CN109065476B - 真空键合装置 - Google Patents
真空键合装置 Download PDFInfo
- Publication number
- CN109065476B CN109065476B CN201810831878.8A CN201810831878A CN109065476B CN 109065476 B CN109065476 B CN 109065476B CN 201810831878 A CN201810831878 A CN 201810831878A CN 109065476 B CN109065476 B CN 109065476B
- Authority
- CN
- China
- Prior art keywords
- chamber
- bonding
- vacuum
- sliding
- pressure plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810831878.8A CN109065476B (zh) | 2018-07-26 | 2018-07-26 | 真空键合装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810831878.8A CN109065476B (zh) | 2018-07-26 | 2018-07-26 | 真空键合装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109065476A CN109065476A (zh) | 2018-12-21 |
CN109065476B true CN109065476B (zh) | 2023-08-22 |
Family
ID=64836470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810831878.8A Active CN109065476B (zh) | 2018-07-26 | 2018-07-26 | 真空键合装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109065476B (zh) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5876082A (en) * | 1996-02-15 | 1999-03-02 | Singulus Technologies Gmbh | Device for gripping and holding substrates |
JP2004136334A (ja) * | 2002-10-18 | 2004-05-13 | Dainippon Printing Co Ltd | 真空熱プレス装置 |
CN101090082A (zh) * | 2006-06-15 | 2007-12-19 | 中国科学院半导体研究所 | 多功能半导体晶片键合装置 |
CN101531063A (zh) * | 2009-04-28 | 2009-09-16 | 南通市神马电力科技有限公司 | 一种拉挤模具的抽真空装置 |
CN102082078A (zh) * | 2010-10-22 | 2011-06-01 | 上海技美电子科技有限公司 | 适于为超薄晶圆贴膜的贴膜方法及贴膜装置 |
CN102456590A (zh) * | 2010-10-18 | 2012-05-16 | 东京毅力科创株式会社 | 接合装置及接合方法 |
CN108193190A (zh) * | 2017-12-28 | 2018-06-22 | 深圳市华星光电半导体显示技术有限公司 | 一种真空装置 |
CN208460718U (zh) * | 2018-07-26 | 2019-02-01 | 成都锐杰微科技有限公司 | 真空键合装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3472963B1 (ja) * | 2002-05-30 | 2003-12-02 | ミカドテクノス株式会社 | 高温用真空プレス装置 |
-
2018
- 2018-07-26 CN CN201810831878.8A patent/CN109065476B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5876082A (en) * | 1996-02-15 | 1999-03-02 | Singulus Technologies Gmbh | Device for gripping and holding substrates |
JP2004136334A (ja) * | 2002-10-18 | 2004-05-13 | Dainippon Printing Co Ltd | 真空熱プレス装置 |
CN101090082A (zh) * | 2006-06-15 | 2007-12-19 | 中国科学院半导体研究所 | 多功能半导体晶片键合装置 |
CN101531063A (zh) * | 2009-04-28 | 2009-09-16 | 南通市神马电力科技有限公司 | 一种拉挤模具的抽真空装置 |
CN102456590A (zh) * | 2010-10-18 | 2012-05-16 | 东京毅力科创株式会社 | 接合装置及接合方法 |
CN102082078A (zh) * | 2010-10-22 | 2011-06-01 | 上海技美电子科技有限公司 | 适于为超薄晶圆贴膜的贴膜方法及贴膜装置 |
CN108193190A (zh) * | 2017-12-28 | 2018-06-22 | 深圳市华星光电半导体显示技术有限公司 | 一种真空装置 |
CN208460718U (zh) * | 2018-07-26 | 2019-02-01 | 成都锐杰微科技有限公司 | 真空键合装置 |
Non-Patent Citations (1)
Title |
---|
马可 ; 辛舟 ; 阎峰云 ; .制备铝基复合基板真空室的结构设计.真空与低温.2018,(03),63-66+69. * |
Also Published As
Publication number | Publication date |
---|---|
CN109065476A (zh) | 2018-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Puers | Capacitive sensors: when and how to use them | |
JP5748567B2 (ja) | 密閉封止された圧力感知装置 | |
CN1183378C (zh) | 压力传感器和压力测定装置 | |
US8806964B2 (en) | Force sensor | |
CN201653605U (zh) | 一种基于硅硅键合的压力传感器 | |
WO2011040270A1 (ja) | 流量測定機構、マスフローコントローラ及び圧力センサ | |
US20150114129A1 (en) | Diaphragm piezoresistive pressure sensor | |
KR100646668B1 (ko) | 역흡입밸브 | |
EP3126804B1 (en) | A pressure sensor and a blower using the same | |
ITMI20120456A1 (it) | Sensore di pressione ceramico e relativo metodo di produzione, e trasduttore che incorpora un sensore di pressione ceramico | |
US9303772B2 (en) | Diaphragm device and pressure regulating reservoir using the same | |
CN109065476B (zh) | 真空键合装置 | |
US20090032366A1 (en) | Piston for automatic transmission | |
CN208460718U (zh) | 真空键合装置 | |
CN107290083A (zh) | 一种可单面封装的双膜电容式压力传感器及制作方法 | |
WO2005066599A3 (en) | Modified dual diaphragm pressure sensor | |
CN102008310B (zh) | 用于注射泵的压力检测装置 | |
JPH04370727A (ja) | 半導体圧力センサの製造方法 | |
WO2007070317B1 (en) | Button diaphragm piston pump | |
CN201917435U (zh) | 一种压力传感器现场校准装置 | |
JP3070045B2 (ja) | 差圧測定装置 | |
CN217687662U (zh) | 一种适于半导体压力传感器的密封结构 | |
JP5181648B2 (ja) | 半導体圧力センサの特性調整方法および特性調整装置 | |
JP2004212388A (ja) | 静電容量型圧力センサ | |
CN204007986U (zh) | 汽车空调压力传感器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 226000 No. 9 Siyuan Road, Chongchuan District, Nantong City, Jiangsu Province Applicant after: NANTONG University Applicant after: Suzhou Ruijie Micro Technology Group Co.,Ltd. Address before: 226000 No. 9 Siyuan Road, Chongchuan District, Nantong City, Jiangsu Province Applicant before: NANTONG University Applicant before: CHENGDU U-PKG TECHNOLOGY Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20221116 Address after: Room Z101, Building 1, No. 78, Jinshan East Road, Suzhou Hi tech Zone, Jiangsu 215129 Applicant after: Suzhou Ruijie Micro Technology Group Co.,Ltd. Address before: 226000 No. 9 Siyuan Road, Chongchuan District, Nantong City, Jiangsu Province Applicant before: NANTONG University Applicant before: Suzhou Ruijie Micro Technology Group Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant |