够有效抑制导体和表面波损耗，因而具有较高的辐射效率，一般能达到90%以上；同时通过合理选择介电常数能获得宽带的效果；对于50%覆盖,满足3GPP讨论中的下降不超过12.98dB的要求。

Description

介质谐振器封装天线***及移动终端 技术领域
本发明涉及天线技术领域，尤其涉及一种介质谐振器封装天线***及移动终端。
 背景技术
5G作为全球业界的研发焦点，发展5G技术制定5G标准已经成为业界共识。国际电信联盟ITU在 2015年6月召开的ITU-RWP5D第22次会议上明确了5G的三个主要应用场景：增强型移动宽带、大规模机器通信、高可靠低延时通信。这3个应用场景分别对应着不同的关键指标，其中增强型移动带宽场景下用户峰值速度为20Gbps，最低用户体验速率为100Mbps。目前3GPP正在对5G技术进行标准化工作，第一个5G非独立组网(NSA)国际标准于2017年12月正式完成并冻结，并计划在2018年6月完成5G独立组网标准。3GPP会议期间诸多关键技术和***架构等研究工作得到迅速聚焦，其中包含毫米波技术。毫米波独有的高载频、大带宽特性是实现5G超高数据传输速率的主要手段。
毫米波频段丰富的带宽资源为高速传输速率提供了保障，但是由于该频段电磁波剧烈的空间损耗，利用毫米波频段的无线通信***需要采用相控阵的架构。通过移相器使得各个阵元的相位按一定规律分布，从而形成高增益波束，并且通过相移的改变使得波束在一定空间范围内扫描。
天线作为射频前端***中不可缺少的部件，在射频电路向着集成化、小型化方向发展的同时，将天线与射频前端电路进行***集成和封装成为未来射频前端发展的必然趋势。封装天线***（AiP）技术是通过封装材料与工艺将天线集成在携带芯片的封装内，很好地兼顾了天线性能、成本及体积，深受广大芯片及封装制造商的青睐。目前高通，Intel，IBM等公司都采用了封装天线***技术。毋庸置疑，AiP技术也将为5G毫米波移动通信***提供很好的天线解决方案。
在毫米波频段，金属天线导体损耗严重，大大降低了天线的辐射效率，介质谐振器天线由于不存在导体和表面波损耗，因而具有较高的辐射效率，一般能达到90%以上。
 技术问题
本发明的目的在于提供一种介质谐振器封装天线***，其可应用于高介电常数的壳体内，增益降低少，可满足3GPP毫米波空间覆盖的指标要求。
 技术解决方案
本发明的技术方案如下：
一种介质谐振器封装天线***，应用于移动终端，所述移动终端包括主板，所述介质谐振器封装天线***包括基板、设于所述基板远离所述主板一侧的介质谐振器天线、设于所述基板靠近所述主板一侧的集成电路芯片和设于所述基板内连接所述介质谐振器天线和所述集成电路芯片的电路，所述电路与所述主板连接。
优选的，所述介质谐振器天线为一维直线阵，其包括多个介质谐振器天线单元，多个所述介质谐振器天线单元依次间隔排布。
优选的，所述介质谐振器封装天线***为毫米波相控阵天线***。
优选的，所述介质谐振器天线通过馈电探针与所述电路连接。
优选的，所述介质谐振器天线可以呈圆形、正方形、六边形以及十字形中的任意一种。
优选的，所述介质谐振器天线与所述电路采用微带馈电、缝隙耦合以及共面波导馈电中的任意一种馈电方式电连接。
本发明还提供了一种移动终端，包括所述的介质谐振器封装天线***。
 有益效果
与相关技术相比，本发明提供的一种介质谐振器封装天线***及移动终端具有如下优点：
1、采用介质谐振器天线，能够有效抑制导体和表面波损耗，因而具有较高的辐射效率，一般能达到90%以上；同时通过合理选择介电常数能获得宽带的效果；
2、所述介质谐振器天线为一维直线阵，在移动终端中占用的空间变窄，简化了设计难度、测试难度以及波束管理复杂度；
3、所述介质谐振器天线为结构对称，很容易满足双极化要求；
4、对于50%覆盖, 相比于峰值增益，下降9.6dB，满足3GPP讨论中的下降不超过12.98dB的要求。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本发明提供的移动终端的立体结构示意图；
图2为图1所示介质谐振器封装天线***与主板的连接结构示意图；
图3为介质谐振器天线通过馈电探针馈电的示意图；
图4为本发明介质谐振器封装天线***的反射系数图；
图5为本发明介质谐振器封装天线***的总效率图；
图6为本发明介质谐振器封装天线***在26.5GHz不扫描时的辐射方向图；
图7为本发明介质谐振器封装天线***在29.5GHz不扫描时的辐射方向图；
图8为本发明介质谐振器封装天线***在26.5GHz扫描到55°时的辐射方向图
图9为本发明介质谐振器封装天线***在29.5GHz扫描到55°时的辐射方向图；
图10为本发明介质谐振器封装天线***的增益CDF曲线图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请参阅图1-3，本发明提供一种移动终端100，该移动终端100可以是手机、ipad以及POS机等，本发明对此不作限定，所述移动终端100包括屏幕1、盖合于所述屏幕1并与所述屏幕1配合形成收容空间的后盖2、夹设于所述屏幕1和所述后盖2之间的主板3及与所述主板3连接的介质谐振器封装天线***4。所述主板3和所述介质谐振器封装天线***4均收容于所述收容空间内。
所述后盖2为3D玻璃后盖，能提供更好的保护、美观度、热扩散、色彩度以及用户体验。具体的，所述后盖2包括与所述屏幕1相对间隔设置的底壁21及自所述底壁21的外周缘向靠近所述屏幕1方向弯折延伸的侧壁22，所述侧壁22与所述屏幕1连接，所述底壁21和所述侧壁22一体成型。
所述介质谐振器封装天线***4临近所述侧壁22设置并与所述底壁21平行，所述介质谐振器封装天线***4用于接收和发送电磁波信号，进而实现所述移动终端100的通信功能。所述介质谐振器封装天线***4可以通过焊球阵列封装（Ball Grid Array，BGA）技术与所述主板3连接，即通过封装材料与工艺将天线集成在携带芯片的封装内，很好地兼顾了天线性能、成本及体积，深受广大芯片及封装制造商的青睐。
具体地，所述介质谐振器封装天线***4包括设于所述屏幕1和所述后盖2之间的基板41、设于所述基板41靠近所述主板3的一侧的集成电路芯片42、设于所述基板41远离所述主板3一侧的介质谐振器天线43及设于所述基板41内连接所述集成电路芯片42和所述介质谐振器天线43的电路44。
所述介质谐振器天线43为一维直线阵，其包括多个介质谐振器天线单元431，多个所述介质谐振器天线单元431依次间隔排布。在本实施例中，所述介质谐振器天线单元431的数量为四个，四个所述介质谐振器天线单元431沿同一方向依次间隔排布。
进一步地，所述介质谐振器封装天线***4为毫米波相控阵***，在手机中占用的空间变窄；并只需扫描一个角度，简化了设计难度、测试难度、以及波束管理的复杂度。
更进一步地，所述介质谐振器天线43通过馈电探针20与所述电路44连接。
更进一步地，所述介质谐振器天线43可以呈圆形、正方形、六边形以及十字形中的任意一种。所述介质谐振器天线43采用对称结构，很容易满足双极化要求，但是本发明并不具体限制所述介质谐振器天线43的形状，可根据实际需要而设计任意形状，这理应都属于本发明的保护范围内。
此外，在其他实施方式中，所述介质谐振器天线43与所述电路44也可以采用微带馈电、缝隙耦合以及共面波导中的任意一种馈电方式电连接。
由于采用所述介质谐振器天线43，从而实现选择范围大，可灵活控制所述介质谐振器天线43的尺寸和带宽，由于其不存在导体和表面波损耗，自身介质损耗小因而具所述介质谐振器天线43的介电常数有较高的辐射效率，一般能达到90%以上。
具体可结合参阅图4和5所示，可见，所述介质谐振器封装天线***4的带宽可达7.5G，相对带宽可达26%，远远满足5G通信的要求，同时可看出阻抗带宽内的总体效率都高于-0.6dB。
请结合图6-9，所述介质谐振器封装天线***4在26.5GHz和29.5GHz时都能较好的工作，能够很好的实现在N257频段内的有效工作。
再结合图10所示，采用累积分布函数（CDF）描述应用本发明提供的所述介质谐振器封装天线***4的终端的空间覆盖，这里，增益CDF是概率密度的积分，定义为CDF(x)=P(Gain≤ x)，其中Gain即为增益。可以观察到，对于50%覆盖, 相比于峰值增益，所述介质谐振器封装天线***4下降约为9.6dB优于3GPP平均的-12.98dB。
与相关技术相比，本发明提供的一种介质谐振器封装天线***及移动终端具有如下优点：
1、采用介质谐振器天线，能够有效抑制导体和表面波损耗，因而具有较高的辐射效率，一般能达到90%以上；同时通过合理选择介电常数能获得宽带的效果；
2、所述介质谐振器天线为一维直线阵，在移动终端中占用的空间变窄，简化了设计难度、测试难度以及波束管理复杂度；
3、所述介质谐振器天线为结构对称，很容易满足双极化要求；
4、对于50%覆盖, 相比于峰值增益，下降9.6dB，满足3GPP讨论中的下降不超过12.98dB的要求。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (7)

  1. 一种介质谐振器封装天线***，应用于移动终端，所述移动终端包括主板，其特征在于，所述介质谐振器封装天线***包括基板、设于所述基板远离所述主板一侧的介质谐振器天线、设于所述基板靠近所述主板一侧的集成电路芯片和设于所述基板内连接所述介质谐振器天线和所述集成电路芯片的电路，所述电路与所述主板连接。
  2. 根据权利要求1所述的介质谐振器封装天线***，其特征在于，所述介质谐振器天线为一维直线阵，其包括多个介质谐振器天线单元，多个所述介质谐振器天线单元依次间隔排布。
  3. 根据权利要求2所述的介质谐振器封装天线***，其特征在于，所述介质谐振器封装天线***为毫米波相控阵天线***。
  4. 根据权利要求3所述的介质谐振器封装天线***，其特征在于，所述介质谐振器天线通过馈电探针与所述电路连接。
  5. 根据权利要求1所述的介质谐振器封装天线***，其特征在于，所述介质谐振器天线可以呈圆形、正方形、六边形以及十字形中的任意一种。
  6. 根据权利要求1所述的介质谐振器封装天线***，其特征在于，所述介质谐振器天线与所述电路采用微带馈电、缝隙耦合以及共面波导馈电中的任意一种馈电方式电连接。
  7. 一种移动终端，其特征在于，包括如权利要求1-6任意一项所述的介质谐振器封装天线***。
PCT/CN2019/113381 2018-12-29 2019-10-25 介质谐振器封装天线***及移动终端 WO2020134477A1 (zh)

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