CN109097727A - Mask plate and preparation method thereof and display device - Google Patents
Mask plate and preparation method thereof and display device Download PDFInfo
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- CN109097727A CN109097727A CN201810860496.8A CN201810860496A CN109097727A CN 109097727 A CN109097727 A CN 109097727A CN 201810860496 A CN201810860496 A CN 201810860496A CN 109097727 A CN109097727 A CN 109097727A
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- template
- lug boss
- metal
- layer
- recessed portion
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- 238000002360 preparation method Methods 0.000 title abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 125
- 229910052751 metal Inorganic materials 0.000 claims abstract description 125
- 239000010410 layer Substances 0.000 claims abstract description 93
- 238000000034 method Methods 0.000 claims abstract description 64
- 239000012044 organic layer Substances 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 30
- 230000007704 transition Effects 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 238000001312 dry etching Methods 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 230000001154 acute effect Effects 0.000 claims description 4
- 239000013047 polymeric layer Substances 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 230000008569 process Effects 0.000 abstract description 8
- 238000007687 exposure technique Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 10
- 238000000151 deposition Methods 0.000 description 9
- 238000005323 electroforming Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 241000209094 Oryza Species 0.000 description 3
- 235000007164 Oryza sativa Nutrition 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 235000009566 rice Nutrition 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Abstract
The present invention provides mask plate and preparation method thereof and display devices.Wherein, the production method of mask plate includes: to form the first lug boss or the first recessed portion on a surface of substrate, to obtain the first template；Metal form is obtained using the first template construct, there is the second lug boss on a surface of the metal form, the shape of second lug boss is consistent with the shape of first lug boss or matches with first recessed portion；It makes to obtain organic layer using the metal form, through-hole is contained in the organic layer, the through-hole matches with second lug boss；The first metal layer is formed on a surface of the organic layer.Inventors have found that the method and process of above-mentioned production mask plate is simple, easy to operate and control, without using double-sided exposure technique, cost of manufacture is lower.
Description
Technical field
The present invention relates to field of display technology, specifically, being related to mask plate and preparation method thereof and display device.
Background technique
High-precision metal mask plate (FMM) is the important mask plate for manufacturing OLED device, is control pixel precision
Key factor.Wet-etching technology production FMM is generallyd use at present, but utilizes the resolution pole of the mask plate of this method acquisition
It is limited to 600ppi.And with 3D, the rise of virtual reality (VR), higher resolution requirement (> is proposed to OLED
800ppi), the manufacture craft of existing FMM limits the production of high-resolution OLED device, therefore finds new mask plate and have
Significance.
Thus, current mask plate still has much room for improvement.
Summary of the invention
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, of the invention
One purpose is to propose that a kind of manufacture craft is simple, method easy to operate or lower-cost production mask plate, utilizes
The prepared mask plate precision of this method is higher, resolution ratio is higher, stress is lower or is easy to throw the net.
In one aspect of the invention, the present invention provides a kind of methods for making mask plate.Implementation according to the present invention
Example, this method comprises: the first lug boss or the first recessed portion are formed on a surface of substrate, to obtain the first mould
Plate；Metal form is obtained using the first template construct, and there is the second lug boss on a surface of the metal form, described the
The shape of two lug bosses is consistent with the shape of first lug boss or matches with first recessed portion；Utilize the gold
Belong to template construct and obtain organic layer, through-hole is contained in the organic layer, the through-hole matches with second lug boss；Institute
It states and forms the first metal layer on a surface of organic layer.Inventors have found that the method and process of above-mentioned production mask plate is simple, holds
Easy to operate and control effectively prevents the anisotropy of wet-etching technology without using double-sided exposure technique, cost of manufacture compared with
It is low, it is easy to obtain that precision is higher, the lesser through-hole of size in organic layer, so that final prepared mask plate precision
Higher, resolution ratio is higher, and stress is lower, and effect of throwing the net is preferable, is unlikely to deform, be conducive to production high-precision, it is high-resolution
OLED device.
According to an embodiment of the invention, there is first recessed portion, and described on a surface of first template
Obtaining metal form using the first template construct includes: to be formed on the surface that first template has first recessed portion
Second metal layer；First template is removed, the metal form is obtained.
According to an embodiment of the invention, there is first lug boss, and described on a surface of first template
Obtaining metal form using the first template construct includes: to be formed on the surface that first template has first lug boss
Then polymeric layer removes first template, obtain transition film layer, has on a surface of the transition film layer second recessed
Concave portion, second recessed portion match with first lug boss；There is second recessed portion in the transition film layer
Second metal layer is formed on surface；The transition film layer is removed, the metal form is obtained.
According to an embodiment of the invention, there is first lug boss, and described on a surface of first template
Obtaining metal form using the first template construct includes: to be formed on the surface that first template has first lug boss
Second metal layer；First template is removed, the metal form is obtained.According to an embodiment of the invention, first recess
Portion or first lug boss are formed by way of dry etching or laser carving；The organic layer be by injection molding or
What the mode of casting was formed；The first metal layer is formed by way of being deposited, sputtering.
According to an embodiment of the invention, the metal form with a thickness of 5-20mm.
According to an embodiment of the invention, the first metal layer with a thickness of 1-20 microns.
According to an embodiment of the invention, the material for forming the first metal layer include in nickel and iron-nickel alloy at least it
One.
According to an embodiment of the invention, the organic layer with a thickness of 5-50 microns.
According to an embodiment of the invention, the diameter of the through-hole is 2-30 microns.
According to an embodiment of the invention, the distance between central axis of the side wall of the through-hole and the through-hole is from bottom to up
It is gradually reduced.
According to an embodiment of the invention, sharp between plane locating for the lower surface of the side wall of the through-hole and the organic layer
Angle angle is less than 85 °.
According to an embodiment of the invention, the material for forming the organic layer includes polycarbonate and polymethyl methacrylate
At least one of.
According to an embodiment of the invention, the material for forming the substrate includes semiconductor.
In another aspect of this invention, the present invention provides a kind of mask plates.According to an embodiment of the invention, the mask plate
It is to be made by mentioned-above method.Inventors have found that the mask plate structure is simple, is easily achieved, precision, resolution ratio compared with
Height, resolution ratio may be up to 800ppi, have both transparent and magnetic properties, and contraposition is more accurate, is easy to throw the net, and be conducive to make resolution ratio
Higher OLED device, is suitable for large-scale production, and the market competitiveness is stronger.
In another aspect of this invention, the present invention provides a kind of display devices.According to an embodiment of the invention, described aobvious
OLED device in showing device is prepared using mentioned-above mask plate.Inventors have found that the display device structure
Simply, be easily achieved, and OLED device has higher resolution ratio, cost is relatively low for obtained display device, the market competitiveness compared with
By force.
Detailed description of the invention
Fig. 1 is to be performed etching to metal substrate using photoresist to obtain the structural schematic diagram of through-hole in the prior art.
Fig. 2 is the method flow schematic diagram that mask plate is made in one embodiment of the invention.
Fig. 3 is the structural schematic diagram of the first template in one embodiment of the invention.
Fig. 4 is the structural schematic diagram of the first template in another embodiment of the present invention.
Fig. 5 is the structural schematic diagram of metal form in one embodiment of the invention.
Fig. 6 is the method flow schematic diagram that metal form is made in one embodiment of the invention.
Fig. 7 is the method flow schematic diagram that metal form is made in another embodiment of the present invention.
Fig. 8 a is the planar structure schematic diagram of organic layer in one embodiment of the invention.
Fig. 8 b is in Fig. 8 a along the sectional view in the direction EE '.
Fig. 9 a is the planar structure schematic diagram of mask plate in one embodiment of the invention.
Fig. 9 b is in Fig. 9 a along the sectional view in the direction CC '.
Figure 10-Figure 11 is the process for forming the first metal layer in one embodiment of the invention on a surface of organic layer
Schematic diagram.
Specific embodiment
The embodiment of the present invention is described below in detail.The embodiments described below is exemplary, and is only used for explaining this hair
It is bright, and be not considered as limiting the invention.Particular technique or condition are not specified in embodiment, according to text in the art
It offers described technology or conditions or is carried out according to product description.Reagents or instruments used without specified manufacturer,
For can be with conventional products that are commercially available.
The present invention is following understanding based on inventor and discovery and completes:
Currently, the method for production high-precision metal mask plate is wet-etching technology, Fig. 1 specifically can refer to, first in gold
Belong to and coat photoresist on opposite two surface of substrate 10, is formed on the surface of metal substrate 10 by double-sided exposure technique
Patterned photoresist layer 20, recycle wet etching method etch away be not photo-etched glue-line 20 covering metal substrate so as to
Through-hole 11 is obtained in metal substrate 10, will obtain high-precision metal mask plate after the removal of photoresist layer 20.But in this method
Wet etching has anisotropy, and resolution pole is limited to 600ppi, and resolution ratio is restricted.In view of the above technical problems, it invents
People conducts in-depth research, and finds after research, can first produce the metal of the higher lug boss of precision smaller with size
Template produces organic layer using the metal form, so that the through-hole in organic layer matches with lug boss, then in organic layer
Metal layer is formed on one surface, can be obtained that resolution ratio is higher, is easy to throw the net, on-deformable mask plate, the mask plate
Resolution ratio may be up to 800ppi.
In view of this, in one aspect of the invention, the present invention provides a kind of methods for making mask plate.According to this hair
Bright embodiment, referring to Fig. 2, this method comprises:
S100: the first lug boss 110 (specific structure can refer to Fig. 3) or are formed on a surface of substrate 100
One recessed portion 120 (specific structure can refer to Fig. 4), to obtain the first template.
According to an embodiment of the invention, in order to obtain structure finer the first lug boss or the first recessed portion, shape
Material at substrate includes semiconductor, and material source is extensive as a result, easily processed into type, can be made on the surface of the substrate
To finer micro-structure.In some embodiments of the invention, in order to easily facilitate processing, the material for forming substrate includes
Silicon.Thus, it is easier to make to obtain the fine micro-structure of comparison in substrate surface, it is convex more conducively to form first on the surface of the substrate
Play portion or the first recessed portion.
According to an embodiment of the invention, first recessed portion or first lug boss are by dry etching or radium
What the mode of carving was formed.It is simple, convenient as a result, easily operated, the first lug boss of acquisition or the ruler of the first recessed portion
It is very little it is smaller, dimensional accuracy is higher.In some embodiments of the invention, when the method for forming the first recessed portion or the first lug boss
When for dry etching, by parameters such as the etching agent, passivator, the gas flows that adjust dry etching, dimensional accuracy can be obtained
Higher first lug boss or the first recessed portion.In other embodiments of the invention, the first recessed portion or first is formed
The method of lug boss is laser carving, i.e., makes the first recessed portion or the first lug boss using laser direct-writing technique, as a result, operation letter
It is single, conveniently, it is easy to accomplish, suitable for making complicated micro-structure, spacing (pitch) is processed at 1 micron or more, is obtained convenient for production
The primary template of metal form.
According to an embodiment of the invention, referring to Fig. 3, when having the first lug boss 110 on the surface of substrate 100, first
The width of lug boss 110 from bottom to top is smaller and smaller；The lower surface of the side wall 111 of first lug boss 110 and the first lug boss 110
Acute angle a between locating plane is less than 85 °.In some embodiments of the invention, referring to Fig. 3,110 edge of the first lug boss
The sectional view in the direction AA ' can be polygon, round or other regularly or irregularly figures etc., as long as can guarantee the
The width of one lug boss from bottom to top is smaller and smaller.The structure of the first lug boss is simple as a result, is easily achieved, and advantageous
Higher, the preferable mask plate of service performance in acquisition resolution ratio.It should be noted that it is above-mentioned upper or under be merely to illustrate this Shen
Please, it should not be understood as the limitation to the application.
According to an embodiment of the invention, referring to Fig. 3, it (such as can be 5 that the diameter D of the first lug boss 110, which is 2-30 microns,
Micron, 10 microns, 15 microns, 20 microns, 25 microns etc.), it should be noted that the diameter of the first lug boss refers to the first protrusion
In plane locating for portion the top between any two points the distance of line maximum value.The size of the first lug boss is smaller as a result,
It help to obtain the higher mask plate of resolution ratio.
According to an embodiment of the invention, referring to Fig. 4, when forming the first recessed portion 120 on a surface of substrate 100, the
The width of one recessed portion 120 from bottom to top is increasing, puts down locating for the side wall 121 of the first recessed portion and the upper surface of substrate 100
Acute angle b between face is less than 85 °.In some embodiments of the invention, referring to Fig. 4, the first recessed portion 120 is along the side BB '
To sectional view can be polygon, it is round or change other irregular figures etc., as long as can guarantee the first recessed portion from
Width on down is increasing.The structure of the first recessed portion is simple as a result, is easily achieved, and help to obtain resolution
Rate is higher, the preferable mask plate of service performance.It should be noted that it is above-mentioned upper or under be merely to illustrate the application, and cannot
It is interpreted as the limitation to the application.
According to an embodiment of the invention, referring to Fig. 4, the diameter D ' of the first recessed portion 120, which is 2-30 microns, (such as can be
5 microns, 10 microns, 15 microns, 20 microns, 25 microns etc.), it should be noted that the diameter of the first recessed portion refers to that first is recessed
In concave portion the lowermost cross section between any two points the distance of line maximum value.The size of the first recessed portion is smaller as a result,
It help to obtain the higher mask plate of resolution ratio.
According to an embodiment of the invention, referring to Fig. 3 and Fig. 4, the height L1 or the first recessed portion of the first lug boss 110
120 depth L2 can be 5-50 microns.Structure is simple as a result, is easily achieved, and help to obtain that thickness is more appropriate to be had
Machine layer.
S200: metal form is obtained using the first template construct.
Have the according to an embodiment of the invention, referring to Fig. 3, Fig. 4 and Fig. 5, on a surface of the metal form 400
Two lug bosses 410, the shape of second lug boss 410 are consistent with the shape of first lug boss 110 or with described
One recessed portion 120 matches.Metal form can bear higher impact force or pressure as a result, can use the metal mold
Plate carries out injection molding or pouring technology.It should be noted that the second lug boss and the first recessed portion, which match, refers to the second protrusion
Portion and the first recessed portion are in complementary relationship, and the second lug boss can fill up the first recessed portion.
According to an embodiment of the invention, the material for forming metal form include but is not limited in nickel or copper at least it
One, material source is extensive as a result, easy to form, and is able to bear higher pressure, and service performance is preferable.
In some embodiments of the invention, have referring to Fig. 6, on a surface of first template described first recessed
Concave portion, and described obtain metal form using the first template construct and include:
S210: second metal layer is formed on the surface that first template has first recessed portion.
According to an embodiment of the invention, forming the side of second metal layer on the surface that the first template has the first recessed portion
Method including but not limited to deposition, electroforming etc., it is simple, convenient as a result, it is easy to accomplish, and it is more uniform to obtain thickness
Second metal layer.According to an embodiment of the invention, including: in the first template using the method that electrocasting method forms second metal layer
One layer of metal seed layer of deposition (deposition method can include but is not limited to vapor deposition etc.) on surface with the first recessed portion (such as
Nickel metal seed layer), the first template for being formed with metal seed layer is placed in electroplating pool, metal seed layer serves as electrode, warp
Required second metal layer can be formed by crossing electroforming process.It is simple, convenient as a result, it is easy to accomplish.
S220: removal first template obtains the metal form.
According to an embodiment of the invention, removal the first template method be not particularly limited, can according to actual needs into
Row flexible choice.In some embodiments of the invention, the method for removing the first template includes but is not limited to mandril demoulding, de- material
Plate demoulding etc., it is simple, convenient, it is easy to accomplish, and can obtain with matched second lug boss of the first recessed portion, be made to
The precision of the metal form arrived is higher, and service performance is preferable.
In other embodiments of the invention, referring to Fig. 7, have described first on a surface of first template
Lug boss, and described obtain metal form using the first template construct and include:
S230: polymeric layer is formed on the surface that first template has first lug boss, then removes institute
The first template is stated, transition film layer is obtained.
According to an embodiment of the invention, having the second recessed portion on a surface of the transition film layer, described second is recessed
Concave portion matches with first lug boss.It should be noted that the second recessed portion and the first lug boss, which match, refers to
Two recessed portions and the first lug boss are in complementary relationship, and the first lug boss can fill up the second recessed portion.
According to an embodiment of the invention, the method for forming polymeric layer on the surface that the first template has the first lug boss
Including but not limited to be molded or be poured etc., it is simple, convenient, it is easy to accomplish.According to an embodiment of the invention, removal first
The method of template includes but is not limited to mandril demoulds, stripper plate demoulds etc., simple, convenient, it is easy to accomplish.
According to an embodiment of the invention, the material for forming transition film layer includes but is not limited to polymethyl methacrylate
(PMMA) and at least one of dimethyl silicone polymer (PDMS).Material source is extensive as a result, the essence of the transition film layer of acquisition
Spend higher, service performance is preferable, is suitable for carrying out electroforming processing on its surface, and more by its lock out operation with second metal layer
Simply, conveniently.
S240: second metal layer is formed on the surface that the transition film layer has second recessed portion.
According to an embodiment of the invention, forming the side of second metal layer on the surface that transition film layer has the second recessed portion
Method including but not limited to deposition, electroforming etc., it is simple, convenient as a result, it is easy to accomplish, and it is more uniform to obtain thickness
Second metal layer.According to an embodiment of the invention, including: in transition film layer using the method that electrocasting method forms second metal layer
One layer of metal seed layer of deposition (deposition method can include but is not limited to vapor deposition etc.) on surface with the second recessed portion (such as
Nickel metal seed layer), the transition film for being formed with metal seed layer is placed in electroplating pool, metal seed layer serves as electrode, warp
Required second metal layer can be formed by crossing electroforming process.It is simple, convenient as a result, it is easy to accomplish.
S250: the transition film layer is removed, the metal form is obtained.
According to an embodiment of the invention, removal transition film layer method be not particularly limited, can according to actual needs into
Row flexible choice.In some embodiments of the invention, the method for removing transition film layer includes but is not limited to mandril demoulding, de- material
Plate demoulding etc., it is simple, convenient, it is easy to accomplish, and can be obtained and the first boss shapes phase on the surface of metal form
The second same lug boss, the precision of prepared metal form is higher, and service performance is preferable, and it is higher to obtain precision conducive to production
Mask plate.
In other embodiments of the invention, there is first lug boss on a surface of first template,
And it includes: on the surface that first template has first lug boss that the first template construct of the utilization, which obtains metal form,
Upper formation second metal layer；First template is removed, the metal form is obtained.It is simple, convenient as a result, it is easy to real
It is existing, and the higher metal form of precision can be obtained, the higher mask plate of precision is obtained conducive to production.
According to an embodiment of the invention, can use the methods of deposition, electroforming forms second metal layer, to utilize electroforming side
Method is illustrated the method to form second metal layer for forming second metal layer, this method comprises: having the in the first template
One layer of metal seed layer of deposition (deposition method can include but is not limited to vapor deposition etc.) on the surface of one lug boss (such as nickel metal
Seed layer), the first template for being formed with seed layer is placed in electroplating pool, metal seed layer serves as electrode, by electroforming process
Required second metal layer can be formed.It is simple, convenient as a result, it is easy to accomplish.According to an embodiment of the invention, metal
Template with a thickness of 5-20 millimeters (such as can for 6 millimeters, 8 millimeters, 10 millimeters, 12 millimeters, 14 millimeters, 16 millimeters, 18 milli
Rice, 20 millimeters etc.).Metal form can bear higher pressure as a result, be conducive to the progress of subsequent injection step.Relative to
Above-mentioned thickness range, when the thickness of metal form is excessively thin, it cannot bear injection pressure and make product in injection moulding process
Yield is relatively low；When the thickness of metal form is blocked up, it is be easy to cause the wasting of resources, improves product cost.
S300: it makes to obtain organic layer 200 using the metal form, contains (the tool of through-hole 210 in the organic layer 200
Body structure can refer to Fig. 8 a and Fig. 8 b).
According to an embodiment of the invention, referring to Fig. 5, Fig. 8 a and Fig. 8 b, the through-hole 210 and second lug boss 410
Match.Thus, it is possible to obtain, precision is higher, the higher mask plate of resolution ratio.It should be noted that the second lug boss and through-hole
Match and refers to that at least part of the second lug boss can fill up above-mentioned through-hole.
According to an embodiment of the invention, the organic layer is formed by way of being molded or being poured.It operates as a result,
Simply, conveniently, it is easy to accomplish, it help to obtain lower-cost mask plate.
According to an embodiment of the invention, the material for forming the organic layer includes polycarbonate and polymethyl methacrylate
At least one of.Material source is extensive as a result, and price is lower, and transparency is high, and good film-forming property, thermal expansion coefficient is small, ductility
By force, preferable to the support effect of the first metal layer, service life is longer.According to an embodiment of the invention, the thickness of organic layer can
To be selected according to the diameter of through-hole, the spacing of through-hole.In some embodiments of the invention, the organic layer with a thickness of
5-50 microns (such as the thickness of organic layer can for 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, 35 microns, it is 40 micro-
Rice, 45 microns etc.).The transparency of organic layer is high as a result, is conducive to contraposition precisely, ductility is strong, the support to the first metal layer
Effect is preferable.It is opposite to the support effect of the first metal layer when the thickness of organic layer is excessively thin relative to above-mentioned thickness range
It is bad, so that the effect of throwing the net of mask plate is relatively bad, and it is relatively easy to deform, service life is not grown relatively；When organic layer
When thickness is blocked up, ductility is relatively bad, and is unfavorable for the magnetism through the first metal layer, and transparency is relatively bad, relatively
It is unfavorable for throwing the net for mask plate.
According to an embodiment of the invention, referring to Fig. 9 a and Fig. 9 b, the side wall 211 of the through-hole 210 and the through-hole 210
The distance between central axis O is gradually reduced from bottom to up, it should be noted that refers to that organic layer is close when in use under above-mentioned
The side of substrate.Be conducive to the formation of subsequent the first metal layer as a result, and mask plate is made not will receive steaming in use
The material for plating material influences, so that mask plate is able to maintain higher precision in the long-term use, effectively extends making for mask plate
Use the service life.It should be noted that above-mentioned central axis refers to the center of all cross sections of through-hole on the thickness direction of organic layer
Between line.
According to an embodiment of the invention, referring to Fig. 9 b, the following table of the side wall 211 of the through-hole 210 and the organic layer 200
Less than 85 ° of acute angle c (such as can be 80 °, 75 °, 70 °, 65 ° etc.) between plane locating for face 201.Be conducive to as a result,
The formation of subsequent the first metal layer, and make mask plate in use and not will receive the influence of evaporation material, so that exposure mask
Version is able to maintain higher precision in the long-term use, effectively extends the service life of mask plate.Reality according to the present invention
Apply example, referring to Fig. 9 b, the diameter L of the through-hole 210 be 2-30 microns (such as can be 5 microns, 10 microns, 15 microns, it is 20 micro-
Rice, 25 microns etc.), it should be noted that the diameter of through-hole refers in the cross section of the top of through-hole between any two points
The maximum value of line.The size of through-hole is smaller as a result, help to obtain the higher mask plate of resolution ratio, and the resolution of mask plate
Rate may be up to 800ppi.
S400: forming the first metal layer 300 on a surface of the organic layer 200, and specific structure can refer to Fig. 9 b.
According to an embodiment of the invention, the thickness of the first metal layer can according to the overall dimensions of mask plate, through-hole diameter,
Through-hole spacing and practical application scene carry out flexible choice.In some embodiments of the invention, the first metal layer
With a thickness of 1-20 microns (such as can for 2 microns, 3 microns, 4 microns, 5 microns, 8 microns, 10 microns, 12 microns, 15 microns,
18 microns etc.).The thickness of the first metal layer is more appropriate as a result, and stress is lower, is not susceptible to deformation, is conducive to the later period and throws the net
The implementation of technique.Relative to above-mentioned thickness range, when the thickness of the first metal layer is excessively thin, the magnetism of the first metal layer is relatively
It is low, the relatively blunt progress thrown the net in the later period, and relatively easily deformation occurs；When the thickness of the first metal layer is blocked up, first
The stress of metal layer is relatively high, and relatively easy deformation occurs, and then the relatively blunt progress thrown the net in the later period.
According to an embodiment of the invention, the material for forming the first metal layer includes nickel and iron-nickel alloy (such as invar
At least one of alloy etc.).Material source is extensive as a result, and magnetic preferably stress is lower, is conducive to the later period and throws the net technique
It carries out.
In some embodiments of the invention, the first metal layer is on the surface of organic layer by vapor deposition, sputtering
Mode formed.It is easy to operate as a result, it is convenient, it is easy to accomplish.
In some currently preferred embodiments of the present invention, the first metal layer is formed on the upper surface of organic layer, specifically, ginseng
According to Figure 10 and Figure 11, organic layer 200 is arranged on substrate 1 (such as substrate can include but is not limited to glass etc.), wherein have
The lower surface 201 of machine layer 200 is contacted with substrate 1, forms the in the upper surface of organic layer 200 by way of being deposited or sputtering
One metal layer 300, wherein evaporation material or sputter material are formed in the top of organic layer 200 along direction from top to bottom
On the upper surface of organic layer 200, some materials are formed in formation coating 2 on the upper surface of substrate 1, removal lining by through-hole 210
Bottom 1 and coating 2 can be obtained mask plate.It is simple, convenient as a result, it is easy to accomplish, and can obtain thickness it is more appropriate,
The more accurate the first metal layer of size, the material for forming the first metal layer are hardly formed in the side wall of organic layer through-hole
On, be conducive to the precision for improving mask plate.It should be noted that the mask plate obtained in this embodiment can incite somebody to action when in use
Organic layer is arranged close to substrate, and evaporation material is hardly formed on the side wall of organic layer through-hole as a result, so that mask plate exists
It is able to maintain higher precision in long-term use process, effectively extends the service life of mask plate.
In some embodiments of the invention, forming the first metal layer includes: to be molded to form organic layer on metal form
Later, metal form is not first removed, forms the first metal layer by way of being deposited, sputtering on the upper surface of organic layer, goes
Except can be obtained after metal form mask plate (it should be noted that in the method, the height of the second lug boss in metal form
Degree can be 1-20 microns higher than the thickness of organic layer).It operates as a result, simpler, conveniently, it is easy to accomplish, and form the first gold medal
The material for belonging to layer will not be formed on the side wall of organic layer through-hole, be more advantageous to the precision for improving mask plate.
According to an embodiment of the invention, the method and process of above-mentioned production mask plate is simple, easy to operate and control, without making
With double-sided exposure technique, the anisotropy of wet-etching technology is effectively prevented, cost of manufacture is lower, is easy to obtain in organic layer
Precision is higher, the lesser through-hole of size so that final prepared mask plate precision is higher, resolution ratio is higher, answers
Power is lower, and effect of throwing the net is preferable, is unlikely to deform, and is conducive to production high-precision, high-resolution OLED device.
In another aspect of this invention, the present invention provides a kind of mask plates.According to an embodiment of the invention, the mask plate
It is to be made by mentioned-above method.Inventors have found that the mask plate structure is simple, is easily achieved, precision, resolution ratio compared with
Height, resolution ratio may be up to 800ppi, have both transparent and magnetic properties, be easy to throw the net, throw the net, be deposited contraposition it is more accurate, be conducive to
The higher OLED device of resolution ratio is made, is conducive to be mass produced, the market competitiveness is stronger.
In another aspect of this invention, the present invention provides a kind of display devices.According to an embodiment of the invention, described aobvious
OLED device in showing device is prepared using mentioned-above mask plate.Inventors have found that the display device structure
Simply, be easily achieved, and OLED device has higher resolution ratio (up to 800ppi), obtained display device cost compared with
Low, the market competitiveness is stronger.
According to an embodiment of the invention, the type of the display device can include but is not limited to mobile phone, TV, plate electricity
Brain, wearable device etc., display device can also include shell, circuit, CPU etc. in addition to including OLED device, herein not after
It repeats more.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (16)
1. a kind of method for making mask plate characterized by comprising
The first lug boss or the first recessed portion are formed on a surface of substrate, to obtain the first template；
Metal form is obtained using the first template construct, there is the second lug boss on a surface of the metal form, it is described
The shape of second lug boss is consistent with the shape of first lug boss or matches with first recessed portion；
It makes to obtain organic layer using the metal form, contains through-hole in the organic layer, the through-hole and described second convex
The portion of rising matches；
The first metal layer is formed on a surface of the organic layer.
2. the method according to claim 1, wherein having described first on a surface of first template
Recessed portion, and described obtain metal form using the first template construct and include:
Second metal layer is formed on the surface that first template has first recessed portion；
First template is removed, the metal form is obtained.
3. the method according to claim 1, wherein having described first on a surface of first template
Lug boss, and described obtain metal form using the first template construct and include:
Polymeric layer is formed on the surface that first template has first lug boss, then removes first mould
Plate, obtains transition film layer, has the second recessed portion on a surface of the transition film layer, second recessed portion and described the
One lug boss matches；
Second metal layer is formed on the surface that the transition film layer has second recessed portion；
The transition film layer is removed, the metal form is obtained.
4. the method according to claim 1, wherein having described first on a surface of first template
Lug boss, and described obtain metal form using the first template construct and include:
Second metal layer is formed on the surface that first template has first lug boss；
First template is removed, the metal form is obtained.
5. method according to claim 1-4, which is characterized in that first recessed portion or first protrusion
Portion is formed by way of dry etching or laser carving；
The organic layer is formed by way of being molded or being poured；
The first metal layer is formed by way of being deposited, sputtering.
6. method according to claim 1-4, which is characterized in that the metal form with a thickness of 5-20mm.
7. the method according to claim 1, wherein the first metal layer with a thickness of 1-20 microns.
8. the method according to claim 1, wherein the material for forming the first metal layer includes nickel and iron nickel
At least one of alloy.
9. the method according to claim 1, wherein the organic layer with a thickness of 5-50 microns.
10. the method according to claim 1, wherein the diameter of the through-hole is 2-30 microns.
11. the method according to claim 1, wherein the central axis of the side wall of the through-hole and the through-hole it
Between distance be gradually reduced from bottom to up.
12. according to the method for claim 11, which is characterized in that the lower surface of the side wall of the through-hole and the organic layer
Acute angle between locating plane is less than 85 °.
13. the method according to claim 1, wherein the material for forming the organic layer include polycarbonate and
At least one of polymethyl methacrylate.
14. the method according to claim 1, wherein the material for forming the substrate includes semiconductor.
15. a kind of mask plate, which is characterized in that be prepared by method described in any one of claim 1-14.
16. a kind of display device, which is characterized in that the OLED device in the display device is using described in claim 15
Mask plate is prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810860496.8A CN109097727A (en) | 2018-08-01 | 2018-08-01 | Mask plate and preparation method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810860496.8A CN109097727A (en) | 2018-08-01 | 2018-08-01 | Mask plate and preparation method thereof and display device |
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| CN109097727A true CN109097727A (en) | 2018-12-28 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051458A (en) * | 2019-06-24 | 2022-02-15 | 奇跃公司 | Polymer patterned disk stack fabrication |
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Application publication date: 20181228 |