CN109072472B - 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法 - Google Patents

表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法 Download PDF

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Publication number: CN109072472B
Authority: CN; China
Prior art keywords: copper foil; treated; carrier; copper; treated copper
Prior art date: 2016-04-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

CN201780023464.6A

Other languages

English (en)

Chinese (zh)

Other versions

CN109072472A (zh

Inventor

加藤翼

松田光由

饭田浩人

吉川和广

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsui Mining and Smelting Co Ltd

Original Assignee

Mitsui Mining and Smelting Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-04-14

Filing date

2017-03-28

Publication date

2020-10-16

2017-03-28 Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd

2018-12-21 Publication of CN109072472A publication Critical patent/CN109072472A/zh

2020-10-16 Application granted granted Critical

2020-10-16 Publication of CN109072472B publication Critical patent/CN109072472B/zh

Status Active legal-status Critical Current

2037-03-28 Anticipated expiration legal-status Critical

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 238
239000011889 copper foil Substances 0.000 title claims abstract description 186
238000004519 manufacturing process Methods 0.000 title claims description 27
239000011347 resin Substances 0.000 claims abstract description 71
229920005989 resin Polymers 0.000 claims abstract description 71
238000000034 method Methods 0.000 claims abstract description 68
238000005530 etching Methods 0.000 claims abstract description 44
238000012546 transfer Methods 0.000 claims abstract description 20
239000002245 particle Substances 0.000 claims description 22
238000007788 roughening Methods 0.000 claims description 16
101100533725 Mus musculus Smr3a gene Proteins 0.000 claims description 11
101100149716 Rattus norvegicus Vcsa1 gene Proteins 0.000 claims description 11
239000000654 additive Substances 0.000 claims description 3
238000007747 plating Methods 0.000 abstract description 60
229910052802 copper Inorganic materials 0.000 abstract description 54
239000010949 copper Substances 0.000 abstract description 54
230000008569 process Effects 0.000 abstract description 22
239000010410 layer Substances 0.000 description 89
238000011282 treatment Methods 0.000 description 45
239000000243 solution Substances 0.000 description 29
239000006087 Silane Coupling Agent Substances 0.000 description 20
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 18
238000011156 evaluation Methods 0.000 description 12
238000005259 measurement Methods 0.000 description 12
PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
229910052751 metal Inorganic materials 0.000 description 9
239000002184 metal Substances 0.000 description 9
239000011701 zinc Substances 0.000 description 9
ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 8
229910052725 zinc Inorganic materials 0.000 description 8
229910000365 copper sulfate Inorganic materials 0.000 description 7
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 7
238000004070 electrodeposition Methods 0.000 description 7
MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
229910000990 Ni alloy Inorganic materials 0.000 description 6
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 6
JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 6
229910052759 nickel Inorganic materials 0.000 description 6
QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 6
-1 nitrogen-containing organic compounds Chemical class 0.000 description 6
238000011161 development Methods 0.000 description 5
230000018109 developmental process Effects 0.000 description 5
239000000758 substrate Substances 0.000 description 5
230000015572 biosynthetic process Effects 0.000 description 4
238000010586 diagram Methods 0.000 description 4
238000005868 electrolysis reaction Methods 0.000 description 4
239000007788 liquid Substances 0.000 description 4
239000000203 mixture Substances 0.000 description 4
230000003287 optical effect Effects 0.000 description 4
238000004381 surface treatment Methods 0.000 description 4
JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 3
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XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical compound OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 description 2
229910000881 Cu alloy Inorganic materials 0.000 description 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
229910001297 Zn alloy Inorganic materials 0.000 description 2
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
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239000011888 foil Substances 0.000 description 2
239000007789 gas Substances 0.000 description 2
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
239000002346 layers by function Substances 0.000 description 2
239000000463 material Substances 0.000 description 2
150000002894 organic compounds Chemical class 0.000 description 2
239000005011 phenolic resin Substances 0.000 description 2
229920003192 poly(bis maleimide) Polymers 0.000 description 2
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239000009719 polyimide resin Substances 0.000 description 2
229920001955 polyphenylene ether Polymers 0.000 description 2
238000002360 preparation method Methods 0.000 description 2
238000004080 punching Methods 0.000 description 2
230000002829 reductive effect Effects 0.000 description 2
238000005507 spraying Methods 0.000 description 2
229910052717 sulfur Inorganic materials 0.000 description 2
239000011593 sulfur Substances 0.000 description 2
229920003002 synthetic resin Polymers 0.000 description 2
239000000057 synthetic resin Substances 0.000 description 2
229920001187 thermosetting polymer Polymers 0.000 description 2
239000010936 titanium Substances 0.000 description 2
229910052719 titanium Inorganic materials 0.000 description 2
WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
FYADHXFMURLYQI-UHFFFAOYSA-N 1,2,4-triazine Chemical compound C1=CN=NC=N1 FYADHXFMURLYQI-UHFFFAOYSA-N 0.000 description 1
WZRRRFSJFQTGGB-UHFFFAOYSA-N 1,3,5-triazinane-2,4,6-trithione Chemical compound S=C1NC(=S)NC(=S)N1 WZRRRFSJFQTGGB-UHFFFAOYSA-N 0.000 description 1
YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 1
SADQQDLRCRDNRA-UHFFFAOYSA-N 2h-benzotriazol-4-ylmethylurea Chemical compound NC(=O)NCC1=CC=CC2=NNN=C12 SADQQDLRCRDNRA-UHFFFAOYSA-N 0.000 description 1
UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 1
OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
101150096622 Smr2 gene Proteins 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
239000002253 acid Substances 0.000 description 1
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
230000003213 activating effect Effects 0.000 description 1
229910045601 alloy Inorganic materials 0.000 description 1
239000000956 alloy Substances 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
239000007864 aqueous solution Substances 0.000 description 1
QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
150000001735 carboxylic acids Chemical class 0.000 description 1
239000003054 catalyst Substances 0.000 description 1
238000005229 chemical vapour deposition Methods 0.000 description 1
239000000460 chlorine Substances 0.000 description 1
229910052801 chlorine Inorganic materials 0.000 description 1
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
229910017052 cobalt Inorganic materials 0.000 description 1
239000010941 cobalt Substances 0.000 description 1
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
238000012790 confirmation Methods 0.000 description 1
ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
239000004643 cyanate ester Substances 0.000 description 1
238000005238 degreasing Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000007865 diluting Methods 0.000 description 1
PPTYNCJKYCGKEA-UHFFFAOYSA-N dimethoxy-phenyl-prop-2-enoxysilane Chemical compound C=CCO[Si](OC)(OC)C1=CC=CC=C1 PPTYNCJKYCGKEA-UHFFFAOYSA-N 0.000 description 1
XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
235000011180 diphosphates Nutrition 0.000 description 1
NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
239000000945 filler Substances 0.000 description 1
239000005357 flat glass Substances 0.000 description 1
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
238000007654 immersion Methods 0.000 description 1
230000006872 improvement Effects 0.000 description 1
230000002401 inhibitory effect Effects 0.000 description 1
239000010954 inorganic particle Substances 0.000 description 1
238000009413 insulation Methods 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
238000010030 laminating Methods 0.000 description 1
230000031700 light absorption Effects 0.000 description 1
238000011068 loading method Methods 0.000 description 1
230000000873 masking effect Effects 0.000 description 1
238000000691 measurement method Methods 0.000 description 1
238000002156 mixing Methods 0.000 description 1
229910052750 molybdenum Inorganic materials 0.000 description 1
150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
239000004745 nonwoven fabric Substances 0.000 description 1
229910052698 phosphorus Inorganic materials 0.000 description 1
239000004645 polyester resin Substances 0.000 description 1
229920001225 polyester resin Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
238000003825 pressing Methods 0.000 description 1
230000009467 reduction Effects 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
229910000077 silane Inorganic materials 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
239000002904 solvent Substances 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
229910052718 tin Inorganic materials 0.000 description 1
BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
VMYXFDVIMUEKNP-UHFFFAOYSA-N trimethoxy-[5-(oxiran-2-yl)pentyl]silane Chemical compound CO[Si](OC)(OC)CCCCCC1CO1 VMYXFDVIMUEKNP-UHFFFAOYSA-N 0.000 description 1
229910052721 tungsten Inorganic materials 0.000 description 1
238000005406 washing Methods 0.000 description 1
230000003313 weakening effect Effects 0.000 description 1
239000002759 woven fabric Substances 0.000 description 1

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Chemical Kinetics & Catalysis (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Automation & Control Theory (AREA)
Electroplating Methods And Accessories (AREA)
Laminated Bodies (AREA)
Manufacturing Of Printed Wiring (AREA)

CN201780023464.6A 2016-04-14 2017-03-28 表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法 Active CN109072472B (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2016081447		2016-04-14
JP2016-081447		2016-04-14
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Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN111684869B (zh) *	2018-03-28	2021-03-19	三井金属矿业株式会社	多层布线板的制造方法
JP6606317B1 (ja) *	2018-04-25	2019-11-13	古河電気工業株式会社	表面処理銅箔、銅張積層板、及びプリント配線板
CN112154525A (zh) *	2018-05-29	2020-12-29	积水保力马科技株式会社	金属触点构件和橡胶开关构件
CN112368826A (zh)	2018-06-22	2021-02-12	积水保力马科技株式会社	热传导性片
WO2020009229A1 (ja) *	2018-07-06	2020-01-09	タツタ電線株式会社	プリント配線基板用貼付フィルム
KR102480377B1 (ko) *	2018-08-10	2022-12-23	미쓰이금속광업주식회사	조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
JPWO2020067141A1 (ja)	2018-09-26	2021-09-30	積水ポリマテック株式会社	熱伝導性シート
JP6895936B2 (ja)	2018-09-28	2021-06-30	古河電気工業株式会社	表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板
WO2020066074A1 (ja) *	2018-09-28	2020-04-02	三井金属鉱業株式会社	多層配線板の製造方法
JP6622443B1 (ja) *	2018-09-28	2019-12-18	三井金属鉱業株式会社	多層配線板の製造方法
TWI768213B (zh) *	2018-11-08	2022-06-21	日商拓自達電線股份有限公司	電磁波屏蔽膜、電磁波屏蔽膜之製造方法及屏蔽印刷配線板之製造方法
CN112969824A (zh) *	2018-11-19	2021-06-15	三井金属矿业株式会社	表面处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
US10581081B1 (en)	2019-02-01	2020-03-03	Chang Chun Petrochemical Co., Ltd.	Copper foil for negative electrode current collector of lithium ion secondary battery
US20220183158A1 (en) *	2019-03-26	2022-06-09	Mitsui Mining & Smelting Co., Ltd.	Method of manufacturing printed wiring board
CN113811641B (zh) *	2019-05-15	2023-12-05	住友电气工业株式会社	印刷布线板
JP7300976B2 (ja) *	2019-12-13	2023-06-30	Ｊｘ金属株式会社	表面処理銅箔、銅張積層板及びプリント配線板
JP2021095596A (ja) *	2019-12-13	2021-06-24	Ｊｘ金属株式会社	表面処理銅箔、銅張積層板及びプリント配線板
JP7421208B2 (ja)	2019-12-24	2024-01-24	日本電解株式会社	表面処理銅箔及びその製造方法
JP7177956B2 (ja) *	2020-02-04	2022-11-24	三井金属鉱業株式会社	粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN115038819A (zh) *	2020-02-04	2022-09-09	三井金属矿业株式会社	粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
KR20230160813A (ko) *	2021-03-26	2023-11-24	미쓰이금속광업주식회사	조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
WO2022202540A1 (ja) *	2021-03-26	2022-09-29	三井金属鉱業株式会社	粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN115226325A (zh) *	2021-04-14	2022-10-21	鹏鼎控股(深圳)股份有限公司	电路板的制作方法以及电路板
WO2022255420A1 (ja) *	2021-06-03	2022-12-08	三井金属鉱業株式会社	粗化処理銅箔、銅張積層板及びプリント配線板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1938456A (zh) *	2004-04-02	2007-03-28	三井金属矿业株式会社	铜箔及其制造方法
CN102712138A (zh) *	2010-01-21	2012-10-03	Jx日矿日石金属株式会社	覆铜层压板的制备方法、其所使用的铜箔及覆铜层压板的层压装置
CN104120471A (zh) *	2013-04-26	2014-10-29	Jx日矿日石金属株式会社	高频电路用铜箔、覆铜板、印刷配线板、带载体的铜箔、电子设备及印刷配线板的制造方法
CN105102678A (zh) *	2013-02-14	2015-11-25	三井金属矿业株式会社	表面处理铜箔及用表面处理铜箔得到的覆铜层压板
CN107923047A (zh) *	2015-07-29	2018-04-17	三井金属矿业株式会社	粗糙化处理铜箔、覆铜层叠板及印刷电路板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5228965A (en) *	1990-10-30	1993-07-20	Gould Inc.	Method and apparatus for applying surface treatment to metal foil
CN103125149B (zh) *	2010-09-27	2016-09-14	吉坤日矿日石金属株式会社	印刷电路板用铜箔、其制造方法、印刷电路板用树脂基板以及印刷电路板
JP5204908B1 (ja)	2012-03-26	2013-06-05	Ｊｘ日鉱日石金属株式会社	キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JP5858849B2 (ja) *	2012-03-30	2016-02-10	Jx日鉱日石金属株式会社	金属箔
JP5481577B1 (ja) *	2012-09-11	2014-04-23	Ｊｘ日鉱日石金属株式会社	キャリア付き銅箔
WO2014133164A1 (ja) *	2013-02-28	2014-09-04	三井金属鉱業株式会社	黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板
WO2014157728A1 (ja) *	2013-03-29	2014-10-02	Jx日鉱日石金属株式会社	キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
JP5470493B1 (ja)	2013-07-23	2014-04-16	Ｊｘ日鉱日石金属株式会社	樹脂基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
MY168616A (en) *	2013-07-23	2018-11-14	Jx Nippon Mining & Metals Corp	Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
MY177676A (en) *	2015-07-03	2020-09-23	Mitsui Mining & Smelting Co Ltd	Roughened copper foil, copper-clad laminate and printed wiring board

2017
- 2017-03-28 CN CN201780023464.6A patent/CN109072472B/zh active Active
- 2017-03-28 JP JP2018511957A patent/JP6945523B2/ja active Active
- 2017-03-28 KR KR1020187024895A patent/KR102338103B1/ko active IP Right Grant
- 2017-03-28 MY MYPI2018703757A patent/MY186859A/en unknown
- 2017-03-28 WO PCT/JP2017/012678 patent/WO2017179416A1/ja active Application Filing
- 2017-04-10 TW TW106111923A patent/TWI711139B/zh active

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1938456A (zh) *	2004-04-02	2007-03-28	三井金属矿业株式会社	铜箔及其制造方法
CN102712138A (zh) *	2010-01-21	2012-10-03	Jx日矿日石金属株式会社	覆铜层压板的制备方法、其所使用的铜箔及覆铜层压板的层压装置
CN105102678A (zh) *	2013-02-14	2015-11-25	三井金属矿业株式会社	表面处理铜箔及用表面处理铜箔得到的覆铜层压板
CN104120471A (zh) *	2013-04-26	2014-10-29	Jx日矿日石金属株式会社	高频电路用铜箔、覆铜板、印刷配线板、带载体的铜箔、电子设备及印刷配线板的制造方法
CN107923047A (zh) *	2015-07-29	2018-04-17	三井金属矿业株式会社	粗糙化处理铜箔、覆铜层叠板及印刷电路板

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CN109072472B (zh)	2020-10-16	表面处理铜箔、带载体铜箔、以及使用它们的覆铜层叠板及印刷电路板的制造方法
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KR102031065B1 (ko)	2019-10-11	캐리어 부착 극박 동박 및 그 제조 방법, 동장 적층판, 및 프린트 배선판의 제조 방법
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CN111886367B (zh)	2023-05-16	粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
KR102039844B1 (ko)	2019-11-01	프린트 배선판의 제조 방법
TWI756039B (zh)	2022-02-21	粗糙化處理銅箔、附有載體銅箔、覆銅層壓板及印刷配線板
KR102531073B1 (ko)	2023-05-09	캐리어 부착 극박 동박, 그 제조 방법, 동장 적층판 및 프린트 배선판